16.1Introduction to soldering surface mount
packages
16.2Reflow soldering
16.3Wave soldering
16.4Manual soldering
16.5Suitability of surface mount IC packages for
wave and reflow soldering methods
17DEFINITIONS
18LIFE SUPPORT APPLICATIONS
19PURCHASE OF PHILIPS I2C COMPONENTS
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Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
1FEATURES
• VGA (progressive mode), CIF and medium resolution
(PAL non-interlaced mode) CCD sensors compliant
• D1 digital video input (8 bits YUV 4:2:2time
multiplexed)
• Internal Pulse Pattern Generator (PPG) dedicated for
VGA Panasonic, CIF and medium resolution Sharp
sensors or compatibles, and frame rate selection
• Frame rate converter
• SDRAM interface for high quality VGA snapshot
(uncompressed 4:2:2 or 4:2:0)
• Downsampler and scaler (programmable formatter for
CIF, QCIF, sub-QCIF, SIF and QSIF) controlled via
SNERT (UART) interface
• Flexible compression engine controlled via SNERT
(UART) interface
• Selectable outputframe rate (up to 15 fps in VGA, up to
30 fps in CIF and QCIF)
• Video packetizer FIFO
• I2C-bus interface for communication between the USB
protocol hardware and the external microcontroller
• Microphone/audio input to USB (microphone supply,
controllable gain and ADC)
• Integrated analog bus driver (ATX)
• Integrated main oscillator
• Integrated 5 V power supply and reset circuit including
functionalities for bus-powered USB device
• Programmable (frequency and duty cycle) switch mode
power signal for CCD supply
• Miscellaneous functions (e.g. power management, PLL
for audio frequencies).
2APPLICATIONS
Low-cost desktop video applications with USB interface.
3GENERAL DESCRIPTION
The SAA8115HL is the second generation of integrated
circuitapplicablein PC video cameras to convert D1 video
signals and analog audio signals to properly formatted
USB packets.
Thispowerful successor of the SAA8117HL can handle up
to 15 fps in VGA format or 30 fps in CIF format. High
snapshot quality is achievable using the SDRAM interface
to an external memory.
It is designed as a back-end of the SAA8112HL (general
cameradigital processing IC) and is optimized for use with
the TDA8784 to TDA8787 (camera pre-processing ICs).
digital supply voltage3.03.33.6V
analog supply voltage3.03.33.6V
analog supply voltage from USBnote 14.05.05.5V
total supply currentV
input signal levels3.0V<V
output signal levels3.0V<V
C31Ohorizontal CCD transfer pulse output
C22Ohorizontal CCD transfer pulse output (FH1)
C13Ohorizontal CCD transfer pulse output (FH2)
C44Ohorizontal CCD transfer pulse output
SHUTTER5Oshutter control output for CCD charge reset
GND16Pground 1 for output buffers
V
DD1
7Psupply voltage 1 for output buffers
RG8Oreset output for CCD output amplifier gate
FS9Odata sample-and-hold pulse output to TDA8784/87 (SHD)
FCDS10Opreset sample-and-hold pulse output to TDA8784/87 (SHP)
CLK111Opixel clock to TDA8784/87 and SAA8112HL
DCP12Odummy clamp pulse output to TDA8784/87
BCP13Ooptical black clamp pulse output to TDA8784/87
VD14Overtical definition pulse to SAA8112HL
HD15Ohorizontal definition pulse to SAA8112HL
V
DD2
16Psupply voltage 2 for output buffers
CLK217Odouble pixel clock to SAA8112HL
GND218Pground 2 for output buffers
YUV019Imultiplexed YUV bit0
YUV120Imultiplexed YUV bit1
YUV221Imultiplexed YUV bit2
YUV322Imultiplexed YUV bit3
DGND123Pdigital ground 1 for input buffers, predrivers and for the digital core
V
DDD1
24Pdigital supply voltage 1 for input buffers, predrivers and one part of the digital
core
YUV425Imultiplexed YUV bit4
YUV526Imultiplexed YUV bit5
YUV627Imultiplexed YUV bit6
YUV728Imultiplexed YUV bit7
DGND229Pdigital ground 2 for input buffers, predrivers and for the digital core
LLC30Iline-locked clock input (delayed CLK2) for YUV-port from SAA8112HL
HREF31Ihorizontal reference input for YUV-port from SAA8112HL
VS32Ivertical synchronization input for YUV-port from SAA8112HL
RESET33IPower-on reset input (for video processing and PPG)
SNDA34I/Odata input/output for SNERT-interface (communication between SAA8115HL
and SAA8112HL)
SNCL35Iclock input for SNERT-interface (communication between SAA8115HL and
SAA8112HL)
SNRES36Ireset input for SNERT-interface (communication between SAA8115HL and
SAA8112HL)
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Digital camera USB interfaceSAA8115HL
SYMBOLPINTYPE
V
DD3
37Psupply voltage 3 for output buffers
(1)
DESCRIPTION
AD438OSDRAM output address bit 4
AD539OSDRAM output address bit 5
AD340OSDRAM output address bit 3
AD241OSDRAM output address bit 2
AD642OSDRAM output address bit 6
AD143OSDRAM output address bit 1
AD744OSDRAM output address bit 7
AD845OSDRAM output address bit 8
AD046OSDRAM output address bit 0
AD947OSDRAM output address bit 9
AD1048OSDRAM output address bit 10
GND349Pground 3 for output buffers
V
DD4
50Psupply voltage 4 for output buffers
CSB51OSDRAM chip select output
RASB52OSDRAM row address strobe output
V
DDD2
53Pdigital supply voltage 2 for the switchable digital core
DGND354Pdigital ground 3 for input buffers, predrivers and for the digital core
CLKEN55OSDRAM clock enable output
CASB56OSDRAM column address strobe output
WEB57OSDRAM write enable output
SDCLK58OSDRAM clock output
DQM59I/OSDRAM data mask enable
DQ860I/OSDRAM data I/O bit 8
DQ761I/OSDRAM data I/O bit 7
DQ962I/OSDRAM data I/O bit 9
