Datasheet saa5261, saa5262, saa5263 DATASHEETS (Philips)

INTEGRATED CIRCUITS

DATA SH EET

SAA5261; SAA5262; SAA5263

10-page intelligent teletext
decoders

Product specification
File under Integrated Circuits, IC02

1998 Apr 22

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

FEATURES
SAA5261, SAA5262 and SAA5263

• Complete 625-line teletext decoder in a single
integrated circuit thereby reducing printed-circuit board
area and cost

• Automatic detection of transmitted pages so that only
existing pages will be selected by page-up and
page-down once inventory validated

• Automatic detection of transmitted Fastext links or
service information (packet 8/30)

• On-screen display for user interface (menus, etc.) using
teletext and dedicated menu icons

• Video Programming System (VPS) decoding

• Wide Screen Signalling (WSS) decoding

• 8-page Fastext decoder

• 6-page TOP decoder in addition to capture ofBasic TOP

Table (BTT) and 3 Additional Information Table (AIT)
pages

• 4-page user defined list mode

• Yugoslavian, Cyrillic, Greek/Turkish, Thai,

Arabic/Hebrew, Pan-European and
Arabic/English/French language coverage

• High level command interface via I
control from a low software overhead

• High level command interface is backward compatible to
SAFARI interface

• 625 and 525 line display

• RGB interface to standard colour decoder ICs, push-pull

output drive

• Versatile 8-bit open-drain I/O expander

• Single 12 MHz crystal oscillator for reduced cost

• +5 V power supply.

2

C-bus giving easy

SAA5262 and SAA5263

• Automatic Channel Installation (ACI)

• Enhanced SAFARI interface providing additional

commands.

SAA5263

• Electronic Programme Guide (EPG) feature.

GENERAL DESCRIPTION

The SAA526xPS ICs are single-chip 10-page 625-line
World System Teletext (WST) decoders with a high level
command interface, SAFARI compatible.

It has been designed so that the overall system cost is kept
to a minimum. This has been achieved through the
capability of the device to be driven from a single +5 V
power supply, low cost 12 MHz crystal oscillator and the
high level command interface, which offers the benefit of
low software overhead in the TV microcontroller.

The SAA526xPS offers automatic detection of Fastext or
TOP transmissions. The device also incorporates a facility
to detect the pages in the transmission, which allows only
transmitted pages to be selected by page-up and
page-down.

SAA5262 and SAA5263 provide Automatic Channel
Installation (ACI) information.

SAA5263 provides access to Electronic Programme Guide
(EPG) information.

1998 Apr 22 2

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

ORDERING INFORMATION

TYPE NUMBER

PACKAGE

NAME DESCRIPTION VERSION

SAA5261PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
SAA5262PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1
SAA5263PS SDIP52 plastic shrink dual in-line package; 52 leads (600 mil) SOT247-1

QUICK REFERENCE DATA

SYMBOL PARAMETER MIN. TYP. MAX. UNIT

V

DDD

I

DDD(M)

I

DDA

I

DDD(T)

f

xtal

T

amb

digital supply voltage 4.5 5.0 5.5 V
microcontroller supply current − 20 35 mA
analog supply current − 35 50 mA
teletext supply current − 50 80 mA
crystal frequency − 12 − MHz
operating ambient temperature −20 − +70 °C

1998 Apr 22 3

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

BLOCK DIAGRAM

handbook, full pagewidth

RESET

FRAME

PL

43

POWER-ON

27

21

ACQUISITION

SERIAL-TO-

CONVERTER

RESET

24 TO 18
HAMMING
DECODER

TELETEXT

AND

DECODING

PARALLEL

PON RGBREF G

DRAM

V

DDAVDDD(T)VDDD(M

VDS COR B

35

30 29 31 32 33 34 38 39 44

DISPLAY

PACKET 26

PROCESSING

ENGINE

R

REFRESH

AND TIMING

SAA526xPS DISLCBD

CONTROLLER

VPS

ACQUISITION

AND

DECODING

WSS

ACQUISITION

AND

DECODING

10 k × 8

DRAM

MEMORY

INTERFACE

SYSTEM

I2C-BUS

INTERFACE

)

