Datasheet SAB6456, SAB6456T Datasheet (Philips)

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Page 1

INTEGRATED CIRCUITS

DATA SH EET

SAB6456 SAB6456T

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

Product speciﬁcation File under Integrated Circuits, IC02

June 1986

Page 2

Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

GENERAL DESCRIPTION

The SAB6456/SAB6456T is a prescaler for UHF/VHF tuners. It can be switched to divide-by-64 or divide-by-256 by the mode-control (MC) pin. The circuit has an input frequency range of 70 MHz to 1 GHz, has high input sensitivity and good harmonic suppression.

SAB6456

SAB6456T

Fig.1 Block diagram.

QUICK REFERENCE DATA

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage pin 8 to pin 4 V Supply current pin 8 I Input frequency range pins 2 and 3 f Sensitivity to input voltage

(r.m.s. value) V

Output voltage

(peak-to-peak value) pins 6 and 7 V

Operating ambient

temperature range T

PACKAGE OUTLINES

SAB6456 : 8-lead DIL; plastic (SOT97); SOT97-1; 1996 November 18. SAB6456T: 8-lead mini-pack (SO8; SOT96A); SOT96-1; 1996 November 18.

CC CC i

i(rms)

o(p-p)

amb

4,5 5,0 5,5 V

− 21 − mA 70 − 1000 MHz

−− 10 mV

− 1 − V

0 − 80 °C

June 1986 2

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Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

PINNING

1. n.c. not connected

2. C1

3. C2

4. V

5. MC mode control

6. Q

7. Q

8. V

Fig.2 Pinning diagram.

FUNCTIONAL DESCRIPTION

The circuit comprises an input amplifier, a divider stage with selectable division ratio and an output stage. The input amplifier is driven by a sinusoidal signal from the local oscillator of a television tuner. The inputs (C1, C2) are

differential and are biased internally to permit capacitive coupling. When driven asymmetrically the unused input should be connected to ground via a capacitor.

H L

differential inputs ground (0 V)

complementary outputs positive supply voltage

SAB6456

SAB6456T

The mode-control (MC) input to the divider stage is intended for static control of the division ratio, selection is made as follows:

divide-by-64: MC pin open-circuit divide-by-256: MC pin connected to ground

The divider stage may oscillate during no-signal conditions but this oscillation is suppressed when input signals are received.

Two complementary signals (Q output signals are slowed internally to reduce harmonics in the television intermediate frequency band.

, QL) are provided by the output differential amplifier stage. The voltage-edges of the

June 1986 3

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Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

ELECTROSTATIC DISCHARGE PROTECTION

Inputs and outputs have electrostatic discharge protection according to specification MIL-883C, class B.

RATINGS

Limiting values in accordance with the Absolute Maximum System (IEC-134)

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Supply voltage pin 8 to pin 4 V Input voltage V Storage temperature range T Junction temperature T

stg

THERMAL RESISTANCE

From junction to ambient

8-lead DIL; plastic (SOT-97A) R 8-lead mini-pack (SO-8; SOT-96A)

on printed circuit board R on ceramic substrate R

−−7,0 V

−−VCCV

−55 −+150 ° C

−−+150 ° C

SAB6456T

th j-a

th j-a th j-a

SAB6456

120 K/W

260 K/W 170 K/W

D.C. CHARACTERISTICS

=5V; VEE=0V; T

=25°C; test IC mounted in a test socket or on a printed circuit board; measurements taken

amb

after thermal equilibrium is established

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Output voltage HIGH V Output voltage LOW V Supply current I Mode-control (MC)

Input voltage LOW

(divide-by-256) V Input current LOW −I Input voltage HIGH

(divide-by-64) pin 5 open-circuit V

OH OL

−−VCCV

−−V

− 0.8 V

− 21 28 mA

0 − 0,2 V

− 25 60 µA

1,4 − 3,0 V

June 1986 4

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Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

A.C. CHARACTERISTICS

= 4,5 to 5,5 V; VEE=0V; T

PARAMETER CONDITIONS SYMBOL MIN. TYP. MAX. UNIT

Sensitivity to input 50 Ω system

voltage (r.m.s. value) f

Input overload voltage 50 Ω system

(r.m.s. value) f

Input parallel resistance f

Input capacitance f

Output voltage HIGH V Output voltage LOW V

= 0 to +80 °C

amb

= 70 MHz V

= 150 MHz V

= 300 MHz V

= 500 MHz V

= 900 MHz V

= 1000 MHz V

= 70 MHz to

1000 MHz V

= 70 MHz R

= 1000 MHz R

= 70 MHz C

= 1000 MHz C

i(rms) i(rms) i(rms) i(rms) i(rms) i(rms)

i i i i i OH

SAB6456

SAB6456T

−−10 mV

300 −− mV

− 560 −Ω

− 30 −Ω

− 5 − pF

− 1,5 − pF

−−VCCV

−−V

− 0,8 V

Output voltage swing

(peak-to-peak value) f

= 70 MHz V

= 1000 MHz;