DQ663I/OSDRAM data I/O bit 6
DQ564I/OSDRAM data I/O bit 5
DQ1065I/OSDRAM data I/O bit 10
DQ466I/OSDRAM data I/O bit 4
DQ1167I/OSDRAM data I/O bit 11
GND468Pground 4 for output buffers
V
DD5
69Psupply voltage 5 for output buffers
DQ370I/OSDRAM data I/O bit 3
DQ271I/OSDRAM data I/O bit 2
DQ172I/OSDRAM data I/O bit 1
DQ073I/OSDRAM data I/O bit 0
DQ1274I/OSDRAM data I/O bit 12
DQ1375I/OSDRAM data I/O bit 13
DQ1476I/OSDRAM data I/O bit 14
DQ1577I/OSDRAM data I/O bit 15
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Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
SYMBOLPINTYPE
(1)
DESCRIPTION
GND578Pground 5 for output buffers
AGND179Panalog ground 1 for ATX (transceiver)
ATXDP80I/Opositive driver of the differential data pair input/output (ATX)
ATXDM81I/Onegative driver of the differential data pair input/output (ATX)
V
DDA1
82Panalog supply voltage 1 for ATX
RESERVED183−test pin 1 (should not be used)
V
V
DDA2
DDA3
84Panalog supply voltage 2 for bandgap (reference)
85Panalog supply voltage 3 for bandgap, comparator and ring oscillator
RESERVED286−test pin 2 (should not be used)
3V387I3V3 detector input signal
AGND288Panalog ground 2 for N-switch
RESERVED389−test pin 3 (should not be used)
VBUS190Isupply voltage input 1 from the USB
VBUS291Isupply voltage input 2 from the USB
LXDOWN92OLX coil node output (5 V downconverter)
AGND393Panalog ground 3 for N-switch
LXUP94ILX coil node input (5 V upconverter)
SWITCHED5V95O5 V switched power supply
RESERVED496−test pin 4 (should not be used)
RESERVED597−test pin 5 (should not be used)
GND698Pground 6 for output buffers
UCINT99Ointerrupt output from USB to microcontroller
SUSPEND100Ocontrol output from USB protocol hardware to microcontroller
DGND4101Pdigital ground 4 for input buffers, predrivers and for the digital core
V
DDD3
102Pdigital supply voltage 3 for input buffers, predrivers and one part of the digital
core
GENPOR103IPower-on reset input (for USB protocol hardware)
UCPOR104Ocontrol output from USB protocol hardware to microcontroller
UCCLK105Oclock output from USB protocol hardware to microcontroller
2
SCL106Islave I
SDA107I/Oslave I
C-bus clock input
2
C-bus data input/output
SMP108Oswitch mode power pulse output for CCD supplies
CLOCKON109Ocontrol output for main oscillator switched on
SNAPSHOT110Iinput for remote wake-up (snapshot)
SUSPREADYNOT111Iinput from microcontroller for SUSPEND mode
TRC112Ithreshold control input for enabling clock
POR113O3.3 V supply domain ready indicator output
OFF114Idisable 5 V switchable supply domain input
M3115Itest mode control input signal bit 3
M2116Itest mode control input signal bit 2
M1117Itest mode control input signal bit 1
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Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
SYMBOLPINTYPE
(1)
DESCRIPTION
M0118Itest mode control input signal bit 0
AGND4119Panalog ground 4 for crystal oscillator (48 MHz, 3rd overtone)
XIN120Ioscillator input
XOUT121Ooscillator output
V
DDA4
122Panalog supply voltage 4 for crystal oscillator (48 MHz, 3rd overtone)
AGND5123Panalog ground 5 for PLL
V
V
DDA5
DDA6
124Panalog supply voltage 5 for PLL
125Panalog supply voltage 6 for amplifier and ADC
REF1126Ireference voltage 1 (used in the ADC)
REF2127Ireference voltage 2 (used in the ADC)
REF3128Ireference voltage 3 (used in the amplifier and the ADC)
RESERVED6129Otest pin 6 (should not be used)
VGAIN130Ivariable gain amplifier input
LNAOUT131Olow noise amplifier output
MICIN132Imicrophone input
MICSUPPLY133Omicrophone supply output
AGND6134Panalog ground 6 for amplifier and ADC
B4135Overtical CCD load pulse output (VH1X)
B3136Overtical CCD load pulse output (VH3X)
B1137Overtical CCD load pulse output
B2138Overtical CCD load pulse output
A1139Overtical CCD transfer pulse output (V1X)
A2140Overtical CCD transfer pulse output (V2X)
V
DD6
141Psupply voltage 6 for output buffers
GND7142Pground 7 for output buffers
A3143Overtical CCD transfer pulse output (V3X)
A4144Overtical CCD transfer pulse output (V4X)
The video synchronization module is capable of locking to
the video signal implementing a horizontal gate signal
HREF (HREF = HIGH when data is valid) and a VS signal
indicating the start of a new video frame.
8.2Frame rate converter and SDRAM interface
An optional SDRAM (external) can be accessed using the
SDRAM interface which is integrated in the SAA8115HL.
Pinning and functionality is based on the NEC
µPD4516161 (16 Mbits) and the NEC µPD4564163
(64 Mbits).
When used, the memory is placed at the video input of the
SAA8115HL before prefilter, scaler and compression
engine. At this point only YUV 4 : 2 : 2 formatted data is
available.
The use of the SDRAM is twofold:
• Lowering the frame rate. The memory enables to store
one frame of video accumulated at a specific rate and to
read it out at a lower frame rate. For interline VGA
sensors, the input frame rate is either 30 fps or 15 fps.
It can be lowered with a factor of 2, 3, 6, 16 or 32.
For CIF or medium resolution PAL, the input frame rate
is only 30 fps
• Enhanced snapshot mode. Storage of full size VGA
pictures in 4:2:2 format which can be retrieved upon
dedicated software command.
8.3Video formatter: downsampler and cutter
Horizontally a downsampling from 512 or 640 to either
384, 320, 192 or 160 or from 352 to 176 is necessary.
