Datasheet SP7514KN, SP7514AN, SP7514BN, SP7514JN Datasheet (Sipex Corporation)

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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
1
DESCRIPTION…
The SP7514 and HS3140 are precision 14-bit multiplying DACs, that provide four-quadrant multiplication. Both parts accept both AC and DC reference voltages. The SP7514 is available for use in commercial and industrial temperature ranges, packaged in a 20-pin SOIC. The HS3140 is available in commercial and military temperature ranges, packaged in a 20-pin side-brazed DIP.
14–Bit Resolution
0.003% Non-Linearity
Four-Quadrant Multiplication
Latch-up Protected
Low Power - 30mW
Single +15V Power Supply
96k96k
48k
6k
2017
SWITCHES ARE SHOWN IN THE HIGH STATE
1
I
OUT
1
R
FEEDBACK
BIT 14
LSB
7654
BIT 1
(MSB)
BIT 2 BIT 3 BIT 4
4 to 16 DECODE
3
18
GND
V
DD
V
REF
19
15 EQUAL
SECTIONS
2
I
OUT
2
96k96k
SP7514
SP7514, HS3140
®
HS3140/SP7514
14-Bit Multiplying DA Cs
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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
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SPECIFICATIONS
(Typical @ 25°C, nominal power supply, V
REF
= +10V, unipolar unless otherwise noted)
PARAMETER MIN. TYP. MAX. UNITS CONDITIONS DIGITAL INPUT
Resolution 14 Bits 2–Quad, Unipolar Coding Binary 4–Quad, Bipolar Coding Offset Binary Logic Compatibility CMOS, TTL Note 1 Input Current ±1 µA
REFERENCE INPUT
Voltage Range ±25 V Note 2 Input Impedance 3.25 9.75 KOhms
ANALOG OUTPUT
Scale Factor 75 225 µA/V
REF
Scale Factor Accuracy ±1 % Note 3 Output Leakage 10 nA Note 4 Output Capacitance
C
OUT
1, all inputs high 100 pF
C
OUT
1, all inputs low 50 pF
C
OUT
2, all inputs high 50 pF
C
OUT
2, all inputs low 100 pF
STATIC PERFORMANCE
Integral Linearity Note 5
SP7514KN/BN, HS3140–4 ±0.003 ±0.006 % FSR SP7514JN/AN, HS3140–3 ±0.006 ±0.012 % FSR
Differential Linearity Note 6
SP7514KN/BN, HS3140–4 ±0.003 ±0.006 %FSR SP7514JN/AN, HS3140–3 ±0.006 ±0.012 % FSR
Monotonicity
SP7514KN/BN, HS3140–4 Guaranteed to 14 bits SP7514JN/AN, HS3140–3 Guaranteed to 13 bits
STABILITY (T
MIN
to T
MAX
)
Scale Factor 4 ppm FSR/° C Note 7 and 8 Integral Linearity 0.5 1.0 ppm FSR/°C Differential Linearity 0.5 1.0 ppm FSR/°C Monotonicity Temp. Range
SP7514JN/KN, HS3140C 0 +70 °C SP7514AN/BN –40 +85 °C HS3140B –55 +125 °C
DYNAMIC PERFORMANCE
Digital Small Signal Settling 1.0 µS Digital Full Scale Settling 2.0 µS Reference Feedthrough Error (V
REF
= 20Vpp) @ 1kHz 200 µV @ 10kHz 2 mV Reference Input Bandwidth 1 MHz
POWER SUPPLY (VDD)
Operating Voltage +15 ±5% V Voltage Range +8 +18 V Current 2.0 mA Note 9 Rejection Ratio 0.005 %/%
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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
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0.048%
0.024%
0.012%
0.006%
0.003% 4
LINEARITY - %
6 8 10 12 14 16 18
VDD-VOLTS
Linearity vs. Supply Voltage
2.5
4
10
I
6 8 10 12 14 16 18
2.0
1.5
1.0
DD
-mA
VDD-VOLTS
Power Supply Current vs. Voltage
0.048
0.024
0.012
0.006
0.003
0.01 0.1 1 10
INTEGRAL LINEARITY ERROR - %
V
REF
-VOLTS
Integral Linearity Error vs. Reference Voltage
50
40
30
20
10
0
01020304050
2 LSB
1 LSB
1/2 LSB @ 16 BITS
LINEARITY ERROR - PPM
VOS-mV
