Datasheet saa5700 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA5700

Chinese Character System Teletext
(CCST) decoder

Preliminary specification
File under Integrated Circuits, IC02

1997 May 16

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

FEATURES

• Acquisition and display of the 625-line PAL CCST
Chinese standard for teletext, with Chinese and Latin
character sets

• Supports multiple DRAM sizes: 256K × 4 bits,
1M × 4 bits, 4M × 4 bits and 2 × 1M × 4 bits with an
additional decoder/demultiplexer IC

• Acquires and stores in background up to (typically)
400 pages with 1M × 4 bits external DRAM

• CCST Fastext, with capability of displaying Chinese
characters on Fastext prompt row

• Meshing for reduced contrast video background in
subtitles and boxes

• Full line and screen colour to all edges of screen

• Supports 625-line 50/100 Hz display modes

• Scan-locked and stand-alone sync modes; supports

video-locked sync modes with external PLL

2

• Easy control via high level I

• Sync mode switching and picture centring via I2C-bus

SAFARI commands

• Supports external decryption unit for encrypted data.

C-bus SAFARI commands

SAA5700

GENERAL DESCRIPTION

The SAA5700 is a Chinese teletext decoder suitable for TV
and multimedia applications. It incorporates all the data
slicing, acquisition and display circuitry on-chip, as well as
the logic for memory management. An external DRAM is
used to store the currently displayed page and also the
precaptured teletext pages.

An external ROM is used to store the ideographic Chinese
character set. There is a high level software interface with
easy commands for the control of the decoder. Control is
achieved via the I2C-bus.

The device is available in a QFP64 package.

ORDERING INFORMATION

PACKAGE

TYPE NUMBER

NAME DESCRIPTION VERSION

SAA5700GP QFP64 plastic quad flat package; 64 leads (lead length 1.95 mm);

body 14 × 20 × 2.8 mm

SOT319-2

1997 May 16 2

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

BLOCK DIAGRAM

handbook, full pagewidth

BLACK

CVBS

REF+

STN

I

REF

V

DDD1VSS1VDDD2VSS2VSS3VDDXVSSOVDDAVSSAVSS

33 48 49 2 19 20 9 8 14,16,

35

4

5

10
6

7

SYNC

SEPARATOR

DATA

ACQUISITION

FRONT END

12 MHz

ACQUISITION

TIMING

OSCILLATOR

AND CLOCK

GENERATOR

6 MHz

SAA5700

26

1

OSCOUT

64

OSCIN

59

RESET

ROMCS

RAS

CAS

RA10 to RA0

RD7 to RD0

WE

27
42
53
44

54, 41, 40,
38 to 36,
32 to 28

55 to 58,
52, 51,
47, 46

PACKET
BUFFER

MEMORY

INTERFACE

SAA5700

BUS

PROCESSOR

BLOCK

24 MHz

DISPLAY

INTERFACE

DISPLAY

TIMING

DISPLAY SECTION

63
60
61
62

21
22
23
24

17
18
25

MGG539

DCL
DDA
SCL
SDA

R
G
B
BLAN

LFB
FFB/STTV
ODD/EVEN

Fig.1 Block diagram.

1997 May 16 3

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

PINNING

SYMBOL PIN I/O DESCRIPTION

OSCOUT 1 O oscillator output to crystal
V

SS3

n.c. 3 − not connected
BLACK 4 I/O black level sample and hold capacitor; 100 nF to V
CVBS 5 I video signal input; 100 nF series capacitor, 250Ω source impedance maximum,

STN 6 I/O ADC current reference decoupling; 100 nF to V
I

REF

V

SSA

V

DDA

REF+ 10 I ADC voltage reference decoupling; 100 nF to V
i.c. 11 − internally connected; do not use
i.c. 12 − internally connected; do not use
i.c. 13 − internally connected; do not use
V