The horizontal downsampling is performed with the use of
a Variable Phase Delay filter (VPD-4). This filter can
realize the needed downsample factors. To avoid aliasing,
this module also contains a prefilter which has four modes:
• No filter for medium resolution PAL (512 × 288) to CIF
(352 × 288) or SIF (320 × 240)
• Prefilter A (3 taps) for VGA (640 × 480) to CIF or SIF,
CIF to QCIF (176 × 144) or QSIF (160 × 120)
• Prefilter B (7 taps) for medium resolution PAL to QCIF
or QSIF
• Prefilter A combined with prefilter B-comb (13 taps) for
VGA to QCIF or QSIF.
Prefilter B-comb is similar to prefilter B but inserts extra
taps with amplification 0.
The vertical downsampling in PAL mode is from CIF to
QCIF only. This is done via a vertical filter A (3 taps).
In VGA mode a 4 taps polyphase filter is applied to scale
from 640 × 480 to CIF and QCIF.
From a full size QCIF picture a sub-QCIF (128 × 96) cut
can be made. For the zoomed sub-QCIF format, the origin
(upperleftcorner)isprogrammable via SNERT in 13 steps
(both horizontally and vertically), so that an electronic pan
and tilt is possible.
The incoming 4:2:2data is vertically filtered to 4:2:0,
in order to be sent over USB, by throwing away colour
samples.In the even lines the V-samples are discarded, in
the odd lines the U-samples.
This block is used to achieve the required output format
from the specified sensor formats (see Fig.3). It works for
YUV4 : 2 : 2only. In RAW mode this block is by-passed to
create a full resolution snapshot.
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Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
8.4Compression engine
The compression engine module (see Fig.3) can process
VGA, CIF, SIF, QCIF and QSIF but has optimal
performance with CIF resolution (30 fps) and VGA
resolution (5 fps). The algorithm is Philips proprietary.
The compression ratio is continuously programmable by
setting the maximum number of bits which can be used for
4 compressed lines, a so-called band (see Table 1). It is
possible to reduce the YUV input data by scaling down
(divide by 2 or divide by 4 operations) to 7 or 6 bits per
sample. For compression with an output rate below 2 bpp
(bits per pixel) it leads to performance improvement.
handbook, full pagewidth
YUV7 to YUV0
PREFILTER_A_ON_OFF
PREFILTER
A
PREFILTER
VIDEO_OUTPUT_FORMAT
B
For a number of compression ratios, performance is also
improved thanks to different quantization tables which are
defined and stored in a ROM. The required table must be
selected via software.
Real time decoding can be done in software on any
Pentium platform.
UV_EXCHANGE
PAL_VGA
to
transfer
DOWN
SCALER
COMPRESSION
ENGINE
buffer
PREFILTER_B_ON_OFF
PREFILTER B_COMB_ON_OFF
COMPRESSION_MODE
VP_C_ BITCOST_(MSB/LSB)
FCE430
Fig.3 The video formatter and compression engine.
Table 1Data rate performed by compression engine
FORMATADVISED DATA RATEMAXIMUM DATA RATE
CIF/SIF2 bpp12 bpp (uncompressed)
QCIF/QSIF6 bppuncompressed
VGA high quality3 bpp4 bpp
VGA1.5 bpp3 bpp
RAW VGA high quality4 bpp4 bpp
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Digital camera USB interfaceSAA8115HL
8.5Transfer buffer
The transfer buffer module (see Fig.4) takes care of a
smooth transfer of the data to the FIFO of the USB.
Moreover the transfer buffer can insert inband
synchronization words in the video data stream. This
function can be switched on and off with
INBAND_CONTROL in register VP_TR_CONTROL
(0x36). The synchronization words can only be used with
non-compressed data stream and are formatted like
0x00 0xFF 0x<framecounter>7<linecounter>9.
(Subscript denotes the number of bits and the frame
counter is circular incrementing).
The non-compressed data is formatted like:
4:2:0:<optional sync word><Y0><Y1><Y2><Y3>
<C0><C2><Y4><Y5><Y6><Y7><C4><C6>....,
4:2:2: <optional sync word><Y0><Y1><Y2><Y3>
<U0><V0><U2><V2><Y4>....,
whereC denotes U-data in the even lines (0, 2, 4 etc.) and
V-data in the odd lines (1, 3, 5 etc.).
8.6USB video FIFO
The USB video FIFO is programmed via the I2C-bus
(see Fig.5). The FIFO is designed to achieve three
differentpacketscontainingvideoonthe isochronous USB
channel.Videodataiscontained in a chain ofequallysized
USB packets, except for the last packet of a video frame
which is always smaller. The video frames can be
separated from each other by one or more 0-length
packets. For low frame rates (below 10 frames per
second) there are always 0-length packets in the stream.
The host can synchronize on the smaller packets for the
high frame rates and on the 0-length packets for the low
frame rates.
For every mode the FIFO must be adjusted. There are
three parameters to program the video FIFO:
• PACKET_SIZE (0x06): this value indicates the length of
all packets with video data except for the last packet of
a video frame
• FIFO_OFFSET (0x04): this value indicates the number
of data in the FIFO before a new packet will be
transmitted over USB
• READ_SPACING (0x07): this value indicates the
number of 12 MHz clock cycles between read actions
from the FIFO.
Moreover the FIFO is enabled and disabled with
FIFO_ACTIVE (0x05).
The write process to the FIFO is controlled by the transfer
buffer and not programmable.
The read process is executed in the PSIE-MMU and is
driven by the USB frame interval (1 ms). Every frame
interval the PSIE-MMU tries to read PACKET_SIZE bytes
from the FIFO. This read process will not be started when
a new video frame is stored in the FIFO and there are less
thanFIFO_OFFSETbyteswritten.Theread process stops
if the next bytes are of another video frame, or if the
read-pointer would overtake the write-pointer.
READ_SPACING determines the read rate. Its value can
easily be determined with the formula:
The Programmable Serial Interface Engine (PSIE) and
Memory Management Unit (MMU) is the heart of the USB
protocol hardware (see Fig.5). It formats the actual
packets that are transferred to the USB and passes the
incoming packets to the right end-point buffers. These
buffers are allocated as part of the USB RAM space.
ThemicrocontrollercommunicatesviatheI2C-buswiththe
PSIE-MMU. The I2C-bus protocol distinguishes three
register spaces. These spaces are addressed via different
commands. The command is sent to the command
address.
handbook, full pagewidth
PI_Address + 0X
to/from
microcontroller
I2C-BUS
INTERFACE
Depending on the command it is sent to the PSIE-MMU
and/or to the command interpreter which configures the
(de-)mux to open the path to the right register space.
