Preliminary
SAB 80C166/83C166 16-Bit Microcontroller
High Performance 16-bit CPU with 4-Stage Pipeline
●
●
100 ns Instruction Cycle Time at 20 MHz CPU Clock
500 ns Multiplication (16 × 16 bit), 1 µs Division (32 / 16 bit)
●
●
Enhanced Boolean Bit Manipulation Facilities
● Register-Based Design with Multiple Variable Register Banks
●
Single-Cycle Context Switching Support
●
Up to 256 KBytes Linear Address Space for Code and Data
1 KByte On-Chip RAM
●
●
32 KBytes On-Chip ROM (SAB 83C166 only)
Programmable External Bus Characteristics for Different Address Ranges
●
●
8-Bit or 16-Bit External Data Bus
● Multiplexed or Demultiplexed External Address/Data Buses
●
Hold and Hold-Acknowledge Bus Arbitration Support
●
512 Bytes On-Chip Special Function Register Area
●
Idle and Power Down Modes
●
8-Channel Interrupt-Driven Single-Cycle Data Transfer Facilities via Peripheral Event
Controller (PEC)
●
16-Priority-Level Interrupt System
● 10-Channel 10-bit A/D Converter with 9.7 µs Conversion Time
●
16-Channel Capture/Compare Unit
●
Two Multi-Functional General Purpose Timer Units with 5 Timers
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Two Serial Channels (USARTs)
●
Programmable Watchdog Timer
Up to 76 General Purpose I/O Lines
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Supported by a Wealth of Development Tools like C-Compilers, Macro-Assembler Packages,
Emulators, Evaluation Boards, HLL-Debuggers, Simulators, Logic Analyzer Disassemblers,
Programming Boards
●
On-Chip Bootstrap Loader
●
100-Pin Plastic MQFP Package (EIAJ)
Semiconductor Group109.94
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SAB 80C166/83C166
Introduction
The SAB 80C166 is the first representative of the Siemens SAB 80C166 family of full featured
single-chip CMOS microcontrollers. It combines high CPU performance (up to 10 million
instructions per second) with high peripheral functionality and enhanced IO-capabilities.
SAB
80C166
Figure 1
Logic Symbol
Ordering Information
TypeOrdering CodePackageFunction
SAB 83C166-5MQ67121-D...P-MQFP-100-2 16-bit microcontroller, 0 ˚C to +70 ˚C,
1 KByte RAM and 32 KByte ROM
SAB 83C166-5M-T3Q67121-D...P-MQFP-100-2 16-bit microcontroller, -40 ˚C to +85 ˚C,
1 KByte RAM and 32 KByte ROM
SAB 80C166-MQ67121-C848P-MQFP-100-2 16-bit microcontroller, 0 ˚C to +70 ˚C
1 KByte RAM
SAB 80C166-M-T3Q67121-C900P-MQFP-100-2 16-bit microcontroller, -40 ˚C to +85 ˚C
1 KByte RAM
Note: The ordering codes (Q67120-D...) for the Mask-ROM versions are defined for each product
Port 4 is a 2-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance
state.
In case of an external bus configuration, Port 4 can be used to
output the segment address lines:
P4.0A16Least Significant Segment Addr. Line
P4.1A17Most Significant Segment Addr. Line
XTAL1:Input to the oscillator amplifier and input to the
internal clock generator
XTAL2:Output of the oscillator amplifier circuit.
To clock the device from an external source, drive XTAL1, while
leaving XTAL2 unconnected. Minimum and maximum high/low
and rise/fall times specified in the AC Characteristics must be
observed.
External Bus Configuration selection inputs. These pins are
sampled during reset and select either the single chip mode or
one of the four external bus configurations:
BUSACT EBC1EBC0 Mode/Bus Configuration
0008-bit demultiplexed bus
0018-bit multiplexed bus
01016-bit multiplexed bus
01116-bit demultiplexed bus
100Single chip mode
101Reserved.
110Reserved.
111Reserved.
ROMless versions must have pin BUSACT
tied to ‘0’.
RSTIN
27IReset Input with Schmitt-Trigger characteristics. A low level at
this pin for a specified duration while the oscillator is running
resets the SAB 80C166. An internal pullup resistor permits
power-on reset using only a capacitor connected to V
RSTOUT
28OInternal Reset Indication Output. This pin is set to a low level
when the part is executing either a hardware-, a software- or a
watchdog timer reset. RSTOUT remains low until the EINIT
(end of initialization) instruction is executed.
Semiconductor Group4
SS
.
Page 6
Pin Definitions and Functions (cont’d)
SAB 80C166/83C166
SymbolPin
Number
NMI29INon-Maskable Interrupt Input. A high to low transition at this pin
ALE25OAddress Latch Enable Output. Can be used for latching the
RD
P1.0 –
P1.15
26OExternal Memory Read Strobe. RD is activated for every
30-37
40-47
Input
Output
I/OPort 1 is a 16-bit bidirectional I/O port. It is bit-wise
Function
causes the CPU to vector to the NMI trap routine. When the
PWRDN (power down) instruction is executed, pin NMI must be
low in order to force the SAB 80C166 to go into power down
mode. If NMI is high, when PWRDN is executed, the part will
continue to run in normal mode.
If not used, pull NMI high externally.
address into external memory or an address latch in the
multiplexed bus modes.
external instruction or data read access.
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance
state. Port 1 is used as the 16-bit address bus (A) in
demultiplexed bus modes and also after switching from a
demultiplexed bus mode to a multiplexed bus mode.
P5.0 –
P5.9
P2.0 –
P2.15
48-53
56-59
62-77
62
75
76
77
I
I
I/O
I/O
I/O
O
I/O
O
I/O
I
Port 5 is a 10-bit input-only port with Schmitt-Trigger
characteristics. The pins of Port 5 also serve as the (up to 10)
analog input channels for the A/D converter, where P5.x equals
ANx (Analog input channel x).
Port 2 is a 16-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance
state.
The following Port 2 pins also serve for alternate functions:
P2.0CC0IOCAPCOM: CC0 Cap.-In/Comp.Out
.........
P2.13CC13IO CAPCOM: CC13 Cap.-In/Comp.Out,
BREQ
P2.14CC14IO CAPCOM: CC14 Cap.-In/Comp.Out,
HLDAExternal Bus Hold Acknowl. Output
P2.15CC15IO CAPCOM: CC15 Cap.-In/Comp.Out,
HOLDExternal Bus Hold Request Input
External Bus Request Output
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Pin Definitions and Functions (cont’d)
SAB 80C166/83C166
SymbolPin
Number
P3.0 –
P3.15
80-92,
95-97
80
81
82
83
84
85
86
87
88
89
90
91
92
95
96
97
Input
Output
I/O
I/O
I
O
I
O
I
I
I
I
O
I/O
O
I/O
O
O
I
O
Function
Port 3 is a 16-bit bidirectional I/O port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance
state.
The following Port 3 pins also serve for alternate functions:
P3.0T0INCAPCOM Timer T0 Count Input
P3.1T6OUT GPT2 Timer T6 Toggle Latch Output
P3.2CAPINGPT2 Register CAPREL Capture Input
P3.3T3OUT GPT1 Timer T3 Toggle Latch Output
P3.4T3EUD GPT1 Timer T3 Ext.Up/Down Ctrl.Input
P3.5T4INGPT1 Timer T4 Input for
Count/Gate/Reload/Capture
P3.6T3INGPT1 Timer T3 Count/Gate Input
P3.7T2INGPT1 Timer T2 Input for
Count/Gate/Reload/Capture
P3.8TxD1ASC1 Clock/Data Output (Asyn./Syn.)