9 to 12

1-8

52
20
16
48

17
47

18
46

19
45

51
15

14
50
49

res

E/W
PDI
SA

FP
DIS8/30
HSMODE
DISDSR
VSMODE
PUINL
V0-V7

ME8/30T
SDA1

SCL1
SDA2
SCL2

DATA SLICER

AND CLOCK

REGENERATOR

ANALOG-

26

I

ref

REFERENCE
GENERATOR

V

SSA

V

SSD1

V

SSD2

TELETEXT

OR

VPS

CONTROL

ANALOG-

TO-DIGITAL

CONVERTER

23281322 24

Fig.1 Block diagram.

1998 Apr 22 4

INPUT CLAMP

AND SYNC

SEPARATOR

DISPLAY

CLOCK

GENERATOR

12 MHz
CLOCK

GENERATOR

42 41

XTALOCVBS2CVBS1

XTALI

25

36

37

40

BLACK

HSYNC

VSYNC

OSCGND

MGL418

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

PINNING

SYMBOL PIN DESCRIPTION

V0 1 versatile open-drain input/output bit 0 (should be tied HIGH)
V1 2 versatile open-drain input/output bit 1 (should be tied HIGH)
V2 3 versatile open-drain input/output bit 2 (should be tied HIGH)
V3 4 versatile open-drain input/output bit 3 (should be tied HIGH)
V4 5 versatile open-drain input/output bit 4 (should be tied HIGH)
V5 6 versatile open-drain input/output bit 5 (should be tied HIGH)
V6 7 versatile open-drain input/output bit 6 (should be tied HIGH)
V7 8 versatile open-drain input/output bit 7 (should be tied HIGH)
res 9 reserved
res 10 reserved
res 11 reserved
res 12 reserved
V

SSD1

SCLK1 14 serial clock input 1 (NVRAM)
SDAT1 15 serial data input/output 1 (NVRAM)
SA 16 slave address input: LOW selects 58H; HIGH selects 60H
FP 17 field polarity input: LOW selects first half line; HIGH selects second half line at the start of an

HSMODE 18 horizontal sync mode control input: LOW selects HSYNC on rising edge
VSMODE 19 vertical sync mode control input. LOW selects VSYNC on rising edge
PDI 20 power-down imminent input: this input should be pulled LOW to indicate that the system is

PL 21 phase-lock output: HIGH indicates that the system is phase-locked to the CVBS input
V

SSA

CVBS1 23 CVBS input: this signal is applied via a 100 nF capacitor (nominal input 1 V (p-p)
CVBS2 24 this pin should be connected to ground if unused
BLACK 25 black level input: a 100 nF capacitor should be connected to V
I

ref

FRAME 27 Frame output for use in non-interlaced displays: during teletext off, teletext mixed with TV

V

SSD2

COR 29 contrast reduction: active LOW output which allows selective contrast reduction of the

PON 30 picture on output: HIGH indicates that a TV picture is present and that the SAA526xPS is in

RGBREF 31 RGB reference input: drive level reference for RGB outputs
B 32 blue dot rate character output of the blue colour information: the high voltage level is defined

13 digital ground 1

even field

about to lose power

22 analog ground

SSA

26 reference current input for analog circuits: for correct operation a 27 kΩ resistor should be

connected to V

SSA

picture and subtitles this pin is inactive. In full teletext mode this pin provides a 25 Hz square
wave. FRAME = 1 = odd, FRAME = 0 = even.