Subsequent write/reads to/from the data address store or
retrieve data from the register space selected by the
command.
8.8ATX interface
The SAA8115HL contains an analog bus driver, called the
ATX. It incorporates a differential and two single-ended
receivers and a differential transmitter.
The interface to the bus consists of a differential data pair
(ATXDM and ATXDP).
PSIE-MMU
REGISTER
SPACE
(DE)MUX
SET MODE
REGISTER
SPACE
PI_Address + 10
Fig.5 I2C-bus interface and register map.
8.9Audio
The SAA8115HL contains a microphone supply and an
amplifier circuit composed of two stages: a Low Noise
Amplifier (LNA)andavariablegainamplifier.TheLNAhas
a fixed gain of 26 dB while the variable gain amplifier can
be programmed between 0 and 30 dB by steps of 2 dB.
The gain control can be done via either the SNERT
interface or the I2C-bus interface (see Table 57).
The serial interface must be first selected using bit SIS
(see Table 57). The frequency transfer characteristic of
theaudiopathmustbecontrolledviaexternalhigh-passor
low-pass filters.
COMMAND
INTERPRETER
to
PSIE-MMU
NON USB
AND
VIDEO FIFO
REGISTERS
FCE432
The PLL converts the 48 MHz to 256fs(fs= audio sample
frequency). There are three modes for the PLL to achieve
the sample frequencies of 48, 44.1 or 32 kHz
(see Table 2).
The bitstream ADC samples the audio signal. It runs at an
oversample rate of 256 times the base sample rate. In the
application, the bitstream can be converted to parallel
16-bit samples. This conversion is programmable with
respect to the effective sample frequency (dropping
sample results in a lower effective sample frequency) and
sample resolution. As a result the effective sample rate
can be determined.
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Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 2ADC clock frequencies and sample frequencies
CLOCK
(MHz)
8.19201324.096
11.2996144.15.6448
12.28801486.144
Note
1. Not supported.
Table 3Typical SAA8115HL compatible sensors
DIVIDING
NUMBER
2162.048
481.042
8note 1note 1
222.052.8224
411.0251.4112
85.51250.7056
2243.072
4121.536
860.768
SAMPLE
FREQUENCY
(kHz)
ADCCLOCK
(MHz)
8.10Sensor pulse pattern generator
The SAA8115HL incorporates a Pulse Pattern Generator
(PPG) function. The PPG can be used for medium
resolution PAL, CIF and VGA CCD-sensors (see Table 3).
Depending on the sensor type, an external inverter driver
should be required to convert the 3.3 V pulses into a
voltage suitable for the used CCD-sensor.
The active video size is 512 × 288 for medium resolution
PAL, 352 × 288 for CIF and 640 × 480 for VGA. The total
H × V size are 685 × 292 for medium resolution PAL/CIF
and 823 × 486 for VGA. It should be noted that additional
HD pulses are added during the vertical blanking interval
to reach a total of 312 lines in PAL and CIF modes and
525 lines in VGA mode as required by the SAA8112HL.
A high level of flexibility is available for the PPG thanks to
19 internal registers (see Section 9.1.3).
SENSOR TYPEBRANDPART NUMBER
VGASonyICX098AK
PanasonicMN3777PP and MN37771PT
SharpLZ24BP
Medium resolution PALSonyICX054, ICX086 and ICX206
PanasonicMN37210FP
SharpLZ2423B and LZ2423H
ToshibaTCD5391AP
CIFSharpLZ244D and LZ2547
Other sensorsall the sensors fully compatible with the above mentioned sensors
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Digital camera USB interfaceSAA8115HL
8.11Power management
USB requires the device to switch power states.
The SAA8115HL contains a power management module
since the complete camera may not consume more than
500 µA during the power state called SUSPEND. This
requires that even the crystal oscillator must be switched
off. The SAA8115HL is not functional except for some
logic that enables the IC to wake-up the camera. After
wake-up of the SAA8115HL first the clock to the
microcontroller is generated and thereafter an interrupt is
generated to wake-up the microcontroller. Therefore the
clock of the microcontroller is generated by the
SAA8115HL.
Thepowermanagementmodulealsosetsaflaginregister
SET_MODE_AND_READ(PSIE_MMU_STATUS).After a
reset the microcontroller should check this register via the
I2C-bus and find the cause of the wake-up. Different
causes may require different start-up routines.
The internal video processing core uses another supply
domain which can be switched off during SUSPEND
mode.
The PPG is switched off by setting
PPG_RESUME_MODE (0x08) and resetting PAL_VGA
(0x09).
The SAA8115HL has the feature to autonomously
wake-up from SUSPEND mode, but requires
microcontroller interference before going in SUSPEND
mode (via the signal on pin SUSPREADYNOT).
SincethemainoscillatoroftheSAA8115HLisswitchedoff
during SUSPEND mode, precautions are needed to avoid
undefined states when the clock is switched on. This is
ensuredviathepins CLOCKON and TRC. Pin CLOCKON
goes HIGH as soon as the main oscillator is switched on.
The oscillator will need some time to make a stable
48 MHz signal. However, the clock is only passed through
to other parts of the SAA8115HL when the level on
pin TRC reaches a certain threshold. The time needed to
reach the threshold can be trimmed with an external
RC circuit.
8.12Power supply
A power supply regulator is integrated in the device. This
DC-to-DC converter transforms the USB supply voltage
(range from 4.0 to 5.5 V) into a stable 5 V supply voltage.
This power domain is switchable. The power circuit also
generates a reset signal when the external 3.3 V supply
voltage is stable and in range.
In non CIF modes the power consumption is reduced by
resetting COMPRESSION_MODE (0x2F) and
COMPRESSION_CLOCK (0x09).
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Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
9CONTROL REGISTER DESCRIPTION
This specification gives an overview of all registers.
9.1SNERT (UART)
The SAA8115HL is partly controlled via SNERT. The frame rate converter, the SDRAM interface, the video formatter,
the compression engine, the PPG, the SMP and the audio functions are controlled via SNERT. This SNERT interface
works independently from the frame rate and can always be operated in the full frequency range.
