Datasheet stb20nm60d Datasheet

Page 1
N-channel 600V - 0.26Ω - 20A - D2PA K
General features
Type V
STB20NM60D 600V <0.29Ω 20A 45W
■ 100% Avalanche tested
■ Low input capacitance and gate charge
■ Low gate input resistance
■ Tight process control and high manufacturing
yields
DSS
R
DS(on)ID
Pw
STB20NM60D
FDmesh™ Power MOSFET
3
1
D²PAK
Description
The FDmesh™ associates all advantages of reduced on-resistance and fast switching with an intrinsic fast-recovery body diode. It is therefore strongly recommended for bridge topologies, in particular ZVS phase-shift converters.
Applications
■ Switching application
Order codes
Part number Marking Package Packaging
STB20NM60D B20NM60D D²PAK Tape & reel
Internal schematic diagram
June 2006 Rev 1 1/13
www.st.com
13
Page 2
Contents STB20NM60D
Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Test circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
2/13
Page 3
STB20NM60D Electrical ratings

1 Electrical ratings

Table 1. Absolute maximum ratings

Symbol Parameter Value Unit
Drain-source voltage (VGS = 0) 600 V
DS
Drain-gate voltage (RGS = 20 kΩ) 600 V
DGR
Gate- source voltage ± 30 V
GS
Drain current (continuous) at TC = 25°C 20 A
I
D
I
Drain current (continuous) at TC = 100°C 12.6 A
D
(1)
Drain current (pulsed) 80 A
Total dissipation at TC = 25°C 192 W
TOT
V
I
DM
P
V
V
Derating factor 1.20 W/°C
(2)
dv/dt
T
1. Pulse width limited by safe operating area
2. ISD < 20A, di/dt < 400A/µs, VDD = 80%V

Table 2. Thermal resistance

Peak diode recovery voltage slope 20 V/ns
T
Operating junction temperature
j
Storage temperature
stg
(BR)DSS
– 65 to 150
Symbol Parameter Value Unit
Rthj-case Thermal resistance junction-case Max 0.65 °C/W
Rthj-amb Thermal resistance junction-ambient Max 62.5 °C/W
Maximum lead temperature for soldering
T
l
purpose

Table 3. Avalanche data

300 °C
°C °C
Symbol Parameter Value Unit
I
E
Avalanche current, repetitive or not-repetitive
AR
(pulse width limited by T
max)
j
Single pulse avalanche energy
AS
(starting T
= 25 °C, ID = IAR, VDD = 35 V)
j
10 A
700 mJ
3/13
Page 4
Electrical characteristics STB20NM60D

2 Electrical characteristics

(T

Table 4. On/off states

=25°C unless otherwise specified)
CASE
Symbol Parameter Test condictions Min Typ Max Unit
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
R
DS(on)

Table 5. Dynamic

Drain-source breakdown voltage
Zero gate voltage drain current (VGS = 0)
Gate-body leakage current (VDS = 0)
Gate threshold voltage VDS = VGS, ID = 250µA 3 4 5 V
Static drain-source on resistance
I
= 250µA, VGS = 0 600 V
D
VDS = Max rating
110µA
VDS = Max rating, TC = 125 °C
VGS = ±30V
= 10V, ID = 10A 0.26 0.29 Ω
V
GS
±10
0
Symbol Parameter Test condictions Min Typ Max Unit
g
C
oss eq.
> I
(1)
fs
C C C
Forward transconductance
Input capacitance
iss
Output capacitance
oss
Reverse transfer capacitance
rss
(2)
Equivalent output capacitance VGS = 0V, VDS = 0V to 480V 190 pF
V
DS
ID=10A
VDS = 25V, f = 1 MHz, VGS = 0
D(on)
x R
DS(on)max,
9S
1300
500
35
f=1 MHz Gate DC Bias = 0
R
Gate input resistance
G
Test signal level = 20mV
2.7 Ω
open drain
Q Q Q
1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %
2. C
oss eq.
increases from 0 to 80%
Total gate charge
g
Gate-source charge
gs
Gate-drain charge
gd
is defined as a constant equivalent capacitance giving the same charging time as C
= 480V, ID = 20A,
V
DD
= 10V
V
GS
(see Figure 13)
37 10 17
when VDS
oss
52 nC
µA
µA
pF pF pF
nC nC
4/13
Page 5
STB20NM60D Electrical characteristics