P3.9RxD1ASC1 Data Input (Asyn.) or I/O (Syn.)
P3.10T×D0ASC0 Clock/Data Output (Asyn./Syn.)
P3.11R×D0ASC0 Data Input (Asyn.) or I/O (Syn.)
P3.12BHEExt. Memory High Byte Enable Signal
P3.13WRExternal Memory Write Strobe
P3.14READY Ready Signal Input
P3.15CLKOUTSystem Clock Output (=CPU Clock)
P0.0 –
P0.15
98 – 5
8 – 15
I/OPort 0 is a 16-bit bidirectional IO port. It is bit-wise
programmable for input or output via direction bits. For a pin
configured as input, the output driver is put into high-impedance
state.
In case of an external bus configuration, Port 0 serves as the
address (A) and address/data (AD) bus in multiplexed bus
modes and as the data (D) bus in demultiplexed bus modes.
54-Reference voltage for the A/D converter.
55-Reference ground for the A/D converter.
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Pin Definitions and Functions (cont’d)
SAB 80C166/83C166
SymbolPin
Number
V
CC
7, 18,
38, 61,
79, 93
V
SS
6, 21,
39, 60,
78, 94
Input
Function
Output
-Digital Supply Voltage:
+ 5 V during normal operation and idle mode.
≥ 2.5 V during power down mode
-Digital Ground.
Semiconductor Group7
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SAB 80C166/83C166
Functional Description
The architecture of the SAB 80C166 combines advantages of both RISC and CISC processors and
of advanced peripheral subsystems in a very well-balanced way. The following block diagram gives
an overview of the different on-chip components and of the advanced, high bandwidth internal bus
structure of the SAB 80C166.
Note: All time specifications refer to a CPU clock of 20 MHz
(see definition in the AC Characteristics section).
Figure 3
Block Diagram
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SAB 80C166/83C166
Memory Organization
The memory space of the SAB 80C166 is configured in a Von Neumann architecture which means
that code memory, data memory, registers and I/O ports are organized within the same linear
address space which includes 256 KBytes. Address space expansion to 16 MBytes is provided for
future versions. The entire memory space can be accessed bytewise or wordwise. Particular
portions of the on-chip memory have additionally been made directly bit addressable.
The SAB 83C166 contains 32 KBytes of on-chip mask-programmable ROM for code or constant
data. The ROM can be mapped to either segment 0 or segment 1.
1 KByte of on-chip RAM is provided as a storage for user defined variables, for the system stack,
general purpose register banks and even for code. A register bank can consist of up to 16 wordwide
(R0 to R15) and/or bytewide (RL0, RH0, …, RL7, RH7) so-called General Purpose Registers
(GPRs).
512 bytes of the address space are reserved for the Special Function Register area. SFRs are
wordwide registers which are used for controlling and monitoring functions of the different on-chip
units. 98 SFRs are currently implemented. Unused SFR addresses are reserved for future
members of the SAB 80C166 family.
In order to meet the needs of designs where more memory is required than is provided on chip, up
to 256 KBytes of external RAM and/or ROM can be connected to the microcontroller.
External Bus Controller
All of the external memory accesses are performed by a particular on-chip External Bus Controller
(EBC). It can be programmed either to Single Chip Mode when no external memory is required, or
to one of four different external memory access modes, which are as follows:
– 16-/18-bit Addresses, 16-bit Data, Demultiplexed
– 16-/18-bit Addresses, 16-bit Data, Multiplexed
– 16-/18-bit Addresses, 8-bit Data, Multiplexed
– 16-/18-bit Addresses, 8-bit Data, Demultiplexed
In the demultiplexed bus modes, addresses are output on Port 1 and data is input/output on Port 0.
In the multiplexed bus modes both addresses and data use Port 0 for input/output.
Important timing characteristics of the external bus interface (Memory Cycle Time, Memory Tri-
State Time, Read/Write Delay and Length of ALE, i.e. address setup/hold time with respect to ALE)
have been made programmable to allow the user the adaption of a wide range of different types of
memories. In addition, different address ranges may be accessed with different bus characteristics.
Access to very slow memories is supported via a particular ‘Ready’ function. A HOLD
protocol is available for bus arbitration.
/HLDA
For applications which require less than 64 KBytes of external memory space, a non-segmented
memory model can be selected. In this case all memory locations can be addressed by 16 bits and
Port 4 is not required to output the additional segment address lines.
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SAB 80C166/83C166
Central Processing Unit (CPU)
The main core of the CPU consists of a 4-stage instruction pipeline, a 16-bit arithmetic and logic unit
(ALU) and dedicated SFRs. Additional hardware has been spent for a separate multiply and divide
unit, a bit-mask generator and a barrel shifter.
Based on these hardware provisions, most of the SAB 80C166’s instructions can be executed in just
one machine cycle which requires 100 ns at 20-MHz CPU clock. For example, shift and rotate
instructions are always processed during one machine cycle independent of the number of bits to
be shifted. All multiple-cycle instructions have been optimized so that they can be executed very fast
as well: branches in 2 cycles, a 16 × 16 bit multiplication in 5 cycles and a 32-/16 bit division in
10 cycles. Another pipeline optimization, the so-called ‘Jump Cache’, allows reducing the execution
time of repeatedly performed jumps in a loop from 2 cycles to 1 cycle.
The CPU disposes of an actual register context consisting of up to 16 wordwide GPRs which are
physically allocated within the on-chip RAM area. A Context Pointer (CP) register determines the
base address of the active register bank to be accessed by the CPU at a time. The number of
register banks is only restricted by the available internal RAM space. For easy parameter passing,
a register bank may overlap others.
32 KByte in the
SAB 83C166
Figure 4
CPU Block Diagram
Semiconductor Group10
1 KByte
Page 12
SAB 80C166/83C166
A system stack of up to 512 bytes is provided as a storage for temporary data. The system stack is
allocated in the on-chip RAM area, and it is accessed by the CPU via the stack pointer (SP) register.
Two separate SFRs, STKOV and STKUN, are implicitly compared against the stack pointer value
upon each stack access for the detection of a stack overflow or underflow.
The high performance offered by the hardware implementation of the CPU can efficiently be utilized
by a programmer via the highly efficient SAB 80C166 instruction set which includes the following
instruction classes:
– Arithmetic Instructions
– Logical Instructions
– Boolean Bit Manipulation Instructions
– Compare and Loop Control Instructions
– Shift and Rotate Instructions
– Prioritize Instruction
– Data Movement Instructions
– System Stack Instructions
– Jump and Call Instructions
– Return Instructions
– System Control Instructions
– Miscellaneous Instructions
The basic instruction length is either 2 or 4 bytes. Possible operand types are bits, bytes and words.
A variety of direct, indirect or immediate addressing modes are provided to specify the required
operands.
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SAB 80C166/83C166
Interrupt System
With an interrupt response time within a range from just 250 ns to 600 ns (in case of internal
program execution), the SAB 80C166 is capable of reacting very fast to the occurrence of nondeterministic events.
