Datasheet STP11NM60FP, STB11NM60-1, STB11NM60 Datasheet (SGS Thomson Microelectronics)

Page 1
STP11NM60 - STP11NM60FP
STB11NM60 - STB11NM60-1
N-CHANNEL600V - 0.4-11ATO-220/TO-220FP/D2PAK/I2PAK
TYPE V
STP11NM60 STP11NM60FP STB11NM60 STB11NM60-1
TYPICAL RDS(on) = 0.4
HIGH dv/dt AND AVALANCHE CA PABILITIES
100% AVALANCHE TESTED
LOW INPUT CAPACITANCE AND GATE
DSS
600 V 600 V 600 V 600 V
R
DS(on)
< 0.45 < 0.45 < 0.45 < 0.45
I
D
11 A 11 A 11 A 11 A
CHARGE
LOW GATE INPUT RESISTANCE
DESCRIPTION
The MDmesh ™ is a new revolutionary MOSFET technology that associates the Multiple Drain pro­cess with the Company’s PowerMESH™ horizontal layout. The resulting product has an outstandinglow on-resistance, impressively high dv/dt and excellent avalanche characteristics. The adoption of the Company’s proprietary strip technique yields overall dynamic performancethat is significantly better than that of similar competition’s products.
APPLICATIONS
The MDmesh™ family isvery suitable for increasing power density of high voltage converters allowing system miniaturization and higher efficiencies.
3
2
1
TO-220
1
D2PAK
3
TO-220FP
I2PAK
INTERNAL SCHEMATIC DIAGRAM
3
2
1
3
2
1
ABSOLUTE MAXIMUM RATINGS
Symbol Parameter Value Unit
STP(B)11NM60(-1) STP11NM60FP
V
DS
V
DGR
V
GS
I
D
I
D
I
DM
P
TOT
dv/dt(1) Peak Diode Recovery voltage slope 15 V/ns
V
ISO
T
stg
T
j
(•)Pulse width limited by safe operating area
Drain-source Voltage (VGS=0) Drain-gate Voltage (RGS=20kΩ)
600 V
600 V Gate- source Voltage ±30 V Drain Current (continuous) at TC= 25°C Drain Current (continuous) at TC= 100°C
()
Drain Current (pulsed) 44 44 (*) A Total Dissipation at TC= 25°C
11 11 (*) A
7 7 (*) A
160 35 W
Derating Factor 1.28 0.28 W/°C
Insulation Winthstand Voltage (DC) -- 2500 V Storage Temperature –65 to 150 °C Max. Operating Junction Temperature 150 °C
(*)Limited only by maximum temperature allowed
<11A, di/dt<400A/µs, VDD<V
(1)I
SD
(BR)DSS,TJ<TJMAX
1/12May 2003
Page 2
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
THERMAL DATA
TO-220/D2PAK/I2PAK
Rthj-case Thermal Resistance Junction-case Max 0.78 3.57 °C/W
Rthj-amb Thermal Resistance Junction-ambient Max 62.5 °C/W
T
l
Maximum Lead Temperature For Soldering Purpose 300 °C
AVALANCHE CHARACTERISTICS
Symbol Parameter Max Value Unit
I
AR
E
AS
Avalanche Current, Repetitive or Not-Repetitive (pulse width limited by T
max)
j
Single Pulse Avalanche Energy (starting T
= 25 °C, ID=IAR,VDD=50V)
j
TO-220FP
5.5 A
350 mJ
ELECTRICAL CHARACTERISTICS (T
= 25 °C UNLESS OTHERWISE SPECIFIED)
CASE
OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
(BR)DSS
Drain-source
ID= 250 µA, VGS= 0 600 V
Breakdown Voltage
I
DSS
I
GSS
Zero Gate Voltage Drain Current (V
GS
Gate-body Leakage Current (V
DS
=0)
=0)
V
= Max Rating
DS
= Max Rating, TC= 125 °C
V
DS
V
= ±30V ±100 nA
GS
A
10 µA
ON (1)
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
GS(th)
R
DS(on)
Gate Threshold Voltage Static Drain-source On
V
DS=VGS,ID
VGS=10V,ID= 5.5A
= 250µA
345V
0.4 0.45
Resistance
DYNAMIC
Symbol Parameter Test Conditions Min. Typ. Max. Unit
(1) Forward Transconductance VDS>I
g
fs
C
iss
C
oss
C
rss
Input Capacitance Output Capacitance 230 pF Reverse Transfer
Capacitance
C
(2) Equivalent Output
oss eq.
