2-channel microless high-efficiency digital audio system
Features
■ Wide supply voltage range (5.0 V to 26 V)
■ PowerSSO-36 exposed pad down package
■ 2 channels of 24-bit DDX
100-dB SNR and dynamic range
■
■ Selectable 32 kHz to 48 kHz input sample
rates
■ Automatic zero-detect mute
■ Automatic invalid input detect mute
■ 2-channel I
■ Selectable clock input ratio (256 or 364 * fs)
■ Max power correction for lower full power
■ 96-kHz internal processing sample rate, 24-bit
2
S input data interface
precision
■ Thermal overload and short-circuit protection
embedded
■ Filterless configuration capability
Applications
■ LCDs
■ DVDs
■ Cradles
■ Digital speakers
■ Wireless speaker cradles
®
STA335ML
Sound Terminal
PowerSSO-36
with exposed
pad down (EPD)
Description
The STA335ML is a single die embedding digital
audio processing and high-efficiency power
amplification, capable of operating without the aid
of an external microcontroller.
The STA335ML is part of the Sound Terminal
family that provides full digital audio streaming to
the speakers and offers cost effectiveness, low
power dissipation and sound enrichment.
The STA335ML combines a unique 24-bit DDX
digital class-D ternary modulator together with an
extremely low R
The latter is capable of a total output power of
2 x 20 W with outstanding performance in terms
of efficiency (>90 %), THD, SNR and EMI.
The microless feature allows its use in low-cost
applications (cradle, digital speakers, audio
terminals) where no microcontroller is needed.
The serial audio data interface accepts the
universally used I
as oversampling clock, gain, I
using a minimal number of selection pins.
stereo power DMOS stage.
dsON
2
S format. Basic features, such
2
S format can be set
®
®
®
The STA335ML is self-protected against thermal
overload, overcurrent, short-circuit and
overvoltage conditions.
The fault condition is also signalled on an external
pin (INT_LINE) for specific requirements.
16CONFIGInConfiguration mode, must be connected to ground
17N.C.-No internal connection
18N.C.-No internal connection
19N.C.-No internal connection
20N.C.-No internal connection
21VDD_DIGPowerPositive supply digital
22GND_DIGGndDigital ground
Power down:
23PWRDNIn
24VDD_PLLPowerPositive supply for PLL
25FILTER_PLLInConnection to PLL filter
0: low-power mode
1: normal operation
26GND_PLLGndNegative supply for PLL
27XTIInPLL input clock, 256 * fs or 384 * fs
2
28BICKIInI
29LRCKIInI
30SDIInI
S serial clock
2
S left/right clock
2
S serial data channel
31RESETInReset
32INT_LINEOutFault interrupt
Oversampling selector:
33ONSELIn
0: 256 * fs
1: 384 * fs
Gain selector:
34GAINIn
0: 0 dBFs
1: 24 dBFs
35GND_DIGGndDigital ground
36VDD_DIGPowerDigital supply
-EP-
Exposed pad for PCB heatsink, to be connected to
ground plane
Doc ID 17638 Rev 45/20
Page 6
Electrical specificationsSTA335ML
3 Electrical specifications
3.1 Absolute maximum ratings
Table 3.Absolute maximum ratings
SymbolParameterMinTypMaxUnit
V
CC
V
L
V
DD
T
op
T
stg
Power supply voltage (pins VCC1, VCC2)--30V
Logic input interface-0.3-4V
Digital supply (pin VDD_DIG)--4V
Operating junction temperature-20-150°C
Storage temperature-40-150°C
3.2 Thermal data
Table 4.Thermal data
SymbolParameterMinTypMaxUnit
R
Th(j-case)
T
sd
T
hsd
T
w
Thermal resistance junction to case (thermal pad) - 1.52°C/W
Thermal shutdown junction temperature140-150°C
Thermal shutdown hysteresis182022°C
Thermal warning temperature120130140°C
3.3 Recommended operating conditions
Table 5.Recommended operating conditions
SymbolParameterMinTypMaxUnit
V
V
V
T
CC
L
DD
amb
Power supply voltage (pins VCC1, VCC2)5-26V
Logic input interface2.73.33.6V
Digital supply (pin VDD_DIG)2.73.33.6V
Ambient temperature-20-70°C
6/20Doc ID 17638 Rev 4
Page 7
STA335MLElectrical specifications
3.4 Electrical specifications - digital section
Table 6.Electrical specifications for digital section
Symbol Parameter ConditionsMinTypMaxUnit
I
il
I
ih
V
il
V
ih
V
ol
V
oh
I
pu
R
pu
Input current without bias
device
Low-level input voltage---
High-level input voltage-
Low-level output voltageIol = 2 mA--
High-level output voltageIoh = 2 mA
Pull-up/down current-2566125µA
Equivalent pull-up/down
resistance
= 0 V-10-10 µA
V
i
Vi = VDD = 3.6 V-10-10µA
0.8 *
V
0.8 *
V
--50-kΩ
3.5 Electrical specifications - power section
The specifications given here are with the operating conditions: VCC = 18 V, VDD = 3.3 V,
f
= 384 kHz, T
sw
Table 7.Electrical specifications for power section
SymbolParameterConditionsMinTypMaxUnit
= 25 °C, RL =8Ω unless otherwise specified.
