The device is manufactured in low voltage PNP
Planar Technology by using a “Base Island”
layout. The resulting transistor shows exceptional
high gain performance coupled with very low
saturation voltage.
Order Codes
Part NumberMarkingPackagePacking
STN888N888SOT-223Tape & Reel
rev.2
August 20051/9
www.st.com
9
Page 2
1 Absolute Maximum RatingsSTN888
1 Absolute Maximum Ratings
Table 1.Absolute Maximum Rating
SymbolParameterValueUnit
V
V
V
P
CBO
CEO
EBO
I
I
CM
TOT
T
stg
T
Collector-Base Voltage (IE = 0)
Collector-Emitter Voltage (IB = 0)
Emitter-Base Voltage (IC = 0)
Collector Current-5A
C
Collector Peak Current (tP < 5ms)
Total dissipation at Tc = 25°C
-45V
-30V
-6V
-10A
1.6W
Storage Temperature-65 to 150°C
Max. Operating Junction Temperature150°C
J
Table 2.Thermal Data
SymbolParameterValueUnit
R
thj-amb
Thermal Resista nce Junction-Ambient__________________Max78°C/W
Figure 3.Collector-Emitter Saturation Voltage Figure 4.Base-Emitter Saturation Voltage
Figure 5.Switching Times Resistive LoadFigure 6.Switching Times Resistive Load
4/9
Page 5
STN8883 Test Circuits
3 Test Circuits
Figure 7.Resistive Load Switching Test Circuit
1) Fast Electronic Switching
2) Non-inductive Resisitor
5/9
Page 6
4 Package Mechani cal DataSTN888
4 Package M echanical Da ta
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are
available at: www.st.com
6/9
Page 7
STN8884 Package Mechanical Data
P008B
SOT-223 MECHANICAL DATA
DIM.
MIN.TYP.MAX.MIN.TYP.MAX.
A1.800.071
B0.600.700.800.0240.0270.031
B12.903.003.100.1140.1180.122
c0.240.260.320.0090.0100.013
D6.306.506.700.2480.2560.264
e2.300.090
e14.600.181
E3.303.503.700.1300.1380.146
H6.707.007.300.2640.2760.287
V10
A10.02
mminch
o
o
10
7/9
Page 8
5 Revision Hist orySTN888
5 Revision History
DateRevisionChanges
03-Aug-20051Initial release.
8/9
Page 9
STN8885 Revision History
I
s
o
d
b
ct
t
ot
a
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
f use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grante
y implic ation or otherwise under any patent or patent ri ghts of STM i croelectr onics. Specifications menti oned in thi s publicati on are subje
o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are n
uthoriz ed for use as critical compo nents in life support devic es or systems without express writt en approval of STMicroel ectronics.
The ST logo is a registered t rademark of S TM i croelectr oni cs.
All other nam es are the pro perty of thei r respectiv e owners
Austra l i a - Be l gi um - Brazil - Canada - Chi na - Czech Rep ubl i c - Finland - F rance - Germ any - Hong Kon g - In di a - Israel - It aly - Japan -
Malaysi a - M al ta - Morocco - Singapore - Spain - Swe den - Switzerland - Un i te d Kingdom - United States of America
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www.st.com
9/9
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