Page 1
SPI 11N60CFD
Cool MOS™ Power Transistor
Feature
• New revolutionary high voltage technology
• Ultra low gate charge
• Periodic avalanche rated
• Extreme d v/d t rated
• High peak current capability
• Intrinsic fast-recovery body diode
• Extreme low reverse recovery charge
Type Package Pb-free
SPI 11N60CFD PG-TO220 Yes
VDS @ T
Marking
11N60CFD
R
DS(on)
jmax
650 V
0.44 Ω
I
D
11 A
PG-TO262
Maximum Ratings
Parameter
Continuous drain current
= 25 °C
T
C
= 100 °C
T
C
Pulsed drain current, t p limited by T
jmax
Avalanche energy, single pulse
= 5.5 A, V DD = 50 V
I
D
Avalanche energy, repetitive t AR limited by T
jmax
1)
ID = 11 A, VDD = 50 V
Avalanche current, repetitive t AR limited by T
jmax
Reverse diode dv/dt
IS=11A, VDS=480V, Tj=125°C
Gate source voltage V
Gate source voltage AC (f >1Hz) V
Symbol Value Unit
I
D
A
11
7
I
D puls
E
AS
E
AR
I
AR
28
340 mJ
0.6
11 A
dv /dt 40 V/ns
GS
GS
±20
± 30
V
Power dissipation, T
= 25°C P
C
Operating and storage temperature T
tot
j
125 W
,
T
stg
-55... +150
°C
2007 -02 -01 Rev. 2.5 Page 1
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Maximum Ratings
SPI 11N60CFD
Parameter
Drain Source voltage slope
VDS = 480 V, ID = 11 A, Tj = 125 °C
Maximum diode commutation speed
VDS = 480 V, ID = 11 A, Tj = 125 °C
Symbol Value Unit
dv /dt 80 V/ns
di F/dt 600
Thermal Characteristics
Parameter
Thermal resistance, junction - case R
Thermal resistance, junction - ambient, leaded R
Soldering temperature, wavesoldering
Symbol Values Unit
thJC
thJA
T
sold
1.6 mm (0.063 in.) from case for 10s
Electrical Characteristics, at T j=25°C unless otherwise specified
Parameter
Symbol Conditions Values Unit
A/µs
min. typ. max.
- - 1 K/W
- - 62
- - 260 °C
min. typ. max.
Drain-source breakdown voltage V
Drain-Source avalanche
V
breakdown voltage
Gate threshold voltage V
Zero gate voltage drain current I
Gate-source leakage current I
Drain-source on-state resistance R
Gate input resistance R
(BR)DSS
(BR)DS
GS(th)
DSS
GSS
DS(on)
G
VGS=0V, ID=0.25mA 600 - - V
VGS=0V, ID=11A - 700 -
ID=500µΑ , VGS=V
VDS=600V, VGS=0V,
=25°C,
T
j
=150°C
T
j
VGS=20V, VDS=0V - - 100 nA
VGS=10V, ID=7A,
=25°C
T
j
=150°C
T
j
f =1MHz, open Drain - 0.86 -
DS
3 4 5
-
-
-
-
1.1
900
0.38
1.02
0.44
µA
-
-
Ω
-
2007 -02 -01 Rev. 2.5 Page 2
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Electrical Characteristics , at T j = 25 °C, unless otherwise specified
SPI 11N60CFD
Parameter
Symbol Conditions Values Unit
Transconductance g
Input capacitance C
Output capacitance C
Reverse transfer capacitance C
Effective output capacitance,
2)
C
energy related
Effective output capacitance,
3)
C
time related
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
fs
iss
oss
rss
o(er)
o(tr)
d(on)
r
d(off)
f
VDS≥ 2*I D* R
=7A
I
D
VGS=0V, VDS=25V,
f=1MHz
VGS=0V,
=0V to 480V
V
DS
VDD=380V, VGS=0/10V,
=11A, RG=6.8 Ω
I
D
DS(on)max
,
min. typ. max.
