Configurable output voltage up to 16V
Quiescent current of 20µA
DESCRIPTION
The SS8028G boost converter is designed for small and
medium size LCD panels requiring high bias voltages.
Shutdown current <1µA
Shutdown-pin current <1µA
Supply range from 2.5V to 6.5V
Low V
: 250mV (ISW=300mA)
DS(on)
Tiny SOT-23-5 package
With a typical quiescent current of 20µA and a supply
voltage range of 2.5V to 6.5V, it is suitable for battery
powered portable applications, such as PDAs and
handheld computers. When the SS8028G goes into
shutdown mode, it consumes less than 1µA.
APPLICATIONS
• STN/TFT LCD Bias
• Personal Digital Assistants (PDAs)
• Handheld Computers
• Digital Still Cameras
• Cellular Phones
Furthermore, with a 350mA current limit, 500ns fixed
minimum off-time and tiny SOT-23-5 package, the
SS8028G can be used with smaller inductors and other
surface-mount components to minimize the required PCB
footprint in space-conscious applications.
To control the SS8028G, no other external current is
needed for the shutdown pin, which typically consumes
• WebPad
• White LED Driver
• Local 3V to 5V Conversion
TYPICAL APPLICATION CIRCUIT
2.5V – 4.2V
4.7 µ F
4.7 µ F
10uH
VCC
VCC
SS8028G
G5111
SHDN
SHDN
GND
GND
less than 1µA over the full supply range.
RoHS compliant.
16V
SW
SW
FB
FB
1M
80.6k
12mA
1 µ F
1 µ F
Rev.2.20 4/06/2005
www.SiliconStandard.com 1 of 9
Page 2
Packing
G963
4 1
3
G963
4 1 2 3
ORDERING INFORMATION
SS8028GTXXXX
PIN CONFIGURATION
SS8028G
Example: SS8028GT11TR
PIN DESCRIPTIONS
PIN NAME FUNCTION
1 SW Switch pin. The drain of the internal N-MOSFET power switch. Connect this pin to the inductor.
2 GND Ground.
3 FB
4
5 VCC Input supply pin. Bypass this pin with a capacitor as close to the device as possible.
SHDN
TR: Tape and reel
TB: Tube
Pinout option
T11
à T11 pin configuration shipped in
tape and reel packing
Feedback pin. Set the output voltage by selecting values for R1 and R2 (see the Block Diagram):
OUT
V
R1 = R2
Active-low shutdown pin. Tie this pin to logic-high to enable the device, or tie it to logic-low to turn the
device off.
-1
2.1
SOT-23-5
Top view
SW
GND
FB
SS8028GT11
2
VCC
5
5
SHDN
ABSOLUTE MAXIMUM RATINGS
SW to GND…………………………………………………................……..-0.3V to +18V
FB to GND…………………………………………………….................…..-0.3V to VCC
VCC,
Operating Temperature Range.............................................................-40°C to 85°C
Maximum Operating Junction Temperature....................................................+125°C
Storage Temperature Range..............................................................-65°C to 150°C
Maximum Lead Temperature (Soldering, 10sec)............................................+300°C
Rev.2.20 4/06/2005
to GND..................................................................................-0.3V to +7V
SHDN
www.SiliconStandard.com 2 of 9
Page 3
ELECTRICAL CHARACTERISTICS
(V
= 3.6V, VSHDN = 3.6V, TA = 25°C)
CC
SS8028G
PARAMETER CONDITIONS MIN
Input Voltage Range
2.5 6.5 V
TYP MAX
UNITS
Not switching 20 30 µA
Quiescent Current
FB Comparator Trip Point
Output Voltage Line
V
= 0V 0.1 1 µA
SHDN
1.18 1.2 1.22
2.5V<VIN<6.5V -0.05
%/V
V
Regulation
FB Pin Bias Current
VFB = 1.2V 30 80 nA
(Note 2)
V
> 1V 500 ns
FB
Switch Off Time
Switch V
DS(ON)
V
< 0.6V 1.6 µs
FB
ISW = 300mA 250 350 mV
Switch Current Limit 300 350 400 mA
Pin Current
SHDN
Input Voltage High 0.9 V
SHDN
Input Voltage Low 0.25
SHDN
Switch Leakage Current Switch off, V
0.1 1 µA
= 16V 0.01
SW
5 µA
V
Note 1: The SS8028G is guaranteed to meet performance specifications from 0°C to 85°C.
