Datasheet SSD1810V, SSD1810TR1, SSD1810AZ Datasheet (Solomon Systech)

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SOLOMON SYSTECH
SOLOMON SYSTECHSOLOMON SYSTECH
SOLOMON SYSTECH
SEMICONDUCTOR TECHNICAL DATA
SSD1810
SSD1810A
ORDERING INFORMATION
SSD1810V Bare Die SSD1810AZ Gold BumpDie SSD1810ATR1 TAB
Bare Die
Gold Bump Die
TAB
Copyright © 2000 Solomon Technolgoy Corp.
REV 1.1
05/01
This document contains information on a new product. Specifications and information herein are subject to change without notice.
Advance Information
LCD Segment / Common Driver with Controller
CMOS
SSD1810 is a single-chip CMOS LCD driver with controller for liquid crystal dot­matrix graphic display system. It consists of 133 high voltage driving output pins sup­porting driving 98 Segments, 34 Commons and 1icon driving-Common or 100 Seg­ments, 32 Commons and 1icon driving-Common.
SSD1810 displays data directly from its internal Graphic RAM (100x66). Data/ Command are sent from general MCU through a software selectable 6800-/8080-se­ries compatible Parallel Interface or Serial Peripheral Interface.
SSD1810 embeds a DC-DC Converter, an On-chip Bias Divider and an On-Chip Oscillator which reduce the number of external components. With the special design on minimizing power consumption and die/package layout, SSD1810 is suitable for any portable battery-driven application requiring long operation period and compact size.
98x34 or 100x32 Graphic Display Modes with a Icon Line
Single Supply Operation, 2.4V - 3.5V
Low Current Sleep Mode
On Chip Voltage Generator / External Power Supply
2X / 3X / 4X On chip DC-DC Converter
On chip Oscillator
On Chip Smart Bias Divider
1:4 / 1:5 / 1:6 / 1:7 Bias Ratio
Maximum -12.0V LCD Driving Output Voltage
Built-in Temperature Compensation Circuit
8-bit 6800-series Parallel Interface, 8-bit 8080-series Parallel Interface and
Serial Peripheral Interface
On Chip 100 x 66 Graphic Display Data RAM
Four grey level control in 32-mux mode
Re-mapping of Row and Column Drivers
Vertical Scrolling
Internal Regulator Resistors Control
External Contrast Control
32 level Internal Contrast Control
Available in Bare Die, Gold Bump Die or TAB (Tape Automated Bonding) pack-
age
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SSD1810/A 2
REV 1.1 05/01
SOLOMON
LCD Driving
Voltage Generator
2X / 3X / 4X DC/DC Converter, Voltage Regulator,
Smart Bias Divider,
Contrast Control,
Temperature
Compensation
COM0 to
COM31
SEG2~SEG99
FR
V
SS
V
DD
RES
D
7
V
L6
V
L2
V
EE
V
F
C
1P
C
2P
C
1N
C
3N
GDDRAM
66 x 100Bits
Command Decoder
Parallel / Serial InterfaceCommand Interface
Display
Timing
Generator
133 Bit Latch
HV Buffer Cell Level Shifter
Level
Selector
CS1
Oscillator
FRS
ICONS
P/S
CS2 D/C
D
6
D
5
D4D3D2D
1
D
0
(SDA)
(SCK)
V
DD
C68/80
E
(RD
)
R/W
(WR)
COM33/SEG1
COM32/SEG0
IRS
MODE
BLOCK DIAGRAM
ICONS (1810A)
CL
Figure 1 SSD1810/A Block Diagram
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SSD1810/A
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REV 1.1
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SOLOMON
PIN ARRANGEMENT
COM10/COM12
COM11/COM13
COM12/COM14
COM13/COM15
COM14/COM16
COM15/COM17
VL6VL5VL4VL3VL2VDDVFVL6C2NC2PC1NC1PC3NVEEVSSD
7
(SDA)
D
6
(SCK)
D
5D4D3D2D1D0
VDDE(RD)
R/W
(WR)
D/C
C68/80
CS2
CS1
P/S
RES
MODE
VDD
IRS
CL
FR
FRS
ICONS
COM31/COM33
COM30/COM32
COM29/COM31
COM28/COM30
COM27/COM29
SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
SEG36
SEG37
SEG38
SEG39
SEG40
SEG41
SEG42
SEG43
SEG44
SEG45
SEG46
SEG47
SEG48
SEG49
SEG50
SEG51
SEG52
SEG53
SEG54
SEG55
SEG56
SEG57
SEG58
SEG59
SEG60
SEG61
SEG62
SEG63
SEG64
SEG65
SEG66
SEG67
SEG68
SEG69
SEG70
SEG71
SEG72
SEG73
SEG74
SEG75
1 50 51
85
86136
137
171
SOLOMON SYSTECH LIMITED
SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7 SEG6 SEG5 SEG4 SEG3 SEG2 SEG1/COM0 SEG0/COM1 COM0/COM2 COM1/COM3 COM2/COM4 COM3/COM5 COM4/COM6 COM5/COM7 COM6/COM8 COM7/COM9 COM8/COM10 COM9/COM11
SEG76 SEG77 SEG78 SEG79 SEG80 SEG81 SEG82 SEG83 SEG84 SEG85 SEG86 SEG87 SEG88 SEG89 SEG90 SEG91 SEG92 SEG93 SEG94 SEG95 SEG96 SEG97 SEG98
SEG99 COM18/COM16 COM19/COM17 COM20/COM18 COM21/COM19 COM22/COM20 COM23/COM21 COM24/COM22 COM25/COM23 COM26/COM24 COM27/COM25 COM28/COM26
Die Size: 233.25mil X 152.01mil Die Thickness: 11mil +/- 1mil
- MODE connect to VDD [34MUX MODE IS SET]
- MODE connect to N/C or VSS [32MUX MODE]
- IRS connect to VDD [Use Internal resistors network]
- IRS connect to N/C or VSS [Use external resistors net­work]
Figure 2 SSD1810V Bare Die Pin Arrangement
Center : 451,286 Size : 100.1u x100.1u
Center : -11033,5367 Size: 99.75u x 99.75u
Center : 11339,-6449 Size: 99.75u x 99.75u
Center : 12140,2273.5
Radius : 102.025u
x
Y
(0,0)
Note:
1. This diagram showing Die Face Up view.
2. Coordinates and Size of all alignment marks are in unit um and w.r.t. center of the chip.
Center : 4435,1047 Radius : 54.6um
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REV 1.1 05/01
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Pad # MODE=VDD MODE=NC/ Pad # MODE=VDD MODE=NC Pad # MODE=VDD MODE=NC
MODE=Vss
Normal Re-map MODE=Vss Normal Re-map MODE=Vss Normal Re-map
94 SEG33 SEG33 31 52 144 SEG83 SEG83 63 20 45 COM17 COM15 95 SEG34 SEG34 32 51 145 SEG84 SEG84 64 1F 46 COM16 COM14 96 SEG35 SEG35 33 50 146 SEG85 SEG85 65 1E 47 COM15 COM13 97 SEG36 SEG36 34 4F 147 SEG86 SEG86 66 1D 48 COM14 COM12 98 SEG37 SEG37 35 4E 148 SEG87 SEG87 67 1C 49 COM13 COM11 99 SEG38 SEG38 36 4D 149 SEG88 SEG88 68 1B 50 COM12 COM10 100 SEG39 SEG39 37 4C 150 SEG89 SEG89 69 1A 51 COM11 COM9 101 SEG40 SEG40 38 4B 151 SEG90 SEG90 6A 19 52 COM10 COM8 102 SEG41 SEG41 39 4A 152 SEG91 SEG91 6B 18 53 COM9 COM7 103 SEG42 SEG42 3A 49 153 SEG92 SEG92 6C 17 54 COM8 COM6 104 SEG43 SEG43 3B 48 154 SEG93 SEG93 6D 16 55 COM7 COM5 105 SEG44 SEG44 3C 47 155 SEG94 SEG94 6E 15 56 COM6 COM4 106 SEG45 SEG45 3D 46 156 SEG95 SEG95 6F 14 57 COM5 COM3 107 SEG46 SEG46 3E 45 157 SEG96 SEG96 70 13 58 COM4 COM2 108 SEG47 SEG47 3F 44 158 SEG97 SEG97 71 12 59 COM3 COM1 109 SEG48 SEG48 40 43 159 SEG98 SEG98 72 11 60 COM2 COM0 110 SEG49 SEG49 41 42 160 SEG99 SEG99 73 10 61 COM1 SEG0 10 73 111 SEG50 SEG50 42 41 161 COM18 COM16 62 COM0 SEG1 11 72 112 SEG51 SEG51 43 40 162 COM19 COM17 63 SEG2 SEG2 12 71 113 SEG52 SEG52 44 3F 163 COM20 COM18 64 SEG3 SEG3 13 70 114 SEG53 SEG53 45 3E 164 COM21 COM19 65 SEG4 SEG4 14 6F 115 SEG54 SEG54 46 3D 165 COM22 COM20 66 SEG5 SEG5 15 6E 116 SEG55 SEG55 47 3C 166 COM23 COM21 67 SEG6 SEG6 16 6D 117 SEG56 SEG56 48 3B 167 COM24 COM22 68 SEG7 SEG7 17 6C 118 SEG57 SEG57 49 3A 168 COM25 COM23 69 SEG8 SEG8 18 6B 119 SEG58 SEG58 4A 39 169 COM26 COM24 70 SEG9 SEG9 19 6A 120 SEG59 SEG59 4B 38 170 COM27 COM25 71 SEG10 SEG10 1A 69 121 SEG60 SEG60 4C 37 171 COM28 COM26 72 SEG11 SEG11 1B 68 122 SEG61 SEG61 4D 36 1 COM29 COM27 73 SEG12 SEG12 1C 67 123 SEG62 SEG62 4E 35 2 COM30 COM28 74 SEG13 SEG13 1D 66 124 SEG63 SEG63 4F 34 3 COM31 COM29 75 SEG14 SEG14 1E 65 125 SEG64 SEG64 50 33 4 COM32 COM30 76 SEG15 SEG15 1F 64 126 SEG65 SEG65 51 32 5 COM33 COM31 77 SEG16 SEG16 20 63 127 SEG66 SEG66 52 31 6 ICONS ICONS 78 SEG17 SEG17 21 62 128 SEG67 SEG67 53 30 79 SEG18 SEG18 22 61 129 SEG68 SEG68 54 2F 80 SEG19 SEG19 23 60 130 SEG69 SEG69 55 2E 81 SEG20 SEG20 24 5F 131 SEG70 SEG70 56 2D 82 SEG21 SEG21 25 5E 132 SEG71 SEG71 57 2C 83 SEG22 SEG22 26 5D 133 SEG72 SEG72 58 2B 84 SEG23 SEG23 27 5C 134 SEG73 SEG73 59 2A 85 SEG24 SEG24 28 5B 135 SEG74 SEG74 5A 29 86 SEG25 SEG25 29 5A 136 SEG75 SEG75 5B 28 87 SEG26 SEG26 2A 59 137 SEG76 SEG76 5C 27 88 SEG27 SEG27 2B 58 138 SEG77 SEG77 5D 26 89 SEG28 SEG28 2C 57 139 SEG78 SEG78 5E 25 90 SEG29 SEG29 2D 56 140 SEG79 SEG79 5F 24 91 SEG30 SEG30 2E 55 141 SEG80 SEG80 60 23 92 SEG31 SEG31 2F 54 142 SEG81 SEG81 61 22 93 SEG32 SEG32 30 53 143 SEG82 SEG82 62 21