The architecture of the SAB 80C166 supports several mechanisms for fast and flexible response to
service requests that can be generated from various sources internal or external to the
microcontroller. Any of these interrupt requests can be programmed to being serviced by the
Interrupt Controller or by the Peripheral Event Controller (PEC).
In contrast to a standard interrupt service where the current program execution is suspended and
a branch to the interrupt vector table is performed, just one cycle is ‘stolen’ from the current CPU
activity to perform a PEC service. A PEC service implies a single byte or word data transfer between
any two memory locations with an additional increment of either the PEC source or the destination
pointer. An individual PEC transfer counter is implicity decremented for each PEC service except
when performing in the continuous transfer mode. When this counter reaches zero, a standard
interrupt is performed to the corresponding source related vector location. PEC services are very
well suited, for example, for supporting the transmission or reception of blocks of data, or for
transferring A/D converted results to a memory table. The SAB 80C166 has 8 PEC channels each
of which offers such fast interrupt-driven data transfer capabilities.
A separate control register which contains an interrupt request flag, an interrupt enable flag and an
interrupt priority bitfield exists for each of the possible interrupt sources. Via its related register, each
source can be programmed to one of sixteen interrupt priority levels. Once having been accepted
by the CPU, an interrupt service can only be interrupted by a higher prioritized service request. For
the standard interrupt processing, each of the possible interrupt sources has a dedicated vector
location.
Software interrupts are supported by means of the ‘TRAP’ instruction in combination with an
individual trap (interrupt) number.
The following table shows all of the possible SAB 80C166 interrupt sources and the corresponding
hardware-related interrupt flags, vectors, vector locations and trap (interrupt) numbers:
The SAB 80C166 also provides an excellent mechanism to identify and to process exceptions or
error conditions that arise during run-time, so-called ‘Hardware Traps’. Hardware traps cause
immediate non-maskable system reaction which is similar to a standard interrupt service (branching
to a dedicated vector table location). The occurrence of a hardware trap is additionally signified by
an individual bit in the trap flag register (TFR). Except when another higher prioritized trap service
is in progress, a hardware trap will interrupt any actual program execution. In turn, hardware trap
services can normally not be interrupted by standard or PEC interrupts.
The following table shows all of the possible exceptions or error conditions that can arise during runtime:
0028
Access
Illegal Instruction Access
Illegal External Bus
ILLINA
ILLBUS
BTRAP
BTRAP
0028
0028
Access
Reserved[002C
003CH]
Trap
Number
H
H
H
H
H
H
H
H
H
H
H
–
H
00
H
00
H
00
H
02
H
04
H
06
H
0A
H
0A
H
0A
H
0A
H
0A
H
[0BH – 0FH]
Trap
Priority
III
III
III
II
II
II
I
I
I
I
I
Software Traps
TRAP Instruction
Semiconductor Group14
Any
[0000
H
01FCH]
in steps
of 04
H
–
Any
[00H – 7FH]
Current
CPU
Priority
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SAB 80C166/83C166
Capture/Compare (CAPCOM) Unit
The CAPCOM unit supports generation and control of timing sequences on up to 16 channels with
a maximum resolution of 400 ns (@ 20 MHz CPU clock). The CAPCOM unit is typically used to
handle high speed I/O tasks such as pulse and waveform generation, pulse width modulation
(PMW), Digital to Analog (D/A) conversion, software timing, or time recording relative to external
events.
Two 16-bit timers (T0/T1) with reload registers provide two independent time bases for the capture/
compare register array.
The input clock for the timers is programmable to several prescaled values of the CPU clock, or may
be derived from an overflow/underflow of timer T6 in module GPT2. This provides a wide range of
variation for the timer period and resolution and allows precise adjustments to the application
specific requirements. In addition, an external count input for CAPCOM timer T0 allows event
scheduling for the capture/compare registers relative to external events.
The capture/compare register array contains 16 dual purpose capture/compare registers, each of
which may be individually allocated to either CAPCOM timer T0 or T1, and programmed for capture
or compare function. Each register has one port pin associated with it which serves as an input pin
for triggering the capture function, or as an output pin to indicate the occurrence of a compare event.
When a capture/compare register has been selected for capture mode, the current contents of the
allocated timer will be latched (captured) into the capture/compare register in response to an
external event at the port pin which is associated with this register. In addition, a specific interrupt
request for this capture/compare register is generated. Either a positive, a negative, or both a
positive and a negative external signal transition at the pin can be selected as the triggering event.
The contents of all registers which have been selected for one of the five compare modes are
continuously compared with the contents of the allocated timers. When a match occurs between the
timer value and the value in a capture/compare register, specific actions will be taken based on the
selected compare mode.
Compare ModesFunction
Mode 0Interrupt-only compare mode;
several compare interrupts per timer period are possible
Mode 1Pin toggles on each compare match;
several compare events per timer period are possible
Mode 2Interrupt-only compare mode;
only one compare interrupt per timer period is generated
Mode 3Pin set ‘1’ on match; pin reset ‘0’ on compare time overflow;
only one compare event per timer period is generated
Double
Register Mode
Semiconductor Group15
Two registers operate on one pin; pin toggles on each compare match;
several compare events per timer period are possible.
Page 17
SAB 80C166/83C166
x = 0
y = 1
Figure 5
CAPCOM Unit Block Diagram
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SAB 80C166/83C166
General Purpose Timer (GPT) Unit
The GPT unit represents a very flexible multifunctional timer/counter structure which may be used
for many different time related tasks such as event timing and counting, pulse width and duty cycle
measurements, pulse generation, or pulse multiplication.
The GPT unit incorporates five 16-bit timers which are organized in two separate modules, GPT1
and GPT2. Each timer in each module may operate independently in a number of different modes,
or may be concatenated with another timer of the same module.
Each of the three timers T2, T3, T4 of module GPT1 can be configured individually for one of three
basic modes of operation, which are Timer, Gated Timer, and Counter Mode. In Timer Mode, the
input clock for a timer is derived from the CPU clock, divided by a programmable prescaler, while
Counter Mode allows a timer to be clocked in reference to external events.
Pulse width or duty cycle measurement is supported in Gated Timer Mode, where the operation of
a timer is controlled by the ‘gate’ level on an external input pin. For these purposes, each timer has
one associated port pin (TxIN) which serves as gate or clock input. The maximum resolution of the
timers in module GPT1 is 400 ns (@ 20 MHz CPU clock).
Figure 6
Block Diagram of GPT1
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SAB 80C166/83C166
The count direction (up/down) for each timer is programmable by software. For timer T3 the count
direction may additionally be altered dynamically by an external signal on a port pin (T3EUD) to
facilitate e. g. position tracking.
Timer T3 has an output toggle latch (T3OTL) which changes its state on each timer over-flow/
underflow. The state of this latch may be output on a port pin (T3OUT) e. g. for timeout monitoring
of external hardware components, or may be used internally to clock timers T2 and T4 for
measuring long time periods with high resolution.
In addition to their basic operating modes, timers T2 and T4 may be configured as reload or capture
registers for timer T3. When used as capture or reload registers, timers T2 and T4 are stopped. The
contents of timer T3 is captured into T2 or T4 in response to a signal at their associated input pins
(TxIN). Timer T3 is reloaded with the contents of T2 or T4 triggered either by an external signal or
by a selectable state transition of its toggle latch T3OTL. When both T2 and T4 are configured to
alternately reload T3 on opposite state transitions of T3OTL with the low and high times of a PWM
signal, this signal can be constantly generated without software intervention.
