Datasheet ST6203LM1, ST6203LB1, ST6203L, ST6201LM1, ST6201LB1 Datasheet (SGS Thomson Microelectronics)

R

LOW VOLTAGE 8-BIT ROM MCUs WITH

■

2.4 to 3.9V Supply Operating Range

■ 4 MHz Maximum Clock Frequency

■

0to+70°C Operating Temperature Range

■

Run, Wait and Stop Modes

■

5 Interrupt Vectors

■ Look-up Table capability in Program Memory

■

Data Storage in Program Memory:
User selectable size

■

Data RAM: 64bytes

■ 9 I/O pins, fully programmable as:

– Input with pull-up resistor
– Input without pull-up resistor
– Input with interrupt generation
– Open-drain or push-pull output
– Analog Input (except ST6203L)

■

3 I/O lines can sink up to 12mA to drive LEDs

■

8-bit Timer/Counter with 7-bit programmable
prescaler

■ Digital Watchdog

■

8-bit A/D Converter with up to 4 analog inputs

■

On-chip Clock oscillatorcan be driven byQuartz
Crystal Ceramic resonator or RC network

■ Power-on Reset

■

One external Non-Maskable Interrupt

■

ST626x-EMU2 Emulation and Development
System (connects to an MS-DOS PC via an
RS232 serial line)

ST6200L/01L/03L

A/D CONVERTER,AND 16 PINS

PDIP16

PSO16

(See end of Datasheet for Ordering Information)

DEVICE SUMMARY

DEVICE

ST6200L 1036 9 4
ST6201L 1836 9 4
ST6203L 1036 9 None

ROM

(Bytes)

I/O Pins

Analog

inputs

Rev. 1.0

November 1997 1/10

1

ST6200L/01L/03L

1 GENERAL DESCRIPTION

1.1 INTRODUCTION

The ST6200L/01L and 03L are low voltage mask
programmed ROM version of ST62T00C,T01C
and T03C OTP devices.

They offer the same functionality as OTP devices,
selecting as ROM options the options defined in
the programmable option byte of the OTP version,
with the exception of the LVD Reset and the OSG
that are not available.

Figure 1. Programming wave form

TEST

100 s max

15

14V typ

10

5

TEST

0.5s min

150 s typ

t

1.2 ROM READOUT PROTECTION

If the ROM READOUT PROTECTION option is
selected, a protection fuse can be blown to pre­vent any access to the program memory content.

In case the user wants to blow this fuse, high volt­age must be applied on the TEST pin.

Figure 2. Programming Circuit

5V

47 F

m

100nF

V

SS

V

DD

PROTECT

100mA

max

4mA typ

t

VR02001

TEST

100nF

ZPD15

15V

14V

VR02003

Note: ZPD15 is used for overvoltage protection

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ST6200L/01L/03L

ST6200L/01L/03L MICROCONTROLLER OPTION LIST

Customer . . . ..........................

Address .............................

.............................

Contact . . . ..........................

PhoneNo .............................

Reference . . . ..........................

SGS-THOMSON Microelectronics references
Device: [ ] ST6200L [ ] ST6201L [ ] ST6203L
Package: [ ] Dual in Line Plastic[ ] Small Outline Plastic with conditionning:

[ ] Standard (Stick)

[ ] Tape & Reel
Temperature Range: [ ] 0°Cto+70°C
Special Marking: [ ] No [ ] Yes ”_ _ _ _ _ _ _ _ _ _ _ ”
Authorized characters are letters, digits, ’.’, ’-’, ’/’ and spaces only.
Maximum character count: DIP16: 9

SO16: 6

Oscillator Source Selection: [ ] Crystal Quartz/Ceramic resonator

[ ] RC Network

Watchdog Selection: [ ] Software Activation

[ ] Hardware Activation

ROM Readout Protection: [ ] Disabled (Fuse cannot be blown)

[ ] Enabled (Fuse can be blown by the customer)

Note: No part is delivered with protected ROM.

The fuse must be blown for protection to be effective.

External STOP Mode Control[ ] Enabled [ ] Disabled
NMI pin pull-up [ ] Enabled [ ] Disabled

Comments :
Supply Operating Range in the application:
Oscillator Fequency in the application:

Notes . . . ..........................

Signature . . . ..........................

Date .............................

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ST6200L/01L/03L

1.3 ORDERING INFORMATION

The following section deals with the procedure for
transfer of customer codes to SGS-THOMSON.

1.3.1 Transfer of Customer Code

Customer code is made up of the ROM contents
and the list of the selected mask options. The
ROM contents are to be sent on diskette, or by
electronic means, with the hexadecimal file gener­ated by the development tool. All unused bytes
must be set to FFh.

The selected mask options are communicated to
SGS-THOMSON using the correctly filled OP­TION LIST appended.

The SGS-THOMSON Sales Organization will be
pleased to provide detailed information on con­tractual points.

