Datasheet SFC05-4 Datasheet (PROTEK)

05131

Only One Name Means ProTek’Tion™

APPLICATIONS

✔ Cellular Phones
✔ Personnal Digital Assistant (PDA)
✔ Ground Positioning System (GPS)
✔ SMART & PCMCIA Cards

IEC COMPATIBILITY (EN61000-4)

✔ 61000-4-2 (ESD): Air - 15kV, Contact - 8kV
✔ 61000-4-4 (EFT): 40A - 5/50ns
✔ 61000-4-5 (Surge): 24A, 8/20µs - Level 2(Line-Gnd) & Level 3(Line-Line)

FEATURES

✔ ESD Protection > 25 kilovolts
✔ 300 Watts Peak Pulse Power per Line (tp = 8/20µs)
✔ Protects up to Four (4) Unidirectional Lines

SFC05-4

FLIP CHIP ARRAY

QUAD

MECHANICAL CHARACTERISTICS

✔ Weight 0.73 milligrams (Approximate)
✔ Flammability Rating UL 94V-0
✔ 8mm Plastic & Paper Tape and Reel Per EIA Standard 481
✔ Device Marking On Reel
✔ Top Contacts: Solder Bump 0.004” in Height (Nominal)

PIN CONFIGURATION

6

5

4

1

BOTTOM VIEW

2

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3

DEVICE CHARACTERISTICS

MAXIMUM RATINGS @ 25°C Unless Otherwise Specified

SFC05-4

PARAMETER
Peak Pulse Power (tp = 8/20µs) - See Figure 1
Operating Temperature
Storage Temperature

SYMBOL VALUE

P

PP

T

J

T

STG

300 Watts

-55°C to 150°C

-55°C to 150°C°C

ELECTRICAL CHARACTERISTICS PER LINE @ 25°C Unless Otherwise Specified

PA RT

NUMBER

SFC05-4

RATED

STAND-OFF

VOLTAGE

V

WM

VOLTS

5.0

MINIMUM

BREAKDOWN

VOLTAGE

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@ 1mA

V

(BR)

VOLTS

@ IP = 5A

V

C

VOLTS

6.0 9.5 11.0V @ 24A

MAXIMUM

CLAMPING

VOLTAGE

(See Fig. 2)

@8/20µs

VC @ I

PP

MAXIMUM
LEAKAGE

CURRENT

@V

WM

I

D

µA
10

UNITS

°C

TYPICAL

CAPACITANCE

@0V, 1 MHz

C

j

pF

150

10,000

1,000

100

- Peak Pulse Current - Watts

PP

P

10

0.01 1 10 100 1,000 10,000

PEAK PULSE POWER VS PULSE TIME

FIGURE 1

t

- Pulse Duration - µs

d

300W, 8/20µs Waveform

FIGURE 2

120

PP

100

80

60

40

- Peak Pulse Current - % of I

20

PP

I

0

0 5 10 15 20 25 30

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PULSE WAVE FORM

t

f

Peak Value I

-t

e

td = t

t - Time - µs

PP

IPP/2

TEST
WAVEFORM
PARAMETERS
tf = 8µs
td = 20µs

GRAPHS

SFC05-4

POWER DERATING CURVE

FIGURE 3

100

80

60

40

% Of Rated Power

20

0

0 25 50 75 100 125 150

TL - Lead Temperature - °C

Peak Pulse Power

8/20µs

Average Power

200°C

100°C

Note: This reflow profile does not take into account the printed circuit board (PCB) material
heating time. Additional time may be required for the preheat time and cool down time upon the
PCB or board material.

