Datasheet SAA9750H Datasheet (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA9740H

Advanced Auto Control Function
(A2CF)

Product specification
Supersedes data of 1996 Jan 30
File under Integrated Circuits, IC02

1996 Oct 10

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

FEATURES

• One chip full digital Auto Focus (AF), Auto Exposure
(AE) and Auto White Balance (AWB)

• Possible to use NTSC and PAL CCD with horizontal
resolution of 510, 670, 720 or 768 pixels

• No manual adjustment

• One microprocessor system commonly used with

CAMera Digital Signal Processor (CAMDSP)
SAA9750H

• 8-bit parallel microprocessor interface

• LQFP64 package (0.5 mm pitch)

• Single 3 V power supply.

Auto Focus features

• Video AF system

• Two windows system (a small centre and large window)

• The window size and place are microprocessor

controlled

th

• Including 5

order IIR digital high-pass filter

• Line peak accumulation in the large window

• High-pass filter’s output accumulation in one field.

Auto Exposure features

• 5 windows accumulation

• Calculation of white-clip by centre window

• Possible to control size and place of the centre windows

by the light condition with microprocessor.

Auto White Balance features

• Mono colour detection

• Accumulation of UV data in the corresponding UV

quadrant

• Green and Magenta elimination gate

• Luminance gate for detecting white

• UV limiter

• White-clip detection/counter.

GENERAL DESCRIPTION

The Advanced Auto Control Function (A2CF) is to be used
for a colour CCD camera system. This IC can realize AWB,
AF and AE with a microprocessor. This device consists of
an input data selector, a parallel 8-bit microprocessor
interface, a data accumulator, a window generator, a
command decoder and AWB, AF, AE for each processing
block.

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DD

V

IL

V

IH

V

OL

V

OH

T

amb

digital supply voltage (pins 6, 18 and 47) 2.7 3.0 3.3 V
LOW level digital input voltage 0 − 0.3V
HIGH level digital input voltage 0.7V

DD

− V

DD

DD

V

V
LOW level digital output voltage −−0.5 V
HIGH level digital output voltage VDD− 0.5 −−V
operating ambient temperature −20 − +70 °C

ORDERING INFORMATION

TYPE

NUMBER

NAME DESCRIPTION VERSION

PACKAGE

SAA9740H LQFP64 plastic low profile quad flat package; 64 leads; body 10 × 10 × 1.4 mm SOT314-2

1996 Oct 10 2

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

BLOCK DIAGRAM

to

LWDB

WDMNT

WDINT

ASTB

WRB

RDB

RSTB28IO7 to IO0

TSTOUT7

TSTOUT1

MHA286

UV_SEL

HSYNC

VD

HD

DD3

to V

DD1

V

+3 V

373632

34 33 35 86, 18, 47

WINDOW

GENERATOR

H/V

COUNTER

SAA9740H

57 to 50

31

30

enable signals

18-BIT

ADDER

AUTO

FOCUS

8

29

20 to 27

INTERFACE

MICROPROCESSOR

REGISTER

PEAK

HOLD

AUTO

EXPOSURE

5

61 to 64, 1

AUTO

16 to 9

8

CLIP

WHITE

WHITE

BALANCE

8

7

39, 38, 45 to 41

CLK1

1/2 CLK1

CLOCK

GENERATOR

48

60

5

TST1

4

TSTIN3

3

TSTIN2

2

TSTIN1

17

WCLIP

58

SCAN_T

SS5

to V

SS1

7, 19 46, 49, 59

V

40

CLK2OUT

Fig.1 Block diagram.

to

CDS7

CDS0

handbook, full pagewidth

Y7 to Y3

1996 Oct 10 3

UV7 to UV0

CLK1

AMSAL

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

PINNING

SYMBOL PIN TYPE DESCRIPTION

Y3 1 input Y input from SAA9750H (CAMDSP) (LSB)
TSTIN1 2 input input pin for test
TSTIN2 3 input input pin for test
TSTIN3 4 input input pin for test
TST1 5 input input pin for test
V