Table 6. Switching times

Symbol Parameter Test condictions Min. Typ. Max. Unit
= 300V, ID = 10A
V
t
d(on)
t
r(Voff)

Table 7. Source drain diode

Turn-on delay time
t
Rise time
r
Off-voltage rise time
t
Fall time
f
t
Cross-over time
c
Symbol Parameter Test condictions Min Typ. Max Unit
DD
RG=4.7Ω VGS = 10V
(see Figure 12)
= 480 V, ID = 20A,
V
DD
RG=4.7Ω, V
GS
= 10V
(see Figure 12)
25 12
22 30
ns ns
8
ns ns ns
I
SD
I
SDM
V
SD
t
Q
I
RRM
t
Q
I
RRM
1. Pulse width limited by safe operating area
2. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
Source-drain current
(1)
Source-drain current (pulsed)
(2)
Forward on voltage ISD = 20 A, VGS = 0 1.5 V
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
Reverse recovery time
rr
Reverse recovery charge
rr
Reverse recovery current
= 20 A, Tj = 25°C
I
SD
di/dt =100A/µs,V
DD
=60V
(see Figure 17)
ISD = 20 A, Tj = 150°C di/dt =100A/µs,V
DD
=60V
(see Figure 17)
240
1800
16
396
2960
20
2080A
A
ns
nC
A
ns
nC
A
5/13
Page 6
Electrical characteristics STB20NM60D

2.1 Electrical characteristics (curves)

Figure 1. Safe operating area Figure 2. Thermal impedance
Figure 3. Output characterisics Figure 4. Transfer characteristics
Figure 5. Transconductance Figure 6. Static drain-source on resistance
6/13
Page 7
STB20NM60D Electrical characteristics
Figure 7. Gate charge vs gate-source voltage Figure 8. Capacitance variations
Figure 9. Normalized gate threshold voltage
vs temperature
Figure 11. Source-drain diode forward
characteristics
Figure 10. Normalized on resistance vs
temperature
7/13
Page 8
Test circuit STB20NM60D

3 Test circuit

Figure 12. Switching times test circuit for
resistive load
Figure 14. Test circuit for inductive load
switching and diode recovery times

Figure 13. Gate charge test circuit

Figure 15. Unclamped inductive load test
circuit

Figure 16. Unclamped inductive waveform Figure 17. Switching time waveform

8/13
Page 9
STB20NM60D Package mechanical data

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a Lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com
9/13
Page 10
Package mechanical data STB20NM60D
D2PAK MECHANICAL DATA
TO-247 MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
M 2.4 3.2 0.094 0.126
R0.4 0.015
V2 0º 4º
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
3
10/13
1
Page 11
STB20NM60D Packaging mechanical data

5 Packaging mechanical data

D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales type
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
11/13
Page 12
Revision history STB20NM60D

6 Revision history

Table 8. Revision history

Date Revision Changes
08-Jun-2006 1 First release
12/13
Page 13
STB20NM60D
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice.
All ST products are sold pursuant to ST’s terms and conditions of sale.
Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST’S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT.
UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZE REPRESENTATIVE OF ST, ST PRODUCTS ARE NOT DESIGNED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS, WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries.
Information in this document supersedes and replaces all information previously supplied.
The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
© 2006 STMicroelectronics - All rights reserved
STMicroelectronics group of companies
Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan -
Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America
www.st.com
13/13
Loading...