SS

n.c. 15 − not connected
V

SS

LFB 17 I scan line flyback input (HSYNC)
FFB/STTV 18 I/O scan field flyback input (VSYNC)/sync to TV output
V

DDX

V

SSO

R 21 O analog Red output
G 22 O analog Green output
B 23 O analog Blue output
BLAN 24 O fast blanking (VDS)
ODD/EVEN 25 O frame rate signal for hardware de-interlace (FRAME)
V

SS

ROMCS 27 O chip select (address decode) for ROM
RA0 28 O bit 0 of address to DRAM, ROM and IC
RA1 29 O bit 1 of address to DRAM, ROM and IC
RA2 30 O bit 2 of address to DRAM, ROM and IC
RA3 31 O bit 3 of address to DRAM, ROM and IC

2 ground ground for I/O pad buffers connect to VSS; internally connected to V

SSA

reference to V

7 I current reference input; 10 kΩ to V

SSA

SSA

SSA

8 ground 0 V power supply; analog
9 supply +5 V power supply; analog

SSA

14 ground connect to VSS for normal use

16 ground connect to VSS for normal use

19 supply +5 V power supply; connect to VDD for normal use
20 ground output stage current return and 0 V

26 ground connect to VSS for normal use

SS1

and V

SS2

1997 May 16 4

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SYMBOL PIN I/O DESCRIPTION

RA4 32 O bit 4 of address to DRAM, ROM and IC
V

SS1

n.c. 34 − not connected
V

DDD1

RA5 36 O bit 5 of address to DRAM, ROM and IC
RA6 37 O bit 6 of address to DRAM, ROM and IC
RA7 38 O bit 7 of address to DRAM, ROM and IC
n.c. 39 − not connected
RA8 40 O bit 8 of address to DRAM, ROM and IC
RA9 41 O bit 9 of address to DRAM, ROM and IC
RAS 42 O row address strobe to DRAM; active LOW
n.c. 43 − not connected
WE 44 O write enable to DRAM and IC; active LOW
i.c. 45 − internally connected; do not use
RD0 46 I/O bit 0 of data bus to/from DRAM, ROM and IC
RD1 47 I/O bit 1 of data bus to/from DRAM, ROM and IC
V

DDD2

V

SS2

n.c. 50 − not connected
RD2 51 I/O bit 2 of data bus to/from DRAM, ROM and IC
RD3 52 I/O bit 3 of data bus to/from DRAM, ROM and IC
CAS 53 O column address strobe to DRAM; active LOW
RA10 54 O bit 10 of address to DRAM, ROM and IC
RD7 55 I/O bit 7 of data bus to/from DRAM, ROM and IC
RD6 56 I/O bit 6 of data bus to/from DRAM, ROM and IC
RD5 57 I/O bit 5 of data bus to/from DRAM, ROM and IC
RD4 58 I/O bit 4 of data bus to/from DRAM, ROM and IC
RESET 59 I chip/processor reset input (active HIGH)
DDA 60 I/O bidirectional serial data to/from optional Decryptor
SCL 61 I primary I
SDA 62 I/O primary I
DCL 63 O serial clock to optional Decryptor
OSCIN 64 I oscillator input from crystal/external clock input

33 ground 0 V power supply digital; connected internally to V

35 supply +5 V power supply digital; connected internally to V

48 supply +5 V power supply digital; connected internally to V
49 ground 0 V power supply digital; connected internally to V

2

C-bus serial clock input

2

C-bus serial data

SS2

DD2

DD1

SS1

and V

and V

SAA5700

SS3

SS3

1997 May 16 5

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

handbook, full pagewidth

DCL

SDA

SCL

62

61

OSCOUT

V

SS3

n.c.

BLACK

CVBS

STN

I

REF

V

SSA

V

DDA

REF+

i.c.
i.c.
i.c.

V

SS

n.c.

