Page 1
STP11NM60 - STP11NM60FP
STB11NM60 - STB11NM60-1
N-CHANNEL600V - 0.4Ω -11ATO-220/TO-220FP/D2PAK/I2PAK
MDmesh™Power MOSFET
TYPE V
STP11NM60
STP11NM60FP
STB11NM60
STB11NM60-1
TYPICAL RDS(on) = 0.4Ω
HIGH dv/dt AND AVALANCHE CA PABILITIES
100% AVALANCHE TESTED
LOW INPUT CAPACITANCE AND GATE
DSS
600 V
600 V
600 V
600 V
R
DS(on)
< 0.45 Ω
< 0.45 Ω
< 0.45 Ω
< 0.45 Ω
I
D
11 A
11 A
11 A
11 A
CHARGE
LOW GATE INPUT RESISTANCE
DESCRIPTION
The MDmesh ™ is a new revolutionary MOSFET
technology that associates the Multiple Drain process with the Company’s PowerMESH™ horizontal
layout. The resulting product has an outstandinglow
on-resistance, impressively high dv/dt and excellent
avalanche characteristics. The adoption of the
Company’s proprietary strip technique yields overall
dynamic performancethat is significantly better than
that of similar competition’s products.
APPLICATIONS
The MDmesh™ family isvery suitable for increasing
power density of high voltage converters allowing
system miniaturization and higher efficiencies.
3
2
1
TO-220
1
D2PAK
3
TO-220FP
I2PAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP(B)11NM60(-1) STP11NM60FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt(1) Peak Diode Recovery voltage slope 15 V/ns
V
ISO
T
stg
T
j
(•)Pulse width limited by safe operating area
Drain-source Voltage (VGS=0)
Drain-gate Voltage (RGS=20kΩ)
600 V
600 V
Gate- source Voltage ±30 V
Drain Current (continuous) at TC= 25°C
Drain Current (continuous) at TC= 100°C
( )
Drain Current (pulsed) 44 44 (*) A
Total Dissipation at TC= 25°C
11 11 (*) A
7 7 (*) A
160 35 W
Derating Factor 1.28 0.28 W/°C
Insulation Winthstand Voltage (DC) -- 2500 V
Storage Temperature –65 to 150 °C
Max. Operating Junction Temperature 150 °C
(*)Limited only by maximum temperature allowed
<11A, di/dt<400A/µs, VDD<V
(1)I
SD
(BR)DSS,TJ<TJMAX
1/12 May 2003
Page 2
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
THERMAL DATA
TO-220/D2PAK/I2PAK
Rthj-case Thermal Resistance Junction-case Max 0.78 3.57 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive
(pulse width limited by T
max)
j
Single Pulse Avalanche Energy
(starting T
= 25 °C, ID=IAR,VDD=50V)
j
TO-220FP
5.5 A
350 mJ
ELECTRICAL CHARACTERISTICS (T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID= 250 µA, VGS= 0 600 V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage
Drain Current (V
GS
Gate-body Leakage
Current (V
DS
=0)
=0)
V
= Max Rating
DS
= Max Rating, TC= 125 °C
V
DS
V
= ±30V ±100 nA
GS
1µ A
10 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage
Static Drain-source On
V
DS=VGS,ID
VGS=10V,ID= 5.5A
= 250µA
345V
0.4 0.45 Ω
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
C
iss
C
oss
C
rss
Input Capacitance
Output Capacitance 230 pF
Reverse Transfer
Capacitance
C
(2) Equivalent Output
oss eq.
Capacitance
R
G
1. Pulsed:Pulse duration = 300 µs, duty cycle1.5%.
2. C
Gate Input Resistance f=1 MHz Gate DC Bias = 0
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
V
.
DSS
D(on)xRDS(on)max,
ID= 5.5A
V
=25V,f=1MHz,VGS=0
DS
VGS=0V,VDS= 0V to 480V 100 pF
Test Signal Level = 20mV
Open Drain
5.2 S
1000 pF
25 pF
1.6 Ω
when VDSincreases from 0 to 80%
oss
2/12
Page 3
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q
Q
Q
t
r
gs
gd
Turn-on Delay Time
Rise Time 20 ns
Total Gate Charge
g
Gate-Source Charge 10 nC
Gate-Drain Charge 15 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time
Fall Time 11 ns
Cross-over Time 19 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
rrm
t
rr
Q
rr
I
rrm
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 11 A
(2)
Source-drain Current (pulsed) 44 A
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Safe Operating Area for TO-2 20/D2PAK/I2PAK Safe Operating Area for TO-220FP
= 300V, ID= 5.5A
DD
= 4.7Ω VGS=10V
R
G
(see test circuit, Figure 3)
V
= 400V, ID=11A,
DD
VGS=10V
V
=400V,ID= 11A,
DD
= 4.7Ω, V GS=10V
R
G
(see test circuit, Figure 5)
ISD=11A,VGS=0
= 11A, di/dt = 100A/µs,
I
SD
VDD= 100 V, Tj= 25°C
(see test circuit, Figure 5)
I
= 11A, di/dt = 100A/µs,
SD
V
= 100 V, Tj= 150°C
DD
(see test circuit, Figure 5)
20 ns
30 nC
6n s
1.5 V
390
3.8
19.5
570
5.7
20
ns
µC
A
ns
µC
A
3/12
Page 4
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Thermal Impedance for TO-220/D2PAK/I2PA K
Thermal Impedance for TO-220FP
Transfer Characteristics Output Characteristics
Transconductance
4/12
Static Drain-source On Resistance
Page 5
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Gate Charge vs Gate-so urc e V oltage
Capacitance Variations
Normalized On Resistance vs Temperature Normalized Gate Thereshold Voltage vs Temp.
Source-drain Diode Forward Characteristics
5/12
Page 6
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Fig. 2: Unclamped Inductive Waveform Fig. 1: Unclamped Inductive Load T es t Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Lo ad Switching
And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/12
Page 7
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181
b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027
D 15.25 15.75 0.60 0.620
E 10 10.40 0.393 0.409
e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256
J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154
L20 16.40 0.645
L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
7/12
Page 8
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181
B 2.5 2.7 0.098 0.106
D 2.5 2.75 0.098 0.108
E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039
F1 1.15 1.7 0.045 0.067
F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409
L2 16 0.630
L3 28.6 30.6 1.126 1.204
L4 9.8 10.6 .0385 0.417
L5 2.9 3.6 0.114 0.141
L6 15.9 16.4 0.626 0.645
L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
8/12
L3
L6
L7
F1
F
G1
H
F2
123
L4
L2
L5
G
Page 9
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
D2PAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393
E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625
L2 1.27 1.4 0.050 0.055
L3 1.4 1.75 0.055 0.068
mm. inch
M 2.4 3.2 0.094 0.126
R 0.4 0.015
V2 0º 8º
3
9/12
1
Page 10
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106
E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531
L1 3.48 3.78 0.137 0.149
L2 1.27 1.4 0.050 0.055
mm inch
C
10/12
A
A1
C2
B2
B
e
E
L1
L2
D
L
P011P5/E
Page 11
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992
B 1.5 0.059
C 12.8 13.2 0.504 0.520
D 20.2 0795
G 24.4 26.4 0.960 1.039
N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421
B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456
K0 4.8 5.0 0.189 0.197
P0 3.9 4.1 0.153 0.161
P1 11.9 12.1 0.468 0.476
P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales ty pe
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
11/12
Page 12
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the
consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom
its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications
mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information
previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or
systems without express written approval of STMicroelectronics.
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