Via SNERT the following registers are accessible (see Table 4).
Table 4SNERT write registers SAA8115HL
ADDRESSFUNCTION
00write register soft reset (see Table 5)
01 to 05write registers Frame Rate Converter (FRC) including the SDRAM interface
06 and 07reserved
08 to 1Awrite registers Pulse Pattern Generator (PPG)
1B to 1Freserved
20 to 38write registers video formatter and compression engine
39 to 3Creserved
3D and 3Ewrite registers Switch Mode Power (SMP)
3Fwrite register audio variable gain amplifier
9.1.1G
Table 5Detailed description of SNERT general register 0x00
76543210PARAMETER
XXXXXreserved
ENERAL REGISTER
BITSNERT REGISTER 00: SOFT_RESET
RESET_VP_C
1compression engine in reset state
0compression engine operating
RESET_VP_VF
1formatter engine in reset state
0formatter engine operating
RESET_FRC
1frame rate converter engine in reset state (by default)
0frame rate converter engine operating
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9.1.2FRAME RATE CONVERTER AND SDRAM INTERFACE REGISTERS
Table 6Detailed description of SNERT FRC and SDRAM register 0x01
BITSNERT REGISTER 01: FRC_CONTROL_0
76543210PARAMETER
Xreserved
XXXnumber of active lines after rising edge of VS signal; range: 0 to 6 (by default 0)
VGA_SENSOR_TYPE (valid if MSB set to logic 0)
11VGA (Sony and Panasonic)
10VGA (Sharp)
0Xreserved
PAL_VGA
1PAL or CIF timing
0VGA timing (by default)
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Digital camera USB interfaceSAA8115HL
Table 13 Detailed description of SNERT PPG register 0x0A
BITSNERT REGISTER 0A: PPG_H_CTRL
76543210PARAMETER
Xreserved
RG_SHORT
1RG pulse width is set to half of nominal value
0RG pulse width is set to nominal value
FH2_CTRL (non FT mode); note 1
1X1no horizontal blanking
1X0no horizontal blanking, pulse inverted
011blanked to HIGH, starts HIGH
010blanked to LOW, starts LOW
001blanked to LOW, starts HIGH
000blanked to HIGH, starts LOW
FH1_CTRL (non FT mode); note 1
1X1no horizontal blanking, pulse inverted
1X0no horizontal blanking
011blanked to HIGH, starts LOW
010blanked to HIGH, starts HIGH
001blanked to HIGH, starts LOW
000blanked to LOW, starts HIGH
Note
1. If bits [5 to 3] equal bits [2 to 0] then FH2 is the inverse of FH1.
2000 Jan 2722
Page 23
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 14 Detailed description of SNERT PPG register 0x0B
BITSNERT REGISTER 0B: PPG_V_INV
76543210PARAMETER
A4_INV
1positive pulses
0negative pulses
A3_INV
1positive pulses
0negative pulses
A2_INV
1negative pulses
0positive pulses
A1_INV
1negative pulses
0positive pulses
B4_INV
1positive pulses
0negative pulses
B3_INV
1positive pulses
0negative pulses
B2_INV
1negative pulses
0positive pulses
B1_INV
1negative pulses
0positive pulses
2000 Jan 2723
Page 24
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 15 Detailed description of SNERT PPG register 0x0C
BITSNERT REGISTER 0C: PPG_H_INV
76543210PARAMETER
CLK2_INV
1inverted pulses
0nominal pulses
CLK1_INV
1inverted pulses
0nominal pulses
FS_INV
1positive pulses
0negative pulses
FCDS_INV
1positive pulses
0negative pulses
FR_INV
1positive pulses
0negative pulses
C3_INV
1negative pulses
0positive pulses
C2_INV
1negative pulses
0positive pulses
C1_INV
1negative pulses
0positive pulses
2000 Jan 2724
Page 25
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 16 Detailed description of SNERT PPG register 0x0D
BITSNERT REGISTER 0D: PPG_MISC_INV
76543210PARAMETER
SELECT_A2
1A2 is HIGH during read-out gate in line 2
0A2 is LOW during read-out gate in line 2
SELECT_A3
1A3 equals A4 (in case of VGA type 1 sensors)
0A3 equals A2
C4_INV
1negative pulses
0positive pulses
CR_INV
1positive pulses
0negative pulses
BCP_INV
1negative pulses
0positive pulses
DCP_INV
1negative pulses
0positive pulses
HD_INV
1negative pulses
0positive pulses
VD_INV
1negative pulses
0positive pulses
Table 17 Detailed description of SNERT PPG register 0x0E
BITSNERT REGISTER 0E: PPG_SHUTTERSPEED_V_LSB
76543210PARAMETER
XXXXXXXX8LSBs of line number (9 bits)
Table 18 Detailed description of SNERT PPG register 0x0F
BITSNERT REGISTER 0F: PPG_SHUTTERSPEED_H_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits)
2000 Jan 2725
Page 26
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 19 Detailed description of SNERT PPG register 0x10
BITSNERT REGISTER 10: PPG_SHUTTERSPEED_MSB
76543210PARAMETER
XXXXreserved
SENSOR_TYPE
1Sony
0Sharp
XXMSBs of pixel number (10 bits)
X MSBs of line number (9 bits)
Table 20 Detailed description of SNERT PPG register 0x11
BITSNERT REGISTER 11: PPG_BCP_START_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where BCP starts
Table 21 Detailed description of SNERT PPG register 0x12
BITSNERT REGISTER 12: PPG_BCP_STOP_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where BCP stops
Table 22 Detailed description of SNERT PPG register 0x13
BITSNERT REGISTER 13: PPG_DCP_START_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where DCP starts
Table 23 Detailed description of SNERT PPG register 0x14
BITSNERT REGISTER 14: PPG_DCP_STOP_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where DCP stops
Table 24 Detailed description of SNERT PPG register 0x15
BITSNERT REGISTER 15: PPG_BCP_DCP_MSB
76543210PARAMETER
XXMSBs of PPG_DCP_STOP
XXMSBs of PPG_DCP_START
XXMSBs of PPG_BCP_STOP
XX MSBs of PPG_BCP_START