COL ADDRESS HE
X
COL ADDRESS HEX
OL ADDRESS HE
X
Table 1 SSD1810’s Output Relation between SEG and Column Address at different MODE
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REV 1.1
05/01
SOLOMON
Pad # Name X Y Pad # Name X Y
1
COM27/COM29
2450 1649.025 51
COM9/COM11
-2744.35 1664.95
2
COM28/COM30
2347.8 1649.025 52
COM8/COM10
-2744.35 1562.75
3
COM29/COM31
2245.6 1649.025 53
COM7/COM9
-2744.35 1460.55
4
COM30/COM32
2143.4 1649.025 54
COM6/COM8
-2744.35 1358.35
5
COM31/COM33
2041.2 1649.025 55
COM5/COM7
-2744.35 1256.15
6 ICONS 1939 1649.025 56
COM4/COM6
-2744.35 1153.95
7 FRS 1790.775 1649.025 57
COM3/COM5
-2744.35 1051.75
8 FR 1688.575 1649.025 58
COM2/COM4
-2744.35 949.55
9 CL 1586.375 1649.025 59
COM1/COM3
-2744.35 847.35
10 IRS 1492.225 1649.025 60
COM0/COM2
-2744.35 753.2
11 VDD 1398.075 1649.025 61
SEG0/COM1
-2744.35 659.05
12 MODE 1303.925 1649.025 62
SEG1/COM0
-2744.35 564.9 13 /RES 1209.775 1649.025 63 SEG2 -2744.35 470.75 14 P/S 1115.625 1649.025 64 SEG3 -2744.35 376.6 15 /CS1 1021.475 1649.025 65 SEG4 -2744.35 282.45 16 CS2 927.325 1649.025 66 SEG5 -2744.35 188.3 17 C68/80 833.175 1649.025 67 SEG6 -2744.35 94.15 18 D/C 739.025 1649.025 68 SEG7 -2744.35 0 19 R/W 641.375 1649.025 69 SEG8 -2744.35 -94.15 20 E/RD 543.725 1649.025 70 SEG9 -2744.35 -188.3 21 VDD 446.075 1649.025 71 SEG10 -2744.35 -282.45 22 D0 348.425 1649.025 72 SEG11 -2744.35 -376.6 23 D1 250.775 1649.025 73 SEG12 -2744.35 -470.75 24 D2 153.125 1649.025 74 SEG13 -2744.35 -564.9 25 D3 55.475 1649.025 75 SEG14 -2744.35 -659.05 26 D4 -42.175 1649.025 76 SEG15 -2744.35 -753.2 27 D5 -139.825 1649.025 77 SEG16 -2744.35 -847.35 28 D6 -237.475 1649.025 78 SEG17 -2744.35 -949.55 29 D7 -335.125 1649.025 79 SEG18 -2744.35 -1051.75 30 VSS -460.6 1649.025 80 SEG19 -2744.35 -1153.95 31 VEE -558.25 1649.025 81 SEG20 -2744.35 -1256.15 32 C3N -655.9 1649.025 82 SEG21 -2744.35 -1358.35 33 C1P -753.55 1649.025 83 SEG22 -2744.35 -1460.55 34 C1N -851.2 1649.025 84 SEG23 -2744.35 -1562.75 35 C2P -948.85 1649.025 85 SEG24 -2744.35 -1664.95 36 C2N -1046.5 1649.025 37 VL6 -1144.15 1649.025 38 VF -1241.8 1649.025 39 VDD -1339.45 1649.025 40 VL2 -1437.1 1649.025 41 VL3 -1534.75 1649.025 42 VL4 -1632.4 1649.025 43 VL5 -1734.6 1649.025 44 VL6 -1836.8 1649.025 45
COM15/COM17
-1939 1649.025
46
COM14/COM16
-2041.2 1649.025
47
COM13/COM15
-2143.4 1649.025
48
COM12/COM14
-2245.6 1649.025
49
COM11/COM13
-2347.8 1649.025
50
COM10/COM12
-2450 1649.025
Pad 1Pad 50
Pad 86 Pad 136
X
Y
(0,0)
Table 2 SSD1810 Pad Coordinates
Remark: MODE connect to VDD : MUX33 mode(COM0~COM33); MODE connect to VSS/NC: MUX32 mode(COM0~COM31);
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Pad # Name X Y Pad # Name X Y
86 SEG25 -2430.225 -1649.025 137 SEG76 2744.35 -1664.95 87 SEG26 -2328.025 -1649.025 138 SEG77 2744.35 -1562.75 88 SEG27 -2225.825 -1649.025 139 SEG78 2744.35 -1460.55 89 SEG28 -2123.625 -1649.025 140 SEG79 2744.35 -1358.35 90 SEG29 -2021.425 -1649.025 141 SEG80 2744.35 -1256.15 91 SEG30 -1919.225 -1649.025 142 SEG81 2744.35 -1153.95 92 SEG31 -1817.025 -1649.025 143 SEG82 2744.35 -1051.75 93 SEG32 -1714.825 -1649.025 144 SEG83 2744.35 -949.55 94 SEG33 -1612.625 -1649.025 145 SEG84 2744.35 -847.35 95 SEG34 -1510.425 -1649.025 146 SEG85 2744.35 -753.2 96 SEG35 -1412.25 -1649.025 147 SEG86 2744.35 -659.05 97 SEG36 -1318.1 -1649.025 148 SEG87 2744.35 -564.9 98 SEG37 -1223.95 -1649.025 149 SEG88 2744.35 -470.75
99 SEG38 -1129.8 -1649.025 150 SEG89 2744.35 -376.6 100 SEG39 -1035.65 -1649.025 151 SEG90 2744.35 -282.45 101 SEG40 -941.5 -1649.025 152 SEG91 2744.35 -188.3 102 SEG41 -847.35 -1649.025 153 SEG92 2744.35 -94.15 103 SEG42 -753.2 -1649.025 154 SEG93 2744.35 0 104 SEG43 -659.05 -1649.025 155 SEG94 2744.35 94.15 105 SEG44 -564.9 -1649.025 156 SEG95 2744.35 188.3 106 SEG45 -470.75 -1649.025 157 SEG96 2744.35 282.45 107 SEG46 -376.6 -1649.025 158 SEG97 2744.35 376.6 108 SEG47 -282.45 -1649.025 159 SEG98 2744.35 470.75 109 SEG48 -188.3 -1649.025 160 SEG99 2744.35 564.9 110 SEG49 -94.15 -1649.025 161
COM16/COM18
2744.35 659.05
111 SEG50 0 -1649.025 162
COM17/COM19
2744.35 753.2
112 SEG51 94.15 -1649.025 163
COM18/COM20
2744.35 847.35
113 SEG52 188.3 -1649.025 164
COM19/COM21
2744.35 949.55
114 SEG53 282.45 -1649.025 165
COM20/COM22
2744.35 1051.75
115 SEG54 376.6 -1649.025 166
COM21/COM23
2744.35 1153.95
116 SEG55 470.75 -1649.025 167
COM22/COM24
2744.35 1256.15
117 SEG56 564.9 -1649.025 168
COM23/COM25
2744.35 1358.35
118 SEG57 659.05 -1649.025 169
COM24/COM26
2744.35 1460.55
119 SEG58 753.2 -1649.025 170
COM25/COM27
2744.35 1562.75
120 SEG59 847.35 -1649.025 171
COM26/COM28
2744.35 1664.95 121 SEG60 941.5 -1649.025 122 SEG61 1035.65 -1649.025
Pad Size
123 SEG62 1129.8 -1649.025 Pad # X Y 124 SEG63 1223.95 -1649.025 1 - 8 3.4 mil 4.3 mil 125 SEG64 1318.1 -1649.025 9 - 42 3.1 mil 4.3 mil 126 SEG65 1412.25 -1649.025 43 - 50 3.4 mil 4.3 mil 127 SEG66 1510.425 -1649.025 51 - 58 4.3 mil 3.4 mil 128 SEG67 1612.625 -1649.025 59 - 77 4.3 mil 3.1 mil 129 SEG68 1714.825 -1649.025 78 - 85 4.3 mil 3.4 mil 130 SEG69 1817.025 -1649.025 86 - 95 3.4 mil 4.3 mil 131 SEG70 1919.225 -1649.025 96 - 126 3.1 mil 4.3 mil 132 SEG71 2021.425 -1649.025 127 - 136 3.4 mil 4.3 mil 133 SEG72 2123.625 -1649.025 137 - 144 4.3 mil 3.4 mil 134 SEG73 2225.825 -1649.025 145 - 163 4.3 mil 3.1 mil 135 SEG74 2328.025 -1649.025 164 - 171 4.3 mil 3.4 mil 136 SEG75 2430.225 -1649.025
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FRS
FR CL
VSS
IRS
VDD
MODE
VSS
/RES
VDD
P/S
VSS
/CS1
CS2
VDD
C68/80
VSS
D/C R/W VSS
E(/RD)
VDD
D0 D1 D2 D3 D4
D5 D6(SCK) D7(SDA)
NC
NC VSS VSS VEE VEE VEE C3N C3N C3N C1P C1P C1P C1N C1N C1N C2P C2P C2P C2N C2N C2N
VL6
VF VF
VDD
VL2 VL2 VL3 VL3 VL4 VL4 VL5 VL5 VL6
NC
NC
COM15/COM17
COM14/COM16
COM13/COM15
COM12/COM14
COM11/COM13
COM10/COM12
COM9/COM11
COM8/COM10
COM7/COM9
COM6/COM8
COM5/COM7
COM4/COM6
COM3/COM5
COM2/COM4
COM1/COM3
COM0/COM2
SEG0/COM1
SEG1/COM0
SEG2
SEG3
SEG4
SEG5
SEG6
SEG94 SEG93 SEG92 SEG91 SEG90 SEG89 SEG88 SEG87 SEG86 SEG85 SEG84 SEG83 SEG82 SEG81 SEG80 SEG79 SEG78 SEG77 SEG76
SEG27 SEG26 SEG25 SEG24 SEG23 SEG22 SEG21 SEG20 SEG19 SEG18 SEG17 SEG16 SEG15 SEG14 SEG13 SEG12 SEG11 SEG10 SEG9 SEG8 SEG7
ICONS
COM33/COM31
COM32/COM30
COM31/COM29
COM30/COM28
COM29/COM27
COM28/COM26
COM27/COM25
COM26/COM24
COM25/COM23
COM24/COM22
COM23/COM21
COM22/COM20
COM21/COM19
COM20/COM18
COM19/COM17
COM18/COM16
ICONS
SEG99
SEG98
SEG97
SEG96
SEG65
SSD1810A
PIN ARRANGEMENT
1
68
92
197
202
Figure 3 SSD1810A Gold Bump Die Pin Arrangement
x
Y
(0,0)
Center : 20583,5619.5 Radius : 102.025u
Center : 17291, -2879 Size : 99.75u x 99.75u
Center : -20585, 5745 Size 99.75u x 99.75u
Die Size : 299.85 mil X 93.03 mil Die Thickness : 21mil +/- 1mil Bump Height: Nominal 18um
Tolerance <4um within die
<8um within lot
- MODE connect to VDD [34MUX MODE IS SET]
- MODE connect to N/C or VSS [32MUX MODE]
- IRS connect to VDD [Use Internal resistors network]
- IRS connect to N/C or VSS [Use external resistors network]
Note:
1. This diagram showing Die Face Up view.
2. Coordinates and Size of all alignment marks are in unit um and w.r.t. center of the chip.
Center : 9980, -3572 Radius : 27.3u
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Pad # MODE=VDD MODE=NC Pad # MODE=VDD MODE=NC Pad # MODE=VDD MODE=NC
Normal Re-map Normal Re-map Normal Re-map
118 SEG31 SEG33 31 52 168 SEG81 SEG83 63 20 69 COM17 COM15 119 SEG32 SEG34 32 51 169 SEG82 SEG84 64 1F 70 COM16 COM14 120 SEG33 SEG35 33 50 170 SEG83 SEG85 65 1E
71 COM15 COM13 121 SEG34 SEG36 34 4F 171 SEG84 SEG86 66 1D 72 COM14 COM12 122 SEG35 SEG37 35 4E 172 SEG85 SEG87 67 1C 73 COM13 COM11 123 SEG36 SEG38 36 4D 173 SEG86 SEG88 68 1B 74 COM12 COM10 124 SEG37 SEG39 37 4C 174 SEG87 SEG89 69 1A 75 COM11 COM9 125 SEG38 SEG40 38 4B 175 SEG88 SEG90 6A 19 76 COM10 COM8 126 SEG39 SEG41 39 4A 176 SEG89 SEG91 6B 18 77 COM9 COM7 127 SEG40 SEG42 3A 49 177 SEG90 SEG92 6C 17
78 COM8 COM6 128 SEG41 SEG43 3B 48 178 SEG91 SEG93 6D 16 79 COM7 COM5 129 SEG42 SEG44 3C 47 179 SEG92 SEG94 6E 15 80 COM6 COM4 130 SEG43 SEG45 3D 46 180 SEG93 SEG95 6F 14 81 COM5 COM3 131 SEG44 SEG46 3E 45 181 SEG94 SEG96 70 13 82 COM4 COM2 132 SEG45 SEG47 3F 44 182 SEG95 SEG97 71 12 83 COM3 COM1 133 SEG46 SEG48 40 43 183 SEG96 SEG98 72 11 84 COM2 COM0 134 SEG47 SEG49 41 42 184 SEG97 SEG99 73 10
85 COM1 SEG0 10 73 135 SEG48 SEG50 42 41 185 ICONS ICONS 86 COM0 SEG1 11 72 136 SEG49 SEG51 43 40 186 COM18 COM16 87 SEG0 SEG2 12 71 137 SEG50 SEG52 44 3F 187 COM19 COM17 88 SEG1 SEG3 13 70 138 SEG51 SEG53 45 3E 188 COM20 COM18 89 SEG2 SEG4 14 6F 139 SEG52 SEG54 46 3D 189 COM21 COM19 90 SEG3 SEG5 15 6E 140 SEG53 SEG55 47 3C 190 COM22 COM20
91 SEG4 SEG6 16 6D 141 SEG54 SEG56 48 3B 191 COM23 COM21 92 SEG5 SEG7 17 6C 142 SEG55 SEG57 49 3A 192 COM24 COM22 93 SEG6 SEG8 18 6B 143 SEG56 SEG58 4A 39 193 COM25 COM23 94 SEG7 SEG9 19 6A 144 SEG57 SEG59 4B 38 194 COM26 COM24 95 SEG8 SEG10 1A 69 145 SEG58 SEG60 4C 37 195 COM27 COM25 96 SEG9 SEG11 1B 68 146 SEG59 SEG61 4D 36 196 COM28 COM26 97 SEG10 SEG12 1C 67 147 SEG60 SEG62 4E 35 197 COM29 COM27
98 SEG11 SEG13 1D 66 148 SEG61 SEG63 4F 34 198 COM30 COM28 99 SEG12 SEG14 1E 65 149 SEG62 SEG64 50 33 199 COM31 COM29
100 SEG13 SEG15 1F 64 150 SEG63 SEG65 51 32 200 COM32 COM30 101 SEG14 SEG16 20 63 151 SEG64 SEG66 52 31 201 COM33 COM31 102 SEG15 SEG17 21 62 152 SEG65 SEG67 53 30 202 ICONS ICONS 103 SEG16 SEG18 22 61 153 SEG66 SEG68 54 2F 104 SEG17 SEG19 23 60 154 SEG67 SEG69 55 2E
105 SEG18 SEG20 24 5F 155 SEG68 SEG70 56 2D 106 SEG19 SEG21 25 5E 156 SEG69 SEG71 57 2C 107 SEG20 SEG22 26 5D 157 SEG70 SEG72 58 2B 108 SEG21 SEG23 27 5C 158 SEG71 SEG73 59 2A 109 SEG22 SEG24 28 5B 159 SEG72 SEG74 5A 29 110 SEG23 SEG25 29 5A 160 SEG73 SEG75 5B 28
111 SEG24 SEG26 2A 59 161 SEG74 SEG76 5C 27 112 SEG25 SEG27 2B 58 162 SEG75 SEG77 5D 26 113 SEG26 SEG28 2C 57 163 SEG76 SEG78 5E 25 114 SEG27 SEG29 2D 56 164 SEG77 SEG79 5F 24 115 SEG28 SEG30 2E 55 165 SEG78 SEG80 60 23 116 SEG29 SEG31 2F 54 166 SEG79 SEG81 61 22 117 SEG30 SEG32 30 53 167 SEG80 SEG82 62 21
COL ADDRESS HE
X
COL ADDRESS HE
X
COL ADDRESS HE
X
Table 3 SSD1810A’s Output Relation between SEG and colomn address at different MODE
Page 9
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PAD# PAD NAME X/um Y/um PAD# PAD NAME X/um Y/um PAD# PAD NAME X/um Y/um
1 FRS -3046.05 -997.675 69
COM15/COM17
3604.3 -1005.2 137 SEG52 -114.975 979.475
2 FR -2957.15 -997.675 70
COM14/COM16 3604.3 -928.9 138 SEG53 -191.275 979.475
3 CL -2868.25 -997.675 71
COM13/COM15 3604.3 -852.6 139 SEG54 -267.575 979.475
4 VSS -2779.35 -997.675 72
COM12/COM14 3604.3 -776.3 140 SEG55 -343.875 979.475
5 IRS -2690.45 -997.675 73
COM11/COM13 3604.3 -700 141 SEG56 -420.175 979.475
6 VDD -2601.55 -997.675 74
COM10/COM12
3604.3 -623.7 142 SEG57 -496.475 979.475
7 MODE -2512.65 -997.675 75
COM9/COM11 3604.3 -547.4 143 SEG58 -572.775 979.475
8 VSS -2423.75 -997.675 76
COM8/COM10 3604.3 -471.1 144 SEG59 -649.075 979.475
9 /RES -2334.85 -997.675 77 COM7/COM9 3604.3 -394.8 145 SEG60 -725.375 979.475 10 VDD -2245.95 -997.675 78 COM6/COM8 3604.3 -318.5 146 SEG61 -801.675 979.475 11 P/S -2157.05 -997.675 79 COM5/COM7 3604.3 -242.2 147 SEG62 -877.975 979.475 12 VSS -2068.15 -997.675 80 COM4/COM6 3604.3 -165.9 148 SEG63 -954.275 979.475 13 /CS1 -1979.25 -997.675 81 COM3/COM5 3604.3 -89.6 149 SEG64 -1030.575 979.475 14 CS2 -1890.35 -997.675 82 COM2/COM4 3604.3 -13.3 150 SEG65 -1106.875 979.475 15 VDD -1801.45 -997.675 83 COM1/COM3 3604.3 63 151 SEG66 -1183.175 979.475 16 C68/80 -1712.55 -997.675 84 COM0/COM2 3604.3 139.3 152 SEG67 -1259.475 979.475 17 VSS -1623.65 -997.675 85 SEG0/COM1 3604.3 215.6 153 SEG68 -1335.775 979.475 18 D/C -1534.75 -997.675 86 SEG1/COM0 3604.3 291.9 154 SEG69 -1412.075 979.475 19 R/W -1445.85 -997.675 87 SEG2 3604.3 368.2 155 SEG70 -1488.375 979.475 20 VSS -1356.95 -997.675 88 SEG3 3604.3 444.5 156 SEG71 -1564.675 979.475 21 E/RD -1268.05 -997.675 89 SEG4 3604.3 520.8 157 SEG72 -1640.975 979.475 22 VDD -1179.15 -997.675 90 SEG5 3604.3 597.1 158 SEG73 -1717.275 979.475 23 D0 -1090.25 -997.675 91 SEG6 3604.3 673.4 159 SEG74 -1793.575 979.475 24 D1 -1001.35 -997.675 92 SEG7 3318.525 979.475 160 SEG75 -1869.875 979.475 25 D2 -912.45 -997.675 93 SEG8 3242.225 979.475 161 SEG76 -1946.175 979.475 26 D3 -823.55 -997.675 94 SEG9 3165.925 979.475 162 SEG77 -2022.475 979.475 27 D4 -734.65 -997.675 95 SEG10 3089.625 979.475 163 SEG78 -2098.775 979.475 28 D5 -645.75 -997.675 96 SEG11 3013.325 979.475 164 SEG79 -2175.075 979.475 29 D6 -556.85 -997.675 97 SEG12 2937.025 979.475 165 SEG80 -2251.375 979.475 30 D7 -467.95 -997.675 98 SEG13 2860.725 979.475 166 SEG81 -2327.675 979.475 31 NC -323.05 -997.675 99 SEG14 2784.425 979.475 167 SEG82 -2403.975 979.475 32 NC -205.45 -997.675 100 SEG15 2708.125 979.475 168 SEG83 -2480.275 979.475 33 VSS -116.55 -997.675 101 SEG16 2631.825 979.475 169 SEG84 -2556.575 979.475 34 VSS -27.65 -997.675 102 SEG17 2555.525 979.475 170 SEG85 -2632.875 979.475 35 VEE 61.25 -997.675 103 SEG18 2479.225 979.475 171 SEG86 -2709.175 979.475 36 VEE 150.15 -997.675 104 SEG19 2402.925 979.475 172 SEG87 -2785.475 979.475 37 VEE 239.05 -997.675 105 SEG20 2326.625 979.475 173 SEG88 -2861.775 979.475 38 C3N 327.95 -997.675 106 SEG21 2250.325 979.475 174 SEG89 -2938.075 979.475 39 C3N 416.85 -997.675 107 SEG22 2174.025 979.475 175 SEG90 -3014.375 979.475 40 C3N 505.75 -997.675 108 SEG23 2097.725 979.475 176 SEG91 -3090.675 979.475 41 C1P 594.65 -997.675 109 SEG24 2021.425 979.475 177 SEG92 -3166.975 979.475 42 C1P 683.55 -997.675 110 SEG25 1945.125 979.475 178 SEG93 -3243.275 979.475 43 C1P 772.45 -997.675 111 SEG26 1868.825 979.475 179 SEG94 -3319.575 979.475 44 C1N 861.35 -997.675 112 SEG27 1792.525 979.475 180 SEG95 -3604.3 673.4 45 C1N 950.25 -997.675 113 SEG28 1716.225 979.475 181 SEG96 -3604.3 597.1 46 C1N 1039.15 -997.675 114 SEG29 1639.925 979.475 182 SEG97 -3604.3 520.8 47 C2P 1128.05 -997.675 115 SEG30 1563.625 979.475 183 SEG98 -3604.3 444.5 48 C2P 1216.95 -997.675 116 SEG31 1487.325 979.475 184 SEG99 -3604.3 368.2 49 C2P 1305.85 -997.675 117 SEG32 1411.025 979.475 185 ICONS -3604.3 291.9 50 C2N 1394.75 -997.675 118 SEG33 1334.725 979.475 186
COM16/COM18 -3604.3 215.6
51 C2N 1483.65 -997.675 119 SEG34 1258.425 979.475 187
COM17/COM19
-3604.3 139.3
52 C2N 1572.55 -997.675 120 SEG35 1182.125 979.475 188
COM18/COM20
-3604.3 63
53 VL6 1661.45 -997.675 121 SEG36 1105.825 979.475 189
COM19/COM21 -3604.3 -13.3
54 VDD 1750.35 -997.675 122 SEG37 1029.525 979.475 190
COM20/COM22 -3604.3 -89.6
55 VF 1839.25 -997.675 123 SEG38 953.225 979.475 191