Figure 7
Block Diagram of GPT2
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SAB 80C166/83C166
With its maximum resolution of 200 ns (@ 20 MHz), the GPT2 module provides precise event
control and time measurement. It includes two timers (T5, T6) and a capture/reload register
(CAPREL). Both timers can be clocked with an input clock which is derived from the CPU clock via
a programmable prescaler. The count direction (up/down) for each timer is programmable by
software. Concatenation of the timers is supported via the output toggle latch (T6OTL) of timer T6,
which changes its state on each timer overflow/underflow.
The state of this latch may be used to clock timer T5, or it may be output on a port pin (T6OUT). The
overflows/underflows of timer T6 can additionally be used to clock the CAPCOM timers T0 or T1,
and to cause a reload from the CAPREL register. The CAPREL register may capture the contents
of timer T5 based on an external signal transition on the corresponding port pin (CAPIN), and timer
T5 may optionally be cleared after the capture procedure. This allows absolute time differences to
be measured or pulse multiplication to be performed without software overhead.
A/D Converter
For analog signal measurement, a 10-bit A/D converter with 10 multiplexed input channels and a
sample and hold circuit has been integrated on-chip. It uses the method of successive
approximation. The sample time (for loading the capacitors) and the conversion time adds up to
9.7 us @ 20 MHz CPU clock.
Overrun error detection/protection is provided for the conversion result register (ADDAT): an
interrupt request will be generated when the result of a previous conversion has not been read from
the result register at the time the next conversion is complete.
For applications which require less than 10 analog input channels, the remaining channel inputs can
be used as digital input port pins.
The A/D converter of the SAB 80C166 supports four different conversion modes. In the standard
Single Channel conversion mode, the analog level on a specified channel is sampled once and
converted to a digital result. In the Single Channel Continuous mode, the analog level on a specified
channel is repeatedly sampled and converted without software intervention. In the Auto Scan mode,
the analog levels on a prespecified number of channels are sequentially sampled and converted. In
the Auto Scan Continuous mode, the number of prespecified channels is repeatedly sampled and
converted.
The Peripheral Event Controller (PEC) may be used to automatically store the conversion results
into a table in memory for later evaluation, without requiring the overhead of entering and exiting
interrupt routines for each data transfer.
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SAB 80C166/83C166
Parallel Ports
The SAB 80C166 provides up to 76 I/O lines which are organized into five input/output ports and
one input port. All port lines are bit-addressable, and all input/output lines are individually (bit-wise)
programmable as inputs or outputs via direction registers. The I/O ports are true bidirectional ports
which are switched to high impedance state when configured as inputs. During the internal reset, all
port pins are configured as inputs.
All port lines have programmable alternate input or output functions associated with them. Port 0
and Port 1 may be used as address and data lines when accessing external memory, while Port 4
outputs the additional segment address bits A17/A16 in systems where segmentation is enabled to
access more than 64 KBytes of memory. Port 2 is associated with the capture inputs or compare
outputs of the CAPCOM unit and/or with optional bus arbitration signals (BREQ, HLDA, HOLD).
Port 3 includes alternate functions of timers, serial interfaces, optional bus control signals (WR,
BHE, READY) and the system clock output (CLKOUT). Port 5 is used for the analog input channels
to the A/D converter. All port lines that are not used for these alternate functions may be used as
general purpose I/O lines.
Serial Channels
Serial communication with other microcontrollers, processors, terminals or external peripheral
components is provided by two serial interfaces with identical functionality, Asynchronous/
Synchronous Serial Channels ASC0 and ASC1.
They are upward compatible with the serial ports of the Siemens SAB 8051x microcontroller family
and support full-duplex asynchronous communication up to 625 Kbaud and half-duplex
synchronous communication up to 2.5 Mbaud @ 20 MHz CPU clock.
Two dedicated baud rate generators allow to set up all standard baud rates without oscillator tuning.
For transmission, reception, and erroneous reception 3 separate interrupt vectors are provided for
each serial channel.
In asynchronous mode, 8- or 9-bit data frames are transmitted or received, preceded by a start bit
and terminated by one or two stop bits. For multiprocessor communication, a mechanism to
distinguish address from data bytes has been included (8-bit data + wake up bit mode).
In synchronous mode one data byte is transmitted or received synchronously to a shift clock which
is generated by the SAB 80C166.
A loop back option is available for testing purposes.
A number of optional hardware error detection capabilities has been included to increase the
reliability of data transfers. A parity bit can automatically be generated on transmission or be
checked on reception. Framing error detection allows to recognize data frames with missing stop
bits. An overrun error will be generated, if the last character received has not been read out of the
receive buffer register at the time the reception of a new character is complete.
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SAB 80C166/83C166
Watchdog Timer
The Watchdog Timer represents one of the fail-safe mechanisms which have been implemented to
prevent the controller from malfunctioning for longer periods of time.
The Watchdog Timer is always enabled after a reset of the chip, and can only be disabled in the time
interval until the EINIT (end of initialization) instruction has been executed. Thus, the chip’s start-up
procedure is always monitored. The software has to be designed to service the Watchdog Timer
before it overflows. If, due to hardware or software related failures, the software fails to do so, the
Watchdog Timer overflows and generates an internal hardware reset and pulls the RSTOUT pin low
in order to allow external hardware components to be reset.
The Watchdog Timer is a 16-bit timer, clocked with the CPU clock divided either by 2 or by 128. The
high byte of the Watchdog Timer register can be set to a prespecified reload value (stored in
WDTREL) in order to allow further variation of the monitored time interval. Each time it is serviced
by the application software, the high byte of the Watchdog Timer is reloaded. Thus, time intervals
between 25 µs and 420 ms can be monitored (@ 20 MHz CPU clock). The default Watchdog Timer
interval after reset is 6.55 ms (@ 20 MHz CPU clock).
Bootstrap Loader
The SAB 80C166 provides a built-in bootstrap loader (BSL), which allows to start program
execution out of the SAB 80C166’s internal RAM. The program to be started is loaded via the serial
interface ASC0 and does not require external memory or an internal ROM.
The SAB 80C166 enters BSL mode, when ALE is sampled high at the end of a hardware reset and
if NMI becomes active directly after the end of the internal reset sequence. BSL mode is entered
independent of the bus mode selected via EBC0, EBC1 and BUSACT.
After entering BSL mode the SAB 80C166 scans the RXD0 line to receive a zero byte, i.e. one start
bit, eight ‘0’ data bits and one stop bit. From the duration of this zero byte it calculates the
corresponding baudrate factor with respect to the current CPU clock and initializes ASC0
accordingly. Using this baudrate, an acknowledge byte is returned to the host that provides the
loaded data. The SAB 80C166 returns the value <55
>.
H
The next 32 bytes received via ASC0 are stored sequentially into locations 0FA40H through 0FA5F
of the internal RAM. To execute the loaded code the BSL then jumps to location 0FA40H. The
loaded program may load additional code / data, change modes, etc.
The SAB 80C166 exits BSL mode upon a software reset (ignores the ALE level) or a hardware reset
(remove conditions for entering BSL mode before).
