Page 1
N-channel 55V - 0.012Ω - 60A - DPAK/IPAK
3
General features
Type V
STD60NF55L-1 55V <0.015Ω 60A
STD60NF55L 55V <0.015Ω 60A
■ Low threshold drive
DSS
R
DS(on)
STD60NF55L
STD60NF55L-1
STripFET™ II Power MOSFET
I
D
3
1
2
1
Description
This MOSFET is the latest development of
STMicroelectronics unique “Single Feature
Size™” strip-based process. The resulting
transistor shows extremely high packing density
for low on-resistance, rugged avalance
characteristics and less critical alignment steps
therefore a remarkable manufacturing
reproducibility.
Applications
■ Switching application
DPAK
IPAK
Internal schematic diagram
Order codes
Part number Marking Package Packaging
STD60NF55LT4 D60NF55L DPAK Tape & reel
STD60NF55L-1 D60NF55L IPAK Tube
July 2006 Rev 6 1/14
www.st.com
14
Page 2
Contents STD60NF55L - STD60NF55L-1
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
2/14
Page 3
STD60NF55L - STD60NF55L-1 Electrical ratings
1 Electrical ratings
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
I
V
V
DM
P
I
I
DS
GS
D
D
(1)
tot
Drain-source voltage (VGS = 0) 55 V
Gate- source voltage ± 15 V
Drain current (continuous) at TC = 25°C 60 A
Drain current (continuous) at TC = 100°C 42 A
Drain current (pulsed) 240 A
Total dissipation at TC = 25°C 110 W
Derating Factor 0.73 W/°C
(2)
dv/dt
Peak diode recovery voltage slope 16 V/ns
(3)
E
AS
T
stg
T
j
1. Pulse width limited by safe operating area.
2. ISD ≤ 40A, di/dt ≤ 350A/µs, VDD ≤ V(
3. Starting Tj = 25 oC, ID = 17.5A, VDD =24V
Single pulse avalanche energy 400 mJ
Storage temperature
-55 to 175 °C
Max. operating junction temperature
BR)DSS
, Tj ≤ T
JMAX
.
Table 2. Thermal data
Rthj-case Thermal resistance junction-case max 1.36 °C/W
Rthj-amb Thermal resistance junction-to ambient max 62.5 °C/W
T
J
Maximum lead temperature for soldering purpose 275 °C
3/14
Page 4
Electrical characteristics STD60NF55L - STD60NF55L-1
2 Electrical characteristics
(T
=25°C unless otherwise specified)
CASE
Table 3. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source
breakdown voltage
Zero gate voltage
drain current (V
GS
Gate-body leakage
current (V
DS
= 0)
= 0)
ID = 250µA, VGS =0 55 V
V
= Max rating
DS
VDS = Max rating,
= 125°C
T
C
1
10
VGS = ± 15V ±100 nA
Gate threshold voltage VDS = VGS, ID = 250µA 1 2 V
Static drain-source on
resistance
= 10V, ID = 30A
V
GS
= 4.5V, ID = 30A
V
GS
0.012
0.014
0.015
0.017
Table 4. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Forward
(1)
g
fs
transconductance
V
= 10V, ID= 30A 35 S
DS
µA
µA
Ω
Ω
C
C
C
t
d(on)
t
t
d(off)
t
Q
Q
Q
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
Input capacitance
iss
Output capacitance
oss
Reverse transfer
rss
capacitance
Turn-on delay time
Rise time
r
Turn-off delay time
Fall time
f
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
= 25V, f = 1MHz,
V
DS
VGS = 0
= 25V, ID = 30A
V
DD
=4.7Ω VGS = 4.5V
R
G
(see Figure 12)
VDD = 40V, ID = 60A,
= 5V, RG=4.7Ω
V
GS
(see Figure 13)
1950
390
130
30
180
80
35
40
10
20
pF
pF
pF
ns
ns
ns
ns
56 nC
nC
nC
4/14
Page 5
STD60NF55L - STD60NF55L-1 Electrical characteristics
Table 5. Source drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
Source-drain current
Source-drain current
(1)
(pulsed)
(2)
Forward on voltage ISD = 60A, VGS = 0 1.3 V
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
ISD = 40A, di/dt = 100A/µs,
VDD = 25V, Tj = 150°C
(see Figure 14)
65
130
4
60
240
A
A
ns
nC
A
5/14
Page 6
Electrical characteristics STD60NF55L - STD60NF55L-1
2.1 Electrical characteristics (curves)
Figure 1. Safe operating area Figure 2. Thermal impedance
Figure 3. Output characterisics Figure 4. Transfer characteristics
Figure 5. Transconductance Figure 6. Static drain-source on resistance