amb
DD
DD
0.2 *
V
DD
V
--V
0.4 *
V
DD
V
--V
PoOutput power BTL
On resistance of power
R
dsON
P-channel/N-channel
MOSFET (Total bridge)
Power
l
dss
P-channel/N-channel
leakage current
gP
gN
I
LDT
I
HDT
t
r
t
f
Power P-channel
R
matching
dsON
Power N-channel
matching
R
dsON
Low current deadtime
(static)
High current deadtime
(dynamic)
Rise timeResistive load Figure 4- 1018ns
Fall timeResistive loadFigure 4- 1018ns
THD = 1%-16-
W
THD = 10%-20-
l
= 1 A-180250mΩ
d
V
= 20 V--10μA
CC
= 1.5 A95--%
l
d
= 1.5 A95--%
l
d
Resistive load Figure 4-815ns
Load = 1.5 A (Figure 5)-1530ns
Doc ID 17638 Rev 47/20
Page 8
Electrical specificationsSTA335ML
Table 7.Electrical specifications for power section (continued)
SymbolParameterConditionsMinTypMaxUnit
Supply current from
in power-down
V
CC
PWRDN = 0-0.11.0mA
PCM Input signal =
I
vcc
Supply current from
in operation
V
CC
-60 dBFs.
Switching frequency =
384 kHz
- 5260mA
No LC filters
I
vdd_dig
I
SCP
UVL
t
min
Supply current DDX
processing (reference
only)
Short-circuit protection Hi-Z output4.04.2-A
Undervoltage
protection threshold
Output minimum pulse
width
Internal clock =
49.152 MHz
- 5570mA
--3.54.3V
No load203060ns
DRDynamic range--100-dB
SNRSignal-to-noise ratioA-weighted-100-dB
THD+N
PSRR
Total harmonic
distortion + noise
Power supply rejection
ratio
DDX stereo mode,
Po = 1 W, f = 1 kHz
DDX stereo, <5 kHz
Vripple = 1 V RMS
Audio input = dither only
-0.2-%
-80-dB
X
η
TA L K
Crosstalk
Peak efficiency, DDX
mode
DDX stereo, <5 kHz
One chan. driven at 1 W
-80-dB
other channel measured
Po = 2 x 20 W into 8 Ω-90-%
8/20Doc ID 17638 Rev 4
Page 9
STA335MLElectrical specifications
3.6 Power-on sequence
Figure 3.Power-on sequence
VCC
Don’t care
VDD_DIG
Don’t care
XTI
RESET
PWRDN
TR = minimum time between XTI master clock stable and reset removal: 1 ms
Note 1: clock stable means: f
Note 2: No specific V
3.7 Test circuits
Figure 4.Resistive load
Don’t care
Don’t care
Don’t care
Don’t care
and VDD turn-on sequence is required.
CC
Low current dead time = MAX(DTr,DTf)
Duty cycle = 50%
INxY
M58
M57
max
gnd
+Vcc
- f
OUTxY
TR
TR
TR
TR
< 1 MHz
min
OUTxY
R 8Ω
DTfDTr
+
V67 =
-
vdc = Vcc/2
Vcc
(3/4)Vcc
(1/2)Vcc
(1/4)Vcc
t
D03AU1458
Figure 5.Test circuit
High current dead time for Bridge application = ABS(DTout(A)-DTin(A))+ABS(DTOUT(B)-DTin(B))
+V
CC
Duty cycle=ADuty cycle=B
DTin(A)
INA
Duty cycle A and B: Fixed to have DC output current of Iout in the direction shown in figure
DTout(A)
Q1
Q3
OUTA
Iout
C69
470nF
Rload=8Ω
C71 470nF
DTout(B)DTin(B)
L68 22μL67 22μ
C70
470nF
Q2
OUTB
Iout
Q4
Doc ID 17638 Rev 49/20
INB
D03AU1517_00
Page 10
Functional descriptionSTA335ML
4 Functional description
4.1 Serial audio interface protocols
The STA335ML serial audio input interfaces with standard digital audio components and
accepts serial data formats. The STA335ML always acts as a slave when receiving audio
input from standard digital audio components. Serial data for two channels is provided using
3 input pins: left/right clock LRCKI (pin 29), serial clock BICKI (pin 28), and serial data SDI
(pin 30).