H
Semiconductor Group21
Page 23
SAB 80C166/83C166
Instruction Set Summary
The table below lists the instructions of the SAB 80C166 in a condensed way.
The various addressing modes that can be used with a specific instruction, the operation of the
instructions, parameters for conditional execution of instructions, and the opcodes for each
instruction can be found in the “C16x Family Instruction Set Manual”.
This document also provides a detailed description of each instruction.
Instruction Set Summary
MnemonicDescriptionBytes
ADD(B)Add word (byte) operands2 / 4
ADDC(B)Add word (byte) operands with Carry2 / 4
SUB(B)Subtract word (byte) operands2 / 4
SUBC(B)Subtract word (byte) operands with Carry2 / 4
MUL(U)(Un)Signed multiply direct GPR by direct GPR (16-16-bit)2
DIV(U)(Un)Signed divide register MDL by direct GPR (16-/16-bit)2
DIVL(U)(Un)Signed long divide reg. MD by direct GPR (32-/16-bit)2
CPL(B)Complement direct word (byte) GPR2
NEG(B)Negate direct word (byte) GPR2
AND(B)Bitwise AND, (word/byte operands)2 / 4
OR(B)Bitwise OR, (word/byte operands)2 / 4
XOR(B)Bitwise XOR, (word/byte operands)2 / 4
BCLRClear direct bit2
BSETSet direct bit2
BMOV(N)Move (negated) direct bit to direct bit4
BAND, BOR, BXORAND/OR/XOR direct bit with direct bit4
BCMPCompare direct bit to direct bit4
BFLDH/LBitwise modify masked high/low byte of bit-addressable
direct word memory with immediate data
4
CMP(B)Compare word (byte) operands2 / 4
CMPD1/2Compare word data to GPR and decrement GPR by 1/22 / 4
CMPI1/2Compare word data to GPR and increment GPR by 1/22 / 4
PRIORDetermine number of shift cycles to normalize direct
word GPR and store result in direct word GPR
SHL / SHRShift left/right direct word GPR2
ROL / RORRotate left/right direct word GPR2
ASHRArithmetic (sign bit) shift right direct word GPR2
Semiconductor Group22
2
Page 24
SAB 80C166/83C166
Instruction Set Summary (cont’d)
MnemonicDescriptionBytes
MOV(B)Move word (byte) data2 / 4
MOVBSMove byte operand to word operand with sign extension2 / 4
MOVBZMove byte operand to word operand. with zero extension2 / 4
JMPA, JMPI, JMPRJump absolute/indirect/relative if condition is met4
JMPSJump absolute to a code segment4
J(N)BJump relative if direct bit is (not) set4
JBCJump relative and clear bit if direct bit is set4
JNBSJump relative and set bit if direct bit is not set4
CALLA, CALLI, CALLRCall absolute/indirect/relative subroutine if condition is met4
CALLSCall absolute subroutine in any code segment4
PCALLPush direct word register onto system stack and call
absolute subroutine
TRAPCall interrupt service routine via immediate trap number2
PUSH, POPPush/pop direct word register onto/from system stack2
SCXTPush direct word register onto system stack and update
register with word operand
RETReturn from intra-segment subroutine2
RETSReturn from inter-segment subroutine2
RETPReturn from intra-segment subroutine and pop direct
word register from system stack
RETIReturn from interrupt service subroutine2
SRSTSoftware Reset4
IDLEEnter Idle Mode4
PWRDNEnter Power Down Mode
EINITSignify End-of-Initialization on RSTOUT-pin4
NOPNull operation2
Semiconductor Group23
Page 25
SAB 80C166/83C166
Special Function Registers Overview
The following table lists all SFRs which are implemented in the SAB 80C166 in alphabetical order.
Bit-addressable SFRs are marked with the letter “b” in column “Name”.
An SFR can be specified via its individual mnemonic name. Depending on the selected addressing
mode, an SFR can be accessed via its physical address (using the Data Page Pointers), or via its
short 8-bit address (without using the Data Page Pointers).
Control Register
A/D Converter Control Register0000
A/D Converter Result Register0000
Address Select Register 10000
A/D Converter Overrun Error Interrupt Control
0000
Register
Bus Configuration Register 10000
GPT2 Capture/Reload Register0000
CAPCOM Register 00000
CAPCOM Register 0 Interrupt Control Register0000
CAPCOM Register 10000
CAPCOM Register 1 Interrupt Control Register0000
CAPCOM Register 20000
CPU Data Page Pointer 0 Register (4 bits)0000
CPU Data Page Pointer 1 Register (4 bits)0001
CPU Data Page Pointer 2 Register (4 bits)0002
CPU Data Page Pointer 3 Register (4 bits)0003
CPU Multiply / Divide Control Register0000
CPU Multiply / Divide Register – High Word0000
CPU Multiply / Divide Register – Low Word0000
Constant Value 1’s Register (read only)FFFF
Port 0 Register0000
Port 1 Register0000
Port 2 Register0000
Port 3 Register0000
Port 4 Register (2 bits)00
Port 5 Register (read only)XXXX
PEC Channel 0 Control Register0000
PEC Channel 1 Control Register0000
PEC Channel 2 Control Register0000
PEC Channel 3 Control Register0000
PEC Channel 4 Control Register0000
PEC Channel 5 Control Register0000
PEC Channel 6 Control Register0000
PEC Channel 7 Control Register0000
CPU Program Status Word0000
Serial Channel 0 Baud Rate Generator Reload
0000
H
H
H
H
H
H
H
H
H
H
H
Register
D8
H
H
H
B8
59
H
H
H
Serial Channel 0 Control Register0000
Serial Channel 0 Error Interrupt Control Register0000
Serial Channel 0 Receive Buffer Register
XX
H
H
H
(read only)
Semiconductor Group26
Page 28
Special Function Registers Overview (cont’d)
SAB 80C166/83C166
NamePhysical
Address
S0RICb FF6E
S0TBUFFEB0
S0TICb FF6C
S1BGFEBC
S1CONb FFB8
S1EICb FF76
S1RBUFFEBA
S1RICb FF74
S1TBUFFEB8
H
H
H
H
H
H
H
H
H
8-Bit
Address
B7
H
58
H
B6
H
5E
H
DC
H
BB
H
5D
H
BA
H
5C
H
DescriptionReset
Value
Serial Channel 0 Receive Interrupt Control
0000
Register
Serial Channel 0 Transmit Buffer Register
00
H
(write only)
Serial Channel 0 Transmit Interrupt Control
0000
Register
Serial Channel 1 Baud Rate Generator Reload
0000
Register
Serial Channel 1 Control Register0000
Serial Channel 1 Error Interrupt Control Register0000
Serial Channel 1 Receive Buffer Register
XX
H
(read only)
Serial Channel 1 Receive Interrupt Control
0000
Register
Serial Channel 1 Transmit Buffer Register
GPT1 Timer 3 Register0000
GPT1 Timer 3 Control Register0000
GPT1 Timer 3 Interrupt Control Register0000
GPT1 Timer 4 Register0000
GPT1 Timer 4 Control Register0000
GPT1 Timer 4 Interrupt Control Register0000
GPT2 Timer 5 Register0000
GPT2 Timer 5 Control Register0000
GPT2 Timer 5 Interrupt Control Register0000
GPT2 Timer 6 Register0000
GPT2 Timer 6 Control Register0000
GPT2 Timer 6 Interrupt Control Register0000
Trap Flag Register0000
H
H
H
H
H
H
H
H
H
H
H
H
H
WDTFEAE
WDTCONFFAE
ZEROSb FF1C
*) The system configuration is selected during reset.
