Datasheet SGR2N60UFD Datasheet (Fairchild Semiconductor)

Page 1
SGR2N60UFD
IGBT
SGR2N60UFD
Ultra-Fast IGBT
General Description
Fairchild's UFD series of Insulated Gate Bipolar Transistors (IGBTs) provides low conduction and switching losses. The UFD series is designed for applications such as motor control and general inverters where high speed switching is a required feature.
Applications
AC & DC motor controls, general purpose inverters, robotics, and servo controls.
C
D-PAK
E
G
Absolute Maximum Ratings T
Symbol Description SGR2N60UFD Units
V
CES
V
GES
I
C
I
CM (1)
I
F
I
FM
P
D
T
Operating Junction Temperature -55 to +150 °C
J
T
stg
T
L
Notes :
(1) Repetitive rating : Pulse width limited by max. junction temperature
Collector-Emitter Voltage 600 V Gate-Emitter Voltage ± 20 V Collector Current @ TC = 25°C2.4 A Collector Current @ T Pulsed Collector Current 10 A Diode Continuous Forward Current @ TC = 100°C1.5 A Diode Maximum Forward Current 12 A Maximum Power Dissipation @ TC = 25°C25 W Maximum Power Dissipation @ T
Storage Temperature Range -55 to +150 °C Maximum Lead Temp. for Soldering Purposes, 1/8” from Case for 5 Seconds
= 25°C unless otherwise noted
C
Features
• High speed switching
• Low saturation voltage : V
• High input impedance
• CO-PAK, IGBT with FRD : t
G
G
= 100°C1.2 A
C
= 100°C10 W
C
= 2.1 V @ IC = 1.2A
CE(sat)
= 45ns (typ.)
rr
C
C
E
E
300 °C
Thermal Characteristics
Symbol Parameter Typ. Max. Units
R
(IGBT) Thermal Resistance, Junction-to-Case -- 5.0 °C/W
θJC
R
(DIODE) Thermal Resistance, Junction-to-Case -- 5.0 °C/W
θJC
R
θJA
Notes :
(2) Mounted on 1” squre PCB (FR4 or G-10 Material)
©2002 Fairchild Semiconductor Corporation SGR2N60UFD Rev. A1
Thermal Resistance, Junction-to-Ambient (PCB Mount)
(2)
-- 50 °C/W
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SGR2N60UFD
Electrical Characteristics of the IGBT T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
Off Characteristics
BV
BT
I
CES
I
GES
CES VCES
J
Collector-Emitter Breakdown Voltage VGE = 0V, IC = 250uA 600 -- -- V
/
T emperature Coefficient of Breakdown Voltage Collector Cut-Off Current VCE = V G-E Leakage Current VGE = V
V
= 0V, IC = 1mA -- 0.6 -- V/°C
GE
, VGE = 0V -- -- 250 uA
CES
, VCE = 0V -- -- ± 100 nA
GES
On Characteristics
V
GE(th)
V
CE(sat)
G-E Threshold Voltage IC = 1.2mA, VCE = V
,
Collector to Emitter Saturation Voltage
I
C
I
C
= 1.2A = 2.4A
VGE = 15V
,
VGE = 15V
GE
3.5 4.5 6.5 V
-- 2.1 2.6 V
-- 2.6 -- V
Dynamic Characteristics
C
ies
C
oes
C
res
Input Capacitance Output Capacitance -- 18 -- pF Reverse Transfer Capacitance -- 4 -- pF
= 30V, VGE = 0V,
V
CE
f = 1MHz
-- 98 -- pF
Switching Characteristics
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
E
Total Switching Loss -- 43 70 uJ
ts
t
d(on)
t
r
t
d(off)
t
f
E
on
E
off
Total Switching Loss -- 63 100 uJ
E
ts
Q
g
Q
ge
Q
gc
L
e
Turn-On Delay Time
-- 15 -- ns Rise Time -- 20 -- ns Turn-Off Delay Time -- 80 130 ns Fall Time -- 95 160 ns Turn-On Switching Loss -- 30 -- uJ
V
= 300 V, IC = 1.2A,
CC
R
= 200, V
G
GE
Inductive Load, T
= 15V,
= 25°C
C
Turn-Off Switching Loss -- 13 -- uJ
Turn-On Delay Time
-- 19 -- ns Rise Time -- 24 -- ns Turn-Off Delay Time -- 115 200 ns Fall Time -- 176 250 ns Turn-On Switching Loss -- 36 -- uJ
