Figure 3.TransconductanceFigure 4.Collector-emitter on voltage vs
temperature
Figure 5.Gate charge vs gate-source voltage Figure 6.Capacitance variations
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Page 7
STGP19NC60SDElectrical characteristics
Figure 7.Normalized gate threshold voltage
vs temperature
Figure 9.Normalized breakdown voltage vs
temperature
Figure 8.Collector-emitter on voltage vs
collector current
Figure 10. Switching losses vs temperature
Figure 11. Switching losses vs gate resistance Figure 12. Switching losses vs collector
current
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Electrical characteristicsSTGP19NC60SD
Figure 13. Turn-off SOAFigure 14. Forward voltage drop versus
forward current
Figure 15. Thermal impedanceFigure 16. IC vs. frequency
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STGP19NC60SDElectrical characteristics
2.2 Frequency applications
For a fast IGBT suitable for high frequency applications, the typical collector current vs.
maximum operating frequency curve is reported. That frequency is defined as follows:
f
= (PD - PC) / (EON + E
MAX
●The maximum power dissipation is limited by maximum junction to case thermal
resistance:
Equation 1
P
= ∆T / R
D
THJ-C
considering ∆T = TJ - TC = 125 °C- 75 °C = 50°C
●The conduction losses are:
Equation 2
P
= IC * V
C
CE(SAT)
* δ
with 50% of duty cycle, V
●Power dissipation during ON & OFF commutations is due to the switching frequency:
Equation 3
)
OFF
typical value @125°C.
CESAT
P
= (EON + E
SW
Typical values @ 125°C for switching losses are used (test conditions: V
V
=15V, RG = 10 Ohm). Furthermore, diode recovery energy is included in the EON (see
GE
Note 1), while the tail of the collector current is included in the E
OFF
) * freq.
CE
measurements.
OFF
= 480V,
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Page 10
Test circuitSTGP19NC60SD
3 Test circuit
Figure 17. Test circuit for inductive load
switching
Figure 18. Gate charge test circuit
Figure 19. Switching waveformFigure 20. Diode recovery time waveform
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STGP19NC60SDPackage mechanical data
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect. The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
18-Sep-20073Added new section: Electrical characteristics (curves)
13/14
Page 14
STGP19NC60SD
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