Datasheet STP3NA80FI, STP3NA80 Datasheet (SGS Thomson Microelectronics)

Page 1
STP3NA80
STP3NA80FI
N - CHANNEL ENHANCEMENT MODE
FAST POWER MOS TRANSISTOR
TYPE V
STP 3NA80 STP 3NA80FI
TYPICAL R
± 30V GATE TO SOURCE VOLTAGE RATING
REPETITIVE AVALANCHE DATA AT 100
LOW INTRINSIC CAPACITANCES
GATE GHARGE MINIMIZED
REDUCED THRESHOLD VOLTAGE SPREAD
DS(on)
DSS
800 V 800 V
= 3.5
R
DS(on)
<4.5 <4.5
I
D
3.1 A 2A
o
C
DESCRIPTION
This series of POWER MOSFETS represents the most advanced high voltage technology. The optimized cell layout coupled with a new proprietary edge termination concur to give the device low R
and gate charge, unequalled
DS(on)
ruggedness and superior switching performance.
APPLICATIONS
HIGH CURRENT, HIGH SPEED SWITCHING
SWITCH MODE POWERSUPPLIES (SMPS)
DC-AC CONVERTERS FOR WELDING
EQUIPMENT AND UNINTERRUPTIBLE POWER SUPPLIES AND MOTOR DRIVE
3
2
1
1
TO-220 ISOWATT220
INTERNAL SCHEMATIC DIAGRAM
3
2
ABSOLUTE MAXIMUM RATINGS
Symb o l Paramet er Val u e Unit
ST P3NA80 ST P5NA80FI
V
V
V
I
DM
P
V
T
() Pulsewidth limited bysafe operating area
November 1993
Drain - s ource Voltage (VGS=0) 800 V
DS
Drain - gat e Voltage (RGS=20kΩ)800V
DGR
Gate-source Voltage ± 30 V
GS
Drain Current (continuous) at Tc=25oC3.12A
I
D
Drain Current (continuous) at Tc=100oC21.3A
I
D
(•) Drain Current (pulsed) 12.5 12.5 A
Total Di ssipation a t Tc=25oC 100 40 W
tot
Derat ing Factor 1.25 0.32 W/ Ins ulation Withs t and Voltage (DC) 2000 V
ISO
St or a ge Tem perature -65 t o 150
stg
Max. Operating Jun ction T emperature 150
T
j
o o
o
C
C C
1/10
Page 2
STP3NA80/FI
THERMAL DATA
TO-220 ISOW ATT 220
R
thj-case
R
thj-amb
R
thc-sink
T
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Uni t
I
AR
E
E
I
AR
Thermal Resistance J unction- c ase Max 0.8 3.12 Thermal Resistance Junc tion-am bie nt Max
Thermal Resistance Cas e-sink Typ Maximum Lead Temperature For So ldering Purpose
l
Avalanc h e Cu rr ent , Repet itive or Not-Rep etitive (pulse width limited by Tjmax, δ <1%)
Single Pul se Avalanche Ener gy
AS
(starti ng T Repetitive Avalanc he Energ y
AR
=25oC, ID=IAR,VDD=50V)
j
(pulse width limited by Tjmax, δ <1%) Avalanc h e Cu rr ent , Repet itive or Not-Rep etitive
(Tc= 100oC, pulse width l imited by Tjmax, δ <1%)
62.5
0.5
300
3.1 A
48 mJ
2mJ
2A
o
C/W
o
C/W
o
C/W
o
C
ELECTRICAL CHARACTERISTICS (T
=25oC unless otherwisespecified)
case
OFF
Symbol Parameter Te st Condition s Min. Typ. Max. Unit
V
(BR)DSS
Drain - s ource
ID=250µAVGS= 0 800 V
Break d own Volta ge
I
DSS
I
GSS
Zer o G at e V oltage Drain Current (VGS=0)
Gat e- body Leakage Current (V
DS
=0)
VDS=MaxRating VDS= Max Rating x 0.8 Tc=125oC
= ± 30 V ± 10 0 nA
V
GS
250
1000µAµA
ON (∗)
Symbol Parameter Te st Condition s Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
I
D(on)
Gate Threshold Voltage VDS=VGSID=250µA 2.25 3 3.75 V St at ic Drain-s our ce O n
Resistance On State Drain Current VDS>I
VGS=10V ID=1.5A VGS=10V ID=1.5A Tc= 100oC
D(on)xRDS(on)max
3.5 4.5 9
3.1 A
VGS=10V
DYNAMIC
Symbol Parameter Te st Condition s Min. Typ. Max. Unit
()Forward
g
fs
Tr ansconductance
C C C
Input Capacitance
iss
Out put Capacitance
oss
Reverse Transfer
rss
Capacitance
VDS>I
D(on)xRDS(on)maxID
=1.5A 1.5 3 S
VDS=25V f=1MHz VGS=0 730
85 20
950 115
30
Ω Ω
pF pF pF
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Page 3
STP3NA80/FI
ELECTRICAL CHARACTERISTICS (continued)
SWITCHING ON
Symbol Parameter Te st Condition s Min. Typ. Max. Unit
t
d(on)
(di/dt)
Q Q Q
Turn-on T ime
t
Rise Time
r
Turn-on Current S lope VDD=640V ID=3A
on
