Datasheet STP36NF06FP Specification

N-channel 60V - 0.032Ω - 30A - TO-220/TO-220FP

3

General features

Typ e V

STP36NF06 60V <0.040Ω 30A

STP36NF06FP 60V <0.040Ω 18A

1. Current limited by package

■ Exceptional dv/dt capability

■ 100% avalanche tested

■ Application oriented characterization

DSS

Description

This Power MOSFET is the latest development of
STMicroelectronics unique "Single Feature
Size™" strip-based process. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalanche
characteristics and less critical alignment steps
therefore a remarkable manufacturing
reproducibility.

R

DS(on)

I

D

(1)

STP36NF06

STP36NF06FP

STripFET™ II Power MOSFET

3

2

1

TO-220

TO-220FP

Internal schematic diagram

2

1

Applications

■ Switching application

Order codes

Part number Marking Package Packaging

STP36NF06 P36NF06 TO-220 Tube

STP36NF06FP P36NF06 TO-220FP Tube

February 2007 Rev 6 1/14

www.st.com

14

Contents STP36NF06 - STP36NF06FP

Contents

1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

2/14

STP36NF06 - STP36NF06FP Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit

TO-220 TO-220FP

I

V

V

DM

P

I

I

DS

GS

D

D

(2)

tot

Drain-source voltage (VGS = 0) 60 V

Gate- source voltage ± 20 V

Drain current (continuous) at TC = 25°C 30 18

Drain current (continuous) at TC = 100°C 21 12

Drain current (pulsed) 120 72 A

Total dissipation at TC = 25°C 70 25 W

Derating factor 0.47 0.17 W/°C

(3)

dv/dt

E

AS

Peak diode recovery voltage slope 20 V/ns

(4)

Single pulse avalanche energy 200 mJ

Insulation withstand voltage

V

ISO

three leads to external heat
(t = 1s; Tc = 25°C)

T

stg

T

j

1. Current limited by package’s thermal resistance

2. Pulse width limited by safe operating area.

3. ISD ≤ 36A, di/dt ≤ 400A/µs, VDD ≤ V

4. Starting Tj = 25 °C, ID = 18A, VDD = 45V

Storage temperature

Max. operating junction temperature

, Tj ≤ T

(BR)DSS

JMAX

(1)

(1)

-- 2500 V

-55 to 175 °C

A

A

Table 2. Thermal data

TO-220 TO-220FP

Rthj-case Thermal resistance junction-case max 2.14 6 °C/W

Rthj-amb Thermal resistance junction-ambient max 62.5 °C/W

T

1. 1.6 mm from case, for 10 sec.

Maximum lead temperature for soldering

J

purpose

(1)

300 °C

3/14

Electrical characteristics STP36NF06 - STP36NF06FP

2 Electrical characteristics

(T

=25°C unless otherwise specified)

CASE

Table 3. On/off states

Symbol Parameter Test conditions Min. Typ. Max. Unit

V

(BR)DSS

I

DSS

I

GSS

V

GS(th)

R

DS(on)

Drain-source
breakdown voltage

Zero gate voltage
drain current (V

GS

Gate-body leakage
current (V

DS

= 0)

= 0)

ID = 250µA, VGS =0 60 V

V

= max ratings

DS

VDS = max ratings,

= 125°C

T

C

1

10

VGS = ± 20V ±100 nA

Gate threshold voltage VDS = VGS, ID = 250µA 2 4 V

Static drain-source on
resistance

V

= 10V, ID = 15A 0.032 0.040 Ω

GS

Table 4. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit

Forward

(1)

g

fs

C
C

oss

C

t

d(on)

t

t

d(off)

t

Q

Q

Q

1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.

transconductance

Input capacitance

iss

Output capacitance
Reverse transfer

rss

capacitance

Turn-on delay time
Rise time

r

Turn-off delay time
Fall time

f

Total gate charge

g

Gate-source charge

gs

Gate-drain charge

gd

= 25V, ID= 15A 12 S

V

DS

= 25V, f = 1MHz,

V

DS

= 0

V

GS

= 30V, ID = 18A

V

DD

RG=4.7Ω VGS = 10V
(see Figure 15)

VDD = 30V, ID = 18A,
VGS = 10V
(see Figure 16)

690
170

68

10
40
27

9

23

6
9

31 nC

µA
µA

pF
pF
pF

ns
ns
ns
ns

nC
nC

4/14

STP36NF06 - STP36NF06FP Electrical characteristics

Table 5. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit

I

SD

I

SDM

V

SD

t

Q

I

RRM

1. Pulse width limited by safe operating area.

2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%

Source-drain current
Source-drain current

(1)