DD1

V

SS1

UV_SEL 8 input UV select input from SAA9750H (CAMDSP)
UV0 9 input UV input from SAA9750H (CAMDSP) (LSB)
UV1 10 input UV input from SAA9750H (CAMDSP)
UV2 11 input UV input from SAA9750H (CAMDSP)
UV3 12 input UV input from SAA9750H (CAMDSP)
UV4 13 input UV input from SAA9750H (CAMDSP)
UV5 14 input UV input from SAA9750H (CAMDSP)
UV6 15 input UV input from SAA9750H (CAMDSP)
UV7 16 input UV input from SAA9750H (CAMDSP) (MSB)
WCLIP 17 input white-clip input from SAA9750H (CAMDSP)
V

DD2

V

SS2

IO7 20 bidirectional microprocessor interface (MSB)
IO6 21 bidirectional microprocessor interface
IO5 22 bidirectional microprocessor interface
IO4 23 bidirectional microprocessor interface
IO3 24 bidirectional microprocessor interface
IO2 25 bidirectional microprocessor interface
IO1 26 bidirectional microprocessor interface
IO0 27 bidirectional microprocessor interface (LSB)
RSTB 28 input system reset
RDB 29 input read control from microprocessor
WRB 30 input write control from microprocessor
ASTB 31 input address set from microprocessor
WDINT 32 output window interrupt
VD 33 input V-drive signal input
HD 34 input H-drive signal input
HSYNC 35 input HSYNC input
WDMNT 36 output window monitor for test (open-drain)
LWDB 37 output large window for test (open-drain)
TSTOUT6 38 output output pin for test
TSTOUT7 39 output output pin for test
CLK2OUT 40 output output pin of internal clock (open-drain)

6 − digital supply voltage
7 − ground

18 − digital supply voltage
19 − ground

1996 Oct 10 4

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

SYMBOL PIN TYPE DESCRIPTION

TSTOUT1 41 output output pin for test
TSTOUT2 42 output output pin for test
TSTOUT3 43 output output pin for test
TSTOUT4 44 output output pin for test
TSTOUT5 45 output output pin for test
V

SS3

V

DD3

CLK1 48 input clock
V

SS4

CDS0 50 input CDS input from ADC (LSB)
CDS1 51 input CDS input from ADC
CDS2 52 input CDS input from ADC
CDS3 53 input CDS input from ADC
CDS4 54 input CDS input from ADC
CDS5 55 input CDS input from ADC
CDS6 56 input CDS input from ADC
CDS7 57 input CDS input from ADC (MSB)
SCAN_T 58 input test control for scan test
V

SS5

AMSAL 60 input for testing
Y7 61 input Y input from SAA9750H (CAMDSP) (MSB)
Y6 62 input Y input from SAA9750H (CAMDSP)
Y5 63 input Y input from SAA9750H (CAMDSP)
Y4 64 input Y input from SAA9750H (CAMDSP)

46 − ground
47 − digital supply voltage

49 − ground

59 − ground

1996 Oct 10 5

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

handbook, full pagewidth

Y3
TSTIN1
TSTIN2
TSTIN3

TST1

V

DD1

V

SS1

UV_SEL

UV0
UV1
UV2
UV3
UV4
UV5
UV6
UV7

Y4

Y5

Y6

Y7

64

63

62

61
1
2
3
4
5
6
7
8

AMSAL
60

SS5

V
59

SCAN_T

CDS7

58

57

CDS6
56

CDS5
55

CDS4
54

CDS3

53

CDS2

52

CDS1

51

SAA9740H

9

10
11
12
13
14
15
16

CDS0
50

SS4

V

49

48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33

CLK1
V

DD3

V

SS3

TSTOUT5
TSTOUT4
TSTOUT3
TSTOUT2
TSTOUT1
CLK2OUT
TSTOUT7
TSTOUT6
LWDB
WDMNT
HSYNC
HD
VD

17

18

19

20

21

22

23
IO4

IO5

IO6

IO7

SS2

DD2

V

V

WCLIP

Fig.2 Pin configuration.