The available formats are given in Figure 6 and Figure 7. Pin FMT (pin 2) selects the format
such that FMT = logical 0 gives the I
Figure 6.I
LRCKI
BICKI
SDI
2
S
21
3
1
2
3
2
S format and FMT = logical 1 gives the left-justified.
n
n
n
n
n
-1
-1
21
3
n
-1
Figure 7.Left-justified
LRCKI
BICKI
SDATAI
1
2
3
n
n
-1
1
10/20Doc ID 17638 Rev 4
n
2
3
n
-1
Page 11
STA335MLFunctional description
4.2 Fault-detect recovery bypass
The on-chip STA335ML power output block provides feedback to the digital controller using
inputs to the power control block. The fault input is used to indicate a fault condition (either
overcurrent or thermal). When fault is asserted (set to 0), the power control block attempts a
recovery from the fault by asserting the 3-state output (setting it to 0 which directs the power
output block to begin recovery), holds it at 0 for 1 ms and then toggles it back to 1. This
sequence is repeated for as long as the fault exists.
4.3 Zero-detect mute enable
If this function is enabled, the zero-detect circuit examines each processing channel to see if
2048 consecutive zero value samples (regardless of fs) are received. If so, the channel is
muted.
4.4 Fade-in/out feature
The STA335ML has an internal fade-in / fade-out feature when powered on or off, or after a
fault condition.
4.5 Oversampling selector
Pin ONSEL (33) is used to configure the PLL to accept 256 * fs or 384 * fs master clock.
Where fs is the I
ONSEL = logical 0 gives
ONSEL = logical 1 gives 384 * fs.
2
S LRCKI frequency:
256 * fs
4.6 Gain selector
Pin GAIN (34) is used to configure the STA335ML gain:
GAIN = logical 0 gives 0 dBFs
GAIN = logical 1 gives
24 dBFs.
4.7 Power-down function
Pin PWRDN (23) is used to power down the STA335ML:
PWRDN = logical 0 sets the power-down mode
PWRDN = logical 1 gives normal operation.
If the power stage is switched off, then the PLL is also switched off.
It is possible to use the PWRDN function as a mute function.
Doc ID 17638 Rev 411/20
Page 12
ApplicationsSTA335ML
5 Applications
5.1 Applications schematic
Figure 10 on the next page shows the schematic of a typical application for the STA335ML.
Concerning the power supplies, take care when designing the PCB layout. In particular, the
3.3-Ω resistors on the digital supplies (VDD_DIG) must be placed as close as possible to
the device. This helps to prevent parasitic oscillation in the digital part of the device due to
the inductive tracks of the PCB. The same rule applies for all the decoupling capacitors in
order to limit any spikes on the supply pins.
5.2 Internal voltage reference
An embedded voltage regulator produces the reference voltages for the DMOS bridge
driver. It requires two 100 nF capacitors to keep the regulator stable. The capacitors should
be place close to the pins.
Figure 8.Reference voltage block diagram
VCC
VCC_REG
100 nF
VSS_REG
VDD_REG
100 nF
GND_REG
Regulator
Input
level
shifter
2
I
S
interface
Driver P
Driver N
5.3 PLL filter schematic
It is recommended to use the circuit in Figure 9 below for the PLL loop filter to achieve the
best performance from the device in general application. Note that the ground of this filter
scheme has to be connected to the ground of the PLL without any resistive path.
Concerning the component values, please take into account that the greater is the filter
bandwidth, the less is the lock time but the higher is the PLL output jitter.
Figure 9.PLL applications schematic
FILTER_PLL
Ferrite bead
GND_DIG
12/20Doc ID 17638 Rev 4
4.7 nF
GND
2k2
680 pF
100 pF
GND_PLL
Page 13
Doc ID 17638 Rev 413/20
Figure 10. Applications schematic
STA335MLApplications
Page 14
ApplicationsSTA335ML
5.4 Typical output configuration
Figure 11, Figure 12 and Figure 13 show the typical output circuits used for the BTL stereo
mode. Please refer to the application note for all the other recommended output
configurations.
Figure 11. Output configuration for stereo BTL mode (8 ohm)
22 µH
OUT1A
100 nF
OUT1B
OUT2A
OUT2B
22R
330 pF
22 µH
22R
330 pF
22 µH
22 µH
6R2
6R2
100 nF
100 nF
6R2
6R2
100 nF
100 nF
470 nF
Left
100 nF
100 nF
470 nF
Right
100 nF
14/20Doc ID 17638 Rev 4
Page 15
STA335MLApplications
Figure 12. Filterless output configuration
OUT1A
Left
OUT1B
OUT2A
Right
OUT2B
The filterless application is more critical in terms of EMI. It is quite important to follow the
suggestions below:
●Tracks from amplifier to speaker should be as short as possible.