Capacitance
R
G
1. Pulsed:Pulse duration = 300 µs, duty cycle1.5%.
2. C
Gate Input Resistance f=1 MHz Gate DC Bias = 0
is defined as a constant equivalent capacitance giving the same charging time as C
oss eq.
V
.
DSS
D(on)xRDS(on)max,
ID= 5.5A
V
=25V,f=1MHz,VGS=0
DS
VGS=0V,VDS= 0V to 480V 100 pF
Test Signal Level = 20mV Open Drain
5.2 S
1000 pF
25 pF
1.6
when VDSincreases from 0 to 80%
oss
2/12
Page 3
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
ELECTRICAL CHARACTERISTICS (CONTINUED)
SWITCHING ON
Symbol Parameter Test Conditions Min. Typ. Max. Unit
V
t
d(on)
Q
Q
Q
t
r
gs
gd
Turn-on Delay Time Rise Time 20 ns Total Gate Charge
g
Gate-Source Charge 10 nC Gate-Drain Charge 15 nC
SWITCHING OFF
Symbol Parameter Test Conditions Min. Typ. Max. Unit
t
r(Voff)
t
f
t
c
Off-voltage Rise Time Fall Time 11 ns Cross-over Time 19 ns
SOURCE DRAIN DIODE
Symbol Parameter Test Conditions Min. Typ. Max. Unit
I
SD
I
SDM
VSD(1)
t
rr
Q
rr
I
rrm
t
rr
Q
rr
I
rrm
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
2. Pulse width limited by safe operating area.
Source-drain Current 11 A
(2)
Source-drain Current (pulsed) 44 A Forward On Voltage Reverse Recovery Time
Reverse Recovery Charge Reverse Recovery Current
Reverse Recovery Time Reverse Recovery Charge Reverse Recovery Current
Safe Operating Area for TO-2 20/D2PAK/I2PAK Safe Operating Area for TO-220FP
= 300V, ID= 5.5A
DD
= 4.7VGS=10V
R
G
(see test circuit, Figure 3) V
= 400V, ID=11A,
DD
VGS=10V
V
=400V,ID= 11A,
DD
= 4.7Ω, VGS=10V
R
G
(see test circuit, Figure 5)
ISD=11A,VGS=0
= 11A, di/dt = 100A/µs,
I
SD
VDD= 100 V, Tj= 25°C (see test circuit, Figure 5)
I
= 11A, di/dt = 100A/µs,
SD
V
= 100 V, Tj= 150°C
DD
(see test circuit, Figure 5)
20 ns
30 nC
6ns
1.5 V
390
3.8
19.5 570
5.7 20
ns
µC
A
ns
µC
A
3/12
Page 4
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Thermal Impedance for TO-220/D2PAK/I2PA K
Thermal Impedance for TO-220FP
Transfer CharacteristicsOutput Characteristics
Transconductance
4/12
Static Drain-source On Resistance
Page 5
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Gate Charge vs Gate-so urc e V oltage
Capacitance Variations
Normalized On Resistance vs TemperatureNormalized Gate Thereshold Voltage vs Temp.
Source-drain Diode Forward Characteristics
5/12
Page 6
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Fig. 2: Unclamped Inductive WaveformFig. 1: Unclamped Inductive Load T es t Circuit
Fig. 3: Switching Times Test Circuit For
Resistive Load
Fig. 5: Test Circuit For Inductive Lo ad Switching And Diode Recovery Times
Fig. 4: Gate Charge test Circuit
6/12
Page 7
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
TO-220 MECHANICAL DATA
DIM.
A 4.40 4.60 0.173 0.181 b 0.61 0.88 0.024 0.034
b1 1.15 1.70 0.045 0.066
c 0.49 0.70 0.019 0.027 D 15.25 15.75 0.60 0.620 E 10 10.40 0.393 0.409 e 2.40 2.70 0.094 0.106
e1 4.95 5.15 0.194 0.202
F 1.23 1.32 0.048 0.052
H1 6.20 6.60 0.244 0.256 J1 2.40 2.72 0.094 0.107
L 13 14 0.511 0.551
L1 3.50 3.93 0.137 0.154 L20 16.40 0.645 L30 28.90 1.137
øP 3.75 3.85 0.147 0.151
Q 2.65 2.95 0.104 0.116
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
7/12
Page 8
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
TO-220FP MECHANICAL DATA
DIM.