28 digital ground 2

television picture to enhance a mixed mode display

TV mode, mix mode, subtitle mode or news flash mode

by the RGBREF pin (can source 4 mA)

1998 Apr 22 5

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SYMBOL PIN DESCRIPTION

G 33 green dot rate character output of the green colour information: the high voltage level is

defined by the RGBREF pin (can source 4 mA)

R 34 red dot rate character output of the red colour information: the high voltage level is defined by

the RGBREF pin (can source 4 mA)
VDS 35 push-pull output for blanking the TV picture
HSYNC 36 horizontal sync input: the polarity of this pulse is set by input HSMODE
VSYNC 37 vertical sync input: the polarity of this pulse is set by input VSMODE
V

DDA

V

DDD(T)

OSCGND 40 ground for crystal oscillator
XTALI 41 12 MHz crystal oscillator input
XTALO 42 12 MHz crystal oscillator output
RESET 43 reset input
V

DDD(M)

PUINL 45 power-up in list mode control input: LOW selects auto TOP/Fastext on power-up; HIGH

DISDSR 46 disable default status row input: LOW enables display of status row
DIS8/30 47 disable packet 8/30 display input: LOW enables display of packet 8/30
DISLCBD 48 disable Link Control Byte (LCB) decode input: LOW enables decoding of the LCB in Fastext
SCLK2 49 serial clock input (I
SDAT2 50 serial data input/output (I
ME8/30T 51 mesh 8/30 and time displays input: HIGH will select a meshed display for the packet 8/30 and

E/

W 52 East/West language select input: LOW selects West language

38 analog supply voltage (+5 V)
39 digital supply voltage for teletext circuits (+5 V)

44 digital supply voltage for microcontroller (+5 V)

selects LIST mode on power-up

2

C-bus)

2

C-bus)

time

1998 Apr 22 6

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

handbook, halfpage

V0
V1
V2
V3
V4
V5
V6

V7
res
res
res
res

V

SSD1

SCL1

SDA1

SA
FP

HSMODE
VSMODE

PDI

PL

V

SSA

CVBS1
CVBS2
BLACK

I

ref

1
2
3
4
5
6
7
8

9
10
11
12
13

SAA526xPS

14
15
16
17
18
19
20
21
22
23
24
25
26

MGL417

52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27

E/W
ME8/30T
SDA2
SCL2
DISLCBD
DIS8/30
DISDSR
PUINL
V

DDD(M)

RESET
XTALO
XTALI
OSCGND
V

DDD(T)

V

DDA

VSYNC
HSYNC
VDS
R
G
B
RGBREF
PON
COR
V

SSD2

FRAME

Fig.2 Pin configuration.

1998 Apr 22 7

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

HIGH LEVEL COMMAND INTERFACE

The I2C-bus interface is used to pass control commands and data between the SAA526xPS and the television
microcontroller. The interface uses high level commands, which are backward compatible with the SAFARI interface.

The formats for the I2C-bus transmission are as follows:

Table 1 User command

START I

Table 2 System command

2

C-bus

ADDRESS

WRITE ACK COMMAND ACK STOP

START I2C-bus

ADDRESS

Table 3 System read

START I2C-bus

ADDRESS

2

Table 4 I

C-bus address

PIN 16 = LOW PIN 16 = HIGH

ADDRESS DESCRIPTION ADDRESS DESCRIPTION

01 01 100 read = 1; write = 0 0110 000 read = 1; write = 0

Table 5 Control commands

COMMAND

BYTE

(HEX)

DATA
BYTE

03 − picture
04 − TV status
07 − time
10 − program 0
11 − program 1
12 − program 2
13 − program 3
14 − program 4
15 − program 5
16 − program 6
17 − program 7
18 − program 8

19 − program 9
1A − program 10
1B − program 11
1C − program 12
1D − program 13
1E − program 14

WRITE ACK COMMAND ACK PARAMETER ACK STOP

READ ACK DATA NACK STOP

COMMAND

DESCRIPTION

COMMAND

BYTE
(HEX)

DATA
BYTE

COMMAND

DESCRIPTION

1F − program 15
20 − red
21 − green
22 − yellow
23 − subtitle
24 − text status
25 − hold
26 − reveal
27 − cancel
28 − index
29 − list toggle
2B − reveal toggle
2C − store
2D − previous
2F − subcode
30 − digit 1
31 − digit 2
32 − digit 3