= 300 V, IC = 1.2A,
V
CC
= 200, V
R
G
GE
Inductive Load, T
= 15V,
= 125°C
C
Turn-Off Switchi ng Lo s s - - 27 -- uJ
Total Gate Charge Gate-Emitter Charge -- 3 5 nC Gate-Collector Charge -- 1.5 3 nC
= 300 V, IC = 1.2A,
V
CE
V
GE
= 15V
-- 9 14 nC
Internal Emitter Inductance Measured 5mm from PKG -- 7.5 -- nH
Electrical Characteristics of DIODE T
= 25°C unless otherwise noted
C
Symbol Parameter Test Conditions Min. Typ. Max. Units
T
V
FM
t
rr
I
rr
Q
rr
©2002 Fairchild Semiconductor Corporation
Diode Forward Voltage IF = 2A
Diode Reverse Recovery Time
Diode Peak Reverse Recovery Current
Diode Reverse Recovery Charge
I
= 2A,
F
di/dt = 200A/us
= 25°C
C
= 100°C
T
C
TC = 25°C
= 100°C
T
C
T
= 25°C
C
= 100°C
T
C
T
= 25°C
C
= 100°C
T
C
-- 1.4 1.7
-- 1.3 --
-- 45 80
-- 75 --
-- 1.5 3.0
-- 2.5 --
-- 60 135
-- 120 --
V
ns
A
nC
SGR2N60UFD Rev. A1
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SGR2N60UFD
12
[A]
C
Common Emitter TC = 25
10
8
6
4
20V
15V
12V
VGE = 10V
Collector Current, I
2
0
02468
Collector - Emitter Voltage, VCE [V]
Fig 1. Typical Output Characteristics
4
Common Emitter V
= 15V
[V]
Collector - Em i t t er Voltage, V
GE
CE
3
2
1
0
0306090120150
2.4A
1.2A
IC = 0.6A
Case Temperature, TC [℃]
6
Common Emitter V
= 15V
GE
= 25℃
T
C
5
T
= 125℃
[A]
Collector Current, I
C
C
4
3
2
1
0
0.5 1 10
Collector - Emitter Voltage, VCE [V]
Fig 2. Typical Saturation Voltage Characteristics
3.0
2.5
2.0
1.5
Load Current [A]
1.0
0.5
Duty cycle : 50%
T
= 100
C
Power Dissipation = 4W
0.0
0.1 1 10 100 1000
VCC = 300V Load Current : peak of square wave
Frequency [KHz]
Fig 3. Saturation Voltage vs. Case Tem perature at Variant Current Level
20
16
[V]
CE
12
8
4
Collector - Emitter Voltage, V
0
IC = 0.6A
048121620
1.2A
2.4A
Gate - Emitter Voltage, VGE [V]
Fig 5. Satur ation Voltage vs. V
©2002 Fairchild Semiconductor Corporation
Fig 4. Load Current vs. Frequ ency
Common Emitter
T
= 25
C
Fig 6. Saturation Voltage vs. VGE
GE
20
16
[V]
CE
12
8
4
Collector - Emitter Voltage, V
0
IC = 0.6A
048121620
2.4A
1.2A
Gate - Emitter Voltage, VGE [V]
Common Emitter
T
= 125
C
SGR2N60UFD Rev. A1
Page 4
SGR2N60UFD
160
120
80
Capacitance [pF]
40
0
11030
Cies
Coes
Cres
Common Emitter V
= 0V, f = 1MHz
GE
T
= 25
C
Switch i ng Tim e [ns]
Collector - Emitter Voltage, VCE [V]
Fig 7. Capaci tance Chara cteristi cs
Fig 8. Turn-On Characteristics vs. Gate Resistance
600
Common Emitter V
= 300V, VGE = ±15V
CC
I
= 1.2A
C
= 25℃
T
C
T
= 125℃
C
Tf
Toff
Switching Time [ns]
100
Toff
Tf
100
Common Emitter VCC = 300V, VGE = ±15V IC = 1.2A TC = 25℃
= 125℃
T
C
10
10 100 500
Gate Resistance, RG [Ω]
100
Common Emitter V
= 300V, VGE = ±15V
CC
= 1.2A
I
C
T
= 25℃
C
= 125℃
T
C
Switching Loss [uJ]
10
Ton
Tr
Eon
Eoff
Eoff
50
10 100 500
Gate Resistance, RG []
Fig 9. Turn-Off Characteristics vs. Gate Resistance
100
Common Emitter V
= 300V, VGE = ±15V
CC
R
= 200
G
TC = 25℃ T
= 125℃
C
Ton
Switching Time [ns]
Tr
10
0.5 1.0 1.5 2.0 2.5
Collector Curre n t, IC [A]
Fig 11. Tur n-On Characteristics vs. Collector Current
©2002 Fairchild Semiconductor Corporation
5
10 100 500
Gate Resistance, RG []
Fig 10. Switching Loss vs. Gate Resistance
1000
Common Emitter V
= 300V, VGE = ±15V
CC
R
= 200
G
TC = 25℃ T
= 125℃
C
Toff
Toff
Tf
Switching Time [ns]
Tf