COM21/COM23 -3604.3 -165.9
56 VF 1928.15 -997.675 124 SEG39 876.925 979.475 192
COM22/COM24
-3604.3 -242.2
57 VDD 2017.05 -997.675 125 SEG40 800.625 979.475 193
COM23/COM25
-3604.3 -318.5
58 VL2 2105.95 -997.675 126 SEG41 724.325 979.475 194
COM24/COM26 -3604.3 -394.8
59 VL2 2194.85 -997.675 127 SEG42 648.025 979.475 195
COM25/COM27 -3604.3 -471.1
60 VL3 2283.75 -997.675 128 SEG43 571.725 979.475 196
COM26/COM28 -3604.3 -547.4
61 VL3 2372.65 -997.675 129 SEG44 495.425 979.475 197
COM27/COM29
-3604.3 -623.7
62 VL4 2461.55 -997.675 130 SEG45 419.125 979.475 198
COM28/COM30
-3604.3 -700
63 VL4 2550.45 -997.675 131 SEG46 342.825 979.475 199
COM29/COM31 -3604.3 -776.3
64 VL5 2639.35 -997.675 132 SEG47 266.525 979.475 200
COM30/COM32 -3604.3 -852.6
65 VL5 2728.25 -997.675 133 SEG48 190.225 979.475 201
COM31/COM33 -3604.3 -928.9
66 VL6 2817.15 -997.675 134 SEG49 113.925 979.475 202 ICONS -3604.3 -1005.2 67 NC 2906.05 -997.675 135 SEG50 37.625 979.475
68 NC 2994.95 -997.675 136 SEG51 -38.675 979.475
BUMP SIZE
PAD# X/um Y/um 1 - 68 60.2 60.2
69 - 91 100.1 42.0
92 - 179 42.0 100.1
180 - 202 100.1 42.0
(0,0) X
Y
Pad#1 Pad#68
Pad#69
Pad#91
Pad#92Pad#179
Pad#180
Pad#202
Die Size: 299.85 mil X 93.03 mil Bumps face up
Remark: MODE connect to VDD : MUX33 mode(COM0~COM33); MODE connect to VSS/NC: MUX32 mode(COM0~COM31);
Table 4 SSD1810A Pad Coordinates
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PIN DESCRIPTIONS
MODE
This pin is display mode select input. MODE = 1: Set to 34-mux display. MODE = 0 or N/C: Set to 32-mux display.
FR
This pin is the frame signal output. The voltage output
from this pin is either V
SS
or VDD. This voltage will toggle
once per frame.
FRS
This pin is used together with FR in for static drive (indica­tor) output. Voltage level output from this pin is also either V
SS
or VDD. After power-on or after Set Indicator Off com­mand is issued, this pin will be same phase signal to FR. If Set Indicator On command is sent to the chip, a out-of-phase to FR signal will be output.
CL
This pin is the display clock output.
CS1
, CS2
These pin are chip select inputs. The chip is enabled for
MCU communication only when both CS1
is pulled low and
CS2 is pulled high.
RES
This pin is reset signal input. Initialization of the chip is started once this pin is pulled low. Minimum pulse width for completing the reset procedure is 1
µs.
D/C
This pin is Data/Command control pin. When the pin is pulled high, the data at D
7-D0
is treated as display data.
When the pin is pulled low, the data at D
7-D0
will be trans­ferred to the command register. Details relationship with other MCU interface signals, please refer to the Timing Character­istics Diagrams.
R/W(WR)
This pin is MCU interface input. When interfacing to a 6800-series microprocessor, this pin will be used as Read/ Write (R/W
) selection input. Read mode will be carried out
when this pin is pulled high and write mode when low.
When interfacing to an 8080-microprocessor, this pin will be the Write (WR)
input. Data write operation is initiated when
this pin is pulled low when the chip is selected.
E(RD)
This pin is MCU interface input. When interfacing to an 6800-series microprocessor, this pin will be used as the En­able (E) signal. Read/write operation is initiated when this pin is pulled high when the chip is selected.
When connecting to an 8080-microprocessor, this pin re­ceives the Read (RD
) signal. Data read operation is initiated
when this pin is pulled low when the chip is selected.
D7-D
0
These pins are the 8-bit bi-directional data bus to be con-
nected to the MCU in parallel interface mode. D
7
is the MSB
while D
0
is the LSB.
When serial mode is selected, D
7
is the serial data input
(SDA) and D
6
is the serial clock input (SCK).
V
DD
Chip’s Power Supply pin. This is also the reference for the
DC-DC Converter output and LCD driving voltages.
V
SS
Ground. A reference for the logic pins.
V
EE
This is the most negative voltage supply pin of the chip. It can be supplied externally or generated by the internal DC-DC converter, by turning on the internal voltage booster option in the Set Power Control Register command.
When using internal DC-DC converter as generator, volt­age at this pin is for internal reference only. It CANNOT be used for driving external circuitries.
C3N, C1P, C1N, C2N and C
2P
When internal DC-DC voltage converter is used, external capacitor(s) is/are connected between these pins. Different con­nection will result in different DC-DC converter multiple factor, 2X, 3X or 4X. Detail connections please refer to voltage convert­er section in the functional block description.
VL2, VL3, VL4 and V
L5
These are the LCD driving voltage levels. All these levels are referenced to V
DD
.
They can be supplied externally or generated by the inter­nal bias divider, by turning on the output op-amp buffers op­tion in the Set Power Control Register command.
The potential relation of these pins are given as:
V
DD
> VL2 > VL3 > VL4 > VL5 > V
L6
and with bias factor, a,
V
L2
- VDD = 1/a * (VL6 - VDD)
V
L3
- VDD = 2/a * (VL6 - VDD)
V
L4
- VDD = (a-2)/a * (VL6 - VDD)
V
L5
- VDD = (a-1)/a * (VL6 - VDD)
V
L6
This pin is the most negative LCD driving voltage. It can be supplied externally or generated by turning on the internal reg-
ulator option in the Set Power Control Register command.
V
F
This pin is the input of the built-in voltage regulator for gen­erating V
L6
.
When external resistor network is selected (IRS pulled low) to generate the LCD driving level, V
L6
, two external resistors, R
1
and R2, should be connected between VDD and VF, and VF and V
L6
, respectively (see application circuit diagrams).
Page 11
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C68/80
This pin is MCU parallel interface selection input. When the pin is pulled high, 6800 series interface is selected and when the pin is pulled low, 8080 series interface is selected.
If Serial Interface is selected (P/S
pulled low), the setting of this pin is ignored, but must be connected to a known logic (either high or low).
P/S
This pin is serial/parallel interface selection input. When this pin is pulled high, parallel interface mode is selected. When it is pulled low, serial interface will be selected.
Note1: For serial mode, D0, D1, D2, D3, D4, D5, R/W/ (WR), E/(RD) is recommended to be connected to Vss.
Note2: Read Back operation is only available in parallel mode.
IRS
This is the input pin to enable the internal resistors net­work for the voltage regulator. When this pin is pulled high, the internal feedback resistors of the internal regulator for generating V
L6
will be enabled.
When it is pulled low, external resistors, R
1
and R2,
should be connected to V
DD
and VF, and VF and VL6, respec-
tively (see application circuit diagrams).
COM0 - COM33
These pins provide the row driving signal to the LCD
panel. The output voltage level of these pins is V
DD
during
sleep mode and standby mode.
SEG0 - SEG99
These pins provide the LCD column driving signals. The
output voltage level of these pins is V
DD
during sleep mode
and standby mode.
ICONS
This pin is the special icon or indicator line. There are two ICONS pins (SSD1810A) on the chip. Both pins output exact­ly the same signal. The reason for duplicating the pin is to en­hance the flexibility of the LCD layout.
Note: SSD1810V has only one ICONS pin.
NC
These are the No Connection pins. Nothing should be connected to these pins, nor they are connected together. These pins should be left open individually.