V

SS

LFB

FFB/STTV

V

DDX

OSCIN
64

63
1
2
3
4
5
6
7
8
9

10
11
12
13
14
15
16
17
18
19

DDA
60

SAA5700

RESET
59

RD4
58

RD5
57

RD6
56

RD7
55

RA10
54

CAS
53

RD3
52

SAA5700

51

RD2
n.c.

50

V

49

SS2

V

48

DDD2

RD1

47

RD0

46

i.c.

45

WE

44

n.c.

43

RAS

42

RA9

41

RA8

40

n.c.

39

RA7

38

RA6

37

RA5

36

V

35

DDD1

n.c.

34

V

33

SS1

20

21

22

23

24

25

B

G

BLAN

ODD/EVEN

SSO

V

R

Fig.2 Pin configuration.

1997 May 16 6

26

V

SS

27

28

RA0

ROMCS

29

RA1

30

RA2

31

RA3

32

RA4

MGG538

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

HIGH LEVEL I2C-BUS COMMAND INTERFACE

This device communicates via the I2C-bus using the SAFARI protocol. The following section indicates the protocol which
is supported by this decoder.

User commands

Table 1 lists the CCST user command codes in TV mode; Table 2 lists the CCST user command codes in Text mode.

Table 1 TV mode user command codes

FUNCTION ID

(HEX)

00 −
01 −
02 −
03 PICTURE
04 STATUS
05 −
06 −
07 TIME
08 −
09 −
0A −

0B −
0C −
0D −
0E −
0F −

10 TV PROGRAMME 0

11 TV PROGRAMME 1

12 TV PROGRAMME 2

13 TV PROGRAMME 3

14 TV PROGRAMME 4

15 TV PROGRAMME 5

16 TV PROGRAMME 6

17 TV PROGRAMME 7

18 TV PROGRAMME 8

19 TV PROGRAMME 9
1A TV PROGRAMME10
1B TV PROGRAMME11
1C TV PROGRAMME 12
1D TV PROGRAMME 13
1E TV PROGRAMME14
1F TV PROGRAMME 15

FUNCTION

Table 2 Text mode user command codes

FUNCTION ID

(HEX)

20 RED
21 GREEN
22 YELLOW
23 SUBTITLE
24 STATUS
25 HOLD TOGGLE
26 REVEAL
27 CANCEL TOGGLE
28 INDEX

29 −
2A BROWSE
2B REVEAL SET TOGGLE
2C −
2D PREVIOUS
2E DISPLAY CHINESE PROMPT
2F SUBCODE TOGGLE

30 1

31 2

32 3

33 4

34 5

35 6

36 7

27 8

28 9

29 0
3A SIZE
3B UP
3C DOWN
3D CYAN
3E MIX
3F TEXT

FUNCTION

1997 May 16 7

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

Extended commands

The extended commands for the decoder are listed in Table 3.

Table 3 Extended commands

OBJECT FUNCTION

NAME

Display 48 set sync mode 04 1 − sync mode none

Processor 52 restart software 06 3 − FFFFFCH none
Memory and OSD 53 read packet 03 1

ID

(HEX)

NAME

set display
position

write packet 06 1

OSD mode on 08 0 − none none
OSD mode off 0A 0 − none none
OSD display 0E 0 − none none
clear display page 10 0 − none none

(HEX)

08 4 −

PARAMETER LENGTH

(BYTES)

ID

INPUT OUTPUT INPUT OUTPUT

[+1]

+40

PARAMETERS

row start, line start none

40 packet number,

[Designation
code]

− packet number,
packet data

packet data

none

1997 May 16 8

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER MIN. MAX. UNITS

V

DDD1

V

DDD2

V

DDA

V

DDX

V

I(max)

V

O(max)

∆V

DDX-DDn

I

I(d)

I

O(d)

I

O(max)