Table 1. ROM Memory Map for ST6200L,03L

Device Address Description

0000h-0B9Fh
0BA0h-0F9Fh
0FA0h-0FEFh
0FF0h-0FF7h
0FF8h-0FFBh

0FFCh-0FFDh

0FFEh-0FFFh

Reserved

User ROM

Reserved

Interrupt Vectors

Reserved

NMI Interrupt Vector

Reset Vector

1.3.2 Listing Generation and Verification

When SGS-THOMSON receives the user’s ROM
contents, a computer listing is generated from it.
This listing refers exactly to the mask which will be
used to produce the specified MCU. The listing is
then returned to the customer who must thorough­ly check, complete, sign and return it to
SGS-THOMSON. The signed listing forms a part
of the contractual agreement for the creation of the
specific customer mask.

Table 2. ROM Memory Map for ST6201L

Device Address Description

0000h-087Fh

0880h-0F9Fh
0FA0h-0FEFh
0FF0h-0FF7h
0FF8h-0FFBh

0FFCh-0FFDh

0FFEh-0FFFh

Reserved

User ROM

Reserved

Interrupt Vectors

Reserved

NMI Interrupt Vector

Reset Vector

Table 3. ROM version Ordering Information

Sales Type ROM Analog inputs Temperature Range Package

ST6200LB1/XXX
ST6200LM1/XXX PSO16
ST6201LB1/XXX
ST6201LM1/XXX PSO16
ST6203LB1/XXX
ST6203LM1/XXX PSO16

1036 Bytes

4

1836 Bytes

1036 Bytes None

0 to +70°C

PDIP16

PDIP16

PDIP16

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ST6200L/01L/03L

2 ELECTRICAL CHARACTERISTICS

2.1 ABSOLUTE MAXIMUM RATINGS

This product contains devices to protect the inputs
against damage due to high static voltages, how­ever it is advisable to take normal precaution to
avoid application of any voltage higher than the
specified maximum rated voltages.

Power Considerations.The average chip-junc­tion temperature, Tj, in Celsius can be obtained
from:

Tj=TA + PD x RthJA

Where:TA = Ambient Temperature.
For proper operation it is recommended that V
and VObe higher than VSSand lower than VDD.
Reliability is enhanced if unused inputs are con­nected to an appropriate logic voltage level (V
or VSS).

DD

I

RthJA =Package thermal resistance(junc-

tion-to ambient).
PD = Pint + Pport.
Pint =IDD x VDD (chip internal power).
Pport =Port power dissipation(determined

by the user).

Symbol Parameter Value Unit

V

DD

V

I

V

O

I

O

IV

DD

IV

SS

Tj Junction Temperature 150 °C

T

STG

Notes:

- Stresses above those listed as “absolute maximum ratings” may cause permanent damage to the device. This is a stress ratingonly and
functional operation of the device at these conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.

- (1) Withinthese limits,clamping diodes are guarantee to be not conductive. Voltages outside these limits are authorised as longas injection
current is kept withinthe specification.

Supply Voltage -0.3 to 7.0 V
Input Voltage VSS- 0.3 to VDD+ 0.3
Output Voltage VSS- 0.3 to VDD+ 0.3
Current Drain per Pin Excluding VDD,V
TotalCurrent into VDD(source) 50 mA
TotalCurrent out of VSS(sink) 50 mA

Storage Temperature -60 to 150 °C

SS

±10 mA

(1)
(1)

V
V

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ST6200L/01L/03L

2.2 RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Test Conditions

T

V

f

OSC

I

INJ+

I

Notes:

1. Care mustbe taken in case of negative current injection, where adapted impedance must be respected on analog sources to not affect the

A/D conversion. For a -1mA injection, a maximum 10 KΩ is recommended.

2.An oscillator frequency above 1MHz is recommended for reliable A/D results

Operating Temperature 1 Suffix Version

A

=2MHz

f

Operating Supply Voltage

DD

Oscillator Frequency

2)

OSC

f

=4MHz

OSC

VDD= 2.4V
V

= 3.0V

DD

Pin Injection Current (positive) VDD= 2.4 to 3.9V +5 mA
Pin Injection Current (negative) VDD= 2.4 to 3.9V -5 mA

INJ-

Min. Typ. Max.

070

2.4
3

0
0

Value

3.9

3.9

2.0

4.0

Unit

°C

V

MHz

Figure 3. Maximum Operating FREQUENCY (Fmax) Versus SUPPLY VOLTAGE (VDD)

Maximum FREQUENCY (MHz)

4.0
FUNCTIONALITY IS NOT

GUARANTEED IN

3.5
THIS AREA

3.0

2.5

2.0

1.5

1

0.5

2.1 2.4 2.7 3.3 3.6 3.9

3.0

SUPPLY VOLTAGE (VDD)

The shaded area is outside the recommended operating range; device functionality is not guaranteed under these conditions.