Page 12
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Command Decoder and Command Interface
This module determines whether D
0
~ D7 input is inter­preted as data or command, based upon the input of the D/C pin. If D/C is high, the input at D0 ~ D7 is written to Graphic Display Data RAM (GDDRAM). If D/C
is low, the input at D0-
D
7
is interpreted as a Command and it will be decoded and
written to the corresponding command register.
Reset is of the same function as Power ON Reset (POR).
Once RES
receives a reset pulse (pull low) of about 1us, all internal circuitry will be back to its initial status. Refer to Com­mand Description section for more information.
MPU Parallel 6800-series Interface
The parallel interface consists of 8 bi-directional data pins
(D
0-D7
), R/W(WR), D/C, E(RD), CS1 and CS2. R/W(WR) input High indicates a read operation from the Graphic Dis­play Data RAM (GDDRAM) or the status register. R/W
(WR) input Low indicates a write operation to Display Data RAM or Internal Command Registers depending on the status of D/C input. The E(RD) input serves as data latch signal (clock) when high provided that CS1
and CS2 are low and high respectively. Refer to Figure 10 on page 26 of parallel timing characteristics for Parallel Interface Timing Diagram of 6800­series microprocessor
In order to match the operating frequency of display RAM with that of the microprocessor, pipeline processing is inter­nally performed which requires the insertion of a dummy read before the first actual display data read form the driver. This is shown in Figure 4 below.
FUNCTIONAL BLOCK DESCRIPTIONS
MPU Parallel 8080-series interface
The parallel interface consists of 8 bi-directional data pins
(D
0-D7
), E(RD), R/W(WR), D/C, CS1 and CS2. E(RD) input serves as data read latch signal (clock) when low provided that CS1
and CS2 are low and high respectively. Whether it
is display data or status register read is controlled by D/C
. R/
W
(WR) input serves as data write latch signal(clock) when
high provided that CS1
and CS2 are low and high respec­tively. Whether it is display data or command register write is controlled by D/C
. Refer to Figure 11 on page 27 of parallel timing characteristics for Parallel Interface Timing Diagram of 8080-series microprocessor.
Similar to 6800-series interface, a dummy read is also required before the first actual display data read form the driver.
MPU Serial interface
The serial interface consists of serial clock SCK, serial data SDA, D/C
, CS1 and CS2. SDA is shifted into a 8-bit shift
register on every rising edge of SCL in the order of D
7
, D6,...
D
0
. D/C is sampled on every eighth clock and the data byte in the shift register is written to the Display Data RAM or com­mand register in the same clock.
R/W(WR)
E(RD)
N
n
n+1
n+2
data bus
write column address
dummy read
data read1 data read 2
data read 3
Figure 4 Display data read with the insertion of dummy read
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Oscillator Circuit
This module is an On-Chip low power RC oscillator circuitry(Figure 5) . The oscillator generates the clock for the DC-DC
voltage converter. This clock is also used in the Display Timing Generator.
Oscillation Circuit
enable
OSC1 OSC2
Internal pwell resistor
Oscillator enable
Buffer
enable
SSD1810/A
C
3NC1PC1NC2PC2N
V
EE
Remarks:
1. C1 = 0.47 - 1.0uF
2. Boosting input from V
SS
.
3. 4. All voltages are referenced to V
DD
V
SS
+
C1 C1
+
SSD1810/A
C
3NC1PC1NC2PC2N
V
EE
V
SS
+
C1 C1
+
C1
+
SSD1810/A
C
3NC1PC1NC2PC2N
V
EE
V
SS
+
C1 C1
+
C1
+
C1
+
2X Boosting Configuration
3X Boosting Configuration
4X Boosting Configuration
LCD Driving Voltage Generator and Regulator
This module generates the LCD voltage required for
display driving output. With reference to V
DD
, it takes a sin-
gle supply input, V
SS
, and generate necessary voltage lev-
els. This block consists of:
1. 2X, 3X and 4X DC-DC voltage converter
The built-in DC-DC voltage converter is used to gener­ate the large negative voltage supply with reference to VDD from the voltage input (VSS). It is possible to produce 2X, 3X or 4X boosting from the potential different between V
SS
- VDD.
Detail configurations of the DC-DC converter for differ­ent boosting multiples are given in Figure 6.
2. Voltage Regulator (Voltages referenced to VDD)
Internal (IRS pin = H) or external (IRS pin = L) feedback gain can control the LCD driving contrast curves.
If internal resistor network is enabled, eight settings can be selected through software command.
If external control is selected, external resistors are re­quired to be connected between V
DD
and VF (R1), and be-
tween V
F
and VL6 (R2). See application circuit diagrams for
detail connections.
Figure 5 Oscillator Circuitry
Figure 6 DC-DC Converter Configurations
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3. Contrast Control (Voltages referenced to V
DD
)
Software control of the 32 contrast voltage levels at each voltage regulator feedback gain. The equation of calculating the LCD driving
voltage is given as:
where
and
*Note: There may be a calculation error of max. 6% when comparing with measurement values.
)
1
)(
(
)1(
6
R
VVRV
V
V
Contrast
GainVV
SSDD
refDDL
BE
ref
+
+
=
+=
β
Ext.
Resistor
Gain
-(1+R
2/R1
)
β
52.8
TC 0
(
-0.00%/°C
)2(
-0.15%/°C
)4(
-0.23%/°C
)7(
-0.31%/°C
)
V
BE
-0.012 0.492 0.490 0.487
R
1.0 0.472 0.269 0.154
VL6 vs Contrast Settings
-9
-8
-7
-6
-5
-4 0 5 10 15 20 25 30
contrast level at VDD = 2.775V
VL6(V)
External Resistors Gain = -5.22
Figure 7 Voltage Regulator Output for Different Contrast Settings (Vop depends on VDD)
Page 15
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3. Smart Bias Divider Divide the regulator output to give the LCD driving voltages (V
L2
- VL5). This is a low power consumption circuit which
saves most of the display current.
4. Contrast Control (Voltages referenced to V
DD
)
Software control of 32 voltage levels of LCD voltage.
5. Bias Ratio Selection circuitry Software control of 1/4, 1/5, 1/6 and 1/7 bias ratio to match the characteristic of LCD panel.
6. Self adjust temperature compensation circuitry Provide 4 different compensation grade selections to satisfy the various liquid crystal temperature grades. The grading can be selected by software control. Defaulted temperature coefficient (TC) value is -0.23%/
o
C.
Graphic Display Data RAM (GDDRAM)
The GDDRAM is a bit mapped static RAM holding the bit pat­tern to be displayed. The size of the RAM is 100x 65= 6500 bits. RAM columns 00H to 0FH are reserved for future use. Only columns 10H to 73H are mapped to segment outputs. Fig­ure 8 on page 16 is a description of the GDDRAM address map. For mechanical flexibility, re-mapping on both Segment and Common outputs are provided. For vertical scrolling of dis­play, an internal initial line register can be set to control the por­tion of the RAM data to be mapped to the display. Figure 8 on page 16 shows the case in which the initial line register is set at 38H. No display data will be written when a column address less than 10H is set.
133 Bit Latch
A register carries the display signal information. In 98 X 35 dis­play mode, first 35 bits are Common driving signals and other 98 bits are Segment driving signals. Data will be fed to the HV-buff­er Cell and level-shifted to the required level.
HV Buffer Cell (Level Shifter)
HV Buffer Cell works as a level shifter which translates the low voltage output signal to the required driving voltage. The output is shifted out with an internal FRM clock which comes from the Display Timing Generator. The voltage levels are given by the level selector which is synchronized with the inter­nal M signal.
Level Selector
Level Selector is a control of the display synchronization. Dis­play voltage can be separated into two sets and used with dif­ferent cycles. Synchronization is important since it selects the required LCD voltage level to the HV Buffer Cell, which in turn outputs the COM or SEG LCD waveform.
Reset Circuit
When RES
input is low, the chip is initialized with the follow-
ing status:
• Display is OFF
• 98X34 Display Display Mode with a Icon Line is set
• Normal segment and display data column address mapping(Mode = 1,SEG0 mapped to address 12H;
Mode = 0 SEG0 mapped to address 10H) is set
• Read-modify-write mode is OFF
• Power control register is set at zero
• Shift register data clear in serial interface
• Bias ratio is set at 1/6
• Static indicator is OFF
• Vertical scroll value register is set at 0
• Column address counter is set at 0
• Page address is set at 0
• COM outputs is normal scan direction
• Contrast control register is set at zero
• Test mode is OFF
• Temperature Coefficient is set to TC5
• Smart Icon Mode is disabled.
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Pin Name SEG0 SEG1 SEG2
……
SEG98 SEG99
RAM RAM Normal 10h 11h 12h
……
72h 73h
COM Column Rema
pp
ed 73h 72h 71h
……
11h 10h Note:
In Gre
y
Scale Mode
,
00h D0 (LSB)
……
0 31 8 23 MSB is from Page 0 to Page 3
01h D1
……
1 30 9 22 LSB is form Page 4 to Page 7.
02h D2
……
2 29 10 21 In Icons line,
03h D3
……
3 28 11 20 MSB is from the bit 0 of page 8 and
04h D4
……
4 27 12 19 LSB is from the bit 1 of page 8.
05h D5
……
5261318
06h D6
……
6251417
07h D7
(
MSB
)
……
7241516
08h D0
(
LSB
)
……
8231615Exam
p
le: (In Grey Mode
)
09h D1
……
9 22 17 14 D0 (LSB)000
….
0Ah D2
……
10 21 18 13 D1 0 0 0
….
0Bh D3
……
11 20 19 12 D2 0 0 0
….
0Ch D4
……
12 19 20 11 D3 0 0 0
.…
0Dh D5
……
13 18 21 10 D4 1 1 1
….
0Eh D6
……
14 17 22 9 D5 1 1 1
….
0Fh D7
(
MSB
)
……
15 16 23 8 D6 1 1 1
….
10h D0
(
LSB
)
……
16 15 24 7 D7
(
MSB)111
….
11h D1
……
17 14 25 6
12h D2
……
18 13 26 5
13h D3
……
19 12 27 4 D0 (LSB) 0 0 0
….
14h D4
……
20 11 28 3 D1 0 0 0
….
15h D5
……
21 10 29 2 D2 1 1 1
….
16h D6
……
229301 D3111
….
17h D7
(
MSB
)
……
238310 D4000
….
18h D0 (LSB)
……
24 7 x x D5 000
….
19h D1
……
25 6 x x D6 111
….
1Ah D2
……
26 5 x x D7
(
MSB)111
….
1Bh D3
……
27 4 x x
1Ch D4
……
28 3 x x
1Dh D5
……
29 2 x x BlBlBl
….
1Eh D6
……
30 1 x x BlBlBl
….
1Fh D7
(
MSB
)
……
31 0 x x
AAA
….