1996 Oct 10 6

24
IO3

25
IO2

26
IO1

27
IO0

28

RSTB

29

RDB

30

WRB

31

ASTB

32

WDINT

MHA285

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

FUNCTIONAL DESCRIPTION

The Advanced Auto Control Function (A2CF) will be used
for colour CCD camera systems.

The input signals are CDS (AF data) from 8-bit ADC,
Y (for AE, 5-bit) and UV (for AWB, 8-bit) data as the output
of SAA9750H (CAMDSP) and they are fed into the A2CF.
After being processed in the A2CF, corresponding data
are led into the microprocessor.

Together with the zoom encoder and focus sensor output
the microprocessor does the following control with the data
of A2CF:

• Control focus motor

• Control iris, AGC (via DAC) and high speed shutter

• Send the control data to SAA9750H (CAMDSP) via

serial bus.

CLK1 is depending on the CCD type. To cope with the
different CCD clocks, some reference data have to be set
by the microprocessor.

AF system

handbook, halfpage

active video

This maximum focus value is accumulated in the AF
window (see Fig.3) by the 18-bit adder. The values in the
large window are stored in REG2 (see Table 7) and those
in the small window are stored in REG3 (see Table 7).
Which data is used is dependent on the software (see
Tables 6 and 7). Besides this accumulation, line peak
accumulation is also done. This data is the maximum value
in one field and is stored in REG0 (see Table 7).

AE system

handbook, halfpage

1

324

5

active video

MHA288

Fig.4 AE window.

large window

centre

window

MHA287

Fig.3 AF window.

Digital CDS signals CDS7 to CDS0 which come after
AGC, gamma processing and ADC are fed into A2CF.
This 8-bit data is shifted to the most suitable 6-bit data for
AF processing by microprocessor. For example, when the
MSB of them is ‘1’ then the 6-bit data is shifted by the
microprocessor to CDS7 to CDS2
(not CDS6 to CDS1 or CDS5 to CDS0; see Table 4). After
AF shifting the signals go through an LPF and they are
down sampled. The down sampling is done by CLK2
(CLK1/2). In order to detect the high frequency component
for AF processing, one HPF is added. This output is the
focus value. Next peak hold block is for acquiring
maximum focus value of every line in one field.

5-bit Y signals Y7 to Y3 which come from SAA9750H are
fed into A2CF for AE processing. This signal is internally
extended to 6 bits by adding a ‘0’ as new MSB. Next they
go through an LPF and they are down sampled in the
same way as AF processing. In order to prevent overflow
of the 18-bit adder block, 2 modes exist (see Table 4).
The first is H decimation is on oroff. If H decimation is on,
then the data for AE processing is available in every other
line. The second mode is that the data for AE processing

1

is shifted to

⁄2 or not. If the data is shifted to1⁄2, it is done

before down sampling and before the data going to the
18-bit adder becomes1⁄2. Both these modes are controlled
by the microprocessor. In AE mode there are 5 windows
as shown in Fig.4. These windows are controlled by the
microprocessor. The accumulation data in window 1 to
window 5 is respectively stored in REG1 to REG5 (see
Table 7). The white-clip count data in the centre window is
stored to the lower 5 bits of REG0 (see Table 7).
The upper 3 bits of REG0 is the overflow information in the
18-bit adder (see Table 7).

1996 Oct 10 7

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

AWB system

8-bit UV signals UV[7] to UV[0] which come from the
SAA9750H (CAMDSP) are fed into the A2CF for AWB
processing. First the 8-bit data is limited to 6-bits because
the necessary data for AWB processing is around the
white colour signal. Then these signals go through an LPF
and they are down sampled. They are separated to U and
V signals by using UV_SEL coming from SAA9750H
(CAMDSP). As shown in Table 1, in the large window
these signals are compared with the threshold that is set
by the microprocessor. If the conditions shown in Fig.8 are
valid, the data is available for AWB processing. If the
conditions aren’t valid, the data is ignored. The available
data in the first to the 4th quadrant are stored in

mode (see Table 4) is for detecting whether the picture is
mono colour or not. If the AWB (B − Y) or AWB (R − Y) or
AWB (∆) (see Table 4) mode is active and white-clip or
AWB limited (as mentioned above), then the counts of
them are stored in the lower 5 bits of REG0 (see Table 7).
In the AWB Y mode the lower 4 bits of REG0 are contrast
peak data in one field and the 4th bit is the overflow
information of the AF (see Table 7).