●Ferrite beads can be used (instead of coils) to improve EMI performance.
–Ferrite beads must have a low impedance in the audio band and high impedance
at high frequencies.
–Place ferrite beads as close as possible to the IC.
–Ferrite filters must reduce EMI above 1 MHz.
–FCC and CE authorities test radiated emission above 30 MHz.
Figure 13. Filterless output configuration with snubber network
OUT1A
22 R
330 pF
OUT1B
OUT2A
22 R
330 pF
OUT2B
Left
Right
The presence of snubber networks reduce the EMI. The snubber networks should be placed
as close as possible to the IC.
Doc ID 17638 Rev 415/20
Page 16
Package thermal characteristicsSTA335ML
6 Package thermal characteristics
Using a double layer PCB the thermal resistance junction to ambient with 2 copper ground
areas of 3 x 3 cm
The dissipated power within the device depends primarily on the supply voltage, load
impedance and output modulation level.
The max estimated dissipated power for the STA335ML is:
2 x 20 W into 8 Ω, at 18 VPd max is approximately 4 W
Figure 14. Double layer PCB with 2 copper ground areas and 16 via holes
Figure 15 shows the power derating curve for the PowerSSO-36 package on a board with
two copper areas of 2 x 2 cm
Figure 15. PowerSSO-36 power derating curve
Pd (W)
Pd (W)
Pd (W)
Pd (W)
Pd (W)
2
and with 16 via holes (see Figure 14) is 24 °C/W in natural air convection.
2
and 3 x 3 cm2.
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
7
Copper Area3x3 cm
Copper Area3x3 cm
Copper Area3x3 cm
Copper Area3x3 cm
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
6
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
4
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Copper Area2x2 cm
Copper Area2x2 cm
Copper Area2x2 cm
Copper Area2x2 cm
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
2
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
Copper Area 2x2 cm
and via holes
and via holes
and via holes
and via holes
and via holes
020406080100120140160
020406080100120140160
020406080100120140160
0
020406080100120140160
020406080100120140160
020406080100120140160
0
020406080100120140160
020406080100120140160
020406080100120140160
020406080100120140160
0
020406080100120140160
0
020406080100120140160
020406080100120140160
20406080100120140160
Copper Area 3x3 cm
and via holes
and via holes
and via holes
and via holes
and via holes
Tamb ( °C)
Tamb ( °C)
Tamb ( °C)
Tamb ( °C)
Tamb ( °C)
STA335ML
STA333BW
STA333ML
STA333BW
STA333BW
STA333ML
PowerSSO-36
PSSO36
PSSO36
PSSO36
PSSO36
PSSO36
16/20Doc ID 17638 Rev 4
Page 17
STA335MLPackage mechanical data
7 Package mechanical data
Figure 16 on page 18 shows the package outline and the table below gives the dimensions.
Table 8.PowerSSO-36 EPD dimensions
Dimensions in mmDimensions in inches
Symbol
MinTypMaxMinTypMax
A2.15-2.470.085-0.097
A22.15-2.400.085-0.094
a10.00-0.100.00-0.004
b0.18-0.360.007-0.014
c0.23-0.320.009-0.013
D10.10-10.500.398-0.413
E7.40-7.600.291-0.299
e-0.5--0.020-
e3-8.5--0.335-
F-2.3--0.091-
G--0.10 --0.004
H10.10-10.500.398-0.413
h--0.40 --0.016
k0-8 degrees0-8 degrees
L0.60-1.000.024-0.039
M-4.30--0.169-
N--10 degrees--10 degrees
O-1.20--0.047-
Q-0.80--0.031-
S-2.90--0.114-
T-3.65--0.144-
U-1.00--0.039-
X 4.10-4.700.161-0.185
Y4.90 -7.10 0.193-0.280
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK
®
packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK
®
is an ST trademark.
Doc ID 17638 Rev 417/20
Page 18
18/20Doc ID 17638 Rev 4
Figure 16. PowerSSO-36 EPD outline drawing
h x 45°
Package mechanical dataSTA335ML
Page 19
STA335MLRevision history
8 Revision history
Table 9.Document revision history
DateRevisionChanges
09-May-20071Initial release.
20-Feb-20082.0Application note added
29-Sep-20082.1Package information updated
18-Dec-20082.2Overcurrent Limit removed
Updated junction temperature range in Table 3: Absolute maximum
ratings on page 6
24-Jun-20103
18-Jul-20114
Updated Table 7: Electrical specifications for power section on
page 7
Removed max estimated dissipated power example on page 16
Updated Table 1: Device summary
Removed Lrclko, Biclko, Sdatao from Figure 7 on page 10
Updated Figure 10: Applications schematic on page 13
Minor textual updates
Doc ID 17638 Rev 419/20
Page 20
STA335ML
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