= 820 Ω;

=60pF V

Attenuation of third

harmonic at output f

= 800 MHz;

= 820 Ω;

=60pF −15 −23 − dB

Output unbalance see Fig.3 ∆V Output resistance R

o(p-p)

0,8 1,0 1,2 V

0,17 −− V

−−0,1 V

− 500 −Ω

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Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

Fig.3 Test circuit for output unbalance measurement.

SAB6456

SAB6456T

Fig.4 Typical input sensitivity curve: VCC=5V;

=25°C.

amb

Fig.5 Smith chart of typical input impedance: V

June 1986 6

= 25 mV; VCC= 5 V; reference value = 50 Ω.

i(rms)

Page 7

Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

PACKAGE OUTLINES

DIP8: plastic dual in-line package; 8 leads (300 mil)

seating plane

w M

SAB6456

SAB6456T

SOT97-1

(e )

pin 1 index

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

max.

inches

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

OUTLINE VERSION

SOT97-1

min.

max.

050G01 MO-001AN

1.73

1.14

0.068

0.045

IEC JEDEC EIAJ

0.021

0.015

0.53

0.38

0 5 10 mm

scale

0.36

1.07

0.23

0.89

0.014

0.042

0.009

0.035

REFERENCES

(1) (1)

cD E e M

9.8

9.2

0.39

0.36

6.48

6.20

0.26

0.24

3.60

8.25

3.05

7.80

0.14

0.32

0.12

0.31

EUROPEAN

PROJECTION

10.0

0.39

0.33

8.3

max.

0.2542.54 7.62

ISSUE DATE

0.010.10 0.30

92-11-17 95-02-04

1.154.2 0.51 3.2

0.0450.17 0.020 0.13

(1)

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Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

SO8: plastic small outline package; 8 leads; body width 3.9 mm

SAB6456

SAB6456T

SOT96-1

v M

pin 1 index

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

UNIT

inches

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

max.

1.75

0.069

A1A2A

0.25

1.45

0.10

1.25

0.010

0.057

0.004

0.049

0.25

0.01

0.49

0.25

0.36

0.19

0.019

0.0100

0.014

0.0075

w M

0 2.5 5 mm

scale

(1)E(2)

5.0

4.8

0.20

0.19

0.16

0.15

eHELLpQZywv θ

4.0

1.27

3.8

0.050

6.2

5.8

0.244

0.228

0.25 0.10.25

0.010.010.041 0.004

(1)

0.7

0.3

0.028

0.012

0.7

0.6

0.028

0.024

(A )

detail X

1.0

1.05

0.4

0.039

0.016

OUTLINE VERSION

SOT96-1

IEC JEDEC EIAJ

076E03S MS-012AA

REFERENCES

June 1986 8

EUROPEAN

PROJECTION

ISSUE DATE

95-02-04 97-05-22

Page 9

Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

SOLDERING Introduction

There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used.

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our

“IC Package Databook”

DIP

SOLDERING BY DIPPING OR BY WA VE The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (T printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit.

EPAIRING SOLDERED JOINTS

Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.

REFLOW SOLDERING Reflow soldering techniques are suitable for all SO

packages.

(order code 9398 652 90011).

). If the

stg max

SAB6456

SAB6456T

Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 °C.

Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 °C.

AVE SOLDERING

W Wave soldering techniques can be used for all SO

packages if the following conditions are observed:

• A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used.

• The longitudinal axis of the package footprint must be parallel to the solder flow.

• The package footprint must incorporate solder thieves at the downstream end.

During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured.

Maximum permissible solder temperature is 260 °C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 °C within 6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

EPAIRING SOLDERED JOINTS

Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 °C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 °C.

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.

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Philips Semiconductors Product speciﬁcation

Sensitive 1 GHz divide-by-64/divide-by-256 switchable prescaler

DEFINITIONS

Data sheet status

Objective speciﬁcation This data sheet contains target or goal speciﬁcations for product development. Preliminary speciﬁcation This data sheet contains preliminary data; supplementary data may be published later. Product speciﬁcation This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.

SAB6456

SAB6456T

June 1986 10