A 4.4 4.6 0.173 0.181 B 2.5 2.7 0.098 0.106 D 2.5 2.75 0.098 0.108 E 0.45 0.7 0.017 0.027
F 0.75 1 0.030 0.039 F1 1.15 1.7 0.045 0.067 F2 1.15 1.7 0.045 0.067
G 4.95 5.2 0.195 0.204
G1 2.4 2.7 0.094 0.106
H 10 10.4 0.393 0.409 L2 16 0.630 L3 28.6 30.6 1.126 1.204 L4 9.8 10.6 .0385 0.417 L5 2.9 3.6 0.114 0.141 L6 15.9 16.4 0.626 0.645 L7 9 9.3 0.354 0.366
Ø 3 3.2 0.118 0.126
MIN. TYP MAX. MIN. TYP. MAX.
mm. inch
E
A
D
B
8/12
L3
L6
L7
F1
F
G1
H
F2
123
L4
L2
L5
G
Page 9
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
D2PAK MECHANICAL DATA
DIM.
MIN. TYP MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181 A1 2.49 2.69 0.098 0.106 A2 0.03 0.23 0.001 0.009
B 0.7 0.93 0.027 0.036 B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
D1 8 0.315
E 10 10.4 0.393 E1 8.5 0.334
G 4.88 5.28 0.192 0.208
L 15 15.85 0.590 0.625 L2 1.27 1.4 0.050 0.055 L3 1.4 1.75 0.055 0.068
mm. inch
M 2.4 3.2 0.094 0.126 R 0.4 0.015
V2
3
9/12
1
Page 10
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
TO-262 (I2PAK) MECHANICAL DATA
DIM.
MIN. TYP. MAX. MIN. TYP. MAX.
A 4.4 4.6 0.173 0.181
A1 2.49 2.69 0.098 0.106
B 0.7 0.93 0.027 0.036
B2 1.14 1.7 0.044 0.067
C 0.45 0.6 0.017 0.023
C2 1.23 1.36 0.048 0.053
D 8.95 9.35 0.352 0.368
e 2.4 2.7 0.094 0.106
E 10 10.4 0.393 0.409
L 13.1 13.6 0.515 0.531 L1 3.48 3.78 0.137 0.149 L2 1.27 1.4 0.050 0.055
mm inch
C
10/12
A
A1
C2
B2
B
e
E
L1
L2
D
L
P011P5/E
Page 11
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
D2PAK FOOTPRINT
TAPE AND REEL SHIPMENT (suffix ”T4”)*
TUBE SHIPMENT (no suffix)*
REEL MECHANICAL DATA
DIM.
A 330 12.992 B 1.5 0.059 C 12.8 13.2 0.504 0.520
D 20.2 0795 G 24.4 26.4 0.960 1.039 N 100 3.937
T 30.4 1.197
mm inch
MIN. MAX. MIN. MAX.
TAPE MECHANICAL DATA
DIM.
A0 10.5 10.7 0.413 0.421 B0 15.7 15.9 0.618 0.626
D 1.5 1.6 0.059 0.063
D1 1.59 1.61 0.062 0.063
E 1.65 1.85 0.065 0.073
F 11.4 11.6 0.449 0.456 K0 4.8 5.0 0.189 0.197 P0 3.9 4.1 0.153 0.161 P1 11.9 12.1 0.468 0.476 P2 1.9 2.1 0.075 0.082
R 50 1.574
T 0.25 0.35 0.0098 0.0137
W 23.7 24.3 0.933 0.956
* on sales ty pe
mm inch
MIN. MAX. MIN. MAX.
BASE QTY BULK QTY
1000 1000
11/12
Page 12
STP11NM60 / STP11NM60FP / STB11NM60 / STB11NM60-1
Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of u se of such inf ormat ion nor for any in fring ement of p aten ts or othe r ri ghts of th ird p arties whic h may resul t f rom its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.
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