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ST6200L/01L/03L

2.3 DC ELECTRICAL CHARACTERISTICS

(TA= 0 to +70°C unless otherwise specified)

Symbol Parameter Test Conditions

V

V

V

Hys

V

V

R

I

I

I

DD

Input Low Level Voltage

IL

All Input pins
Input High LevelVoltage

IH

All Input pins
Hysteresis Voltage

All Input pins
Low Level Output Voltage

All Output pins

OL

Low Level Output Voltage
20 mA Sink I/O pins

High Level Output Voltage

OH

All Output pins

Pull-up Resistance

PU

Input Leakage Current
All Input pins but RESET

IL

Input Leakage Current

IH

RESET pin
Supply Current in RESET

Mode
Supply Current in

RUN Mode
Supply Current in WAIT

(3)

Mode
Supply Current in STOP

(3)

Mode

(2)

(1)

= 3V 0.2 V

V

DD

= 3.0V; IOL= +10µA

V

DD

V

= 3.0V; IOL= + 3.0mA

DD

V

= 2.4V; IOL= + 1.5mA

DD

= 3.0V; IOL= +10µA

V

DD

V

= 3.0V; IOL= + 8mA

DD

V

= 3.0V; IOL= +12mA

DD

V

= 2.4V; IOL= + 5mA

DD

= 3.0V; IOH= -10µA

V

DD

V

= 3.0V; IOH= -1.5mA

DD

V

= 2.4V; IOH= -10µA

DD

All Input pins 100 250 600
RESET pin 400 600 1200
VIN=VSS(No Pull-Up configured)

V

IN=VDD

V

IN=VSS

VIN=V

DD

V

RESET=VSS

f

=4MHz

OSC

VDD=3.0V f

VDD=3.0V f
I

=0mA

LOAD

V

=3.0V

DD

=4MHz 1.5 mA

INT

=4MHz 0.5 mA

INT

Value

Min. Typ. Max.

V

DD

V

x 0.8 V

DD

0.1

0.8

0.8

0.1

0.8

1.3

0.8

2.9

2.0

2.3

0.1 1.0

-8 -16 -30
10

1.5 mA

2 µA

Unit

x 0.2 V

V

V

ΚΩ

µA

Notes:

(1) Hysteresis voltage between switching levels
(2) All peripherals running
(3) All peripherals in stand-by

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ST6200L/01L/03L

DC ELECTRICAL CHARACTERISTICS(Cont’d)

2.4 AC ELECTRICAL CHARACTERISTICS

((TA=0to+70°C unless otherwise specified

Symbol

t

REC

Supply Recovery Time

Parameter Test Conditions

(1)

VDD=3.0V

f

RC

Internal frequency with RC
oscillator

2) 3)

R=47kΩ
R=100kΩ
R=470kΩ

C

C

OUT

Notes:

1. Period for which V
2 An oscillator frequency above 1MHz is recommended for reliable A/D results.

3. Measure performed with OSCin pin soldered on PCB,with an around 2pF equivalent capacitance.

Input Capacitance All Inputs Pins 10 pF

IN

Output Capacitance All Outputs Pins 10 pF

has to be connected at 0V to allow internal Reset function at next power-up.

DD

Value

Min. Typ. Max.

Unit

100 ms

2.5

1.4

450

3

1.7

520

3.5

2.1

600

MHz
MHz

kHz

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ST6200L/01L/03L

2.5 A/D CONVERTER CHARACTERISTICS

(TA= 0 to +70°C unless otherwise specified)

Symbol Parameter Test Conditions

Min. Typ. Max.

Res Resolution 8 Bit

f

> 1.2MHz, VDD=3.0V

A

TOT

t

C

TotalAccuracy

Conversion Time

(1) (2)

ZIR Zero Input Reading

FSR Full Scale Reading

AD

AC

Notes:

1. Noise at VDD,VSS <10mV

2. With oscillator frequencies less than 1MHz, the A/DConverter accuracy is decreased.

Analog Input Current During

I

Conversion
Analog Input Capacitance 2 5 pF

IN

OSC

f

> 1.2MHz, VDD=2.4V

OSC

f

> 32kHz, VDD=3.0V

OSC

= 2MHz

f

OSC

f

= 4 MHz

OSC

Conversion result when
V

IN=VSS

00 Hex

Conversion result when
V

IN=VDD

V

= 4.0V 1.0 µA

DD

Value

±25
±35
±50

280
140

FF Hex

Unit

mV

µs

2.6 TIMER CHARACTERISTICS

((TA=0to+70°C unless otherwise specified)

Symbol Parameter Test Conditions

f

IN

t

W

Input Frequency on TIMER Pin MHz

Pulse Width at TIMER Pin VDD= 2.4V 250 ns

.

Value

Min. Typ. Max.

Unit

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ST6200L/01L/03L

Notes:

Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patentor patent rightsof SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without
express written approval of SGS-THOMSON Microelectronics.



1997 SGS-THOMSON Microelectronics -Printed in Italy - All Rights Reserved.

Australia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands - Singapore

SGS-THOMSON Microelectronics GROUP OF COMPANIES

Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A.

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