T

stg

T

amb

digital supply voltage 1 −0.3 +6.5 V
digital supply voltage 2 −0.3 +6.5 V
analog supply voltage −0.3 +6.5 V
supply voltage X −0.3 +6.5 V
maximum input voltage (any input) −0.3 VDD+ 0.5 V
maximum output voltage (any output) −0.3 VDD+ 0.5 V
supply voltage difference

between V

DDX

, V

DDD1

, V

DDD2

and V

DDA

− 0.25 V
diode input current (DC) − 20 mA
diode output current (DC) − 20 mA
maximum output current (any output) − 10 mA
storage temperature −55 +125 °C
operating ambient temperature −20 +70 °C

CHARACTERISTICS

T

= −20 to +70 °C and V

amb

= 4.5 to 5.5 V; unless otherwise indicated.

DDn

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

Power supplies

V

DDD1

I

DDD1

V

DDD2

I

DDD2

V

DDA

I

DDA

V

DDX

I

DDX

I

DD(tot)

digital supply voltage 1 4.5 5.0 5.5 V
digital supply current 1 − 95 140 mA
digital supply voltage 2 4.5 5.0 5.5 V
digital supply current 2 − 2.4 6.5 mA
analog supply voltage 4.5 5.0 5.5 V
analog supply current − 40 53 mA
supply voltage X 4.5 5.0 5.5 V
supply current X − 32 40 mA
total supply current − 170 240 mA

Inputs

CVBS
V

sync

V

bur(p-p)

sync amplitude 0.1 0.3 0.6 V
colour burst amplitude

0 0.3 4 V

(peak-to-peak value)

V

I(video)(p-p)

video input amplitude (peak-to-peak

0.7 1.0 1.4 V
value)

V

I(data)

Z

source

V

SW(I)

teletext data amplitude 0.29 0.46 0.71 V
source impedance −−250 Ω
input switching level of sync

1.6 1.9 2.2 V
separator

C

i

input capacitance −−10 pF

1997 May 16 9

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

REF

R

IREF

V

IREF

RESET
V

IL

V

IH

I

LI

LFB (HSYNC)
V

IL

V

IH

V

hys

I

LI

I

I(max)

t

W(LFB)

t

i(r)

t

i(f)

FFB (VSYNC)
V

IL

V

IH

I

LI

I

I(max)

t

W(FFB)

t

i(r)

t

i(f)

Input/outputs

resistor to V
voltage on I

SSA

pin VDD=5V − 2.3 − V

REF

− 10 − kΩ

LOW-level input voltage −0.3 − +0.8 V
HIGH-level input voltage 2.0 − VDD+ 0.5 V
input leakage current VI= 0 to V

DD

−10 − +10 µA

LOW-level input voltage −0.3 − +0.6 V
HIGH-level input voltage 2.4 − VDD+ 0.5 V
input hysteresis voltage − 0.7 − V
input leakage current VI= 0 to V

DD

−10 − +10 mA
maximum input current note 1 −1 − +1 µA
LFB input pulse width 200 −−ns
input rise time −−100 ns
input fall time −−100 ns

LOW-level input voltage −0.3 0.3V
HIGH-level input voltage 0.7V
input leakage current VI= 0 to V

DD

−10 +10 −µA

DD

VDD+ 0.5 − V

DD

− V

maximum input current −1+1− mA
FFB input pulse width 1 −−display

lines
input rise time −−500 ns
input fall time −−500 ns

REF+
C

V

REF+

REF+

decoupling capacitor to V

SSA

DC voltage on REF+ 2.3 2.5 2.7 V

OSCIN AND OSCOUT
V

osc(p-p)

oscillation amplitude
(peak-to-peak value)

C
f
∆f

i

osc

osc

input capacitance −−10 pF
oscillator frequency − 6.0 − MHz
oscillator frequency tolerance − 500 − ppm

