Datasheet STP7NK80Z, STP7NK80ZFP, STB7NK80Z-1, STB7NK80Z Datasheet (SGS Thomson Microelectronics)

Page 1
STP7NK80Z - STP7NK80ZFP
STB7NK80Z - STB7NK80Z-1
N-CHANNEL800V-1.5Ω - 5.2A TO-220/TO-220FP/I2PAK/D2PAK
TYPE V
STP7NK80Z STP7NK80ZFP STB7NK80Z STB7NK80Z-1
TYPICAL R
EXTREMELY HIGH dv/dt CAPABILITY
100% AVALANCHE TESTED
GAT E CHARGE MINIMIZED
VERY LOW INTRINSIC CAPACITANCES
VER Y GO OD MANUFACTURING
800 V 800 V 800 V 800 V
(on) = 1.5
DS
DSS
R
DS(on)
< 1.8 < 1.8 < 1.8 < 1.8
I
D
5.2 A
5.2 A
5.2 A
5.2 A
Pw
125 W
30 W 125 W 125 W
REPEATIBILITY
DESCRIPTION
The SuperMESH™ series is obtained through an extreme optimization of ST’s well established s tri p­based PowerMESH™ layout. In addition to pushing on-resistance significantly down, special careis tak­en t o ensure a very good dv/dt capability for the most demanding applicat ions. Such series comple­ments ST full range of high voltage MOSFETs in­cluding revolutionary MDm es h™ products.
TO-220
3
2
1
TO-220FP
D2PAK
I2PAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
1
APPLICATIONS
HIGH CURRENT,HIGH SPEED SWITCHING
SMPS FOR INDUSTRIAL APPLICATION.
LIGHT ING (PREHE ATING)
ORDERING INFORMATION
SALES TYPE MARKING PACKAGE PACKAGING
STP7NK80Z P7NK80Z TO-220 TUBE
STP7NK80ZFP P7NK80ZFP TO-220FP TUBE STB7NK80ZT4 B7NK80Z
STB7NK80Z B7NK80Z
STB7NK80Z-1 B7NK80Z
2
PAK
D
2
PAK
D
2
PAK
I
(ONLY UNDER REQUEST)
TAPE & REEL
TUBE
TUBE
1/13August 2002
Page 2
STP7NK80Z - STP7NK80ZFP - STB7NK80Z - STB7NK80Z-1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP7NK80Z STB7NK80Z
STB7NK80Z-1
I
V
DM
P
V
DGR
V
I I
TOT
DS
GS
D D
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
800 V
800 V Gate- source Voltage ± 30 V Drain Current (continuous) at TC= 25°C Drain Current (continuous) at TC= 100°C
()
Drain Current (pulsed) 20.8 20.8 (*) A Total Dissipation at TC= 25°C
5.2 5.2 (*) A
3.3 3.3 (*) A
125 30 W
Derating Factor 1 0.24 W/°C
V
ESD(G-S)
Gate source ESD(HBM-C=100pF, R=1.5KΩ) 4000 V
dv/dt (1) Peak Diode Recovery voltage slope 4.5 V/ns
V
ISO
T
j
T
stg
() Pulse width limited by safe operating area (1) I
5.2A, di/dt 200A/µs, VDD≤ V
SD
(*) Limited only by maximum temperature allowed
Insulation Withstand Voltage (DC) - 2500 V Operating Junction Temperature
Storage Temperature
(BR)DSS,Tj≤TJMAX.
-55 to 150
-55 to 150
STP7NK80ZFP
°C °C
THERMAL DATA
TO-220
D
2
I
2
PAK
PAK
TO-220FP
Rthj-case Thermal Resistance Junction-case Max 1 4.2 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 50 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose
300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
= 25 °C, ID=IAR,VDD=50V)
j
5.2 A
210 mJ
GATE-SOURCE ZENER DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
BV
GSO
Gate-Source Breakdown Voltage
Igs=± 1mA (Open Drain) 30 V
PROTECTION FEATURES OF GATE-TO-SOURCE ZENER DIODES
The built-in back-to-back Zener diodes havespecifically been designed to enhance not only the dev ice’s ESD c apability, but also to make them sa fely absorb pos sible voltage transients that may occasionally be applied from gate to source. In this respect the Zener voltage is appropriate to achieve an efficient and cost-effective intervention to protect the device’s integrity. These integrated Zener d iodes thus avoid t he usage of external components.
2/13
Page 3
STP7NK80Z - STP7NK 80Z FP - STB7NK80Z - STB7NK80Z-1
ELECTRICAL CHARACTERISTICS (TCASE =25°C UNLESS OT HERWISE SPECIFIED)
ON/OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source Breakdown Voltage
I
DSS
I
GSS
V
GS(th)
R
DS(on)
Zero Gate Voltage Drain Current (V
GS
=0)
Gate-body Leakage Current (V
DS
=0) Gate Threshold Voltage Static Drain-source On
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS=15V,ID= 2.6 A 5 S
g
fs
Input Capacitance Output Capacitance Reverse Transfer Capacitance
(3) Equivalent Output
C
oss eq.