2000 Jan 2726
Page 27
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 25 Detailed description of SNERT PPG register 0x16
BITSNERT REGISTER 16: PPG_B3_START_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where B3 starts
Table 26 Detailed description of SNERT PPG register 0x17
BITSNERT REGISTER 14: PPG_B3_STOP_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where B3 stops
Table 27 Detailed description of SNERT PPG register 0x18
BITSNERT REGISTER 18: PPG_B4_START_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where B4 starts
Table 28 Detailed description of SNERT PPG register 0x19
BITSNERT REGISTER 19: PPG_B4_STOP_LSB
76543210PARAMETER
XXXXXXXX8LSBs of pixel number (10 bits) where B4 stops
Table 29 Detailed description of SNERT PPG register 0x1A
BITSNERT REGISTER 1A: PPG_B3_B4_MSB
76543210PARAMETER
XXMSBs of PPG_B4_STOP
XXMSBs of PPG_B4_START
XXMSBs of PPG_B3_STOP
XX MSBs of PPG_B3_START
2000 Jan 2727
Page 28
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
9.1.4VIDEO FORMATTER AND COMPRESSION ENGINE REGISTERS
Table 30 Detailed description of SNERT video formatter register 0x20
BITSNERT REGISTER 20: VP_VF_CONTRL_0
76543210PARAMETER
XXreserved
UV_EXCHANGE
Xexchange chrominance irregularities if needed
SCALE_DATA: limits the number of bits of the video signal
11undefined
106 bits
017 bits
008 bits
PREFILTER_B_COMB_ON_OFF (if filter B is on)
1prefilter B_COMB with 13 taps
0prefilter B_COMB with 7 taps
PREFILTER_B_ON_OFF
1on with 7 taps
0bypassed
PREFILTER_A_ON_OFF
1on with 3 taps
0bypassed
2000 Jan 2728
Page 29
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 31 Detailed description of SNERT video formatter register 0x21
BITSNERT REGISTER 21: VP_VF_CONTRL_1
76543210PARAMETER
420_FIL_BYPASS: 4 :2:0 formatter mode
1throw away samples
0average UV samples
VGA_RAW: data mode
1raw data, no scaling or 4:2:0 formatting
0YUV data
Table 46 Detailed description of SNERT compression engine register 0x30
BITSNERT REGISTER 30: VP_C_YMASK
76543210PARAMETER
XXXXXXXXoperates an AND between this value and the compression engine input; can be
used to set bit positions in the Y signal to 0 (by default 0x00)
Table 47 Detailed description of SNERT compression engine register 0x31
BITSNERT REGISTER 31: VP_C_UVMASK
76543210PARAMETER
XXXXXXXXoperates an AND between this value and the compression engine input; can be
used to set bit positions in the UV signal to 0 (by default 0x00)
Table 48 Detailed description of SNERT compression engine register 0x32
BITSNERT REGISTER 32: VP_C_BITCOST_MSB
76543210PARAMETER
XXXXXXXXset the compression ratio; the bitcost determines the maximum number of bits
generated by the compression algorithm for 4 subsequent lines
Table 49 Detailed description of SNERT compression engine register 0x33
BITSNERT REGISTER 33: VP_C_BITCOST_LSB
76543210PARAMETER
XXXXXXXXset the compression ratio; the bitcost determines the maximum number of bits
generated by the compression algorithm for 4 subsequent lines
2000 Jan 2732
Page 33
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 50 Detailed description of SNERT compression engine register 0x34
BITSNERT REGISTER 34: VP_C_THRESHOLD_MSB
76543210PARAMETER
XXXXXXXXoutput of the video formatter is clipped to this maximum value
Table 51 Detailed description of SNERT compression engine register 0x35
BITSNERT REGISTER 35: VP_C_THRESHOLD_LSB
76543210PARAMETER
XXXXXXXXthreshold must be set to:
(number of UV blocks per band) × (DC_COEFF_LENGTH + 2)
Table 52 Detailed description of SNERT compression engine register 0x36
BITSNERT REGISTER 36: VP_TR_CONTROL
76543210PARAMETER
Xreserved
VGA_FORMAT
14:2:2 (uncompressed only)
04:2:0
INBAND_CONTROL
1on
0off
LLC_OUT_DIV: select the rate at which the video data is transmitted to the
USB core
XXXXX range [1 to 31]
Table 53 Detailed description of SNERT compression engine register 0x37
BITSNERT REGISTER 37: VP_TR_SQCIF_OFFSET
76543210PARAMETER
VERTICAL_OFFSET
XXXXrange 3 × [0 to 15]
HORIZONTAL_OFFSET
XXXX range 4 × [0 to 12]
Table 54 Detailed description of SNERT compression engine register 0x38
BITSNERT REGISTER 38: VP_VS_V_SHIFT
76543210PARAMETER
XXXXXXXXshift internal line counter with respect to VS pulse
2000 Jan 2733
Page 34
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
9.1.5SWITCH MODE POWER REGISTERS
Table 55 Detailed description of SNERT SMP register 0x3D
BITSNERT REGISTER 3D: SMP_PERIOD
76543210PARAMETER
XXXXXXXXperiod of SMP signal in units of 4 × XOSC_PERIOD (0 by default)
Table 56 Detailed description of SNERT SMP register 0x3E
BITSNERT REGISTER 3E: SMP_LOWTIME
76543210PARAMETER
XXXXXXXXlow edge of SMP signal in units of 4 × XOSC_PERIOD (0 by default)
9.1.6A
Table 57 Detailed description of SNERT audio gain amplifier register 0x3F
76543210PARAMETER
XXreserved
UDIO VARIABLE GAIN AMPLIFIER
BITSNERT REGISTER 3F: AUDIO_VGAIN
SIS: serial interface select
1SNERT
0I
Xreserved
XXXXvariable gain settings (0 to 30 dB)
2
C-bus
2000 Jan 2734
Page 35
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
9.2I2C-bus interface
The USB function has its own I2C-bus interface for communication with the microcontroller. The I2C-bus uses two
addresses:
• Command address for writing commands to the Memory Manager (MM)
• Data address for writing/reading data to/from the Memory Manager (MM).