BLACK
C

BLACK

V

BLACK

storage capacitor to V

SSA

black level for nominal sync
amplitude

1997 May 16 10

− 100 − nF

− V

DD

− V

− 100 − nF

1.75 2.0 2.25 V

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

I

LI

STN
C

STN

V

STN

SCL (OPEN-DRAIN)
f

SCL

V

IL

V

IH

V

OL

I

LI

C

i

C

L

t

i(r)

t

i(f)

t

o(f)

SDA (OPEN-DRAIN)
V

IL

V

IH

V

OL

I

LI

C

i

C

L

t

i(r)

t

i(f)

t

o(f)

input leakage current VI= 0 to V

decoupling capacitor to V

SSA

DD

−10 − +10 µA

− 100 − nF

DC voltage on STN 0.95 1.1 1.25 V

SCL clock frequency 0 − 400 kHz
LOW-level input voltage −0.5 − +1.5 V
HIGH-level input voltage 3.0 − VDD+ 0.5 V
LOW-level output voltage IOL= 3 mA 0 − 0.4 V

I

= 6 mA 0 − 0.6 V

OL

input leakage current VI= 0 to V

DD

−10 − +10 µA
input capacitance −−10 pF
load capacitance −−400 pF
input rise time f

= 100 kHz;

SCL

50 − 1000 ns

note 2
f

= 400 kHz;

SCL

50 − 300 ns

note 2

input fall time f

= 100 kHz;

SCL

50 − 300 ns

note 3
f

= 400 kHz;

SCL

50 − 300 ns

note 3

output fall time 3 to 1.5 V;

50 − 250 ns

IOL=3mA

LOW-level input voltage −0.5 − +1.5 V
HIGH-level input voltage 3.0 − VDD+ 0.5 V
LOW-level output voltage IOL= 3 mA 0 − 0.4 V

= 6 mA 0 − 0.6 V

I

OL

input leakage current VI= 0 to V

DD

−10 − +10 µA
input capacitance −−10 pF
load capacitance −−400 pF
input rise time f

= 100 kHz;

SCL

50 − 1000 ns

note 2
f

= 400 kHz;

SCL

50 − 300 ns

note 2

input fall time f

= 100 kHz;

SCL

50 − 300 ns

note 3
f

= 400 kHz;

SCL

50 − 300 ns

note 3

output fall time 3 to 1.5 V;

50 − 250 ns

IOL=3mA

1997 May 16 11

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

DCL AND DDA (INTERNAL PULL-DOWN RESISTOR)
V

IL

V

IH

V

OL

I

LI

C

i

C

L

t

o(f)

RD7 TO RD0
V

IL

V

IH

V

OL

V

OH

I

LI

C

i

C

L

t

o(r)

t

o(f)

Outputs

LOW-level input voltage −0.3 − +0.8 V
HIGH-level input voltage 2.0 − VDD+ 0.5 V
LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
input leakage current VI= 0 to V

DD

−10 − +10 µA
input capacitance −−10 pF
load capacitance −−50 pF
output fall time 2.2 to 0.6 V;

−−10 ns

IOL= 1.6 mA

LOW-level input voltage −0.3 − +0.8 V
HIGH-level input voltage 2.0 − VDD+ 0.5 V
LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
HIGH-level output voltage IOH= −0.2 mA 2.4 − V
input leakage current VI= 0 to V

DD

−10 − +10 µA

DD

V

input capacitance −−10 pF
load capacitance −−30 pF
output rise time into C
output fall time into C

L

L

0.6 to 2.2 V −−10 ns

2.2 to 0.6 V −−10 ns

CAS
V

OL

V

OH

C

L

t

o(r)

t

o(f)

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
HIGH-level output voltage IOH= −0.2 mA 2.4 − V
load capacitance −−50 pF
output rise time into C
output fall time into C

RAS, WE, ROMCS, RA10 TO RA0
V

V
C
t
t

OL
OH

L
o(r)
o(f)