Instantaneous

to 200°C

1-2 Minutes

to 150°C

Pre-Heat

FIGURE 5

OVERSHOOT & CLAMPING VOLTAGE FOR SFC05-4

35

25

REFLOW SOLDER PROFILE

FIGURE 4

225°C

5-10 sec

1-2 Minutes to 25°C

Soldering

Time

Time

Cool Down

Time

15

5 Volts per Division

5

-5

ESD Test Pulse - 25 kilovolt, 1/30ns (waveshape)

FIGURE 6

TYPICAL CLAMPING VOLTAGE VS PEAK PULSE CURRENT FOR SFC05-4

14

12

10

8

6

4

- Clamping Voltage - Volts

C

V

2

0

0 5 10 15 20

- Peak Pulse Current - Amps

I

PP

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PACKAGE OUTLINE & DIMENSIONS

SFC05-4

PACKAGE OUTLINE

B

TOP

A

E

F

END

C

G

H

I

SIDE

MOUNTING PAD LAYOUT - Option 1

A

DIE
SOLDER
BUMPS

C

F

E

G

B

PACKAGE DIMENSIONS

MILLIMETERS

DIM

A
B
C
E

F
G
H

I

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).

3. “H” Dimensions for the SFC05-4 device
are 0.10mm Max and 0.004” Max.

0.510

0.510

0.99 ± 0.0254

0.15 NOM

1.5 ± 0.0254

0.15 NOM
See Note 3

0.076 MIN

0.419 NOM

INCHES

0.020

0.020

0.039 ± 0.001

0.006 NOM

0.059 ± 0.001

0.006 NOM
See Note 3

0.003 MIN

0.0165 NOM

PAD DIMENSIONS

DIM

A
B
C
D
E
F

G

NOTE:

1.

Preferred:

MILLIMETERS

0.305

0.457

0.203

0.254

0.510

0.990

0.510

Using 0.1mm (0.004”) stencil.

INCHES

0.012

0.018

0.008

0.010

0.020

0.039

0.020

SOLDER PRINT

0.010” - 0.012” DIA.

D

SOLDER PADS

SOLDER MASK

Outline & Dimensions: Rev 0 - 10/02, 06039

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PACKAGE OUTLINE & DIMENSIONS

SFC05-4

COPPER CONTACTS

0.009” [0.23] DIA.

D

SOLDER PRINT

0.014” [0.36] DIA.

MOUNTING PAD LAYOUT - Option 2

A

C

E

SOLDER MASK

PACKAGE DIMENSIONS

DIE
SOLDER
BUMPS

MILLIMETERS

DIM

A
B
C
D
E

1.499

0.152 NOM

0.510

0.990

0.510

NOTES:

1. Controlling dimensions in inches.

2. Decimal tolerances for mounting pad and
outline: .xxx ± 0.05mm (± 0.002”).

3.

Preferred:

Using 0.1mm (0.004”) stencil.

Outline & Dimensions: Rev 0 - 10/02, 06039

INCHES

0.059

0.006 NOM

0.020

0.039

0.020

TAPE & REEL ORIENTATION

B

1

6

2

5

3

4

NOTE:

1. Top view of tape. Solder bumps are face

down in tape package.

COPYRIGHT © ProTek Devices 2003

SPECIFICATIONS: ProTek reserves the right to change the electrical and or mechanical
characteristics described herein without notice (except JEDEC).

DESIGN CHANGES: ProTek reser ves the right to discontinue product lines without notice, and that
the final judgement concerning selection and specifications is the buyer’s and that in furnishing
engineering and technical assistance, ProTek assumes no responsibility with respect to the
selection or specifications of such products.

TAPE & REEL ORDERING NOMENCLATURE

1. Surface mount product is taped and
reeled in accordance with EIA 481.

2.

8mm Plastic Tape:

7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-1
(i.e., SFC05-4-T75-1).

3.

8mm Paper Tape:

7 Inch Reels - 5,000
pieces per reel. Ordering Suffix: -T75-2
(i.e., SFC05-4-T75-2).

ProTek Devices

2929 South Fair Lane, Tempe, AZ 85282
Tel: [phone] Fax: [phone]
E-Mail: [e-mail]
Web Site: www.protekdevices.com

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