1998 Apr 22 8

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

COMMAND

BYTE

(HEX)

33 − digit 4
34 − digit 5
35 − digit 6
36 − digit 7
37 − digit 8
38 − digit 9
39 − digit 0
3A − size
3B − up
3C − down
3D − cyan
3E − mix
3F − text
4A 0 read PAL + line
89 00 to 41 select list
91 00 to 03 or

92 00 read broadcast status
93 00 or 01 read network

94 0 read PCS byte
98 OSD data OSD mode on
99 0 OSD mode off
9A 0 OSD display on
9B 0 OSD display off
9C 0 OSD cursor on
9D 0 OSD cursor off
9E 0, row, column OSD position
9F 0 followed by

A0 00 to FF bitwise parameter or

A1 00 to FF bitwise parameter

A2 00 to FF returns V7to V0 on

A3 PWM

B0 reg data or text register
B1 reg data and text register
B2 reg data read text register
B8 0 quick list

DATA
BYTE

00 to 80

20 bytes

No.

PWM

data

COMMAND

DESCRIPTION

force mode

identification

OSD data write

V7 to V0

and V7 to V0

2

C-bus read

I
PWM control

COMMAND

BYTE
(HEX)

SAA5262 and SAA5263 only

B9 0 get time
C0 0 = disable set ACI mode

C1 0 get ACI status
C2 0 select next ACI channel
C3 information type get ACI information
D0 0 get device version
D1 page type and

D2 page type get page number
D3 page type and

D4 page type get language
D5 row 24 control enable/disable row 24
D6 start column

D7 string type,

D8 option type and

D9 movement type move cursor

SAA5263 only

C8 EPG mode set EPG mode
C9 0 get EPG status

CA number and list

CB 0 get number of EPG

CC CNI index get found EPG CNIs
CD number and list

CE table type, item

DATA
BYTE

1 = enable

page number

language

and

length string

index length

and string

values

of features

of CNIs

type and string

index

COMMAND

DESCRIPTION

set page number

set language

set row 24 contents

set string contents

set option

set EPG feature list

CNIs found

set EPG CNI list

get EPG item
information

1998 Apr 22 9

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

handbook, full pagewidth

23

lines

10.5

µs

∆X

∆Y

25

rows

64 µs

52 µs

40 µs

TEXT DISPLAY AREA

40 characters

TV PICTURE AREA

FIELD SCANNING AREA

Fig.3 625 display format.

250

lines

287

lines

MGL122

312

lines

handbook, full pagewidth

17

lines

10.5

µs

∆X

∆Y

25

rows

63.55 µs

52 µs

40 µs

TEXT DISPLAY AREA

40 characters

TV PICTURE AREA

FIELD SCANNING AREA

Fig.4 525 display format.

1998 Apr 22 10

225

lines

243

lines

MGL123

263

lines

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

CHARACTER SETS
Geographical coverage

handbook, full pagewidth

handbook, full pagewidth

MGL412

Fig.5 SAA5261PS/101 Yugoslavia.

Fig.6 SAA5261PS/109 Cyrillic, SAA5262PS/122 Cyrillic.

1998 Apr 22 11

MGL128

Philips Semiconductors Product specification

,,,,,

,,,,,

,,,,,

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

handbook, full pagewidth

handbook, full pagewidth

MGL129

Fig.7 SAA5261/113 Greek/Turkish, SAA5262PS/123 Greek/Turkish.

1998 Apr 22 12

MGL132

Fig.8 SAA5261PS/104 Thai, SAA5262PS/124 Thai.

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

ok, full pagewidth

handbook, full pagewidth

MGL130

Fig.9 SAA5261P/105 Arabic/Hebrew, SAA5262PS/125 Arabic/Hebrew.