Microprocessor interface

8-bit data bus and 3 control ports are prepared (WRB,
RDB and ASTB) for microprocessor interface in A2CF for
quick data access instead of serial bus. A2CF has 11 read
commands and 13 write commands.

respectively REG1 to REG4 (see Table 7). The AWB (∆)

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNIT

V

DD

P

tot

V

I

V

O

T

stg

T

amb

V

es

supply voltage −0.5 +5.0 V
total power dissipation − 83 mW
input voltage −0.5 VDD+ 0.5 V
output voltage −0.5 VDD+ 0.5 V
storage temperature −65 +150 °C
operating ambient temperature −20 +70 °C
electrostatic handling; note 1 −2000 +2000 V

LTCH latch-up protection 100 − mA

Note

1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.

1996 Oct 10 8

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

DC CHARACTERISTICS

T

= −20 to +70 °C; VDD= 2.7 to 3.3 V; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

DD

Input pins (TSTIN1 to TSTIN3, TST1, UV_SEL, UV0 to UV7, Y3 to Y7, WCLIP, RSTB, RDB, WRB, ASTB, VD, HD,
HSYNC, CLK1, CDS0 to CDS7, SCAN_T and AMSAL)

V

IH

V

IL

I

IH

I

IL

Output pins (WDINT and TSTOUT1 to TSTOUT7; push pull output)

V

OH

V

OL

Output pins (WDMNT, LWDB and CLK2OUT; open-drain)

V

OL

I

OZ

Bidirectional pins (IO0 to IO7)

V

OH

V

OL

V

IH

V

IL

I

IH

I

IL

I

OZ

supply current note 1 − 12 25 mA

HIGH level input voltage 0.7V
LOW level input voltage −−0.3V
HIGH level input current VIH=V
LOW level input current VIL=V

DD

SS

HIGH level output voltage IOH= −20 µAV

= −4mA VDD− 0.5 −−V

I

OH

−−1µA

−−−1µA

DD

−−V

DD

V

DD

− 0.1 −−V

LOW level output voltage IOL= +20 µA −−0.1 V

=+4mA −−0.5 V

I

OL

LOW level output voltage IOL= +20 µA −−0.1 V

=+4mA −−0.5 V

I

OL

3-state leakage current VO=V

DD

HIGH level output voltage IOH= −20 µAV

= −8mA VDD− 0.5 −−V

I

OH

−−5µA

− 0.1 −−V

DD

LOW level output voltage IOL= +20 µA −−0.1 V

=+8mA −−0.5 V

I

OL

HIGH level input voltage 0.7V
LOW level input voltage −−0.3V
HIGH level input current VIH=V
LOW level input current VIL=V

DD

SS

3-state leakage current VO=VDD or V

SS

−−1µA

−−−1µA

−−±5µA

−−V

DD

DD

V

Note

1. 510H PAL; V

= 3 V; all modes active.

DD

1996 Oct 10 9

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

AC CHARACTERISTICS
Microprocessor interface

T

= −20 to +70 °C; VDD= 2.7 to 3.3 V; VIL=0V; VIH=VDD; V

amb

otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

suAD

t

hAD

t

AR

t

WR

t

RRD

t

hRRD

t

AW

t

WW

t

suW

t

hW

address setup time 0.4 −−µs
address hold time 0.4 −−µs
ASTB to RDB time 0.5 −−µs
RDB width 1.0 −−µs
RDB to read data RL=1kΩ−−0.8 µs
RDB to read data hold time RL=1kΩ−−0.1 µs
ASTB to WRB time 0.5 −−µs
WRB width 1.0 −−µs
WRB setup time 0.4 −−µs
WRB hold time 0.4 −−µs