C
iss
C
oss
C
rss
Capacitance
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(on)
Q Q Q
t
r
g gs gd
Turn-on Delay Time Rise Time
Total Gate Charge Gate-Source Charge Gate-Drain Charge
ID=1mA,VGS= 0 800 V
V
= Max Rating
DS
VDS= Max Rating, TC= 125 °C V
= ± 20V ±10 µA
GS
V
DS=VGS,ID
= 100µA
3 3.75 4.5 V
1
50
VGS=10V,ID= 2.6 A 1.5 1.8
=25V,f=1MHz,VGS=0 1138
V
DS
122
25
VGS=0V,VDS= 0V to 640V 50 pF
VDD=400V,ID= 2.6 A RG= 4.7VGS=10V
20 12
(Resistive Load see, Figure 3)
=640V,ID= 5.2 A,
V
DD
V
=10V
GS
40
7
56 nC
21
µA µA
pF pF pF
ns ns
nC nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
d(off)
Turn-off Delay Time
t
f
Fall Time
VDD= 400 V, ID= 2.6 A R
=4.7ΩVGS=10V
G
45 22
(Resistive Load see, Figure 3)
t
r(Voff)
t t
= 640V, ID= 5.2 A,
Off-voltage Rise Time
f
c
Fall Time Cross-over Time
V
DD
RG=4.7Ω, VGS= 10V (Inductive Load see, Figure 5)
12 10 20
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
RRM
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
3. C
Source-drain Current
(2)
Source-drain Current (pulsed) Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
.
V
DSS
ISD= 5.2 A, VGS=0 I
SD
VDD=50V,Tj= 150°C (see test circuit, Figure 5)
= 5.2 A, di/dt = 100A/µs
530
3.31
12.5
when VDSincreases from 0 to 80%
oss
5.2
20.8
1.6 V
ns ns
ns ns ns
A A
ns
µC
A
3/13
Page 4
STP7NK80Z - STP7NK80ZF P - STB7NK80Z - STB 7NK80Z -1
Safe Operating Area For TO-220/D2PAK/I2PAK
Thermal Impedan ce For TO-220/D2PAK/I2PAK
Safe Operating Area For TO-220FP
Thermal Impedance For TO-220FP
Output Characteristics
4/13
Transfer Characteristics
Page 5
STP7NK80Z - STP7NK 80Z FP - STB7NK80Z - STB7NK80Z-1
Transconductance
Gate Charge vs Gate-so urce Voltage Capacitance Variations
Static Drain-source On Resistance
Normalized Gate Threshold Voltage vs Temp. Normalized On Resistance vs Temperature
5/13
Page 6
STP7NK80Z - STP7NK80ZF P - STB7NK80Z - STB 7NK80Z -1
Source-drain Diode Forward Ch aracteristics
Maximum Avalanche Energy vs Temperature
Normalized BVDSS vs Temperature
6/13
Page 7
STP7NK80Z - STP7NK 80Z FP - STB7NK80Z - STB7NK80Z-1
Fig. 2: Unclamped Induct ive WaveformFig. 1: Unclamped Inductive Load Test Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Load Switching And Di ode Recovery Times
Fig. 4: Gate Charge tes t Circuit
7/13
Page 8
STP7NK80Z - STP7NK80ZF P - STB7NK80Z - STB 7NK80Z -1
E
P011C
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 C 1.23 1.32 0.048 0.051 D 2.40 2.72 0.094 0.107
D1 1.27 0.050
E 0.49 0.70 0.019 0.027
F 0.61 0.88 0.024 0.034 F1 1.14 1.70 0.044 0.067 F2 1.14 1.70 0.044 0.067
G 4.95 5.15 0.194 0.203 G1 2.4 2.7 0.094 0.106 H2 10.0 10.40 0.393 0.409 L2 16.4 0.645 L4 13.0 14.0 0.511 0.551 L5 2.65 2.95 0.104 0.116 L6 15.25 15.75 0.600 0.620 L7 6.2 6.6 0.244 0.260 L9 3.5 3.93 0.137 0.154
DIA. 3.75 3.85 0.147 0.151
MIN. TYP. MAX. MIN. TYP. MAX.
mm inch
A
C
D
8/13
L5
Dia.
L7
D1
L6
L2
L9
F1
G1
F
H2
G
F2
L4
Page 9
STP7NK80Z - STP7NK 80Z FP - STB7NK80Z - STB7NK80Z-1
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.5 0.045 0.067 F2 1.15 1.5 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
L3
L6
L7
¯
F1
F
G1
H
G
F2
123
L2
L5
L4
9/13
Page 10
STP7NK80Z - STP7NK80ZF P - STB7NK80Z - STB 7NK80Z -1
D2PAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068
mm. inch
M 2.4 3.2 0.094 0.126
R 0.4 0.015 V2
3
10/13
1
Page 11
STP7NK80Z - STP7NK 80Z FP - STB7NK80Z - STB7NK80Z-1
P011P5/E
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106
E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531 L1 3.48 3.78 0.137 0.149 L2 1.27 1.4 0.050 0.055
mm inch
C
A
A1
C2
B2
B
e
E
L1
L2
D
L
11/13
Page 12
STP7NK80Z - STP7NK80ZF P - STB7NK80Z - STB 7NK80Z -1
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520 D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937 T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421 B0 15.7 15 .9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1. 65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456 K0 4.8 5. 0 0.189 0.197 P0 3.9 4.1 0. 153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0. 075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales ty pe
12/13
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
Page 13
STP7NK80Z - STP7NK 80Z FP - STB7NK80Z - STB7NK80Z-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility f or t he consequences of use of su ch in formation nor for any in fringement of patents or other rights of third parties w hich may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously suppli ed. STMi croelect ronics pr oducts are not author ized for use as cr itical component s in li fe suppo rt devi ces or systems without express written approval of STMicroelectronics.
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