MGL133

Fig.10 SAA5261PS/117 Pan-European, SAA5262PS/128 Pan-European/Eastern, SAA5263PS/137

Pan-European.

1998 Apr 22 13

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

handbook, full pagewidth

dbook, full pagewidth

MGL131

Fig.11 SAA5261PS/108 Arabic/English/French, SAA5262PS/126 Arabic/English/French.

MGL413

Fig.12 SAA5261PS/110 Iranian, SAA5262PS/120 Iranian.

The character sets for the languages Yugoslavian, Cyrillic, Greek/Turkish, Thai, Arabic/Hebrew, Pan-European,
Arabic/English/French and Iranian are available on request.

1998 Apr 22 14

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

LIMITING VALUES

In accordance with Absolute Maximum Rating System (IEC 134).

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

V

DDD

V

DDA

V

I

V

O

I

O

I

I/OK

T

amb

T

stg

Note

1. This maximum value has an absolute maximum of 6.5 V independent of V

digital supply voltages −0.3 +6.5 V
analog supply voltage −0.3 +6.5 V
input voltage (any input) note 1 −0.3 V
output voltage (any output) note 1 −0.3 V

DDD(M)
DDD(M)

+ 0.5 V

+ 0.5 V
output current (each output) −±10 mA
DC input or output diode current −±20 mA
operating ambient temperature −20 +70 °C
storage temperature −55 +125 °C

.

DDD

QUALITY AND RELIABILITY

This device will meet Philips Semiconductors general quality specification for business group

Circuits SNW-FQ-611-Part E”

. The principal requirements are shown in Tables 6 to 9.

Group A
Table 6 Acceptance tests per lot; note 1

TEST REQUIREMENTS

Mechanical cumulative target: <80 ppm
Electrical cumulative target: <80 ppm

Note

1. ppm = fraction of defective devices, in parts per million.

Group B
Table 7 Processability tests (by package family); note 1

TEST REQUIREMENTS

Solderability <7% LTPD
Mechanical <15% LTPD
Solder heat resistance <15% LTPD

Note

1. LTPD = Lot Tolerance Percent Defective.

“Consumer Integrated

1998 Apr 22 15

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

Group C
Table 8 Reliability tests (by package family); note 1

TEST CONDITIONS REQUIREMENTS

Operational life 168 hours at Tj= 150 °C <1000 FPM at Tj=70°C
Humidity life temperature, humidity, bias 1000 hours,

T

=85°C, 85% RH (or equivalent

amb

test)

Temperature cycling

T

stg(min)

to T

stg(max)

performance

Note

1. FPM = fraction of devices failing at test conditions, in Failures Per Million.

Table 9 Reliability tests (by device type)

TEST CONDITIONS REQUIREMENTS

ESD and latch-up ESD human body model 100 pF, 1.5 kΩ <2000 V

ESD machine model 200 pF, 0 Ω <200 V
latch-up 100 mA, 1.5V

<2000 FPM

<2000 FPM

(absolute maximum)

DDD

CHARACTERISTICS

V

DDD(M)

=5V±10%; VSS=0V; T

= −20 to +70°C; unless otherwise specified.

amb

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Supplies

V

DDD(M)

microcontroller supply

referenced to V

4.5 5.0 5.5 V

SSD

voltage

V

DDA

V

DDD(T)

analog supply voltage referenced to V
teletext supply

referenced to V

4.5 5.0 5.5 V

SSD

4.5 5.0 5.5 V

SSD

voltage

I

DDD(M)

microcontroller supply

− 20 35 mA

current

I

DDA

I

DDD(T)

analog supply current − 35 50 mA
teletext supply

− 50 80 mA

current

Digital inputs

P

IN RESET

V

IL

LOW-level input

−0.3 − 0.2V

DDD(M)

− 0.1 V

voltage

V

IH

HIGH-level input

0.7V

DDD(M)

− V

DDD(M)

+ 0.3 V

voltage

I

LI

C

i

input leakage current Vi= 0 to V

DDD(M)