= 0.5VDD; input tr and tf= 30 ns; see Fig.5; unless

ref

handbook, full pagewidth

ASTB

RDB

WRB

V

90%

read dataaddressIO7 to IO0

10%

t

suAD

t

r

90%

t

f

t

50%

hAD

10%

t

AR

50%

t

AW

t

RRD

t

W R

t

hRRD

50%

t

W W

write data

t

suW

t

hW

50%50%

90%

10%

MHA292

IH

V

IL

V

IH

V

IL

V

IH

V

IL

V

IH

V

IL

Fig.5 Microprocessor interface timing.

1996 Oct 10 10

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

Data input/output timing (CLK1)

T

= −20 to +70 °C; VDD= 2.7 to 3.3 V; VIL=0V; VIH=VDD; V

amb

capacitance = 20 pF; unless otherwise specified.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

t

suDI

t

hDI

t

dDO

t

hDO

t

W CLK1

data input setup time note 1 5 −−ns
data input hold time note 1 8 −−ns
data output delay time notes 2 and 3 −−60 ns
data output hold time notes 2 and 3 −−60 ns
width of CLK1 − 50 − %

Notes

1. Data inputs: UV0 to UV7, Y3 to Y7, AD0 to AD7, UV_SEL, HSYNC, HD, VD and WCLIP.

2. Data outputs: WDINT, CLK2OUT, WDMNT and LWDB (open-drain outputs with 1 kΩ output load resistor).

3. T

=25°C; VDD= 3.0 V.

amb

= 0.5VDD; tr and tf= 6 ns; output load

ref

handbook, full pagewidth

CLK1

data inputs

data outputs

(1) 50% for open-drain outputs.

t

f

90%

V

ref

10%

t

suDI

90%

10%

t

dDO

90%

(1)

10%

t

dDO

t

W CLK1

90%

10%

t

hDI

90%

10%

MHA291

t

r

10%

90%

V

IH

V

IL

V

IH

V

IL

V

IH

V

IL

Fig.6 Data input/output timing (CLK1).

1996 Oct 10 11

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

MICROPROCESSOR COMMANDS
Table 1 Write commands; note 1

COMMAND

FUNCTION

IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0

DATA

81H
82H
83H
84H
85H
86H
87H
88H

(2)
(2)
(2)
(2)
(2)
(2)
(2)
(2)

X X X1[5] X1[4] X1[3] X1[2] X1[1] X1[0] X1 address
X X X2[5] X2[4] X2[3] X2[2] X2[1] X2[0] X2 address
X X X3[5] X3[4] X3[3] X3[2] X3[1] X3[0] X3 address
X X X4[5] X4[4] X4[3] X4[2] X4[1] X4[0] X4 address
X X Y1[5] Y1[4] Y1[3] Y1[2] Y1[1] Y1[0] Y1 address
X X Y2[5] Y2[4] Y2[3] Y2[2] Y2[1] Y2[0] Y2 address
X X Y3[5] Y3[4] Y3[3] Y3[2] Y3[1] Y3[0] Y3 address

X X Y4[5] Y4[4] Y4[3] Y4[2] Y4[1] Y4[0] Y4 address
8BH X TEST2 TEST1 TEST0 X IIRC2 IIRC1 IIRC0 IIRC
8CH THB[3] THB[2] THB[1] THB[0] THA[3] THA[2] THA[1] THA[0] TH1
8DH XXXX THC[3] THC[2] THC[1] THC[0] TH2
8EH SFTY SFT1 SFT0 X HON MODE2 MODE1 MODE0 MODE
8FH X SIZE MWD1 MWD0 X PHS PHD PVD SET

Notes

1. X = don’t care.

2. For auto exposure processing different windows in the active video field are taken with different weighting factors.
The coordinates of the five windows are set according to Fig.7. The resolution is 1 bit ≡ 16 pixel in x-direction and
1 bit ≡ 8 lines in y-direction.

handbook, halfpage

0/0

active video

X3/Y3

WIN1

X1/Y1

WIN3WIN2

WIN5

WIN4

X2/Y2

X4/Y4

MHA289

Fig.7 Window size control for AE processing

(see WRITE command 81H to 88H).