An address is a byte. The 7 MSBs are the actual address, the LSB is the R/W bit. When it is logic 0, data is transferred
from the master to the slave, when it is logic 1, data is written from the slave to the master.
The 6 MSBs of the two addresses are equal and are defined by the PI_Address = 010111 (see Table 58). The LSB of
the address differentiates between the command address and the data address. When bit 1 is logic 1 the address is the
command address (0x5E) and when bit 1 is logic 0 the address is one of the data addresses (0x5C or 0x5D).
2
Table 58 I
C-bus addresses
BIT
76543210
010111000x5C: for writing data to the memory manager
010111010x5D: for reading data from the memory manager
010111100x5E: for writing commands
010111110x5F: not in use
9.2.1COMMANDS
The commands listed in Table 59 must be sent to the I2C-bus address 0x5E.
2
Table 59 I
76543210
00end-point numberselect end-point
01end-point numberread/write status
10end-point numberinitialize/read status information
1101addressread/write register bank
11100XXXnot used
11101000set non-USB register
11110000read/write data
11110001acknowledge setup
11110010set buffer empty
11111010set buffer full
11110100read interrupt register
11110101read current frame number
11110110send resume
11110111set status change bits
11110011set mode
C-bus USB command codes
BIT
ADDRESS
FUNCTION
2000 Jan 2735
Page 36
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 60 Detailed description of set mode and write register overview
BYTESET_MODE_AND_WRITE
3N1 timer: programmable timer for power management; counts 12 MHz cycles; must be bigger than number
of cycles needed for the microcontroller to go in power-down state after pinSUSPREADYNOT is made
LOW
2N2 timer: programmable timer for power management; counts 12 MHz cycles; determines the time between
the microcontroller clock is switched off and the main clock is switched off
1PSIE-MMU control byte (see Table 61)
Table 61 Detailed description of set mode and write byte 3
BITPSIE-MMU CONTROL BYTE
76543210PARAMETER
XXXreserved
interrupt after isochronous audio transfer
1for each isochronous audio transfer an interrupt to the microcontroller will
be generated; default set to logic 1 upon general Power-on reset and/or
bus reset by the SAA8115HL
0no interrupts are given to the microcontroller
interrupt after isochronous video transfer
1for each isochronous video transfer an interrupt to the microcontroller will
be generated; default set to logic 1 upon general Power-on reset and/or
bus reset by the SAA8115HL
0no interrupts are given to the microcontroller
audio end-point
1audioend-pointenabled;defaultsetto logic 1 upon general Power-on reset
and/or bus reset by the SAA8115HL
0audio end-point disabled; the PSIE-MMU will not react on in-tokens on the
audio end-point
video end-point
1video end-point enabled; default set to logic 1 upon general Power-on reset
and/or bus reset by the SAA8115HL
0video end-point disabled; the PSIE-MMU will not react on in-tokens on the
video end-point
error debug mode
1interrupts are generated only in the event the transfer is not successfully
completed; the microcontroller can read data from the interrupt and status
registers to see the cause of this error
0all successful USB transactions are reported to the microcontroller via an
interrupt; default set to logic 0 upon general power-on reset by the
SAA8115HL
2000 Jan 2736
Page 37
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 62 Detailed description of set mode and read status byte
BITPSIE-MMU STATUS BYTE
76543210PARAMETER
XXXXreserved
remote wake-up status flag
1remote wake-up when device is in SUSPEND mode
0no remote wake-up
resume status flag
1bus resume by the host when device is in SUSPEND mode
0no bus resume
bus reset status flag
1bus reset
0no bus reset
power-up status flag
1general power-up reset
0no power-up reset
9.2.2E
The SAA8115HL has 6 logical end-points which are listed in Table 63.
Table 63 Mapping of logical to physical end-point numbers for used end-points
Control end-point0801
Control end-point1823
Interrupt end-point28−4
Interrupt end-point38−5
Iso video end-point496.0−6
Iso video end-point535.1−7
ND-POINTS
END-POINT NAME
LOGICAL
END-POINT
BUFFER SIZE
PHYSICAL END-POINT
OUTIN
2000 Jan 2737
Page 38
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
9.2.3CONTROL TOP REGISTERS
The following registers can be written on I2C-bus address 1 after the command 0xE8 on I2C-bus address 0.
2
Table 64 I
ADDRESSCONTROL TOP REGISTERS (BASE ADDRESS: 0x08)
0x08clock control
0x09reset control
0x0Amux block control
0x0Bpower-on analog modules control
Table 65 Detailed description of I
76543210PARAMETER
1sel_ad: clock generated from ADC
0sel_pll: clock generated from PLL
C-bus control top registers
2
C-bus control top registers 0x08
BITTOP REGISTER 0x08: CLKSHOP_CONTROL
select ADC clock source
set clock dividers for ADC
00set_divide00: divided by 1
01set_divide01: divided by 2
10set_divide10: divided by 4
11set_divide11: divided by 8
1upc_osc_ad_off: power management audio enabled
0power management audio disabled
power control PLL module
1upc_pll_off: PLL power-off
0power-on
Xreserved
power control ADC module left channel
1upc_adl_off: power-off
0power-on
power control ADC module right channel
1upc_adr_off: power-off
0power-on
power control AGC module left channel
1upc_AGCl_off: power-off
0power-on
power control AGC module right channel
1upc_AGCr_off: power-off
0power-on
2000 Jan 2740
Page 41
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
9.2.4VIDEO FIFO REGISTERS
Table 69 I2C-bus video FIFO registers overview
ADDRESSVIDEO FIFO REGISTERS (BASE ADDRESS: 0x04)
0x04FIFO offset (8 LSBs)
0x05FIFO active and FIFO offset (3 MSBs)
0x06packet size (8 LSBs)
0x07read spacing and packet size (2 MSBs)