−10 − +10 µA

input capacitance −−4pF

1998 Apr 22 16

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

PINS HSYNC AND VSYNC
V

th(f)

switching threshold
falling

V

th(r)

switching threshold
rising

V

hys

C

i

hysteresis voltage − 0.33V
input capacitance −−4pF

Digital outputs

INS R, G AND B: note 1

P
V

OL

LOW-level output

IOL=2mA 0 − 0.2 V

voltage

V

OH

HIGH-level output

IOH= −2mA V

voltage

 output impedance −−150 Ω

Z

O

C

L

I

O

t

o(r)

load capacitance −−50 pF
DC output current −−−4mA
output rise time between 10 and

90%; CL=50pF

t

o(f)

output fall time between 90 and

10%; CL=50pF
PIN VDS
V

OL

LOW-level output

IOL= 1.6 mA 0 − 0.2 V

voltage

V

OH

HIGH-level output

IOH= −1.6 mA V

voltage
C
t

L

o(r)

load capacitance −−50 pF

output rise time between 10 and

90%; CL=50pF

t

o(f)

output fall time between 90 and

10%; CL=50pF
PINS R, G, B AND VDS
t

d(skew)

skew delay between

any two pins
PIN COR (OPEN-DRAIN OUTPUT)
V

OH

HIGH-level pull-up

output voltage
V

OL

LOW-level output

IOL=2mA 0 − 0.5 V

voltage
I

OL

LOW-level output

current
C

L

load capacitance −−25 pF

0.2V

DDD(M)

−−0.8V

RGBREF

− 0.3 V

−− V

V

DDD(M)

RGBREF

DDD(M)

− V

V

RGBREF

+ 0.4 V

−−20 ns

−−20 ns

− 0.3 − V

DDD(M)

DDD(M)

+ 0.4 V

−−20 ns

−−20 ns

−−20 ns

−−V

DDD(M)

V

−−2mA

1998 Apr 22 17

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

PIN FRAME
V

OH

HIGH-level output

voltage
V

OL

LOW-level output

voltage
I

OL

LOW-level output

current
C

L

load capacitance −−100 pF

Digital inputs/outputs

P

INS V0 TO V7

V

IL

LOW-level input

voltage
V

IH

HIGH-level input

voltage
C

i

V

OL

input capacitance −−4pF

LOW-level output

voltage
C

L

load capacitance −−50 pF
PINS SCL AND SDA (PINS 14, 15, 49 AND 50)
V

IL

LOW-level input

voltage
V

IH

HIGH-level input

voltage
C

i

V

OL

input capacitance −−5pF

LOW-level output

voltage
C
t

L

o(f)

load capacitance −−400 pF

output fall time between 3 and 1 V −−200 ns

Digital inputs

IOL=8mA 0 − 0.5 V

IOL= −8mA V

− 0.5 − V

DDD(M)

DDD(M)

−8 − +8 mA

−0.3 − 0.2V

3.0 − V

DDD(M)

DDD(M)

+ 0.3 V

− 0.1 V

IOL=10mA 0 − 0.45 V

−0.3 − +1.5 V

3.0 − V

DDD(M)

+ 0.3 V

IOL=3mA 0 − 0.5 V

V

INS VSMODE, HSMODE, PDI, SA, FP, PUINL, DISDSR, DIS8/30, DISLCBD, ME8/30T AND E/W

P
V

IL

LOW-level input

−0.3 − 0.2V

voltage
V

IH

HIGH-level input

0.2V

+ 0.9 − V

DDD(M)

voltage
C

i

C

L

input capacitance −−4pF

load capacitance −−50 pF

Digital outputs

INS PL AND PON

P
V

OL

LOW-level output

IOL=10mA 0 − 0.45 V

voltage
C

L

load capacitance −−50 pF

1998 Apr 22 18

DDD(M)

DDD(M)