(pulsed)

(2)

Forward on voltage ISD = 30A, VGS = 0 1.5 V

Reverse recovery time

rr

Reverse recovery charge

rr

Reverse recovery current

ISD = 30A,
di/dt = 100A/µs,

= 30V, Tj = 150°C

V

DD

(see Figure 17)

65

155

4.8

30

120

A
A

ns

nC

A

5/14

Electrical characteristics STP36NF06 - STP36NF06FP

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area for TO-220 Figure 2. Thermal impedance for TO-220

Figure 3. Safe operating area for TO-220FP Figure 4. Thermal impedance for TO-220FP

Figure 5. Output characteristics Figure 6. Transfer characteristics

6/14

STP36NF06 - STP36NF06FP Electrical characteristics

Figure 7. Transconductance Figure 8. Static drain-source on resistance

Figure 9. Gate charge vs. gate-source voltage Figure 10. Capacitance variations

Figure 11. Normalized gate threshold voltage

vs. temperature

Figure 12. Normalized on resistance vs.

temperature

7/14

Electrical characteristics STP36NF06 - STP36NF06FP

Figure 13. Source-drain diode forward

characteristics

Figure 14. Normalized B

vs. temperature

VDSS

8/14

STP36NF06 - STP36NF06FP Test circuit

3 Test circuit

Figure 15. Switching times test circuit for

resistive load

Figure 17. Test circuit for inductive load

switching and diode recovery times

Figure 16. Gate charge test circuit

Figure 18. Unclamped Inductive load test

circuit

Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform

9/14

Package mechanical data STP36NF06 - STP36NF06FP

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com

10/14

STP36NF06 - STP36NF06FP Package mechanical data

L2

A

B

D

E

H

G

L6

F

L3

G1

123

F2

F1

L7

L4

L5

DIM.

mm. inch

MIN. TYP MAX. MIN. TYP. MAX.

A 4.4 4.6 0.173 0.181

B 2.5 2.7 0.098 0.106

D 2.5 2.75 0.098 0.108

E 0.45 0.7 0.017 0.027

F 0.75 1 0.03 0 0.039

F1 1.15 1.7 0.045 0.067

F2 1.15 1.7 0.045 0.067

G 4.95 5.2 0.195 0.204

G1 2.4 2.7 0.094 0.106

H 10 10.4 0.39 3 0.409

L2 16 0.630

L3 28.6 30.6 1.126 1.204

L4 9.8 1 0.6 .0385 0.417

L5 2.9 3.6 0.11 4 0.141

L6 15.9 16.4 0.626 0.645

L7 9 9.3 0.354 0.366

Ø 3 3.2 0.118 0.126

TO-220FP MECHANICAL DATA

11/14

Package mechanical data STP36NF06 - STP36NF06FP

TO-220 MECHANICAL DATA

DIM.

A 4.40 4.60 0.173 0.181

b 0.61 0.88 0.024 0.034

b1 1.15 1.70 0.045 0.066

c 0 .49 0.70 0.019 0.027

D 15.25 15 .75 0.60 0.620

E 10 10.40 0.393 0.409

e 2.40 2.70 0.094 0.106

e1 4.95 5.15 0.194 0.202

F 1.23 1.32 0.048 0.052

H1 6.20 6 .60 0. 244 0.256

J1 2.40 2.72 0. 094 0.107

L 13 14 0.511 0.551

L1 3.50 3.93 0.137 0.154

L20 16.40 0.645

L30 28.90 1.137

øP

Q 2.65 2.95 0.104 0.116

MIN. TYP MAX. MIN. TYP. MAX.

3.75 3.85 0.147 0.151

mm. inch

12/14

STP36NF06 - STP36NF06FP Revision history

5 Revision history

Table 6. Revision history

Date Revision Changes

09-Sep-2004 3 Complete version

16-Aug-2006 4 The document has been reformatted

19-Dec-2006 5 Missing value on Table 3. (V

21-Feb-2007 6 Typo mistake on page 1

GS(th)

)

13/14

STP36NF06 - STP36NF06FP

Please Read Carefully:

Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.

All ST products are sold pursuant to ST’s terms and conditions of sale.

Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.

No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.

UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.

UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.

Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.

ST and the ST logo are trademarks or registered trademarks of ST in various countries.

Information in this document supersedes and replaces all information previously supplied.

The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.

© 2007 STMicroelectronics - All rights reserved

STMicroelectronics group of companies

Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -

Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America

www.st.com

14/14