57
H
H
H
D7
8E
H
H
H
Watchdog Timer Register (read only)0000
Watchdog Timer Control Register0000
Constant Value 0’s Register (read only)0000
H
H
H
Semiconductor Group28
Page 30
SAB 80C166/83C166
Absolute Maximum Ratings
Ambient temperature under bias (TA):
SAB 83C166-5M, SAB 80C166-M..................................................................................0 to + 70 ˚C
SAB 83C166-5M-T3, SAB 80C166-M-T3..................................................................– 40 to + 85 ˚C
Storage temperature (TST) ....................................................................................... – 65 to + 150 ˚C
Voltage on VCC pins with respect to ground (VSS) ..................................................... – 0.5 to + 6.5 V
Voltage on any pin with respect to ground (VSS).................................................– 0.5 to VCC + 0.5 V
Input current on any pin during overload condition.................................................. – 10 to + 10 mA
Absolute sum of all input currents during overload condition ..............................................|100 mA|
Power dissipation........................................................................................................................ 1 W
Note: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device at
these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability. During overload conditions (VIN > VCC or VIN < VSS) the
voltage on pins with respect to ground (VSS) must not exceed the values defined by the
Absolute Maximum Ratings.
Parameter Interpretation
The parameters listed in the following partly represent the characteristics of the SAB 80C166 and
partly its demands on the system. To aid in interpreting the parameters right, when evaluating them
for a design, they are marked in column “Symbol”:
CC (Controller Characteristics):
The logic of the SAB 80C166 will provide signals with the respective timing characteristics.
SR (System Requirement):
The external system must provide signals with the respective timing characteristics to the SAB
80C166.
Semiconductor Group29
Page 31
SAB 80C166/83C166
DC Characteristics
V
= 5 V ± 10 %;VSS = 0 V
CC
T
= 0 to +70 ˚Cfor SAB 83C166-5M, SAB 80C166-M
A
T
= -40 to +85 ˚Cfor SAB 83C166-5M-T3, SAB 80C166-M-T3
A
ParameterSymbolLimit ValuesUnitTest Condition
min.max.
Input low voltage
Input high voltage
(all except RSTIN
and XTAL1)
Input high voltage RSTIN
Input high voltage XTAL1
Output low voltage
(Port 0, Port 1, Port 4, ALE, RD
,
WR, BHE, CLKOUT, RSTOUT)
Output low voltage
(all other outputs)
Output high voltage
(Port 0, Port 1, Port 4, ALE, RD
,
WR, BHE, CLKOUT, RSTOUT)
Output high voltage
(all other outputs)
Input leakage current (Port 5)
1)
Input leakage current (all other)I
RSTIN pullup resistorR
Read inactive current
Read active current
ALE inactive current
ALE active current
4)
4)
4)
4)
XTAL1 input currentI
Pin capacitance
5)
(digital inputs/outputs)
Power supply current
Idle mode supply currentI
Power-down mode supply currentI
V
SR – 0.50.2 V
IL
CC
V–
– 0.1
V
SR 0.2 V
IH
CC
V
+ 0.5V–
CC
+ 0.9
V
SR 0.6 V
IH1
V
SR 0.7 V
IH2
V
CC –0.45VIOL = 2.4 mA
OL
V
CC –0.45VI
OL1
V
CC 0.9 V
OH
CC
CC
CC
2.4
V
CC 0.9 V
OH1
CC
2.4
I
CC –±200nA0 V < VIN < V
OZ1
CC –±500nA0 V < VIN < V
OZ2
CC 50150kΩ–
RST
2)
I
RH
I
RL
I
ALEL
I
ALEH
IL
C
3)
IO
–-40µAV
-500–µAV
2)
–150µAV
3)
2100–µAV
CC –±20µA0 V < VIN < V
CC –10pFf = 1 MHz
V
+ 0.5V–
CC
V
+ 0.5V–
CC
–VI
I
–V
V
I
I
T
I
CC
ID
PD
–50 +
5 * f
–30 +
1.5 * f
CPU
CPU
mAReset active
f
mAf
–50µAV
= 1.6 mA
OL1
= – 500 µA
OH
= – 2.4 mA
OH
= – 250 µA
OH
= – 1.6 mA
OH
= V
OUT
= V
OUT
= V
OUT
= V
OUT
= 25 ˚C
A
in [MHz]
CPU
in [MHz]
CPU
= 5.5 V
CC
CC
CC
OHmin
OLmax
OLmax
OHmin
CC
6)
6)
7)
Semiconductor Group30
Page 32
SAB 80C166/83C166
Notes
1)
This specification does not apply to the analog input (Port 5.x) which is currently converted.
2)
The maximum current may be drawn while the respective signal line remains inactive.
3)
The minimum current must be drawn in order to drive the respective signal line active.
4)
This specification is only valid during Reset, or during Hold-mode.
5)
Not 100% tested, guaranteed by design characterization.
6)
The supply current is a function of the operating frequency. This dependency is illustrated in the figure below.
These parameters are tested at V
7)
All inputs (including pins configured as inputs) at 0 V to 0.1 V or at VCC – 0.1 V to VCC, V
(including pins configured as outputs) disconnected.
A voltage of V
≥ 2.5 V is sufficient to retain the content of the internal RAM during power down mode.
CC
and 20 MHz CPU clock with all outputs open.
CCmax
= 0 V, all outputs
REF
Figure 8
Supply/Idle Current as a Function of Operating Frequency
Semiconductor Group31
Page 33
SAB 80C166/83C166
A/D Converter Characteristics
V
= 5 V ± 10 %;VSS = 0 V
CC
T
= 0 to +70 ˚Cfor SAB 83C166-5M, SAB 80C166-M
A
T
= -40 to +85 ˚Cfor SAB 83C166-5M-T3, SAB 80C166-M-T3
A
4.0 V ≤V
ParameterSymbolLimit ValuesUnitTest Condition
Analog input voltage range
Sample timet
Conversion timet
Total unadjusted errorTUE CC –± 2LSB
Internal resistance of reference
voltage source
Internal resistance of analog
source
ADC input capacitanceC
≤VCC+0.1 V; VSS-0.1 V ≤V
AREF
≤VSS+0.2 V
AGND
min.max.
V
SR V
AIN
CC –2 t
S
CC –10 tCC +
C
R
SR –tCC / 250
AREF
AGND
V
t
AREF
S
- 0.25
R
SR –tS / 500
ASRC
- 0.25
CC –50pF
AIN
SC
+ 4TCL
V
kΩ
kΩ
1)
2) 4)
3) 4)
5)
t
in [ns]
CC
t
in [ns]
S
7)
6) 7)
2) 7)
Notes
1)
V
may exceed V
AIN
cases will be X000
2)
During the sample time the input capacitance CI can be charged/discharged by the external source. The
or V
AGND
or X3FFH, respectively.