1996 Oct 10 12

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

Address 8BH
Table 2 IIRC (IO[2] to IO[0])

IIRC2 IIRC1 IIRC0 FUNCTION

0 0 0 1 MHz HPF select for auto focus processing
0 0 1 700 kHz HPF select for auto focus processing
0 1 0 220 kHz HPF select for auto focus processing
0 1 1 bypass HPF for auto focus processing
1 1 0 110 kHz select for auto focus processing

Table 3 IIRC 9IO[6] to 9IO[4]; note 1

TEST2 TEST1 TEST0 FUNCTION

X X X only for test purposes

Note

1. X = don’t care.

Address 8CH and 8DH

Address 8CH and 8DH are used to define the active range that is taken for auto white balance processing.
The calculation of active area can be seen in Fig.8.

handbook, full pagewidth

−THA

−THB

R−Y (V)

THB

THA

B−Y (U)

Conditions:
(1) U+V< THA.
(2) V < THB.
(3) Y > THC.
Threshold values can be set with 4-bit resolution.

Fig.8 Set threshold values for Auto White Balance (AWB) mode.

1996 Oct 10 13

MHA290

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

Address 8EH

By applying address 8EH and setting the MODE bits it is possible to read the values that are stored in the registers
corresponding to the selected mode. The selection which register will be read is then defined by READ address
70H to 7BH (see Tables 6 and 7).

Table 4 MODE and shift definition (see WRITE command 8EH); note 1

IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0

SFTY SFT1 SFT0 − HON MODE MODE MODE

XXXXX 0 0 0AE set mode: read AE values
XXXXX 0 0 1AF set mode: read AF values
XXXXX 0 1 1AWB (B−Y) set mode: read AWB (B − Y) values
XXXXX 1 0 0AWB (R−Y) set mode: read AWB (R − Y) values
XXXXX 1 0 1AWB∆ set mode: read AWB ∆ values
XXXXX 1 1 0AWB Y set mode: read AWB Y values
XXXX0 0 0 0H dec decimation for 1H off
XXXX1 0 0 0H dec decimation for 1H on
X 0 0 X X 0 0 1 AF shift select CDS5 to CDS0 for AF

X 0 1 X X 0 0 1 AF shift select CDS6 to CDS1 for AF

X 1 X X X 0 0 1 AF shift select CDS7 to CDS2 for AF

0XXXX 0 0 0AE shift take AE[5] to AE[0] for internal AE

1XXXX 0 0 0AE shift take AE[5] to AE[1] for internal AE

MODE FUNCTION

processing

processing

processing

processing (see Chapter
“Functional description”)

processing (see Chapter
“Functional description”)

Note

1. X = don’t care.

1996 Oct 10 14

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

Address 8FH

To apply several types of CCDs it is possible to set polarity VD, HD and HSYNC by PVD, PHD and PHS.
The modes set by MWD and SIZE bit are only used for system evaluation. During normal application mode they can have

any value.

Table 5 Settings (see WRITE command 8FH); note 1

IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0

− SIZE MWD1 MWD0 − PHS PHD PVD

X X X X X X X 0 PVD VD ‘H’ active
X X X X X X X 1 PVD VD ‘L’ active
X X X X X X 0 X PHD HD ‘H’ active
X X X X X X 1 X PHD HD ‘L’ active
X X X X X 0 X X PHSYNC HSYNC ‘H’ active
X X X X X 1 X X PHSYNC HSYNC ‘L’ active
X X 0 0 X X X X MWD AE monitor AE window
X X 0 1 X X X X MWD AF monitor AF window
X X 1 0 X X X X MWD AWB monitor AWB window
X X 1 1 X X X X MWD ALL monitor all windows
X 0 X X X X X X MWD SMALL monitor small window
X 1 X X X X X X MWD LARGE monitor large window