Additional Linearity Error vs. Output-Amplifier
Offset-Voltage (V
REF
= + 10V)
0.01
4
GAIN CHANGE - %
6 8 10 12 14 16 18
0.004
0.002
0
VDD-VOLTS
0.008
0.006
Gain Change vs. Supply Voltage
CHARACTERISTIC CURVES
(Typical @ + 25°C, VDD = + 15VDC, V
REF
= + 10VDC, unless otherwise noted)
SPECIFICATIONS (continued)
(Typical @ 25°C, nominal power supply, V
REF
= +10V, unipolar unless otherwise noted)
PARAMETER MIN. TYP. MAX. UNITS CONDITIONS ENVIRONMENTAL AND MECHANICAL
Operating Temperature
SP7514JN/KN 0 +70 °C SP7514AN/BN –40 +85 °C HS3140–C 0 +70 °C HS3140–B –55 +125 °C HS3140–B/883 –55 +125 °C
Storage Temperature –65 +150 °C Package
SP7514_N 20-pin SOIC HS3140 20–pin Side–Brazed DIP
Notes:
1. Digital input voltage must not exceed supply voltage or go below –0.5V ; “0” <0.8V; 2.4V < “1” V
DD.
2. AC or DC; use R6758–1 for fixed reference applications
3. Using the internal feedback resistor and an external op amp. The Scale Factor can be adjusted externally by variable resistors in series with the reference input and/or in series to the internal feedback resistor. Please refer to the Applications Information section.
4. At 25°C; the output leakage current will create an offset voltage at the external op amps output. It doubles every 10°C temperature increase.
5. Integral Linearity is measured as the arithmetic mean value of the magnitudes of the greatest positive deviation and the greatest negative deviation from the theoretical value for any given input combination.
6. Differential Linearity is the deviation of an output step form the theoretical value of 1LSB for any two adjacent digital input codes.
7. At 25°C, the output leakage current will create an offset voltage output. It doubles every 10°C temperature increase.
8. Using the internal feedback resistor and an external op amp.
9. Use series 470ohm resistor to limit start-up current.
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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
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PIN ASSIGNMENTS…
Pin 1 – IO1 – Current Output 1. Pin 2 – IO2 – Current Output 2. Pin 3 – GND – Ground. Pin 4 – DB13 – MSB, Data Bit 1. Pin 5 – DB12 – Data Bit 2. Pin 6 – DB11 – Data Bit 3. Pin 7 – DB10 – Data Bit 4. Pin 8 – DB9 – Data Bit 5. Pin 9 – DB8 – Data Bit 6. Pin 10 – DB7 – Data Bit 7. Pin 11 – DB6 – Data Bit 8. Pin 12 – DB5 – Data Bit 9. Pin 13 – DB4 – Data Bit 10. Pin 14 – DB3 – Data Bit 11. Pin 15 – DB2 – Data Bit 12. Pin 16 – DB1 – Data Bit 13. Pin 17 – DB0 – LSB, Data Bit 14. Pin 18 – VDD – Positive Supply Voltage. Pin 19 – V
REF
– Reference Voltage Input.
Pin 20 – RFB – Feedback Resistor.
PRINCIPLES OF OPERATION
The SP7514/HS3140 achieve high accuracy by using a decoded or segmented DAC scheme to implement this function. The following is a brief description of this approach.
The most common technique for building a D/A converter of n bits is to use n switches to turn n current or voltage sources on or off. The n switches and n sources are designed so that each switch or bit contrib­utes twice as much to the D/A converter’s output as the preceding bit. This technique is commonly known as binary weighting and allows an n-bit converter to generate 2n output levels by turning on the proper combination of bits.