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
HIGH-level output voltage IOH= −0.2 mA 2.4 − V
load capacitance −−50 pF
output rise time into C

output fall time into C
ODD/EVEN (FRAME)
V

V
C
t
t

OL
OH

L
o(r)
o(f)

LOW-level output voltage IOL= 1.6 mA 0 − 0.4 V
HIGH-level output voltage IOH= −0.2 mA 2.4 − V
load capacitance −−200 pF
output rise time into C
output fall time into C

DD

L

L

L

L

L

L

0.6 to 2.2 V −−5ns

2.2 to 0.6 V −−5ns

DD

0.6 to 2.2 V −−10 ns

2.2 to 0.6 V −−10 ns

DD

0.6 to 2.2 V −−200 ns

2.2 to 0.6 V −−200 ns

V

V

V

1997 May 16 12

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

STTV
V

STTV

V

STTV(DC)

I

O(drive)

R, G AND B
I

OL

I

OH

R

L

C

L

t

o(r)

t

o(f)

BLAN (VDS)
V

OH

V

OL

C

L

t

o(r)

t

o(f)

t

SK

VCS, TCS amplitude 0.2 0.3 0.4 V
nominal DC voltage 1.85 2.0 2.15 V
output drive −−3mA

LOW-level output current (black

−10 − +10 µA

level)
HIGH-level output current

V

= 5 V 5.1 6.0 6.9 mA

DDX

(full intensity)
load resistance to V

1V

output

(p-p)

for nominal

SSO

− 160 −Ω

load capacitance −−20 pF
output rise time 10% to 90% −−15 ns
output fall time 90% to 10% −−15 ns

HIGH-level output voltage IOH= −2mA VDD− 0.25 − V

DD

V
LOW-level output voltage IOL= 2 mA 0 − 0.2 V
load capacitance −−50 pF
output rise time 10% to 90% −−15 ns
output fall time 90% to 10% −−15 ns
skew delay between outputs R,G,B

−−15 ns

and BLAN

Notes

1. This current is the maximum allowed into the inputs when line and field flyback signals are connected to these inputs.
An external series resistor must be used to limit the input currents to 1 mA.

2. Measured from V

3. Measured from V

IL(max)
IH(min)

to V
to V

IH(min)
IL(max)

.
.

1997 May 16 13

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

Table 4 I2C-bus Timing (see note 1 and Fig.3)

SYMBOL PARAMETER

f

SCL

t

LOW

t

HIGH

t

SU;DAT

t

HD;DAT

t

SU;STO

t

BUF

t

HD;STA

t

SU;STA

t

r

t

f

SCL clock frequency 0 100 0 400 kHz
LOW period of the SCL clock 4.7 − 1.3 −µs
HIGH period of the SCL clock 4.0 − 0.6 −µs
data set-up time 250 − 100 −µs
date hold time 0 − 0 −µs
set-up time clock HIGH to STOP 4.7 − 0.6 −µs
set-up time STOP to START 4.7 − 1.3 −µs
START hold time 4.0 − 0.6 −µs
set-up time clock rising edge to START 4.7 − 0.6 −µs
rise time of both SDA and SCL signals − 1000 − 300 ns
fall time of both SDA and SCL signals − 300 − 300 ns

Note

2

1. The I

C-bus interface pins SDA and SCL may pull the data and clock lines below 3 V while the power supply VDD is

in the range 0.4 to 0.8 V. Outside this range, the SDA and SCL pins behave correctly.

100 kHz 400 kHz

MIN. MAX. MIN. MAX.