- 8.3 - S
- 1200 - pF
- 390 -
- 30 -
- 45 - pF
- 85 -
- 34 - ns
- 18 -
- 43 -
- 7 -
Gate Charge Characteristics
Gate to source charge
Gate to drain charge Q
Gate charge total Q
Gate plateau voltage V
1
Repetitve avalanche causes additional power losses that can be calculated as P
2
is a fixed capacitance that gives the same stored energy as C
C
o(er)
3
is a fixed capacitance that gives the same charging time as C
C
o(tr)
Q
gs
gd
g
lateau
VDD=480V, ID=11A - 9 - nC
VDD=480V, ID=11A,
=0 to 10V
V
GS
VDD=480V, ID=11A - 7 - V
while V DS is rising from 0 to 80% V
oss
while V DS is rising from 0 to 80% V
oss
- 23 -
- 48 64
AV=E AR
*f .
DSS
DSS
.
.
2007 -02 -01 Rev. 2.5 Page 3
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Electrical Characteristics, at T j = 25 °C, unless otherwise specified
SPI 11N60CFD
Parameter
Inverse diode continuous
Symbol Conditions Values Unit
I
S
forward current
Inverse diode direct current,
I
SM
pulsed
Inverse diode forward voltage V
Reverse recovery time t
Reverse recovery charge Q
Peak reverse recovery current I
Peak rate of fall of reverse
SD
rr
rr
rrm
dirr/dt
recovery current
Typical Transient Thermal Characteristics
Symbol
Value Unit Symbol Value Unit
min. typ. max.
TC=25°C - - 11 A
- - 28
VGS=0V, IF=I
VR=480V, IF=IS ,
/dt=100A/µs
di
F
S
- 1 1.2 V
- 140 - ns
- 0.7 - µC
- 11 - A
- 1200 - A/µs
Thermal resistance
R
th1
R
th2
R
th3
R
th4
R
th5
R
th6
P
tot
typ. typ.
Thermal capacitance
0.015 K/W
0.03
0.056
0.197
0.216
0.083
T
R
j T
th1
(t)
C
th1
C
th2
C
th1
C
th2
C
th3
C
th4
C
th5
C
th6
R
th,n
C
th,n
T
case
amb
External Heatsink
0.0001878
0.0007106
0.000988
0.002791
0.007285
0.063
Ws/K
2007 -02 -01 Rev. 2.5 Page 4
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SPI 11N60CFD
1 Power dissipation
= f (T C)
P
tot
SPP11N60CFD
140
W
120
110
100
tot
90
P
80
70
60
50
40
30
20
10
0
0 20 40 60 80 100 120
°C
2 Safe operating area
= f ( VDS )
I
D
10
=25°C
C
1
10
2
V
3
10
V
DS
parameter : D = 0 , T
2
10
A
1
10
D
I
0
10
-1
10
-2
10
160
T
C
10
tp=0.001 ms
tp=0.01 ms
tp=0.1 ms
tp=1 ms
DC
0
3 Transient thermal impedance
= f (t p)
Z
thJC
10
/T
p
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
single pulse
-6
10
-5
10
-4
-3
10
parameter: D = t
1
10
K/W
0
10
thJC
-1
10
Z
-2
10
-3
10
-4
10
-7
10
s
4 Typ. output characteristic
= f (V DS); Tj=25°C
I
D
parameter: t
40
A
30
D
25
I
20
15
10
5
-1
10
t
p
0
0 4 8 12 16 20 V 26
= 10 µs, V
p
Vgs = 20V
Vgs = 10V
Vgs = 9V
Vgs = 8.5V
Vgs = 8V
Vgs = 7.5V
Vgs = 7V
Vgs = 6.5V
Vgs = 6V
GS
V
DS
2007 -02 -01 Rev. 2.5 Page 5
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SPI 11N60CFD
5 Typ. output characteristic
= f (V DS); Tj=150°C
I
D
parameter: t
22
A
18
16
14
D
I
12
10
8
6
4
2
0
0 4 8 12 16 20 V 26
= 10 µs, V
p
Vgs = 20V
Vgs = 8.5V
Vgs = 8V
Vgs = 7.5V
Vgs = 7V
Vgs = 6.5V
Vgs = 6V
GS
6 Typ. drain-source on resistance
R
parameter: T
V
DS
=f (I D)
DS(on)