H
up to the absolute maximum ratings. However, the conversion result in these
AREF
internal resistance of the analog source must allow the capacitors to reach their final voltage level within t
After the end of the sample time t
The value for the sample clock is t
3)
This parameter includes the sample time tS, the time for determining the digital result and the time to load the
, changes of the analog input voltage have no effect on the conversion result.
S
= TCL * 32.
SC
result register with the conversion result.
The value for the conversion clock is t
4)
This parameter depends on the ADC control logic. It is not a real maximum value, but rather a fixum.
5)
TUE is tested at V
AREF
= 5.0V, V
AGND
= TCL * 32.
CC
= 0 V, V
= 4.8 V. It is guaranteed by design characterization for all
CC
other voltages within the defined voltage range.
6)
During the conversion the ADC’s capacitance must be repeatedly charged or discharged. The internal
resistance of the reference voltage source must allow the capacitors to reach their respective voltage level
within t
7)
Not 100% tested, guaranteed by design characterization.
. The maximum internal resistance results from the CPU clock period.
CC
.
S
Semiconductor Group32
Page 34
SAB 80C166/83C166
Testing Waveforms
AC inputs during testing are driven at 2.4 V for a logic ‘1’ and 0.4 V for a logic ‘0’.
Timing measurements are made at V
min for a logic ‘1’ and VIL max for a logic ‘0’.
IH
Figure 9
Input Output Waveforms
For timing purposes a port pin is no longer floating when a 100 mV change from load
voltage occurs, but begins to float when a 100 mV change from the loaded VOH/VOL level occurs
(IOH/IOL = 20 mA).
Figure 10
Float Waveforms
Semiconductor Group33
Page 35
AC Characteristics
External Clock Drive XTAL1
V
= 5 V ± 10 %;VSS = 0 V
CC
T
= 0 to +70 ˚Cfor SAB 83C166-5M, SAB 80C166-M
A
T
= -40 to +85 ˚Cfor SAB 83C166-5M-T3, SAB 80C166-M-T3
A
SAB 80C166/83C166
ParameterSymbolMax. CPU Clock
= 20 MHz
Variable CPU Clock
1/2TCL = 1 to 20 MHz
Unit
min.max.min.max.
Oscillator periodTCL SR 252525500ns
t
High time
Low time
Rise time
Fall time
SR6–6–ns
1
t
SR6–6–ns
2
t
SR–5–5ns
3
t
SR–5–5ns
4
Figure 11
External Clock Drive XTAL1
Memory Cycle Variables
The timing tables below use three variables which are derived from registers SYSCON and
BUSCON1 and represent the special characteristics of the programmed memory cycle. The
following table describes, how these variables are to be computed.
DescriptionSymbol Values
ALE Extensiont
Memory Cycle Time Waitstates
Memory Tristate Time
Figure 12-1
External Memory Cycle: Multiplexed Bus, With Read/Write Delay, Normal ALE
Semiconductor Group37
Page 39
SAB 80C166/83C166
ALE
A17-A16
(A15-A8)
BHE
Read Cycle
BUS
RD
t
5
t
16
t
17
t
25
t
27
Address
t
6
t
7
t
19
t
18
Data InAddress
t
t
8
10
t
14
t
12
Write Cycle
BUS
Data OutAddress
t
t
8
10
t
22
t
23
WR
t
12
Figure 12-2
External Memory Cycle: Multiplexed Bus, With Read/Write Delay, Extended ALE
Semiconductor Group38
Page 40
SAB 80C166/83C166
ALE
A17-A16
(A15-A8)
BHE
Read Cycle
BUS
RD
t
5
t
t
16
17
Address
t
6
t
7
AddressData In
t
9
t
11
t
15
t
13
t
25
t
27
t
19
t
18
Write Cycle
BUS
Data OutAddress
t
9
t
11
t
22
t
23
WR
t
13
Figure 12-3
External Memory Cycle: Multiplexed Bus, No Read/Write Delay, Normal ALE
Semiconductor Group39
Page 41
SAB 80C166/83C166
ALE
A17-A16
(A15-A8)
BHE
Read Cycle
BUS
RD
t
5
t
16
t
17
t
25
t
27
Address
t
6
t
7
t
19
t
18
Data InAddress
t
9
t
11
t
15
t
13
Write Cycle
BUS
Data OutAddress
t
9
t
11
t
22
t
23
WR
t
13
Figure 12-4
External Memory Cycle: Multiplexed Bus, No Read/Write Delay, Extended ALE
Semiconductor Group40
Page 42
SAB 80C166/83C166
AC Characteristics (cont’d)
Demultiplexed Bus
V
= 5 V ± 10 %;VSS = 0 V
CC
T
= 0 to +70 ˚Cfor SAB 83C166-5M, SAB 80C166-M
A
T
= -40 to +85 ˚Cfor SAB 83C166-5M-T3, SAB 80C166-M-T3
A
C
(for Port 0, Port 1, Port 4, ALE, RD, WR, BHE, CLKOUT) = 100 pF
L
ALE cycle time = 4 TCL + 2tA + tC + tF (100 ns at 20-MHz CPU clock without waitstates)
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
ALE high timet
Address setup to ALE
ALE falling edge to RD
,
5
t
6
t
8
CC 15 + t
CC 10 + t
CC 15 + t
A
A
A
–TCL - 10 + tA–ns
–TCL - 15 + tA–ns
–TCL - 10
WR (with RW-delay)
ALE falling edge to RD
CC -10 + t
9
–-10
A
,
t
WR (no RW-delay)
, WR low time
RD
t
12
CC 40 + t
C
–2TCL - 10
(with RW-delay)
, WR low time
RD
t
13
CC 65 + t
C
–3TCL - 10
(no RW-delay)
to valid data in
RD
t
SR –30 + t
14
C
(with RW-delay)
to valid data in
RD
t
SR –55 + t
15
C
(no RW-delay)
t
ALE low to valid data in
SR –55
16
+ tA + t
t
Address to valid data in
Data hold after RD
SR –75
17
2t
+ t
+
A
t
SR0–0–ns
18
rising edge
Variable CPU Clock
1/2TCL = 1 to 20 MHz
+ t
A
+ t
A
+ t
C
+ t
C
–2TCL - 20
–3TCL - 20
–3TCL - 20
C
–4TCL - 25
C
Unit
–ns
–ns
–ns
–ns
ns
+ t
C
ns
+ t
C
ns
+ tA + t
C
ns
2t
+ t
+
A
C
Data float after RD
rising
t
SR –35 + t
20
edge (with RW-delay)
Data float after RD
rising
t
SR –15 + t
21
edge (no RW-delay)
t
Data valid to WR
Data hold after WR
22
t
24
CC 35 + t
CC 15 + t
C
F
Semiconductor Group41
F
F
–2TCL - 15
–TCL - 10
–2TCL - 15
+ t
C
+ t
F
+ t
F
–ns
ns
ns
–TCL - 10 + tF–ns
Page 43
SAB 80C166/83C166
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
ALE rising edge after RD,
t
26
CC -10 + t
–-10
F
WR
Address hold after RD
,
t
28
CC 0 + t
F
–0
WR
Variable CPU Clock
1/2TCL = 1 to 20 MHz
–ns
+ t
F
–ns
+ t
F
Unit
Semiconductor Group42
Page 44
SAB 80C166/83C166
ALE
A17-A16