100
0.5 1.0 1.5 2.0 2.5
Collector Current, IC [A]
Fig 12. Turn-Off Characteristics vs. Collector Current
SGR2N60UFD Rev. A1
Page 5
SGR2N60UFD
100
Common Emitter V
= 300V, VGE = ±15V
CC
R
= 200
G
TC = 25℃
= 125℃
T
C
Eon Eon
Switching Loss [uJ]
Eoff
10
Eoff
0.5 1.0 1.5 2.0 2.5
Collector Curre n t, IC [A]
Fig 13. Switching Loss vs. Collector Current
30
IC MAX. (Pulsed)
10
[A]
C
1
IC MAX. (Continuous)
DC Operation
50us
100us
1
15
Common Emitter RL = 250
Tc = 25
12
[ V ]
GE
9
300 V
6
VCE = 100 V
3
200 V
Gate - Emitter Voltage, V
0
0246810
Gate Charge, Qg [ nC ]
Fig 14. Gate Charge Characteristics
20
10
[A]
C
1
0.1
Single Nonrepetitive
Collec tor Current, I
Pulse TC = 25 Curves must be derated linearly with increase in temperature
0.01
0.3 1 10 100 1000
Collector-Emitter Voltage, VCE [V]
Fig 15. SOA Characteristics
10
0.5
/W]
0.2
1
0.1
0.05
0.02
0.1
0.01
0.01
-5
10
single pulse
-4
10
Thermal Resp on se, Zthjc [
Collector Current, I
0.1 1 10 100 1000
Fig 16. Turn-Off SOA Characteristics
-3
10
Rectangular Pulse Duration [sec]
-2
10
Safe Operating Are a VGE=20V, TC=100oC
Collector-Emitter Voltage, VCE [V]
Pdm
t1
t2
Duty factor D = t1 / t2 Peak Tj = Pdm
-1
10
Zthjc + T
×
0
10
C
1
10
©2002 Fairchild Semiconductor Corporation
Fig 17. Transient Thermal Impedance of IGBT
SGR2N60UFD Rev. A1
Page 6
SGR2N60UFD
30
TC = 25℃ TC = 100℃
10
[A]
F
1
Forward Current, I
0.1 0123
Forward Voltage Drop, VFM [V]
120
VR = 200V I
= 2A
F
T
= 25℃
100
C
[nC]
rr
TC = 100℃
80
60
40
Stored Recovery Charge, Q
20
10
VR = 200V IF = 2A TC = 25℃ TC = 100℃
[A]
rr
Reverse Recovery Current, I
1
100 500
di/dt [A/us]
Fig 19. Revers e R ecovery CurrentFig 18. Forward Characteristics
100
80
[ns]
rr
60
40
20
Reverce Recovery Time, t
VR = 200V IF = 2A TC = 25℃ TC = 100℃
0
100 500
di/dt [A /us]
0
100 500
di/dt [A/us]
Fig 20. Stored Charge Fig 21. Reverse Recovery Time
©2002 Fairchild Semiconductor Corporation
SGR2N60UFD Rev. A1
Page 7
Package Dimension
SGR2N60UFD
D-PAK
6.60 ±0.20
0.60 ±0.20
0.80 ±0.20
MAX0.96
2.30TYP
[2.30±0.20]
5.34 ±0.30 (4.34)(0.50) (0.50)
0.76 ±0.10
2.30TYP
[2.30±0.20]
2.70 ±0.20
0.70 ±0.20
6.10 ±0.20
9.50 ±0.30
±0.10
0.91
0.89 ±0.10
6.60 ±0.20 (5.34)
(5.04) (1.50)
2.30 ±0.10
0.50 ±0.10
0.50 ±0.10
1.02 ±0.20
2.30 ±0.20
(0.90)
(0.70)
MIN0.55
(1.00)
(2XR0.25)
6.10 ±0.20
9.50 ±0.30
©2002 Fairchild Semiconductor Corporation SGR2N60UFD Rev. A1
2.70 ±0.20 (0.10) (3.05)
0.76 ±0.10
Dimensions in Millimeters
Page 8
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PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Product Status Definition
Advance Information Formative or In
Design
Preliminary First Production This datasheet contains preliminary data, and
No Identification Needed Full Production This datasheet contains final specifications. Fairchild
Obsolete Not In Production This datasheet contains specifications on a product
This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.
supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.
Semiconductor reserves the right to make changes at any time without notice in order to improve design.
that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only .
Rev. H5©2002 Fairchild Semiconductor Corporation
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