=150°C, V
j
2
GS
Ω
1.8
1.7
1.6
DS(on)
1.5
R
1.4
1.3
1.2
1.1
1
0.9
0.8
0.7
0 4 8 12 16 20 A 28
Vgs = 6V
Vgs = 6.5V
Vgs = 7V
Vgs = 7.5V
Vgs = 8V
Vgs = 8.5V
Vgs = 20V
I
D
7 Drain-source on-state resistance
R
parameter : I
= f (T j)
DS(on)
= 7 A, V GS = 10 V
D
SPP11N60CFD
2.6
Ω
2.2
2
1.8
DS(on)
1.6
R
1.4
1.2
1
0.8
0.6
0.4
0.2
0
-60 -20 20 60 100
98%
typ
°C
8 Typ. transfer characteristics
= f ( V GS ); VDS≥ 2 x ID x R
I
D
DS(on)max
parameter: t p = 10 µs
40
A
30
D
25
I
20
15
10
5
180
T
j
0
0 2 4 6 8 10 12 14 16 V 20
Tj = 25?C
Tj = 150?C
V
GS
2007 -02 -01 Rev. 2.5 Page 6
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SPI 11N60CFD
9 Typ. gate charge
= f (Q
V
GS
parameter: I
SPP11N60CFD
16
V
0.2 V
12
0.8 V
GS
10
V
8
6
4
2
0
0 10 20 30 40 50
)
Gate
= 11 A pulsed
D
DS max
DS max
nC
Q
Gate
70
10 Forward characteristics of body diode
= f (VSD)
I
F
parameter: T j , t
2
SPP11N60CFD
10
A
1
10
F
I
0
10
-1
10
0 0.4 0.8 1.2 1.6 2 2.4
p = 10 µs
Tj = 25 °C typ
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%)
V
3
V
SD
11 Avalanche SOA
= f (t AR)
I
AR
par.: T
≤ 150 °C
j
11
A
9
8
7
AR
I
6
5
4
3
2
1
0
10-310-210-110010110
T
j
(START)
=125°C
T
j
2
(START)
=25°C
µs
t
AR
10
12 Avalanche energy
= f (T j)
E
AS
par.: I
4
= 5.5 A, V DD = 50 V
D
350
mJ
250
AS
E
200
150
100
50
0
20 40 60 80 100 120
°C
160
T
j
2007 -02 -01 Rev. 2.5 Page 7
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SPI 11N60CFD
13 Drain-source breakdown voltage
V
(BR)DSS
(BR)DSS
V
= f (T j)
SPP11N60CFD
720
V
680
660
640
620
600
580
560
540
-60 -20 20 60 100
°C
14 Avalanche power losses
= f (f )
P
AR
parameter: E
300
W
200
AR
P
150
100
50
0
180
T
j
10
4
=0.6mJ
AR
10
5
Hz
10
6
f
15 Typ. capacitances
C = f (V
parameter: V
10
pF
10
C
10
10
10
)
DS
=0V, f =1 MHz
GS
4
3
2
1
C
rss
0
0 100 200 300 400 V 600
16 Typ. C
= f(VDS)
E
oss
7.5
stored energy
oss
µJ
C
iss
6
5.5
5
oss
E
4.5
C
oss
V
DS
4
3.5
3
2.5
2
1.5
1
0.5
0
0 100 200 300 400 V 600
V
DS
2007 -02 -01 Rev. 2.5 Page 8
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SPI 11N60CFD
17 Typ. reverse recovery charge
Qrr = f(TJ)
parameter: I D = 11A
1200
1100
1000
rr [nC]
Q
900
800
700
600
25 50 75 °C 125
18 Typ. reverse recovery charge
Qrr = f(ID)
parameter: di/dt = 100 A/µs
1200
1100
1000
900
rr [nC]
Q
800
700
600
500
400
300
200
1 2 3 4 5 6 7 8 9 A 11
T
j
Tj = 125°C
Tj = 25°C
I
D
19 Typ. reverse recovery charge
Qrr = f( di/dt)
parameter: I D = 11 A
1600
1500
Tj = 125°C
1400
1300
rr [nC]
Q
1200
1100
1000
900
800
700
600
100 200 300 400 500 600 700 A/µs 900
Tj = 25°C
di /dt
2007 -02 -01 Rev. 2.5 Page 9
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Definition of diodes switching characteristics
SPI 11N60CFD
2007 -02 -01 Rev. 2.5 Page 10
Page 11
PG -TO-262-3-1
SPI 11N60CFD
Rev. 2. 5 P age 11
2007 -02 -01
Page 12
SPI 11N60CFD
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
2007 -02 -01 Rev. 2.5 Page 12