Specifications over the -40°C to 85°C operating temperature range are assured by design,
characterization and correlation with statistical process controls.
Note 2: Bias current flows into the FB pin.
Rev.2.20 4/06/2005
www.SiliconStandard.com 3 of 9
Page 4
VIN=2.7V
VOUT=16V
TYPICAL PERFORMANCE CHARACTERISTICS
SS8028G
(VCC=+3.6V, V
=+3.6V, L=10µH, TA=25°C, unless otherwise noted.)
SHDN
Efficiency vs. Load Current
90
80
70
60
50
Efficiency (%)
40
30
0.1110100
VIN=4.2V
VIN=2.7V
Load Current (mA)
Vds_on vs. Temperature
500
400
VIN=2.7V
300
VIN=3.6V
Output Voltage vs. Load Current
17
16.5
16
Output Voltage (V)
15.5
15
12345678910
Load Current (mA)
Quiescent Current vs. Temperature
50
40
30
VIN=4.2V
VIN=4.2V
200
Switch Vds_on (mV)
100
-20020406080100
VIN=4.2V
Temperature (C)
FB Bias Current vs. Temperature
30
VIN=2.7V
25
20
VIN=4.2V
Feedback Bias Current (nA)
15
-20020406080100
Temperature (C)
20
Quiescent Current (µA)
10
-20020406080100
VIN=2.7V
Temperature (C)
Feedback Voltage vs. Temperature
1.22
1.21
VIN=2.7V
1.2
1.19
Feedback Voltage (V)
1.18
-20020406080100
VIN=4.2V
Temperature (C)
Rev.2.20 4/06/2005
www.SiliconStandard.com 4 of 9
Page 5
TYPICAL PERFORMANCE (cont.)
SS8028G
Switch Current Limit vs. Temperature
450
400
350
VIN=2.7V
Peak Current (mA)
300
250
-20020406080100
VIN=4.2V
Temperature (C)
Load Transient
Rev.2.20 4/06/2005
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Page 6
BLOCK DIAGRAM
V
V
IN
IN
VOUT
VOUT
R1
R1
R2
R2
C1
C1
FB
FB
1.2V
1.2V
BIAS
BIAS
+
+
VCC
VCC
ERROR
ERROR
COMP
COMP
VREF
VREF
SHDN
SHDN
SHUTDOWN
SHUTDOWN
LOGIC
LOGIC
en_sw
en_sw
PUMP CONTROL
PUMP CONTROL
OC
OC
COMP
COMP
+
+
T
T
CONTROL
CONTROL
OFF
OFF
L1
L1
PULSE
PULSE
DRIVER
DRIVER
GND
GND
SW
SW
SS8028G
V
V
OUT
OUT
C2
C2
APPLICATIONS INFORMATION
The SS8028G is a boost converter with an integrated
N-channel MOSFET (refer to the block diagram above).
The boost cycle is initiated when the FB pin voltage drops
below 1.2V and the MOSFET turns on. During the period
that the MOSFET is on, the inductor current ramps up
until the 350mA current limit is reached. Then the
MOSFET turns off and the inductor current flows through
the external schottky diode, ramping down to zero.
During the MOSFET off period, the inductor current
charges the output capacitor and the output voltage
climbs. This pumping mechanism continues cycle by
cycle until the FB pin voltage exceeds 1.2V and the
non-switching mode starts. In this mode, the SS8028G
consumes as little as 20uA typically, saving on battery
power.
Choosing an Inductor
There are several recommended inductors that work
well with the SS8028G in Table 1. Use the equations
and recommendations in the next few sections to find
the proper inductance value for your design.