2
Table 70 Detailed description of I
BITFIFO REGISTER 0x04: FIFO_OFFSET
76543210PARAMETER
XXXXXXXX mode_fifo_offset: sets the minimum contents of the FIFO that has to be
C-bus video FIFO registers 0x04
FIFO_OFFSET
reached, before a new video frame will be put on the USB. This value can
be set between 0 and 2047. Total 11 bits with 8 LSBs in this register and
3 MSBs in register 0x05.
2
Table 71 Detailed description of I
BITFIFO REGISTER 0x05: FIFO_ACTIVE AND FIFO_OFFSET
76543210PARAMETER
1mode_active: FIFO is active and the contents of the other mode registers
0FIFO not active
XXXXreserved
XXX3 MSBs of the offset value; see also register 0x04
C-bus video FIFO registers 0x05
FIFO_ACTIVE
should not be updated by the microcontroller (maledictive)
FIFO_OFFSET (MSBs)
2000 Jan 2741
Page 42
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
Table 72 Detailed description of I2C-bus video FIFO registers 0x06
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOLPARAMETERCONDITIONSMIN.MAX.UNIT
V
DDA
V
DDA_USB
V
DDD
V
n
T
stg
T
amb
T
j
Note
1. This concerns pins VBUS1 and VBUS2.
analog supply voltage−0.5+4.0V
analog supply voltage from USBnote 1−0.5+5.5V
digital supply voltage−0.5+4.0V
voltage on
pins AGND and DGND−0.5+4.0V
all other pins−0.5VDD+ 0.5V
storage temperature−55+150°C
ambient temperature070°C
junction temperature−40+125°C
11 THERMAL CHARACTERISTICS
SYMBOLPARAMETERCONDITIONSVALUEUNIT
R
th(j-a)
thermal resistance from junction to ambientin free air45K/W
12 CHARACTERISTICS
V
DDD=VDDA
= 3.3 V ±10%; T
=0to70°C.
amb
SYMBOLPARAMETERCONDITIONSMIN.TYP.MAX.UNIT
Supplies
V
DDDn
V
DDAn
V
DDA_USB
V
DGND
V
AGND
I
DDDn
I
DDAn
digital supply voltage3.03.33.6V
analog supply voltage3.03.33.6V
analog supply voltage from USBnote 14.05.05.5V
digital ground supply−0.30.0+0.3V
analog ground supply−0.30.0+0.3V
digital supply currentT
analog supply currentT
Fig.7 PPG high-speed pulses for Sony ICX098AK VGA CCD-sensor.
2000 Jan 2750
t
d3
50%50%
t
d7
t
WL(FS)
t
d4
FCE607
Page 51
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2000 Jan 2751
ndbook, full pagewidth
14 APPLICATION INFORMATION
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
V-DRIVER
CCD9 to CCD0
TDA878xSENSOR
FS, FCDS, DCP, BCP, CLK1
C1 to C4, CR, RG
A1 to A4, B1 to B4
SMP
RESET
SDATA
SCLK
STROBE
DATA7 to DATA0
M
EPPROM
(optional)
PSEN
ALE
AD10 to AD8
AD15 to AD11
SDAE
SAA8112HL
DSP AND
MICROCONTROLLER
UCM
EEPROM
SCLE
SCL
SDA
YUV7 to YUV0
HREF
VS
LLC
HD
VD
CLK1
CLK2
SNRES
SNCL
SNDA
SUSPEND
SUSPREADYNOT
UCINT
UCPOR
UCCLK
SDRAM
(optional)
DQ15 to DQ0
AD10 to AD0
RASB
CASB
SAA8115HL
USB INTERFACE
FCE464
DQM
WEB
CLKEN
CLOCKON
TRC
CSB
SMP
Fig.8 Typical USB camera application.
Page 52
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
15 PACKAGE OUTLINE
LQFP144: plastic low profile quad flat package; 144 leads; body 20 x 20 x 1.4 mm
c
y
X
A
SOT486-1
108
109
pin 1 index
144
1
w M
b
e
p
D
H
D
DIMENSIONS (mm are the original dimensions)
mm
A
max.
1.6
0.15
0.05
1.45
1.35
0.25
cE
p
0.27
0.20
0.17
0.09
UNITA1A2A3b
73
72
Z
E
e
H
E
E
A
2
A
A
1
w M
b
p
detail X
37
36
v M
Z
D
A
B
v M
B
0510 mm
scale
(1)
(1)(1)(1)
D
20.1
19.9
eH
H
20.1
19.9
0.50
22.15
21.85
D
E
22.15
21.85
LL
p
0.75
0.45
0.080.20.081.0
Z
1.40
1.10
D
(A )
3
L
p
L
Zywvθ
E
o
1.40
7
o
1.10
0
θ
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC JEDEC EIAJ
REFERENCES
SOT486-1136E23 MS-026
2000 Jan 2752
EUROPEAN
PROJECTION
ISSUE DATE
99-12-03
00-01-19
Page 53
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
16 SOLDERING
16.1Introduction to soldering surface mount
packages
Thistextgivesaverybriefinsightto a complex technology.
A more in-depth account of soldering ICs can be found in
our
“Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
16.2Reflow soldering
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
totheprinted-circuitboardbyscreenprinting,stencillingor
pressure-syringe dispensing before package placement.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
• Forpackageswithleadsonfoursides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
16.3Wave soldering
Conventional single wave soldering is not recommended
forsurfacemountdevices(SMDs)orprinted-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
To overcome these problems the double-wave soldering
method was specifically developed.
2000 Jan 2753
16.4Manual soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
Page 54
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
16.5Suitability of surface mount IC packages for wave and reflow soldering methods
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Jan 2754
Page 55
Philips SemiconductorsPreliminary specification
Digital camera USB interfaceSAA8115HL
17 DEFINITIONS
Data sheet status
Objective specificationThis data sheet contains target or goal specifications for product development.
Preliminary specificationThis data sheet contains preliminary data; supplementary data may be published later.
Product specificationThis data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
18 LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
19 PURCHASE OF PHILIPS I
Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2
C COMPONENTS
2
C components conveys a license under the Philips’ I2C patent to use the
2000 Jan 2755
Page 56
Philips Semiconductors – a w orldwide compan y
Argentina: see South America
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Tel. +381 11 3341 299, Fax.+381 11 3342 553
For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
The information presented in this document does not form part of anyquotationorcontract,is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
2000
Internet: http://www.semiconductors.philips.com
69
Printed in The Netherlands753505/03/pp56 Date of release: 2000 Jan 27Document order number: 9397750 06568
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