In order to meet environmental requirements, ST offers these devices in ECOPACK®
packages. These packages have a Lead-free second level interconnect . The category of
second level interconnect is marked on the package and on the inner box label, in compliance
with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also
marked on the inner box label. ECOP ACK is an ST trademark. ECOP ACK specifications are
available at: www.st.com
nformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequence
f use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is grante
y implic ation or oth erwise under any patent or patent rights of STMicroel ectronics. Specificati ons mentioned in this publication are sub je
o change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are n
uthoriz ed for use as crit ical components in life suppor t devices or sys tems without express writt en approval of STM i croelectronics.
The ST logo is a registered trademark of STM i croelectroni cs.
All other nam es are the property of their respective owners