Note

1. X = don’t care.

READ commands

The values of the internal registers can be read as follows:

1. Set mode AF, AE or AWB by WRITE command 8EH according to Table 4.

2. Select register by READ command 70H to 7BH according to Table 6.

MODE FUNCTION

Table 6 Read command

DATA

COMMAND

IO7 IO6 IO5 IO4 IO3 IO2 IO1 IO0

70H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] REG1
71H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0]
72H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] REG2
73H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0]
74H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] REG3
75H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0]
76H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] REG4
77H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0]
78H O[15] O[14] O[13] O[12] O[11] O[10] O[9] O[8] REG5
79H O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0]
7BH O[7] O[6] O[5] O[4] O[3] O[2] O[1] O[0] REG0

1996 Oct 10 15

FUNCTION

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

Register assignment

For the different modes (AF, AE and AWB) the contents of the registers are assigned according to Table 7.

Table 7 Register assignment

MODE REGISTER DATA FUNCTION

AF REG0 (8-bit) O[7] to O[5] n.a.

O[4] overflow information of AF block

O[3] to O[0] contrast peak within one field
REG1 (18-bit) O[15] to O[0] n.a.
REG2 (18-bit) O[15] to O[0] accumulated data in the large window
REG3 (18-bit) O[15] to O[0] accumulated data in the centre window
REG4 (18-bit) O[15] to O[0] accumulated data of the large window minus the data of the centre

window

REG5 (18-bit) O[15] to O[0] n.a.

AE REG0 (8-bit) O[7] to O[5] 18-bit adder overflow information

O[4] to O[0] white-clip counter output
REG1 (18-bit) O[15] to O[0] accumulated data in WIN1; REG1[18] to REG1[3]
REG2 (18-bit) O[15] to O[0] accumulated data in WIN2; REG2[18] to REG2[3]
REG3 (18-bit) O[15] to O[0] accumulated data in WIN3; REG3[18] to REG3[3]
REG4 (18-bit) O[15] to O[0] accumulated data in WIN4; REG4[18] to REG4[3]
REG5 (18-bit) O[15] to O[0] accumulated data in WIN5; REG5[18] to REG5[3]

AWB (B − Y) REG0 (8-bit) O[7] to O[5] n.a.

O[4] to O[0] white-clip or AWB limiter count
REG1 (18-bit) O[15] to O[0] accumulated B − Y data of 1st quadrant; REG1[18] to REG1[3]
REG2 (18-bit) O[15] to O[0] accumulated B − Y data of 2nd quadrant; REG2[18] to REG2[3]
REG3 (18-bit) O[15] to O[0] accumulated B − Y data of 3rd quadrant; REG3[18] to REG3[3]
REG4 (18-bit) O[15] to O[0] accumulated B − Y data of 4th quadrant; REG4[18] to REG4[3]
REG5 (18-bit) O[15] to O[0] n.a.

AWB (R − Y) REG0 (8-bit) O[7] to O[5] n.a.

O[4] to O[0] white-clip or AWB limiter count
REG1 (18-bit) O[15] to O[0] accumulated R − Y data of 1st quadrant; REG1[18] to REG1[3]
REG2 (18-bit) O[15] to O[0] accumulated R − Y data of 2nd quadrant; REG2[18] to REG2[3]
REG3 (18-bit) O[15] to O[0] accumulated R − Y data of 3rd quadrant; REG3[18] to REG3[3]
REG4 (18-bit) O[15] to O[0] accumulated R − Y data of 4th quadrant; REG4[18] to REG4[3]
REG5 (18-bit) O[15] to O[0] n.a.

AWB (∆) REG0 (8-bit) O[7] to O[5] n.a.

O[4] to O[0] white-clip or AWB limiter count
REG1 (18-bit) O[15] to O[0] accumulated ∆(R − Y) data of WIN1 to WIN5; REG1[18] to REG1[3]
REG2 (18-bit) O[15] to O[0] accumulated ∆(B − Y) data of WIN1 to WIN5; REG2[18] to REG2[3]
REG3 (18-bit) O[15] to O[0] accumulated ∆(R − Y) data of WIN3; REG3[18] to REG3[3]
REG4 (18-bit) O[15] to O[0] accumulated ∆(B − Y) data of WIN3; REG4[18] to REG4[3]
REG5 (18-bit) O[15] to O[0] n.a.