TABLE 1.R ECOMMENDED INDUCTORS
PART VALUE
LQH3C4R7
LQH3C100
LQH3C220
CD43-4R7
CD43-100
CDRH4D18-4R7
CDRH4D18-100
DO1608-472
DO1608-103
DO1608-223
(uH) MAX DCR ?Ω)
4.7
10
22
4.7
10
4.7
10
4.7
10
22
0.26
0.30
0.92
0.11
0.18
0.16
0.20
0.09
0.16
0.37
www.murata.com
www.sumida.com
www.coilcraft.com
Inductor Selection – Boost Regulator
The appropriate inductance value for the boost regulator
application may be calculated from the following
equation. Select a standard inductor close to this value.
V
OUT-VIN(MIN)+VD
L =
I
LIM
x t
OFF
VENDOR
Murata
Sumida
Coilcraft
Rev.2.20 4/06/2005
www.SiliconStandard.com 6 of 9
Page 7
Here, VD = 0.4V (Schottky diode voltage), I
and t
increase the available output current, but limit it to about
twice the calculated value. When too large an inductor is
used, the output voltage ripple will increase without
providing much additional output current. In conditions of
varying V
minimum V
value can be used to give smaller physical size, but
overshoot of the inductor current will occur (see Current
Limit Overshoot section).
= 500ns. A larger value can be used to slightly
OFF
, such as battery power applications, use the
IN
value in the above equation. A smaller
IN
LIM
Inductor Selection – SEPIC Regulator
For a SEPIC regulator using the SS8028G, the
approximate inductance value can be calculated using
the formula below. As for the boost inductor selection, a
larger or smaller value can be used.
Current Limit Overshoot
The SS8028G uses a constant off-time control scheme;
the MOSFET is turned off after the 350mA current limit is
reached. When the current limit is reached and the
MOSFET actually turns off, there is a 100ns delay time.
During this time, the inductor current exceeds the current
limit by a small amount. The formula below can calculate
the peak inductor current.
L = 2
I
PEAK
= I
LIM
+
V
OUT
V
+ V
I
LIM
IN(MAX)
x t
D
OFF
– V
SAT
x 100ns
L
Here, V
= 0.25V (switch saturation voltage). For
SAT
systems with high input voltages and smaller
inductance values, the current overshoot will be most
apparent. This overshoot can be useful as it helps
increase the amount of available output current. By
using a small inductance value, the current limit
overshoot can be quite high. Even though it is
internally current limited to 350mA, the internal
MOSFET of the SS8028G can handle larger currents
Rev.2.20 4/06/2005
www.SiliconStandard.com 7 of 9
= 350mA
SS8028G
without any problem, but the total efficiency will suffer.
For best performance, the I
500mA.
Capacitor Selection
Low ESR (Equivalent Series Resistance) capacitors
should be used at the output to minimize the output
ripple voltage and the peak-to-peak transient voltage.
Multilayer ceramic capacitors (MLCC) are the best
choice, as they have a very low ESR and are
available in very small packages. Their small size
makes them a good match with the SS8028G’s
SOT-23 package. If solid tantalum capacitors (like the
AVX TPS, Sprague 593D families) or OS-CON
capacitors are used, they will occupy more volume
than ceramic ones and the higher ESR increases the
output ripple voltage. It is important to use a capacitor
with a sufficient voltage rating.
A low ESR surface-mount ceramic capacitor also
makes a good selection for the input bypass capacitor,
which should be placed as close as possible to the
SS8028G. A 4.7µF input capacitor is sufficient for
most applications.
Diode Selection
For most SS8028G applications, the high switching
frequency requires high-speed Schottky diodes, such
as the Motorola MBR0530 (0.5A, 30V) with their low
forward voltage drop and fast switching speed. Many
different manufacturers make equivalent parts, but
make sure that the component is rated for at least
0.35A. To achieve high efficiency, the average
current rating of the Schottky diodes should be
greater than the peak switching current. Choose a
reverse breakdown voltage greater than the output
voltage.