In such binary-weighted converter, the switch with the smallest contribution (the LSB) accounts for only 2-n of the converter’s full-scale value. Similarly, the switch with the largest contribution (the MSB) accounts for 2
-1
or half of the converter’s full-scale output. Thus it is easy to see that a given percent change in the MSB will have a greater effect on the converter’s output than would a similar percent change in the LSB. For example, a 1% change in the LSB of a 10 bit converter would only affect the output by 0.001% of full-scale. A 1% change in the MSB of the same converter would affect the output by 0.5% of FSR.
In order to overcome the problem which results from the large weighting of the MSB, the two MSB’s can be decoded to three equally weighted sources. Table 1 shows that all combinations of the two MSB’s of a converter result in four output levels. So by replacing the two MSB’s with three bits equally weighted at 1/ 4 full-scale and decoding the two MSB digital inputs into three lines which drive the equally weighted bits, the same functional performance can be obtained. Thus by replacing the two MSB switches of a conven­tional converter with three switches properly de­coded, the contribution of any switch is reduced from 1/2 to 1/4. This reduction in sensitivity also reduces the
FEATURES…
The SP7514 and HS3140 are precision 14-bit multi­plying DACs. The DACs are implemented as a one­chip CMOS circuit with a resistor ladder network.
Three output lines are provided on the DACs to allow unipolar and bipolar output connection with a mini­mum of external components. The feedback resistor is internal. The resistor ladder network termination is externally available, thus eliminating an external re­sistor for the 1 LSB offset in bipolar mode.
The SP7514 is available for use in commercial and industrial temperature ranges, packaged in a 20-pin SOIC. The HS3140 is available in commercial and military temperature ranges, packaged in a 20–pin side–brazed DIP. For product processed and screened to the requirements of MIL–M– 38510 and MIL–STD–883C, please consult the factory (HS3140B only).
Figure 1. SP7514/HS3140 Equivalent Output Circuit
+
E
O
C
f
C
R
p
R
f
C
O
R
i
V
REF
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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
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2
- 1
(MSB) 2
- 2
Output
00 0 0 1 1/4 Full-Scale 1 0 1/2 Full-Scale 1 1 3/4 Full-Scale
Table 1. Contribution of the two MSB's
V
REF
V
DD
470
DIGITAL INPUTS
R
FEEDBACK
I
O1
+
-
I
O2
GND
R
OS
A
V
OUT
SP7514 HS3140
200
400
Figure 2. Unipolar Operation
accuracy required of any switch for a given overall converter accuracy.
With the decoded converter described above, a 1% change in any of the converter’s switches will affect the output by no more than 0.25% of full-scale as compared to 0.5% for a conventional converter. In other words the conventional D/A converter can be made less sensitive to the quality of its individual bits by decoding.
In the SP7514/HS3140 the first four MSB’s are decoded into 16 levels which drive 15 equally weighted current sources. The sensitivity of each switch on the output is reduced by a factor of 8. Each of the 15 sources contributes 6.25% output change rather than an MSB change of 50% for the common approach.
Following the decoded section of the DAC a standard binary weighted R-2R approach is used. This divides each of the 16 levels (or 6.25% of F.S.) into 4096 discrete levels (the 12 LSB’s).
Output Capacitance
The SP7514/HS3140 have very low output capaci­tance (CO). This is specified both with all switches ON and all switches OFF. Output capacitance varies from 50pF to 100pF over all input codes. This low capaci­tance is due in part to the decoding technique used. Smaller switches are used with resulting less capaci­tance. Three important system characteristics are affected by CO and CO; namely digital feedthrough,
settling time, and bandwidth. The DAC output equiva­lent circuit can be represented as shown in Figure 1.
Digital feedthrough is the change in analog output due to the toggling conditions on the converter input data lines when the analog input V
REF
is at 0V. The
SP7514/HS3140 very low CO and therefore will yield low digital feedthrough. Inputs to the DAC can be buffered. This input latch with microprocessor control is shown in Figure 4.