A15-A0
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
16
t
17
t
26
t
28
Address
t
6
t
20
t
18
Data In
t
8
t
14
t
12
Write Cycle
t
BUS
(D15-D8)
Data Out
24
D7-D0
t
8
t
22
WR
t
12
Figure 13-1
External Memory Cycle: Demultiplexed Bus, With Read/Write Delay, Normal ALE
Semiconductor Group43
Page 45
SAB 80C166/83C166
ALE
A17-A16
A15-A0
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
16
t
17
t
26
t
28
Address
t
6
t
20
t
18
Data In
t
8
t
14
t
12
Write Cycle
BUS
(D15-D8)
Data Out
t
24
D7-D0
t
8
t
22
WR
t
12
Figure 13-2
External Memory Cycle: Demultiplexed Bus, With Read/Write Delay, Extended ALE
Semiconductor Group44
Page 46
SAB 80C166/83C166
ALE
A17-A16
A15-A0
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
16
t
17
t
26
t
28
Address
t
6
t
21
t
18
Data In
t
9
t
15
t
13
Write Cycle
t
BUS
(D15-D8)
Data Out
24
D7-D0
t
9
t
22
WR
t
13
Figure 13-3
External Memory Cycle: Demultiplexed Bus, No Read/Write Delay, Normal ALE
Semiconductor Group45
Page 47
SAB 80C166/83C166
ALE
A17-A16
A15-A0
BHE
Read Cycle
BUS
(D15-D8)
D7-D0
RD
t
5
t
16
t
17
t
26
t
28
Address
t
6
t
21
t
18
Data In
t
9
t
15
t
13
Write Cycle
t
BUS
(D15-D8)
Data Out
24
D7-D0
t
9
t
22
WR
t
13
Figure 13-4
External Memory Cycle: Demultiplexed Bus, No Read/Write Delay, Extended ALE
Semiconductor Group46
Page 48
AC Characteristics (cont’d)
CLKOUT and READY
V
= 5 V ± 10 %;VSS = 0 V
CC
T
= 0 to +70 ˚Cfor SAB 83C166-5M, SAB 80C166-M
A
T
= -40 to +85 ˚Cfor SAB 83C166-5M-T3, SAB 80C166-M-T3
A
C
(for Port 0, Port 1, Port 4, ALE, RD, WR, BHE, CLKOUT) = 100 pF
L
SAB 80C166/83C166
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
CLKOUT cycle timet
CLKOUT high timet
CLKOUT low timet
CLKOUT rise timet
CLKOUT fall timet
CLKOUT rising edge to
CC 50502TCL2TCLns
29
CC 20–TCL – 5–ns
30
CC 15–TCL – 10–ns
31
CC–5–5ns
32
CC–5–5ns
33
t
34
CC 0 + t
A
10 + t
A
ALE falling edge
t
Synchronous READY
SR 10–10–ns
35
setup time to CLKOUT
t
Synchronous READY
SR 10–10–ns
36
hold time after CLKOUT
t
Asynchronous READY
SR 65–2TCL + 15–ns
37
low time
t
Asynchronous READY
setup time
1)
SR 20–20–ns
58
Variable CPU Clock
1/2TCL = 1 to 20 MHz
0 + t
A
10 + t
Unit
A
ns
t
Asynchronous READY
hold time
Async. READY
1)
hold time
after RD, WR high
(Demultiplexed Bus)
Notes
1)
These timings are given for test purposes only, in order to assure recognition at a specific clock edge.
2)
Demultiplexed bus is the worst case. For multiplexed bus 2TCL are to be added to the maximum values. This
adds even more time for deactivating READY
2)
SR0–0–ns
59
t
SR 00
60
+ 2tA + t
2)
.
0TCL - 25
F
+ 2tA + t
2)
F
Semiconductor Group47
ns
Page 49
SAB 80C166/83C166
CLKOUT
ALE
Command
RD, WR
Sync
READY
Async
READY
Running cycle
t
32
t
30
t
34
2)
t
58
t
59
3)
1)
t
33
t
t
31
t
35
3)
t
58
3)
t
37
5)
29
t
36
t
59
READY
waitstate
t
35
MUX/Tristate
t
36
3)
4)
t
60
see 6)
6)
7)
Figure 14
CLKOUT and READY
Notes
1)
Cycle as programmed, including MCTC waitstates (Example shows 0 MCTC WS).
2)
The leading edge of the respective command depends on RW-delay.
3)
READY sampled HIGH at this sampling point generates a READY controlled waitstate,
READY
4)
READY may be deactivated in response to the trailing (rising) edge of the corresponding command (RD or
WR
5)
If the Asynchronous READY signal does not fulfill the indicated setup and hold times with respect to CLKOUT
(e.g. because CLKOUT is not enabled), it must fulfill
if READY
6)
Multiplexed bus modes have a MUX waitstate added after a bus cycle, and an additional MTTC waitstate may
be inserted here.
For a multiplexed bus with MTTC waitstate this delay is 2 CLKOUT cycles, for a demultiplexed bus without
MTTC waitstate this delay is zero.
7)
The next external bus cycle may start here.
sampled LOW at this sampling point terminates the currently running bus cycle.
).
t
in order to be safely synchronized. This is guaranteed,
37
is removed in response to the command (see Note 4)).
Semiconductor Group48
Page 50
AC Characteristics (cont’d)
External Bus Arbitration
V
= 5 V ± 10 %;VSS = 0 V
CC
T
= 0 to +70 ˚Cfor SAB 83C166-5M, SAB 80C166-M
A
T
= -40 to +85 ˚Cfor SAB 83C166-5M-T3, SAB 80C166-M-T3
A
C
(for Port 0, Port 1, Port 4, ALE, RD, WR, BHE, CLKOUT) = 100 pF
L
SAB 80C166/83C166
ParameterSymbolMax. CPU Clock
= 20 MHz
min.max.min.max.
HOLD input setup time
t
SR 20–20–ns
61
to CLKOUT
CLKOUT to HLDA
high
t
CC –50–50ns
62
or BREQ low delay
CLKOUT to HLDA
low
t
CC –50–50ns
63
or BREQ high delay
t
CC
Other signals release
Other signals drive
66
t
67
–25–25ns
CC
-535-535ns
Variable CPU Clock
1/2TCL = 1 to 20 MHz
Unit
Semiconductor Group49
Page 51
CLKOUT
HOLD
HLDA
SAB 80C166/83C166
t
61
t
63
1)
t
62
BREQ
t
66
2)
Other
Signals
1)
Figure 15
External Bus Arbitration, Releasing the Bus
Notes
1)
The SAB 80C166 will complete the currently running bus cycle before granting bus access.
2)
This is the first possibility for BREQ to get active.
Semiconductor Group50
Page 52
SAB 80C166/83C166
CLKOUT
HOLD
HLDA
BREQ
Other
Signals
2)
t
61
t
62
t
62
t
62
1)
t
63
t
67
Figure 16
External Bus Arbitration, (Regaining the Bus)
Notes
1)
This is the last chance for BREQ to trigger the indicated regain-sequence.
Even if BREQ
Please note that HOLD
2)
The next SAB 80C166 driven bus cycle may start here
is activated earlier, the regain-sequence is initiated by HOLD going high.
may also be deactivated without the SAB 80C166 requesting the bus.
Semiconductor Group51
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