SAA5700

UNIT

handbook, full pagewidth

SCL

SDA

t

SU;STA

t

BUF

t

SU;DAT

t

LOW

t

HD;STA

t

HIGH

Fig.3 Primary I2C-bus timing.

t

r

t

HD;DAT

t

f

t

SU;STO

MGG541

1997 May 16 14

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

DRAM Interface timing (see note 1 and Fig.4)

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

T

cy(RAS)

t

pch(RAS)

t

h(CAS)

t

d(RAS-CAS)

t

WL(CAS)

T

cy(CAS)

t

pch(CAS)

t

h(CAS-RAS)

t

pch(CAS-RAS)

t

su(RA)

t

h(RA)

t

su(CA)

t

h(CA)

t

su(R)

t

h(R)(CAS)

t

h(R)(RAS)

t

su(W)

t

h(W)

t

su(i)(D)

t

h(i)(D)

t

ACC(R)(CAS)

t

ACC(R)(RAS)

RAS cycle time − 375 − ns
RAS precharge time 60 −−ns
CAS hold time 80 −−ns
RAS to CAS delay time 20 −−ns
CAS pulse width LOW 20 −−ns
CAS page mode cycle time 50 −−ns
CAS precharge time 10 −−ns
RAS hold time after CAS 20 −−ns
CAS to RAS precharge time 10 −−ns
row address set-up time 0 −−ns
row address hold time 10 −−ns
column address set-up time 0 −−ns
column address hold time 15 −−ns
read command set-up time 0 −−ns
read command hold time from (CAS) 0 −−ns
read command hold time from (RAS) 10 −−ns
write command set-up time 0 −−ns
write command hold time 15 −−ns
data input set-up time 0 −−ns
data input hold time 15 −−ns
read access time from (CAS) −−20 ns
read access time from (RAS) −−80 ns

Note

1. Based on a display clock frequency of 24 MHz, maximum 24 MHz + 500 ppm.

1997 May 16 15

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

handbook, full pagewidth

RAS

CAS

t

RP

t

ASR

t

RAH

t

RCD

t

ASC

t

CSH

t

CAS

t

CAH

t

PC

SAA5700

t

CYC

t

RSH

t

CP

READ
CYCLE

WRITE
CYCLE

ADDRESS

WE

RD OUT

WE

RD IN

t

WCS

t

RCS

t

RAC

t

DS

t

CAC

t

DH

t

RCH

t

WCH

t

RRH

MGG542

Fig.4 DRAM interface timing.

1997 May 16 16

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

APPLICATION INFORMATION

handbook, full pagewidth

crystal

oscillator

22 pF

CVBS

front

end

+5 V

HSYNC
VSYNC

R/G/B/BLAN

TV

display

RGB ground

ODD/EVEN

2

C-bus to

I

microcontroller

RESET

6 MHz

100 kΩ
OSCOUT

22 pF

100 nF

75 Ω

10 kΩ

100 nF

100 nF

100 nF

100 nF

R/G/B/BLAN

ODD/EVEN

OSCIN

V

SS3

CVBS

V

SSA

I

REF

STN

REF+

BLACK

V

DDA

LFB

FFB

V

SSO

SDA

SCL

+5 V +5 V

35 33 19

64

1

2

5

8

7

6

10

4

9

17
18
21 to 24
20

25

62
61

RESET

0 V

100 nF

V

DDD1VSS1VDDX

100 nF

52, 51, 47, 46

SAA5700

1459 16 26

V

SS

28 to 32,
36 to 38,
40,41,54

55 to 58

V

SS

DCL

63

DDA

60

V

48

V

49

WE

44

CAS

53

RAS

42

RD3 to RD0

RA0 to RA10

ROMCS

27

V

SS

DDD2
SS2

RD7

to

RD4

+5 V

DI

100 nF

OE

0 V

74LS573

EN

V

DD

V

SS

WE

CAS
RAS

D3 to D0

A10 to A0

DO

V

DD

V

SS

DRAM

OE

D3 to D0

D7 to D4

A18 to A0

+5 V

0 V

MGG540

0 V

OE

SAA5700

ROM

CE

0 V

+5 V

0 V

Fig.5 Application Diagram.