Settling time is directly affected by CO. In Figure 1, C
O
combines with Rf to add a pole to the open loop response, reducing bandwidth and causing excessive phase shift - which could result in ringing and/or oscillation. A feedback capacitor, Cf must be added to restore stability. Even with Cf, there is still a zero-pole mismatch due to RiCO which is code dependent. This code dependent mismatch is minimized when CORi = RfCf. However Cf must now be made larger to compensate for worst case RiCO - resulting in re­duced bandwidth and increased settling time. With the SP7514/HS3140, small values for Cf must be used.
DIGITAL INPUTS
R
FEEDBACK
I
O1
+
-
I
O2
GND
R
OS1
A
V
OUT
1
+
­A
2
R
OS2
V
OUT1
A1, A
2
, OP-07
4K
4K
R
OS2
R
200
V
REF
V
DD
470
400
SP7514 HS3140
Figure 3. Bipolar Operation
TRANSFER FUNCTION (N=14)
BINARY INPUT UNIPOLAR OUTPUT BIPOLAR OUTPUT
111...111 –V
REF
(1 - 2–N)–V
REF
(1 – 2
–(N – 1)
)
100...001 –V
REF
(1/2 + 2–N)–V
REF
(2
–(N – 1)
)
100...000 –V
REF
/2 0
011...111 –V
REF
(1/2 – 2–N)V
REF
(2
–(N – 1)
)
000…001 –V
REF
(2
(N – 1)
)V
REF
(1 – 2
–(N – 1)
)
000...000 0 V
REF
Table 2. Transfer Function
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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
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Figure 4. Microprocessor Interface to SP7514/HS3140
D0 D1 D2 D3 D4 D5 D6 D7
CLK
74273
V
REF
(+ 25V MAX)
LSB 15 14 13 12 11 10
9 SP7514/
7516
D0 D1 D2 D3 D4 D5 D6 D7
74273
CLK
MSB
GND
8 7 6 5 4 3 2
LATCHESADDRESS DECODER
G2A
74LS138
G2B
C B A
D0 D1 D2 D3 D4 D5 D6 D7
+
200
470
3
DD
V
400
WR
BDSEL
A
2
A
1
A
0
V
REF
V
DD
+
R
I
01
I
02
UNIPOLAR MODE
(2-QUADRANT)
6
2 3
A
1
V
OUT
0 TO - V
REF
(1-2
- N
)
R
0S
F
Resistor Rp can be added, this will parallel Rj decreas­ing the effective resistance. If Cf is reduced the bandwidth will be increased and settling time de­creased. However a system penalty for lowering Cf is to increase noise gain. The trade-off is noise vs. settling time. If Rp is added then a large value (1µF or greater) non-polarized capacitor Cp should be added in series with Rp to eliminate any DC drifts. If settling time is not important, eliminate Rp and Cp, and adjust Cf to prevent overshoot.
Output Offset
In most applications, the output of the DAC is fed into an amplifier to convert the DAC’s current output to voltage. A little known and not commonly discussed parameter is the linearity error versus offset voltage of the output amplifier. All CMOS DAC’s must operate into a virtual ground, i.e., the summing junction of an op amp. Any amplifier’s offset from the amplifier will appear as an error at the output (which can be related to LSB’s of error).
Most all CMOS DAC’s currently available are imple­mented using an R-2R ladder network. The formula for nonlinearity is typically 0.67mV/mVOS (not de­rived here). However the SP7516 has a coefficient of only 0.065mV/mVOS. This is due to the decoding technique described earlier. CMOS DAC applica­tions notes (including this one) always show a poten­tiometer used to null out the amplifier’s offset. If an amplifier is chosen having ‘pretrimmed’ offset it may be possible to eliminate this component. Consider the following calculations:
SP7514/ HS3140
1. Using LF441A amplifier (low power - 741 pinout)
2. Specified offset: 0.5mV max
3. Temperature coefficient of input offset: 10µV/°C max
V
OS
max (0°C to 70°C) = 0.5mV + (70µV)10
= 1.2mV
Add'l nonlinearity (max.) = 1.2mV x 0.065mV/mV
= 78µV (1/2 LSB @ 16 Bits)
Where: 78µV = 1/2 LSB @ 16 Bits (10V range)
Via the above configuration, the SP7514/HS3140 can be used to divide an analog signal by digital code (i.e. for digitally controlled gain). The transfer func­tion is given in Table 2, where the value of each bit is 0 or 1. Division by all “0”s is undefined and causes the op amp to saturate.