20h D0 (LSB)
……
xxxx AAA
….
21h D1
……
xxxx BBB
….
22h D2
……
xxxx BBB
….
23h D3
……
x x x x CCC
….
24h D4
……
x x x x CCC
….
25h D5
……
xxxx
26h D6
……
xxxx
27h D7
(
MSB
)
……
xxxx
28h D0 (LSB)
……
x x x x D0(MSB)001
….
29h D1
……
xxxx D1
(
LSB)010
….
2Ah D2
……
xxxx
2Bh D3
……
xxxx Bl
A
B
….
2Ch D4
……
xxxx
2Dh D5
……
x x x x Bl : BLANK ( 00)
2Eh D6
……
x x x x A : COLOR A (01)
2Fh D7
(
MSB
)
……
x x x x B : COLOR B
(10)
30h D0 (LSB)
……
x x x x C : COLOR C (11)
31h D1
……
xxxx
32h D2
……
xxxx
33h D3
……
xxxx
34h D4
……
xxxx
35h D5
……
xxxx
36h D6
……
xxxx
37h D7
(
MSB
)
……
xxxx
38h D0 (LSB)
……
xx031
39h D1
……
xx130
3Ah D2
……
xx229
3Bh D3
……
xx328
3Ch D4
……
xx427
3Dh D5
……
xx526
3Eh D6
……
xx625
3Fh D7
(
MSB
)
……
xx724
D0
(
MSB
)
……
ICONS ICONS ICONS ICONS
D1
(
LSB
)
……
Page 8
LINE 6 LINE 7
Page 7
Icons
LINE 3 LINE 4 LINE 5
Page 8
Page 4
Page 5
Page 6
Page 0
Page 4
Page 0
Page 1
Page 2
Page 3
LINE 0 LINE 1 LINE 2
POR 38H
initial line re
g
ister
Normal Remapped Normal Remapped
Figure 8 Graphic Display Data RAM (GDDRAM) Address Map
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123456789
. . .
TIME SLOT
35
COM0
123456789
. . .
35 123456789
. . .
35 123456789
. . .
35
COM1
SEG0
SEG1
M
V
DD
V
L2
V
L3
V
L4
V
L5
V
L6
V
DD
V
L2
V
L3
V
L4
V
L5
V
L6
V
DD
V
L2
V
L3
V
L4
V
L5
V
L6
V
DD
V
L2
V
L3
V
L4
V
L5
V
L6
COM1 COM2 COM3 COM4 COM5 COM6 COM7
SEG1
SEG2
SEG3
SEG4
COM0
SEG0
LCD Panel Driving Waveform
The following is an example of how the Common and Segment drivers may be connected to LCD panel. The waveforms shown in Figure 6a and 6b illustrate the desired multiplex scheme.
Figure 9 LCD Driving Signal from SSD1810/A
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COMMAND TABLE
Bit Pattern Command Comment
0000X
3X2X1X0
Set Lower Column Address Set the lower nibble of the column address register using X3X2X1X0 as data
bits. The initial display line register is reset to 0000b after POR.
0001X
3X2X1X0
Set Higher Column Address Set the higher nibble of the colume address register using X3X2X1X0 as data
bits. The initial display line register is reset to 0000b after POR.
00100X
2X1X0
Set Internal Regulator Resistor Ratio Feedback gain of the internal regulator generating VL6 increases as X2X1X0
increased from 000b to 111b. After POR, X
2X1X0
= 100b.
00101X
2X1X0
Set Power Control Register X0=0: turns off the output op-amp buffer (POR)
X
0
=1: turns on the output op-amp buffer
X
1
=0: turns off the internal regulator (POR)
X
1
=1: turns on the internal regulator
X
2
=0: turns off the internal voltage booster (POR)
X
2
=1: turns on the internal voltage booster
100X
4X3X2X1X0
Set Contrast Control Register Sets one of 32 available values to the internal contrast control register using
X
4X3X2X1X0
. Maximum ± 4% VL6 output variation among the 32 levels should
be considered.
Recommend to use level 10010000b [90] as the center contrast control for smaller output variance. The contrast control register is reset to 10000000b after POR.
1010000X
0
Set Segment Re-map When Mode = 1: (34 mux)
X
0
=0: column address 12H is mapped to SEG2 (POR)
X
0
=1: column address 71H is mapped to SEG2 When Mode = 0 or NC (32 mux) X
0
=0: column address 10H is mapped to SEG0 (POR) X
0
=1: column address 73H is mapped to SEG0
See Table 1 on page 4 for detail
1010001X
0
Set LCD Bias X0=0: 1/6 bias (POR)
X
0
=1: 1/5 bias
1010010X
0
Set Entire Display On/Off X0=0: normal display (POR)
X
0
=1: entire display on
1010011X
0
Set Normal/Inverse Display X0=0: normal display (POR)
X
0
=1: inverse display
1010111X
0
Set Display On/Off X0=0: turns off LCD panel (POR)
X
0
=1: turns on LCD panel
1011X
3X2X1X0
Set Page Address Set GDDRAM Page Address (0~8) for read/write using X3X2X1X0
1100X
3
*** Set COM Output Scan Direction X3=0: normal mode (POR)
X
3
=1: remapped mode. COM0-33 become COM33-0.
See Figure 8 on page 16 for detail mapping
11100000 Set Read-Modify-Write Mode Read-modify-write mode will be entered in which the column address will not be
increased during display data read. After POR, Read-modify-write mode is turned OFF.
11100010 Software Reset Initialize the internal status
11101110 Set End of Read-Modify-Write Mode Exit Read-modify-write mode. Column address before entering the mode will be
restored.After POR, Read-modify-write mode is turned OFF.
1010110X
0
Set Indicator On/Off X0=0: indicator off (POR)
X
0
=1: indicator on
1111**** Set Test Mode Reserved for IC testing. Do NOT use
******** Set Power Save Mode
(Standby or Sleep)
Standby or sleep mode will be entered using compound commands.
Issue compound commands “Set Display Off” followed by “Set Entire display On”.
01X
5X4X3X2X1X0
Set Vertical Scroll Register Set the vertical scroll value from 0-63 using 01X5X4X3X2X1X0 when Vertical
Scroll Value Range Register is set to 0.
The Vertical Scroll Register is reset to 01000000 after POR.
Table 5 Write Command Table (D/C=0, R/W(WR)=0, E(RD)=1
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Bit Pattern Command Description
10101001
011X
4X3X2X1X0
Set Bias Ratio (X1X0)
Set Temperature Coefficient
X1X0 = 00 : 1/5 or 1/6
X
1X0
= 01 : 1/7 bias
X
1X0
= 10 : 1/4 bias
X
1X0
= 11 : Reserved for IC testing. Do NOT use
X
4X3X2
= 000 : 0.0%/oC (TC0)
X
4X3X2
= 010 : -0.15%/oC (TC2)
X
4X3X2
= 101 : -0.23%/oC (TC5,POR)
X
4X3X2
= 111 : -0.31 % /oC (TC7)
X
4X3X2
= 001, 011, 100, 110 : Reserved
1010101X
0
Set Grey scale / mono display mode X0 = 0 : mono (POR)
X
0
= 1 : Grey Scale
If Grey scale mode is selected, there are four grey level which can be selected by two bits. The MSB is from page 0 to page 3, bit 0 of page 8 and the LSB is from page 4 to page 7, bit 1 of page 8.
The grey level of the 3 color (Color A, B, C) is defined by another separated com­mand (Set Grey Level Control).
example:
MSB, LSB = 00 : Blank (1/16)
MSB, LSB = 01 : Color A (5/16)
MSB, LSB = 10 : Color B (11/16)
MSB, LSB = 11 : Color C (16/16)
See Figure 8 on page 16 for detail.
1101X
3X2X1X0
****XdXcXbX
a
Set Grey Level Control Select a color
X
3X2X1X0
= 0111 Color A (POR 16/16)
X
3X2X1X0
= 1000 Color B (POR 16/16)
X
3X2X1X0
= 1001 Color C (POR 16/16)
Set the Grey level of a color
X
dXcXbXa
= 0000 1/16
X
dXcXbXa
= 0001 2/16
:
::
XdXcXbXa = 1110 15/16
X
dXcXbXa
= 1111 16/16
See an example on page 22 for setting grey level control.
11010010 0X
6X5
00100
Set 4- / 6-Phases Smart-Icon Mode X
6X5
= 00 : 4 phases (1.8V to 2.2V)
X
6X5
= 01 : 6 phases (2.2V to 2.6V) POR
X
6X5
= 10 : Reserved for IC testing. Do NOT use
X
6X5
= 11 : Reserved for IC testing. Do NOT use
1101000X
0
Set Smart Icon Mode On/OFF X0 = 0 : normal display mode
X
0
= 1 : smart icon mode
11011100 0000000X
0
Option for Vop dependent V
DD
X0 = 0 : Vop dependent VDD (POR)
X
0
= 1 : Vop independent V
DD
Table 6 Extended Command Table
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Note : Patterns other than that given in Command Table and Extended Command Table are prohibited to enter to the chip as a command. Otherwise, unexpected result will occurs
Data Read / Write
To read data from the GDDRAM, input High to R/W(WR) pin and D/C pin for 6800-series parallel mode, Low to E(RD) pin and High
to D/C
pin for 8080-series parallel mode. No data read is provided in serial interface mode.
In normal data read mode, GDDRAM column address pointer will be increased by one automatically after each data read. However,
no automatic increase will be performed in read-modify-write mode.
Also, a dummy read is required before first valid data is read. See Figure 4 on page 12 in Functional Block Descriptions section for
detail waveform diagram.
To write data to the GDDRAM, input Low to R/W
(WR) pin and High to D/C pin for both 6800-series and 8080-series parallel mode. For serial interface mode, it is always in write mode. GDDRAM column address pointer will be increased by one automatically after each data write.
It should be noted that, after the automatic column address increment, the pointer will NOT wrap round to 0 when overflow (>97 when mode is 0 or >99 when mode is 1). The increment of the pointer stops at 97 or 99, so manual adjustment may be needed to set column address pointer.
*1. If read data is issued in read-modify-write mode, address pointer will not be increased automatically.
D
7D6D5D4D3D2D1D0
Read Status Register D7=0: indicates the driver is ready for command.
D
7
=1: indicates the driver is Busy.
D
6
=0: indicates normal segment mapping with column address
D
6
=1: indicates reverse segment mapping with column address
D
5
=0: indicates the display is ON.
D
5
=1: indicates the display is OFF.
D
4
=0: initialization is completed.
D
4
=1: initialization process is in progress after RES or software reset.
D
3D2D1D0
= 1010, these 4-bit is fixed to 1010 which could be used to identify as
Solomon Systech Device.