1997 May 16 17

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

PACKAGE OUTLINE

QFP64: plastic quad flat package; 64 leads (lead length 1.95 mm); body 14 x 20 x 2.8 mm

c

y

X

51 33

52

32

Z

A

E

SAA5700

SOT319-2

pin 1 index

64

1

w M

b

e

DIMENSIONS (mm are the original dimensions)

mm

A

max.

3.20

0.25

0.05

2.90

2.65

0.25

UNIT A1A2A3b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

p

D

H

D

cE

p

0.50

0.25

0.14

20.1

19.9

0.35

0 5 10 mm

(1)

(1) (1)(1)

D

14.1

13.9

19

Z

D

scale

eH

H

24.2

1

23.6

20

D

B

e

H

E

w M

b

p

v M

A

v M

B

LLpQZywv θ

E

18.2

17.6

1.0

0.6

A

2

A

E

1.4

1.2

A

1

detail X

0.2 0.10.21.95

Q

(A )

3

θ

L

p

L

Z

E

D

1.2

0.8

o

7

o

0

1.2

0.8

OUTLINE
VERSION

SOT319-2

IEC JEDEC EIAJ

REFERENCES

1997 May 16 18

EUROPEAN

PROJECTION

ISSUE DATE

92-11-17
95-02-04

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“IC Package Databook”

Reflow soldering

Reflow soldering techniques are suitable for all QFP
packages.

The choice of heating method may be influenced by larger
plastic QFP packages (44 leads, or more). If infrared or
vapour phase heating is used and the large packages are
not absolutely dry (less than 0.1% moisture content by
weight), vaporization of the small amount of moisture in
them can cause cracking of the plastic body. For more
information, refer to the Drypack chapter in our

Reference Handbook”

Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.

Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.

Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.

(order code 9398 652 90011).

“Quality

(order code 9397 750 00192).

SAA5700

Wave soldering

Wave soldering is not recommended for QFP packages.
This is because of the likelihood of solder bridging due to
closely-spaced leads and the possibility of incomplete
solder penetration in multi-lead devices.

If wave soldering cannot be avoided, the following
conditions must be observed:

• A double-wave (a turbulent wave with high upward

pressure followed by a smooth laminar wave)
soldering technique should be used.

• The footprint must be at an angle of 45° to the board

direction and must incorporate solder thieves
downstream and at the side corners.

Even with these conditions, do not consider wave
soldering the following packages: QFP52 (SOT379-1),
QFP100 (SOT317-1), QFP100 (SOT317-2),
QFP100 (SOT382-1) or QFP160 (SOT322-1).

During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.

Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.

A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.

Repairing soldered joints

Fix the component by first soldering two diagonally­opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.

1997 May 16 19

Philips Semiconductors Preliminary specification

Chinese Character System Teletext

SAA5700

(CCST) decoder

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

Purchase of Philips I
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

2

C COMPONENTS

2

C components conveys a license under the Philips’ I2C patent to use the

1997 May 16 20

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

NOTES

1997 May 16 21

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

NOTES

1997 May 16 22

Philips Semiconductors Preliminary specification

Chinese Character System Teletext
(CCST) decoder

SAA5700

NOTES

1997 May 16 23

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,

Tel. [phone], Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: seeSouth America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15thfloor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

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Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

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Hungary: seeAustria
India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. [phone], Fax. [phone]

Indonesia: see Singapore
Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. [phone], Fax. [phone]
Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,

TEL AVIV 61180, Tel. [phone], Fax. [phone]
Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. [phone], Fax. [phone]
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. [phone], Fax. [phone]
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. [phone], Fax. [phone]
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. [phone], Fax. [phone]
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. [phone]

Middle East: see Italy

Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Rua do Rocio 220, 5th floor, Suite 51,
04552-903 São Paulo, SÃO PAULO - SP, Brazil,
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Spain: Balmes 22, 08007 BARCELONA,
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Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone], Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,
Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1997 SCA54
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 547047/50/01/pp24 Date of release: 1997 May 16 Document order number: 9397 750 01008