Applications Information Unipolar Operation
Figure 2 shows the interconnections for unipolar operation. Connect IO1 and FB1 as shown in diagram. Tie IO2 (Pin 7), FB3 (Pin 3), and FB4 (Pin 1) to Ground (Pin 8). As shown, a series resistor is recommended in the VDD supply line to limit current during ‘turn-on’. To maintain specified linearity, external amplifiers must be zeroed. Apply an ALL “ZEROES” digital input and adjust ROS for V
OUT
= 0 ± 1mV. The
SP7514 and HS3140 have been used successfully with OP-07, OP-27 and LF441A. For high speed applications the SP2525 is recommended.
Bipolar Operation
Figure 3 shows the interconnections for bipolar op­eration. Connect IO1, IO2, FB1, FB3, FB4 as shown in diagram. Tie LDTR to IO2. As shown, a series resistor is recommended in the VDD supply line to limit current during ‘turn-on. To maintain specified linearity, exter­nal amplifiers must be zeroed. This is best done with V
REF
set to zero and, the DAC register loaded with
10...0 (MSB = 1). Set R
0S1
for V01 = 0. Set R
0S2
for
V
OUT
= 0. Set V
REF
to +10V and adjust RB for V
OUT
to be 0V.
Grounding
Connect all GND pins to system analog ground and tie this to digital ground. All unused input pins must be grounded.
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HS3140/SP7514 HS3140/SP7514 14-Bit Multiplying DACs © Copyright 2000 Sipex Corporation
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ORDERING INFORMATION
Model ................................................................ Monotonicity.................................. Temperature Range .................................... Package
Double-Buffered 12-Bit Multiplying DAC
HS3140C-3Q............................................................ 13-Bit...............................................0°C to +70°C ................... 20-pin, 0.3" Side-Brazed DIP
HS3140B-3Q............................................................ 13-Bit......................................... -55°C to +125°C ................... 20-pin, 0.3" Side-Brazed DIP
HS3140B-3/883 ....................................................... 13-Bit ......................................... -55°C to +125°C ................... 20-pin, 0.3" Side-Brazed DIP
HS3140C-4Q............................................................ 14-Bit...............................................0°C to +70°C ................... 20-pin, 0.3" Side-Brazed DIP
HS3140B-4Q............................................................ 14-Bit......................................... -55°C to +125°C ................... 20-pin, 0.3" Side-Brazed DIP
HS3140B-4/883 ....................................................... 14-Bit ......................................... -55°C to +125°C ................... 20-pin, 0.3" Side-Brazed DIP
SP7514JN ................................................................ 13-Bit ...............................................0°C to +70°C ...................................... 20-pin, 0.3" SOIC
SP7514KN ............................................................... 14-Bit ...............................................0°C to +70°C ...................................... 20-pin, 0.3" SOIC
SP7514AN ............................................................... 13-Bit .......................................... –40°C to +85°C ...................................... 20-pin, 0.3" SOIC
SP7514BN ............................................................... 14-Bit .......................................... –40°C to +85°C ...................................... 20-pin, 0.3" SOIC
Corporation
SIGNAL PROCESSING EXCELLENCE
Sipex Corporation reserves the right to make changes to any products described herein. Sipex does not assume any liability arising out of the application or use of any product or circuit described hereing; neither does it convey any license under its patent rights nor the rights of others.
Sipex Corporation Headquarters and
Sales Office
22 Linnell Circle Billerica, MA 01821 TEL: (978) 667-8700 FAX: (978) 670-9001 e-mail: sales@sipex.com
Sales Office
233 South Hillview Drive Milpitas, CA 95035 TEL: (408) 934-7500 FAX: (408) 935-7600
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