Page 1
Product specification
1999 Dec 23
DISCRETE SEMICONDUCTORS
SMA BZG01 series
Voltage regulator diodes
Page 2
1999 Dec 23 2
Philips Semiconductors Product specification
Voltage regulator diodes SMA BZG01 series
FEATURES
• Glass passivated
• High maximum operating
temperature
• Ideal for surface mount automotive
applications
• Low leakage current
• Excellent stability
• UL 94V-O classified plastic
package
• Zener working voltage range:
10 to 270 V for 35 types
• Supplied in 12 mm embossed tape
and reel, 1500 and 7500 pieces
• Marking: cathode, date code,
type name
• Easy pick and place.
DESCRIPTION
DO-214AC surface mountable
package with glass passivated chip.
The well-defined void-free case is of a
transfer-moulded thermo-setting
plastic. The small rectangular
package has two J bent leads.
Fig.1 Simplified outline (DO-214AC) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT
P
tot
total power dissipation Ttp= 100 °C; see Fig.2 − 2.50 W
P
tot
total power dissipation T
amb
= 25 °C; see Fig.2; device
mounted on an Al2O3 PCB (see Fig.5)
− 1.50 W
P
ZSM
non-repetitive peak reverse power
dissipation
tp= 100 µs; square pulse;
Tj= 25 °C prior to surge; see Fig.3
− 150 W
T
stg
storage temperature −65 +175 °C
T
j
junction temperature −65 +175 °C
Page 3
1999 Dec 23 3
Philips Semiconductors Product specification
Voltage regulator diodes SMA BZG01 series
ELECTRICAL CHARACTERISTICS
Total series
Tj= 25 °C unless otherwise specified.
Per type
Tj= 25 °C unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MAX. UNIT
V
F
forward voltage IF= 0.1 A; see Fig.4 1.2 V
TYPE
No.
SUFFIX
(1)
WORKING VOLTAGE
DIFFERENTIAL
RESISTANCE
TEMPERATURE
COEFFICIENT
TEST
CURRENT
REVERSE CURRENT
at REVERSE VOLTAGE
VZ (V) at I
Z
r
dif
(Ω) at IZ SZ (%/K) at I
Z
IZ (mA)
IR (µA)
VR (V)
MIN.
NOM.
MAX. TYP. MAX. MIN. MAX.
MAX.
C10
9.4 10 10.6 2 7 0.05 0.09 25 10 7.5
C11
10.4 11 11.6 3 8 0.05 0.10 20 4 8.2
C12
11.4 12 12.7 3 9 0.05 0.10 20 3 9.1
C13
12.4 13 14.1 3 10 0.05 0.10 20 2 10
C15
13.8 15 15.6 5 15 0.05 0.10 15 1 11
C16
15.3 16 17.1 5 15 0.06 0.11 15 1 12
C18
16.8 18 19.1 7 20 0.06 0.11 15 1 13
C20
18.8 20 21.2 8 24 0.06 0.11 10 1 15
C22
20.8 22 23.3 8 25 0.06 0.11 10 1 16
C24
22.8 24 25.6 8 25 0.06 0.11 10 1 18
C27
25.1 27 28.9 10 30 0.06 0.11 8 1 20
C30
28 30 32 10 30 0.06 0.11 8 1 22
C33
31 33 35 12 35 0.06 0.11 8 1 24
C36
34 36 38 13 40 0.06 0.11 8 1 27
C39
37 39 41 17 50 0.06 0.11 6 1 30
C43
40 43 46 17 50 0.07 0.12 6 1 33
C47
44 47 50 30 90 0.07 0.12 4 1 36
C51
48 51 54 40 115 0.07 0.12 4 1 39
C56
52 56 60 40 120 0.07 0.12 4 1 43
C62
58 62 66 40 125 0.08 0.13 4 1 47
C68
64 68 72 40 130 0.08 0.13 4 1 51
C75
70 75 79 40 135 0.08 0.13 4 1 56
C82
77 82 87 70 200 0.08 0.13 2.7 1 62
C91
85 91 96 80 250 0.09 0.13 2.7 1 68
C100
94 100 106 120 350 0.09 0.13 2.7 1 75
C110
104 110 116 150 450 0.09 0.13 2.7 1 82
Page 4
1999 Dec 23 4
Philips Semiconductors Product specification
Voltage regulator diodes SMA BZG01 series
Note
1. To complete the type number the suffix is added to the basic type number, e.g. BZG01-C130.
THERMAL CHARACTERISTICS
Notes
1. Device mounted on an Al2O3 printed-circuit board, 0.7 mm thick; thickness of Cu-layer ≥35 µm, see Fig.5.
2. Device mounted on an epoxy-glass printed-circuit board, 1.5 mm thick; thickness of Cu-layer ≥40 µm, see Fig.5.
For more information please refer to the ‘General Part of associated Handbook’.
C120
114 120 127 200 550 0.09 0.13 2 1 91
C130
124 130 141 250 700 0.09 0.13 2 1 100
C150
138 150 156 300 1000 0.09 0.13 2 1 110
C160
153 160 171 350 1100 0.09 0.13 1.5 1 120
C180
168 180 191 400 1200 0.09 0.13 1.5 1 130
C200
188 200 212 500 1500 0.09 0.13 1.5 1 150
C220
208 220 233 700 2250 0.09 0.13 1 1 160
C240
228 240 256 800 2550 0.09 0.13 1 1 180
C270
251 270 289 1000 3000 0.09 0.13 1 1 200
SYMBOL PARAMETER CONDITIONS VALUE UNIT
R
th j-tp
thermal resistance from junction to tie-point 30 K/W
R
th j-a
thermal resistance from junction to ambient note 1 100 K/W
note 2 150 K/W
TYPE
No.
SUFFIX
(1)
WORKING VOLTAGE
DIFFERENTIAL
RESISTANCE
TEMPERATURE
COEFFICIENT
TEST
CURRENT
REVERSE CURRENT
at REVERSE VOLTAGE
VZ (V) at I
Z
r
dif
(Ω) at IZ SZ (%/K) at I
Z
IZ (mA)
IR (µA)
VR (V)
MIN.
NOM.
MAX. TYP. MAX. MIN. MAX.
MAX.
Page 5
1999 Dec 23 5
Philips Semiconductors Product specification
Voltage regulator diodes SMA BZG01 series
GRAPHICAL DATA
Solid line: tie-point temperature.
Dotted line: ambient temperature; device mounted on an Al2O3 PCB
as shown in Fig.5.
Fig.2 Maximum total power dissipation as a
function of temperature.
Tj= 25 °C prior to surge.
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
Tj= 25 °C.
Fig.4 Forward current as a function of forward
voltage; typical values.
Dimensions in mm.
Fig.5 Printed-circuit board for surface mounting.
Page 6
1999 Dec 23 6
Philips Semiconductors Product specification
Voltage regulator diodes SMA BZG01 series
PACKAGE OUTLINE
Page 7
1999 Dec 23 7
Philips Semiconductors Product specification
Voltage regulator diodes SMA BZG01 series
DEFINITIONS
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
Data sheet status
Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
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