6/14
Page 7
STD60NF55L - STD60NF55L-1 Electrical characteristics
Figure 7. Gate charge vs gate-source voltage Figure 8. Capacitance variations
Figure 9. Normalized gate threshold voltage
vs temperature
Figure 11. Source-drain diode forward
characteristics
Figure 10. Normalized on resistance vs
temperature
7/14
Page 8
Test circuit STD60NF55L - STD60NF55L-1
3 Test circuit
Figure 12. Switching times test circuit for
resistive load
Figure 14. Test circuit for inductive load
switching and diode recovery times
Figure 13. Gate charge test circuit
Figure 15. Unclamped Inductive load test
circuit
Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform
8/14
Page 9
STD60NF55L - STD60NF55L-1 Package mechanical data
4 Package mechanical data
In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in
compliance with JEDEC Standard JESD97. The maximum ratings related to soldering
conditions are also marked on the inner box label. ECOPACK is an ST trademark.
ECOPACK specifications are available at: www.st.com
9/14
Page 10
Package mechanical data STD60NF55L - STD60NF55L-1
DPAK MECHANICAL DATA
DIM.
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A2 0.03 0.23 0.001 0.009
B 0.64 0.9 0.025 0.035
b4 5.2 5.4 0.204 0.212
C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
D1 5.1 0.200
E 6.4 6.6 0.252 0.260
E1 4.7 0.185
e 2.28 0.090
e1 4.4 4.6 0.173 0.181
H 9.35 10.1 0.368 0.397
L 1 0.039
(L1) 2.8 0.110
L2 0.8 0.031
L4 0.6 1 0.023 0.039
R 0.2 0.008
V2 0° 8° 0° 8°
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
10/14
0068772-F
Page 11
STD60NF55L - STD60NF55L-1 Package mechanical data
0068771-E
TO-251 (IPAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A 2.2 2.4 0.086 0.094
A1 0.9 1.1 0.035 0.043
A3 0.7 1.3 0.027 0.051
B 0.64 0.9 0.025 0.031
B2 5.2 5.4 0.204 0.212
B3 0.85 0.033
B5 0.3 0.012
B6 0.95 0.037
C 0.45 0.6 0.017 0.023
C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244
E 6.4 6.6 0.252 0.260
G 4.4 4.6 0.173 0.181
H 15.9 16.3 0.626 0.641
L 9 9.4 0.354 0.370
L1 0.8 1.2 0.031 0.047
L2 0.8 1 0.031 0.039
H
C
A
E
= =
C2
L2
B2
= =
D
B3
2
1 3
L1
B6
A1
L
A3
B
B5
G
= =
11/14
Page 12
Packing mechanical data STD60NF55L - STD60NF55L-1
5 Packing mechanical data
DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
mm inch
MIN. MAX. MIN. MAX.
12/14
BASE QTY BULK QTY
2500 2500
Page 13
STD60NF55L - STD60NF55L-1 Revision history
6 Revision history
Table 6. Revision history
Date Revision Changes
14-Mar-2005 3 Preliminary version
18-May-2005 4 New package inserted: IPAK
18-Nov-2005 5 Changed value in Ta b l e 4 (Rise Time from 18 to 180ns)
19-Jul-2006 6 New template, no content change
13/14
Page 14
STD60NF55L - STD60NF55L-1
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the
right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any
time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no
liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this
document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products
or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such
third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED
WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED
WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS
OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT
RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING
APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY,
DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE
GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER’S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void
any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any
liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
14/14
Loading...