Total Gate Charge
g
Gat e- Source Charge
gs
Gate-Drain Charge
gd
SWITCHING OFF
Symbol Parameter Te st Condition s Min. Typ. Max. Unit
t
r(Voff)
t
Off -voltage Rise Time
t
Fall Time
f
Cross-over Time
c
SOURCE DRAINDIODE
VDD=400V ID=1.5A RG=47 VGS=10V
25 55
(see test circuit, figure 3)
180 A/µs RG=47 VGS=10V (see test circuit, figure 5)
VDD= 640 V ID=3A VGS=10V 35
6
15
VDD=640V ID=3A RG=47 Ω VGS=10V (see test circuit, figure 5)
50 15 75
35 75
50 nC
70 25
100
ns ns
nC nC
ns ns ns
Symbol Parameter Te st Condition s Min. Typ. Max. Unit
I
I
SDM
SD
Source-drain C urrent
()
Source-drain C urrent
3.1
12.5
(pulsed)
V
(∗) Forward On V oltage ISD=3.1A VGS=0 1.6 V
SD
t
Reverse Recovery
rr
Time
Q
Reverse Recovery
rr
ISD=3.1A di/dt=100A/µs VDD= 100 V Tj=150oC (see test circuit, figure 5)
700
9.5
Charge
I
RRM
Reverse Recovery
27
Current
() Pulsed:Pulse duration = 300 µs, dutycycle 1.5 % () Pulse widthlimited by safeoperating area
Safe Operating Areas For TO-220 Safe Operating Areas For ISOWATT220
A A
ns
µC
A
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Page 4
STP3NA80/FI
Thermal ImpedeanceFor TO-220
Derating Curve For TO-220
Thermal ImpedanceFor ISOWATT220
Derating Curve For ISOWATT220
Output Characteristics
4/10
Transfer Characteristics
Page 5
Transconductance Static Drain-source On Resistance
Gate Charge vs Gate-source Voltage Capacitance Variations
STP3NA80/FI
Temperature
Normalized On Resistance vs TemperatureNormalized Gate Threshold Voltage vs
5/10
Page 6
STP3NA80/FI
Turn-on Current Slope Turn-off Drain-source Voltage Slope
Cross-over Time Switching Safe Operating Area
Accidental Overload Area Source-drain Diode ForwardCharacteristics
6/10
Page 7
STP3NA80/FI
Fig. 1: Unclamped Inductive Load Test Circuits
Fig. 3: Switching Times Test Circuits For
Resistive Load
Fig. 2: Unclamped Inductive Waveforms
Fig. 4: Gate Charge Test Circuit
Fig. 5: Test Circuit For Inductive Load Switching
And Diode Reverse Recovery Time
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Page 8
STP3NA80/FI
TO-220 MECHANICAL DATA
DIM.
mm inch
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409
L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
E
A
L4
D
F2
F1
G1
H2
G
F
C
D1
L2
Dia.
L5
L7
L6
L9
P011C
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Page 9
ISOWATT220 MECHANICAL DATA
STP3NA80/FI
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.4 0.7 0.015 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 0.385 0.417 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
mm inch
E
A
D
B
L3
L6
L7
Ø
F1
H
L2
F2
F
123
L4
G1
G
P011G
9/10
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STP3NA80/FI
Information furnished isbelieved to be accurateand reliable. However, SGS-THOMSONMicroelectronics assumes noresponsability for the consequences of use of suchinformation nor for any infringementof patents orother rights of third parties whichmay results from its use. No license isgrantedby implicationor otherwiseunder anypatentor patentrights ofSGS-THOMSON Microelectronics.Specificationsmentioned in this publicationare subjectto change without notice.This publication supersedes and replacesall information previouslysupplied. SGS-THOMSON Microelectronicsproducts arenotauthorizedfor useascriticalcomponents inlifesupportdevices orsystemswithout express written approvalof SGS-THOMSON Microelectonics.
1994 SGS-THOMSONMicroelectronics - All Rights Reserved
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10/10
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