Lowering Output Ripple Voltage
The SS8028G supplies energy to the load in bursts by
ramping up the inductor current, then delivering that
current to the load. Using low ESR capacitors will help
is best kept below
PEAK
Page 8
C2 22
D1
C2 22
10
C2 22
D1
C2 22
L1:MURATA LQH3C4R7M24
L1,L2:MURATA LQH3C100K24
10
minimize the output ripple voltage, but proper
selection of the inductor and the output capacitor also
plays a big role. If a larger inductance value or a
smaller capacitance value is used, the output ripple
voltage will increase because the capacitor will be
slightly overcharged each burst cycle. To reduce the
TYPICAL APPLICATION CIRCUITS
SS8028G
output ripple, increase the output capacitance value,
or add a 10pF feed-forward capacitor in the feedback
network of the SS8028G (see the circuits in the
Typical Applications section). To add this small
inexpensive 10pF capacitor will greatly reduce the
output voltage ripple.
V
2.5V to 4.2V
Boost Converter SEPIC Converter
GND
GND
C3
D1:MOTOROLA MBR0520
1uF
1
SW
L2
L2
FB
D1
D1
µ H
µ H
IN
2.5V~5.5V
2.5V~5.5V
VCC
VCC
SHDN
C1
C1
4.7 µ F
4.7 µ F
VBAT
VBAT
ON/OFF Control
ON/OFF Control
SHDN
C1
C1
4.7µF
4.7µF
L1
4.7uH
G5111
GND
GND
D1:MOTOROLA MBR0520
SW
10µH/0.5A
10µH/0.5A
VCC
VCC
390k
R1
120k
R2
SW
FB
FB
SS8028G
SHDN
SHDNFB
L1
10uH
V
5 V
5 V
50mA
50mA
µ F
µ F
L1
L1
SW
SW
FB
D1
D1
MBR0520
MBR0520
2.5V to 4.2V
IN
VCC
SHDN
C1
C1
4.7 µ F
4.7 µ F
C2
C2
1µF
1µF
D2(Optional)
D2(Optional)
18V
18V
470k
R1
270k
R2
3.3 V
3.3 V
60mA
60mA
µ F
µ F
White LED Driver
Rev.2.20 4/06/2005
GND
GND
VBIAS(+3.3V)
VBIAS(+3.3V)
PWM Dim
PWM Dim
PWM Dimming Control
PWM Dimming Control
VH=3.3V
VH=3.3V
VL=0V
VL=0V
Freq=160~240Hz
Freq=160~240Hz
www.SiliconStandard.com 8 of 9
R3
R3
308k_1%
308k_1%
R4
R4
660k_1%
660k_1%
R2
R2
120k_1%
120k_1%
R1
R1
30_1%
30_1%
Dimming Ratio>50:1
Dimming Ratio>50:1
Drive 2~4 White LEDs
Drive 2~4 White LEDs
Page 9
SS8028G
PACKAGE DIMENSIONS
SOT-23-5 (unit: mm)
D
D
H
H
E
E
e1
e1
e
e
A
A2
A2
b
b
A
A1
A1
1. Package body sizes exclude mold flash protrusions or gate burrs
2. Tolerance ±0.1000 mm (4mil) unless otherwise specified
Information furnished by Silicon Standard Corporation is believed to be accurate and reliable. However, Silicon Standard Corporation makes no
guarantee or warranty, express or implied, as to the reliability, accuracy, timeliness or completeness of such information and assumes no
responsibility for its use, or for infringement of any patent or other intellectual property rights of third parties that may result from its
use. Silicon Standard reserves the right to make changes as it deems necessary to any products described herein for any reason, including
without limitation enhancement in reliability, functionality or design. No license is granted, whether expressly or by implication, in relation to
the use of any products described herein or to the use of any information provided herein, under any patent or other intellectual property rights of
Silicon Standard Corporation or any third parties.
DIMENSIONS IN MILLIMETERS
MIN
SOT23-5 Package Orientation
SOT23-5 Package Orientation
NOM MAX
Feed Direction
Feed Direction
Rev.2.20 4/06/2005
www.SiliconStandard.com 9 of 9
Page 10
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