Datasheet std26nf10 Datasheet

Page 1
Low gate charge STripFET™ II Power MOSFET
Features
Type V
STD26NF10 100V < 0.038Ω 25A
DSS
R
DS(on)
STD26NF10
N-channel 100V - 0.033Ω - 25A - DPAK
I
D
■ Exceptional dv/dt capability
■ Application oriented characterization
■ Application oriented characterization
Description
This Power MOSFET series realized with STMicroelectronics unique STripFET process has specifically been designed to minimize input capacitance and gate charge. It is intended for any application with low gate charge drive requirements.
Applications
■ Switching application
– Automotive
3
1
DPAK
Internal schematic diagram
Order code
Part number Marking Package Packaging
STD26NF10 D26NF10 DPAK Tape & reel
April 2007 Rev 1 1/13
www.st.com
13
Page 2
Contents STD26NF10
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Packing mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
Page 3
STD26NF10 Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
V
I
V
DGR
V
I
D
DM
P
I
DS
GS
(1)
D
(2)
tot
Drain-source voltage (VGS = 0) 100 V
Drain-gate voltage (RGS = 20 kΩ)100V
Gate- source voltage ± 20 V
Drain current (continuous) at TC = 25°C 25 A
Drain current (continuous) at TC = 100°C 21 A
Drain current (pulsed) 100 A
Total dissipation at TC = 25°C 100 W
Derating Factor 0.67 W/°C
(3)
dv/dt
(4)
E
AS
T
stg
T
j
1. Current limited by package
2. Pulse width limited by safe operating area.
3. ISD ≤ 35A, di/dt ≤ 300A/µs, VDD =V(
4. Starting Tj = 25 °C, ID = 12.5A VDD = 50V
Peak diode recovery avalanche energy 13 V/ns
Single pulse avalanche energy 480 mJ
Storage temperature
-55 to 175 °C
Max. operating junction temperature
, Tj ≤ T
BR)DSS
JMAX

Table 2. Thermal data

Rthj-case Thermal resistance junction-case max 1.5 °C/W
Rthj-amb Thermal resistance junction-to ambient max 100 °C/W
T
J
Maximum lead temperature for soldering purpose 300 °C
3/13
Page 4
Electrical characteristics STD26NF10

2 Electrical characteristics

(T
=25°C unless otherwise specified)
CASE

Table 3. On/off states

Symbol Parameter Test conditions Min. Typ. Max. Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Drain-source breakdown voltage
Zero gate voltage drain current (V
GS
Gate-body leakage current (V
DS
= 0)
= 0)
ID = 250µA, VGS =0 100 V
V
= Max rating
DS
VDS = Max rating,
= 125°C
T
C
1
10
VGS = ± 20V ±100 nA
Gate threshold voltage VDS = VGS, ID = 250µA 2 3 4 V
Static drain-source on resistance
V
= 10V, ID = 12.5A 0.033 0.038 Ω
GS

Table 4. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit
Forward
(1)
g
fs
C
C
C
t
d(on)
t
t
d(off)
t
Q
Q
Q
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%.
transconductance
Input capacitance
iss
Output capacitance
oss
Reverse transfer
rss
capacitance
Turn-on delay time Rise time
r
Turn-off delay time Fall time
f
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
= 15V, ID= 12.5A 20 S
V
DS
= 25V, f = 1MHz,
V
DS
= 0
V
GS
= 50V, ID = 12.5A
V
DD
RG=4.7Ω VGS = 10V (see Figure 12)
VDD = 80V, ID = 12.5A, VGS = 10V, RG=4.7Ω (see Figure 13)
1550
220
95
17 60 60 15
55 12 20
µA µA
pF pF pF
ns ns ns ns
nC nC nC
4/13
Page 5
STD26NF10 Electrical characteristics

Table 5. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit
I
SD
I
SDM
V
SD
t
Q
I
RRM
1. Pulse width limited by safe operating area.
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5%
Source-drain current Source-drain current
(1)
(pulsed)
(2)
Forward on voltage ISD = 25A, VGS = 0 1.5 V
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
ISD = 25A, di/dt = 100A/µs, VDD = 50V, Tj = 150°C (see Figure 14)
88
317
7.2
25
100
A A
ns
nC
A
5/13
Page 6
Electrical characteristics STD26NF10

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance
Figure 3. Output characteristics Figure 4. Transfer characteristics
Figure 5. Transconductance Figure 6. Static drain-source on resistance
6/13
Page 7
STD26NF10 Electrical characteristics
Figure 7. Gate charge vs. gate-source voltage Figure 8. Capacitance variations
Figure 9. Normalized gate threshold voltage
vs. temperature
Figure 11. Source-drain diode forward
characteristics
Figure 10. Normalized on resistance vs.
temperature
7/13
Page 8
Test circuit STD26NF10

3 Test circuit

Figure 12. Switching times test circuit for
resistive load
Figure 14. Test circuit for inductive load
switching and diode recovery times

Figure 13. Gate charge test circuit

Figure 15. Unclamped Inductive load test
circuit

Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform

8/13
Page 9
STD26NF10 Package mechanical data

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect. The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
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Page 10
Package mechanical data STD26NF10
DPAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 2.2 2.4 0.086 0.094 A1 0.9 1.1 0.035 0.043 A2 0.03 0.23 0.001 0.009
B 0.64 0.9 0.025 0.035 b4 5.2 5.4 0.204 0.212
C 0.45 0.6 0.017 0.023 C2 0.48 0.6 0.019 0.023
D 6 6.2 0.236 0.244 D1 5.1 0.200
E 6.4 6.6 0.252 0.260 E1 4.7 0.185
e 2.28 0.090
e1 4.4 4.6 0.173 0.181
H 9.35 10.1 0.368 0.397
L 1 0.039
(L1) 2.8 0.110
L2 0.8 0.031 L4 0.6 1 0.023 0.039
R 0.2 0.008 V2 0° 8° 0° 8°
mm. inch
10/13
0068772-F
Page 11
STD26NF10 Packing mechanical data

5 Packing mechanical data

DPAK FOOTPRINT
All dimensions are in millimeters
TAPE AND REEL SHIPMENT
TAPE MECHANICAL DATA
DIM.
A0 6.8 7 0.267 0.275
B0 10.4 10.6 0.409 0.417
B1 12.1 0.476
D 1.5 1.6 0.059 0.063
D1 1.5 0.059
E 1.65 1.85 0.065 0.073
F 7.4 7.6 0.291 0.299
K0 2.55 2.75 0.100 0.108
P0 3.9 4.1 0.153 0.161
P1 7.9 8.1 0.311 0.319
P2 1.9 2.1 0.075 0.082
R 40 1.574
W 15.7 16.3 0.618 0.641
mm inch
MIN. MAX. MIN. MAX.
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0.795
G 16.4 18.4 0.645 0.724
N 50 1.968
T 22.4 0.881
BASE QTY BULK QTY
mm inch
MIN. MAX. MIN. MAX.
2500 2500
11/13
Page 12
Revision history STD26NF10

6 Revision history

Table 6. Revision history

Date Revision Changes
20-Apr-2007 1 First release
12/13
Page 13
STD26NF10
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