D/C
R/W(WR)Action
Auto Address
Increment
0 0 Write Command No
0 1 Read Status No
1 0 Write Data Yes
1 1 Read Data Yes
*1
Table 7 Read Command Table (D/C=0, R/W(WR)=1, E=1(RD=0))
Table 8 Automatic Address Increment
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Command Description
Set Lower Column Address
This command specifies the lower nibble of the 8-bit col­umn address of the display data RAM. The column address will be increased by each data access after it is pre-set by the MCU.
Set Higher Column Address
This command specifies the higher nibble of the 8-bit col­umn address of the display data RAM. The column address will be increased by each data access after it is pre-set by the MCU.
Set Power Control Register
This command turns on/off the various power circuits as­sociated with the chip. There are three power relating sub-cir­cuits could be turned on/off by this command.
Internal voltage booster is used to generated the large negative voltage supply (V
EE
) from the voltage input (VSS -
V
DD
). An external negative power supply is required if this op-
tion is turned off.
Internal regulator is used to generate the LCD driving volt­age. V
L6
, from the negative power supply, VEE.
Output op-amp buffer is the internal divider for dividing the different voltage levels (V
L2
, VL3, VL4, VL5) from the inter-
nal regulator output, V
L6
. External voltage sources should be
fed into this driver if this circuit is turned off.
Set Contrast Control Register
This command adjusts the contrast of the LCD panel by changing the LCD drive voltage, V
L6
, provided by the On-Chip
power circuits. V
L6
is set with 32 steps (5-bit) in the contrast
control register by a compound commands.
Set Segment Re-map
This command changes the mapping between the display data column addresses and segment drivers. It allows flexibil­ity in mechanical layout of LCD glass design. Please refer to Figure 8 on page 16 for example.
Set LCD Bias
This command is used to select a suitable bias ratio re­quired for driving the particular LCD panel in use.
The selectable values of this command is 1/6 or 1/5.
For other bias ratio settings, extended commands should be used.
Set Entire Display On/Off
This command forces the entire display, including the icon row, to be selected regardless of the contents of the GD­DRAM. In addition, this command has higher priority than the normal/inverse display.
This command is used together with “Set Display Display ON/OFF” command to form a compound command for enter­ing power save mode. See “Set Power Save Mode” later in this section.
Set Normal/Inverse Display
This command turns the display to be either normal or in­versed. In normal display, RAM data of 1 indicates an illumina­tion on the corresponding pixel, while in inversed display, RAM data of 0 will turn on the pixel.
It should be noted that the icon line will not affect, that is not be reversed, by this command.
Set Display On/Off
This command is used to turn the display on or off. When display off is issued with entire display is on, power save mode will be entered. See “Set Power Save Mode” later in this section for details.
Set Page Address
This command enters the page address from 0 to 8 to the RAM pager register for read/write operations. Please refer to Figure 8 on page 16.
Set COM Output Scan Direction
This command sets the scan direction of the COM output al­lowing layout flexibility in LCD module assembly. See Figure 8 on page 16 for the relationship between turning on or off of this feature.
In addition, the display will have immediate effect once this command is issued. That is, if this command is sent during nor­mal display, the graphic display will have vertical flipping effect.
Set Read-Modify-Write Mode
This command puts the chip in read-modify-write mode in which:
1. column address is saved before entering the mode
2. column address is increased only after display data write but not after display data read.
This Ready-Modify-Write mode is used to save the MCU’s loading when a very portion of display area is being updated fre­quently.
As reading the data will not change the column address, it could be get back from the chip and do some operation in the MCU. Then the updated data could be write back to the GD­DRAM with automatic address increment.
After updating the area, “Set End of Read-Modify-Write Mode” is sent to restore the column address and ready for next update sequence.
Software Reset
Issuing this command causes some of the chip’s internal status registers to be initialized:
• Static indicator is OFF
• Vertical scroll register is set at zero
• Column address counter is set at zero
• Page address is set at zero
• Normal scan direction of the COM outputs
• Contrast control register is set at zero
• Test mode is OFF
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Set End of Read-Modify-Write Mode
This command relieves the chip from read-modify-write mode. The column address before entering read-modify-write mode will be restored no matter how much modification during the read-modify-write mode.
Set Indicator On/Off
This command turns on or off the drive indicators.
When the “Set Indicator On” command is sent, the second command byte “Indicator Display Mode” must follow. However, the “Set Indicator Off” command is a single byte command and no second byte command is required.
The status of static indicator also controls whether standby mode or sleep mode will be entered, after issuing the power save compound command. See “Set Power Save Mode” later in this section.
Set Test Mode
This command force the driver chip into its test mode for in­ternal testing of the chip. Under normal operation, users should NOT apply this command.
Set Power Save Mode
Entering Standby or Sleep Mode should be done by using a compound command composed of “Set Display ON/OFF” and “Set Entire Display ON/OFF” commands. When “Set Entire Dis­play ON” is issued when display is OFF, either Standby Mode or Sleep Mode will be entered.
The status of the Static Indicator will determine which pow­er save mode is entered. If static indicator is off, the Sleep Mode will be entered:
• Internal oscillator and LCD power supply circuits are stopped
• Segment and Common drivers output V
DD
level
• The display data and operation mode before sleep are held
• Internal display RAM can still be accessed
If the static indicator is on, the chip enters Standby Mode
which is similar to sleep mode except:
• Internal oscillator is on
• Static icon is on
Please also be noted that during Standby Mode, if the soft­ware reset command is issued, Sleep Mode will be entered. Both power save modes can be exited by the issue of a new software command or by pulling Low at hardware pin RES
.
Status register Read
This command is issued by pulling D/C Low during a data read (refer to Figure 10 on page 26 and Figure 11 on page 27 for parallel interface waveforms). It allows the MCU to monitor the internal status of the chip.
No status read is provided for serial mode.
EXTENDED COMMANDS
These commands are used, in addition to basic commands,
to trigger the enhanced features designed for the chip.
Set Temperature Coefficient (TC) Value
4 different temperature coefficient settings is selected by this command in order to match various liquid crystal tempera­ture grades. Please refer to the extended command table, Table 6 on page 19 for detail TC values.
Set Grey scale / mono display mode
This command is used to set the grey scale or mono display mode. If grey scale mode is set, the grey level is selected by two bits. The MSB is from page 0 to page 3, bit 0 of page 8 and the LSB is from page 4 to page 7, bit 1 of page 8
Set Grey Level Control
This command is to set the grey level of the three color(A, B and C). There can be adjusted to 15 grey scale levels form 1/ 16 to 16/16 (1/16 is lightest, 16/16 is the darkest).
Set 4- / 6-Phase Smart-Icon Mode
This command is to set 4-Phase or 6-Phase smart icon modes which for lower V
DD
or higher Von of panel.
Set Smart Icon Mode ON/OFF
This command is to switch on/off the low-current Icon Dis­play Mode.
Set Vertical Scroll Register
This command is used to scroll the screen vertically by selecting a scroll value from 0 to 63. With scroll value equals to 0, D0 of Page 0 is mapped to COM0. With scroll value equals to 1, D1 of Page0 is mapped to COM0. The vertical scroll values of 0 to 63 are assigned to Page 0 to 7. ICONs is not affected by this command. Refer toFigure 8 on page 16.
Example for setting grey level control
• Fill display data into Graphic Display RAM
Command
Remark:
1. 10101011
set grey scale mode
2. 11 01 0 111
Select color A
3. 00000000
set the grey level to 1/16
4. 11011000
Select color B
5. 00000110
set the grey level to 7/16
6. 11011001
Select color C
7. 0 00 0 1111 se t t h e g r e y l e v e l t o 1 6 / 1 6
Page 23
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Symbol Parameter Value Unit
V
DD
Supply Voltage -0.3 to +4 V
V
EE
-2.4 to -12 V
V
in
Input Voltage VSS-0.3 to VDD+0.3 V
I Current Drain Per Pin Excluding V
DD
and
V
SS
25 mA
T
A
Operating Temperature -30 to +85 °C
T
stg
Storage Temperature Range -65 to +150 °C
* Maximum Ratings are those values beyond which damage to the device may occur. Functional
operation should be restricted to the limits in the Electrical Characteristics tables or Pin Descrip­tion section.
This device contains circuitry to protect the inputs against damage due to high static voltages or elec­tric fields; however, it is advised that normal precau­tions to be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. For proper operation it is recom­mended that V
in
and V
out
be constrained to the
range V
SS
< or = (Vin or V
out
) < or = VDD. Reliability of operation is enhanced if unused input are con­nected to an appropriate logic voltage level (e.g., either V
SS
or VDD). Unused outputs must be left open. This device may be light sensitive. Caution should be taken to avoid exposure of this device to any light source during normal operation. This device is not radiation protected.
Symbol Parameter Test Condition Min Typ Max Unit
V
DD
Logic Circuit Supply Voltage Range Voltage Generator Circuit Supply Voltage Range
(Absolute value referenced to VSS)2.43.03.5V
I
AC
I
DP1
I
DP2
I
SB
I
SLEEP
I
ICON
Access Mode Supply Current Drain (VDD Pins)
Display Mode Supply Current Drain (V
DD
Pins)
Display Mode Supply Current Drain (V
DD
Pins)
Standby Mode Supply Current Drain (V
DD
Pins)
Sleep Mode Supply Current Drain (V
DD
Pins)
Icon Mode Supply Current Drain (V
DD
Pins)
V
DD
= 3.0V, Voltage Generator On, 4X Converter
Enabled, Write accessing, T
cyc
= 3.3MHz, Osc.
Freq.=22kHz, Display On.
V
DD
= 3.0V, V
EE
= -8V, Voltage Generator On, DC-
DC Converter Disabled, R/W
(WR) Halt, Osc. Freq. =
22kHz, Display On, V
L6
- VDD = -8V.
V
DD
= 3.0V, V
EE
= -5V, Voltage Generator On, DC-
DC Converter Enabled, R/W
(WR) Halt, Osc. Freq. =
22kHz, Display On, V
L6
- VDD = -8V.
V
DD
=3.0V, LCD Driving Waveform Off, Osc. Freq. =
22kHz, R/W
(WR) halt.
V
DD
= 3.0V, LCD Driving Waveform Off, Oscillator
Off, R/W
(WR) halt.
V
DD
= 3.0V, Voltage Generator On, Osc. Freq. =
22kHz, Display On. V
L6
- VDD = -8V.
-
-
-
-
-
-
200
25
120
5
0.2
7
400
70
200
10
5
15
µA
µA
µA
µA
µA
µA
V
EE
V
LCD
LCD Driving Voltage Generator Output
(V
EE
Pin)
LCD Driving Voltage Input (V
EE
Pin)
Display On, Voltage Generator Enabled, DC/DC Converter Enabled, Typ. Osc. Freq., Regulator Enabled, Divider Enabled.
Voltage Generator Disabled.