1996 Oct 10 16

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

MODE REGISTER DATA FUNCTION

AWB (Y) REG0 (8-bit) O[7] to O[5] n.a.

O[4] overflow information of auto focus block

O[3] to O[0] contrast peak within one field
REG1 (18-bit) O[15] to O[0] accumulated R − Y data of 1st quadrant; REG1[18] to REG1[3]
REG2 (18-bit) O[15] to O[0] accumulated R − Y data of 2nd quadrant; REG2[18] to REG2[3]
REG3 (18-bit) O[15] to O[0] accumulated R − Y data of 3rd quadrant; REG3[18] to REG3[3]
REG4 (18-bit) O[15] to O[0] accumulated R − Y data of 4th quadrant; REG4[18] to REG4[3]
REG5 (18-bit) O[15] to O[0] n.a.

1996 Oct 10 17

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

APPLICATION INFORMATION

CAMERA

UV (8-bit)

Y (8-bit)

C

Y

CAMDSP

LPF BPF

SIGNAL PROCESS

clamp

ADC

serial

data bus

SSG

ENCODER

Y/C SEPARATION

8-bit

ADC

SAA9750H

HD, VD

AGC

MICROPROCESSOR

Y7 to Y3

UV7 to UV0

WCLIP

HSYNC

UV_SEL

D/APPG

A2CF

AF/AE/AWB

IO7 to IO0

SAA9740H

MHA293

3

CDS7 to CDS0

CDS

AGC,

GAMMA

CCD

hall

sensor

focus

sensor

zoom

encoder

handbook, full pagewidth

iriszoom

focus

1996 Oct 10 18

lens

lens

high speed

shuffle control

IRIS

DRIVER

MOTOR

DRIVER

MOTOR

DRIVER

Fig.9 Camera block diagram (SAA9750H and SAA9740H).

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

PACKAGE OUTLINE

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm

c

y

X

A

48 33

49

64

pin 1 index

1

16

Z

32

E

e

H

E

E

w M

b

p

17

A

2

A

A

1

detail X

SOT314-2

Q

(A )

3

θ

L

p

L

Z

e

DIMENSIONS (mm are the original dimensions)

mm

OUTLINE
VERSION

SOT314-2

A

A1A2A3bpcE

max.

0.20

0.05

1.45

0.25

1.35

IEC JEDEC EIAJ

1.60

UNIT

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

w M

b

p

D

H

D

0.27

0.18

0.17

0.12

D

(1)

(1) (1)(1)

D

10.1

10.1

9.9

9.9

REFERENCES

v M

B

v M

0 2.5 5 mm

scale

eH

12.15

0.5

11.85

1996 Oct 10 19

A

B

H

D

LLpQZywv θ

E

12.15

11.85

0.75

0.45

0.69

0.59

0.12 0.11.0 0.2

EUROPEAN

PROJECTION

Z

D

1.45

1.45

1.05

1.05

ISSUE DATE

94-01-07
95-12-19

E

o

7

o

0

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all LQFP
packages.

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

Wave soldering

Wave soldering is not recommended for LQFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

(order code 9398 652 90011).

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering LQFP packages LQFP48 (SOT313-2),
LQFP64 (SOT314-2) or LQFP80 (SOT315-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1996 Oct 10 20

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

1996 Oct 10 21

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

NOTES

1996 Oct 10 22

Philips Semiconductors Product specification

Advanced Auto Control Function (A2CF) SAA9740H

NOTES

1996 Oct 10 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]/xxx
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Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
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Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,
Chung Hsiao West Road, Sec. 1, P.O. Box 22978,
TAIPEI 100, Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1996 SCA52
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 537021/1200/02/pp24 Date of release: 1996 Oct 10 Document order number: 9397 750 01158