-12.0
-12.0
-
-
-2.4
-2.4
V
V
V
OH1
V
OL1
V
L6
V
L6
Logic High Voltage
Logic Low Voltage
LCD Driving Voltage Source (V
L6
Pin)
LCD Driving Voltage Source (V
L6
Pin)
I
out
=-100µA
I
out
=100µA
Regulator Enabled (V
L6
voltage depends on Int/Ext
Contrast Control)
Regulator Disabled
0.9*V
DD
0
V
EE
-0.5
-
-
-
-
Floating
V
DD
0.1*V
DD
V
DD
-
V
V
V
V
MAXIMUM RATINGS
DC CHARACTERISTICS
Table 9 MAXIMUM RATINGS* (Voltages Reference to V
SS
, TA=25°C)
Table 10 ELECTRICAL CHARACTERISTICS (Unless otherwise specified, Voltage Reference to VSS, VDD=2.4 to 3.5V, TA=-30 to 85°C)
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Table 10
ELECTRICAL CHARACTERISTICS(Unless otherwise specified, Voltage Reference to VSS, VDD=2.4 to 3.5V, TA=-30 to 85°C)
* The formula for the temperature coefficient is:
Symbol Parameter Test Condition Min Typ Max Unit
V
IH1
V
IL1
Logic High Input voltage
(RES
, D0-D7,R/W(WR), D/C)
Logic Low Input voltage
(RES
, CE, D0-D7, R/W(WR), D/C, S/P)
0.8*V
DD
0
-
-
V
DD
0.2*V
DD
V
V
V
L2
V
L3
V
L4
V
L5
V
L6
V
L2
V
L3
V
L4
V
L5
V
L6
LCD Display Voltage Output
(V
L2
, VL3, VL4, VL5, VL6 Pins)
LCD Display Voltage Input
(V
L2
, VL3,VL4, VL5, VL6 Pins)
Voltage reference to V
DD
, Smart Bias Divider
Enabled, 1:a bias ratio
Voltage reference to V
DD
, External Voltage
Generator, Smart Bias Divider Disabled
-
-
-
-
-
V
L3
V
L4
V
L5
V
L6
-12V
1/a*V
L6
2/a*V
L6
(a-2)/a*V
L6
(a-1)/a*V
L6
V
L6
-
-
-
-
-
-
-
-
-
-
V
DD
V
L2
V
L3
V
L4
V
L5
V V V V V
V V V V V
I
OH
I
OL
I
OZ
Logic High Output Current Source
(D
0-D7
, OSC2)
Logic Low Output Current Drain
(D
0-D7
, OSC2)
Logic Output Tri-state Current Drain Source
(D
0-D7
, OSC2)
V
out=VDD
-0.4V
V
out
=0.4V
50
-
-1
-
-
-
-
-50
1
µA
µA
µA
I
IL/IIH
Logic Input Current
(RES
, D0-D7, R/W(WR), D/C, S/P)
-1 - 1 µA
C
IN
Logic Pins Input Capacitance
(OSC1, OSC2, all logic pins)
-57.5pF
V
L6
Variation of VL6 Output (VDD is fixed) Regulator Enabled, Internal Contrast Control
Enabled, Set Contrast Control Register = 0
- ± 4-%
TC0 TC2 TC5 TC7
Temperature Coefficient Compensation
Flat Temperature Coefficient Temperature Coefficient 2* Temperature Coefficient 5* (POR) Temperature Coefficient 7*
Voltage Regulator Enabled Voltage Regulator Enabled Voltage Regulator Enabled Voltage Regulator Enabled
-
-0.075
-0.18
-0.27
0.0
-0.15
-0.23
-0.31
-0.075
-0.18
-0.27
-
%/
o
C
%/
o
C
%/
o
C
%/
o
C
TC(%)=
V
ref
at 50°C - V
ref
at 0°C
50°C - 0°C
X
1
V
ref
at 25°C
X100%
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SSD1810/A
25
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Symbol Parameter Test Condition Min Typ Max Unit
F
OSC
Oscillation Frequency of Display timing generator Internal Oscillator Enabled 15 17.5 20 kHz
F
FRM
Frame Frequency Display ON, Set 98 X 34 Graphic Display
Mode with a Icon Line
Display ON, Set 100 X 32 Graphic Display Mode with a Icon Line
-
-
-
-
Hz
Hz
F
OSC
8*35
F
OSC
8*33
Table 11 AC ELECTRICAL CHARACTERISTICS (TA=25°C, Voltage reference to VSS, AVDD=DVDD=3V: unless otherwise specified.)
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Valid Data
t
cycle
t
DSW
t
AS
t
AH
t
DHR
t
ACC
CS1
D/C
D0-D
7
E(RD)
Valid Data
D
0-D7
(Write data to driver)
(Read data from driver)
t
DHW
PW
CSL
PW
CSH
t
F
t
R
R/W(WR)
(CS2=1)
t
OH
Symbol Parameter Min Typ Max Unit
t
cycle
Clock Cycle Time 450 - - ns
t
AS
Address Setup Time 15 - - ns
t
AH
Address Hold Time 15 - - ns
t
DSW
Write Data Setup Time 20 - - ns
t
DHW
Write Data Hold Time 20 - - ns
t
DHR
Read Data Hold Time 20 - - ns
t
OH
Output Disable Time - - 70 ns
t
ACC
Access Time - - 140 ns
PW
CSL
Chip Select Low Pulse Width (read)
Chip Select Low Pulse Width (write)
140
60
-
-
-
-
ns
ns
PW
CSH
Chip Select High Pulse Width (read)
Chip Select High Pulse Width (write)
140
200
-
-
-
-
ns
ns
t
R
Rise Time - - 15 ns
t
F
Fall Time - - 15 ns
Table 12 6800-Series MPU Parallel Timing Characteristics (VDD - VSS = 2.4 to 3.5V, TA = -30 to 85°C)
Figure 10 Parallel 6800-series Interface Timing Characteristics
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27
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Symbol Parameter Min Typ Max Unit
t
cycle
Clock Cycle Time 450 - - ns
t
AS
Address Setup Time 15 - - ns
t
AH
Address Hold Time 15 - - ns
t
DSW
Write Data Setup Time 20 - - ns
t
DHW
Write Data Hold Time 20 - - ns
t
DHR
Read Data Hold Time 20 - - ns
t
OH
Output Disable Time - - 70 ns
t
ACC
Access Time - - 140 ns
PW
CSL
Chip Select Low Pulse Width (read)
Chip Select Low Pulse Width (write)
140
60
-
-
-
-
ns
ns
PW
CSH
Chip Select High Pulse Width (read)
Chip Select High Pulse Width (write)
140
200
-
-
-
-
ns
ns
t
R
Rise Time - - 15 ns
t
F
Fall Time - - 15 ns
Valid Data
t
cycle
t
DSW
t
AS
t
AH
t
DHR
t
ACC
CS1
D/C
D0-D
7
E(RD)
Valid Data
D
0-D7
(Write data to driver)
(Read data from driver)
t
DHW
PW
CSL
PW
CSH
t
F
t
R
(CS2=1)
t
OH
R/W(WR)
Table 13 8080-Series MUP Parallel Timing Characteristics (VDD - VSS = 2.4 to 3.5V, TA = -30 to 85°C)
Figure 11 8080-series Parallel Interface Timing Characteristics
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SOLOMON
Symbol Parameter Min Typ Max Unit
t
cycle
Clock Cycle Time 1000 - - ns
t
AS
Address Setup Time 500 - - ns
t
AH
Address Hold Time 500 - - ns
t
CSS
Chip Select Setup Time 60 - - ns
t
CSH
Chip Select Hold Time 800 - - ns
t
DSW
Write Data Setup Time 250 - - ns
t
DHW
Write Data Hold Time 100 - - ns
t
CLKL
Clock Low Time 300 - - ns
t
CLKH
Clock High Time 300 - - ns
t
R
Rise Time - - 15 ns
t
F
Fall Time - - 15 ns
Valid Data
t
cycle
t
DSW
t
AS
t
AH
SCK (D6)
D/C
SDA (D7)
CS1
t
DHW
t
CLKL
t
CLKH
t
F
t
R
(CS2=1)
t
CSS
t
CSH
D6D7 D4D5 D2D3 D0D1
SCK (D6)
D/C
SDA (D7)
CS1
(CS2=1)
Table 14 Serial Timing Characteristics (VDD - VSS = 2.4 to 3.5V, TA = -30 to 85°C)
Figure 12 Serial Timing Characteristics
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APPLICATIN EXAMPLES
V
L6
V
F
C
3N
To LCD Panel
COM0 to COM33
SEG0 to SEG97
SSD1810/A
C
1P
C
1N
C2PC
2N
V
L2VL3
V
L4VL5VL6
V
EE
V
SS
V
DD
1µF
V
DD
V
EE
ICONS
Remark :
1. RES should be at a known state.
2. R/W
(WR), D/C, D0-D2 and D5-D6 can be open for SPI serial mode.
SSD1810/A
1µF
V
DD
C1C1C1
C1
C1
C
3N
C1PC
1N
C2PC
2N
V
L6
V
F
V
L2VL3
V
L4
V
L5
V
L6
V
EE
V
SS
V
DD
V
LCD
To LC D Panel
COM0 to COM33
SEG0 to SEG97
ICONS
Remark :
1. C1 = 0.22 - 0.47uF
Figure 13 All External Power Supply
Figure 14 Internal Divider Only
Page 30
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SOLOMON
To LCD Panel
SSD1810/A
C1 C1C1
C1
V
L2VL3
V
L4VL5
V
L6
V
SS
V
DD
C
3N
C1PC
1N
C2PC
2N
V
EE
1µF
V
DD
C2C2C2
C2
C2
V
DD
V
L6
V
F
C3
Remark :
1. C1 = 1.0 - 4.7uF
2. C2 = 0.22 - 0.47uF
3. C3 = 0.1uF
4. C4 = 0.1uF
5. IRS = VDD
COM0 to COM33
SEG0 to SEG97
ICONS
C4
R1
R2
+
+
+
+
+
Optional for External Resistors R1 and R2 [IRS must be pulled to GND]
Optional for C3 and C4
Figure 15 Application Circuit (4x DC-DC Converter)
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SOLOMON
Figure 16 SSD1810AT TAB Drawing 1/2
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Internal Connections: V
SS:
MODE, IRS
Figure 17 SSD1810AT TAB Drawing 2/2
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Figure 18 TAB Wheel Mechanical Drawing
Page 34
SSD1810/A
Solomon reserves the right to make changes without further notice to any products herein. Solomon makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Solomon assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters can and do vary in different appli­cations. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Solomon does not con­vey any license under its patent rights nor the rights of others.Solomon products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of unintended or unauthorized application, Buyer shall indemnify and hold Solomon and its offices, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Solomon was negligent regarding the design or manufacture of the part.
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