− 0.1 V

+ 0.3 V

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT
Analog inputs

PINS CVBS0 AND CVBS1
V

sync

sync voltage

amplitude
V

vid(p-p)

video input voltage

amplitude

(peak-to-peak value)
Z

source

V

IH

source impedance −−250 Ω

HIGH-level input

voltage

 input impedance 2.5 5.0 − kΩ

Z

i

C

i

PIN I
R

VSS

ref

input capacitance −−10 pF

resistor to ground − 27 − kΩ
RGBREF: note 1
V

i

I

I

input voltage −0.3 − V

DC input current −−12 mA

Analog input/output

0.1 0.3 0.6 V

0.7 1.0 1.4 V

3.0 − V

DDD(M)

DDD(M)

+ 0.3 V

V

IN BLACK

P
C

BLACK

storage capacitor to

ground
V

BLACK

black level voltage

for nominal sync

amplitude
I

LI

input leakage current −10 − +10 µA

Crystal oscillator

IN XTALI

P
V

IL

LOW-level input

voltage
V

IH

HIGH-level input

voltage
C

i

input capacitance −−10 pF
PIN XTALO
C

o

output capacitance −−10 pF

− 100 − nF

1.8 2.15 2.5 V

−0.3 − 0.2V

0.7V

DDD(M)

− V

DDD(M)

DDD(M)

+ 0.3 V

− 0.1 V

1998 Apr 22 19

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

RYSTAL SPECIFICATION: note 2

C
f

xtal

C

L

C1 series capacitance T
C0 parallel capacitance T
R

res

T

xtal

X

j

X

d

Notes

1. All RGB current is sourced from the RGBREF pin. The maximum effective series resistance between RGBREF and
the R, G and B pins is 150 Ω.

2. Crystal order number 4322 143 05561.

nominal frequency − 12 − MHz
load capacitance − 32 − pF

=25°C − 18.5 − fF

amb

=25°C − 4.9 − pF

amb

resonance resistance T

=25°C − 35 −Ω

amb

temperature range −20 +25 +70 °C
adjustment tolerance T

=25°C −−±50 × 10

amb

drift −−±30 × 10

−6

−6

TIMING CHARACTERISTICS

SYMBOL PARAMETER INPUT OUTPUT I2C-BUS SPECIFICATION
SCL timing

t

HD;STA

t

LOW

t

HIGH

t

r(SCL)

t

f(SCL)

START condition hold time ≥4.0 µs note 1 ≥4.0 µs
SCL LOW time ≥4.7 µs note 1 ≥4.7 µs
SCL HIGH time ≥4.0 µs ≥4.0 µs; note 2 ≥4.0 µs
SCL rise time ≤1.0 µs note 3 ≤1.0 µs
SCL fall time ≤0.3 µs ≤0.3 µs; note 4 ≤0.3 µs

SDA timing

t

SU;DAT1

t

HD;DAT

t

SU;STA

t

SU;STO

t

BUF

t

r(SDA)

t

f(SDA)

data set-up time ≥250 ns note 1 ≥250 ns
data hold time ≥0 ns note 1 ≥0ns
repeated START set-up time ≥4.7 µs note 1 ≥4.7 µs
STOP condition set-up time ≥4.0 µs note 1 ≥4.0 µs
bus free time ≥4.7 µs note 1 ≥4.7 µs
SDA rise time ≤1.0 µs note 3 ≤1.0 µs
SDA fall time ≤0.3 µs ≤0.3 µs; note 4 ≤0.3 µs

Notes

1. This parameter is determined by the user software. It must comply with the I

2

C-bus specification.

2. This value gives the auto-clock pulse length which meets the I2C-bus specification for the special crystal frequency.
Alternative, the SCL pulse must be timed by software.

3. The rise time is determined by the external bus line capacitance and pull-up resistor. It must be less than 1 µs.

4. The maximum capacitance on bus lines SDA and SCL is 400 pF.

1998 Apr 22 20

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1998 Apr 22 21

repeated START condition

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SDA

(input / output)

SCL

(input / output)

START or repeated START condition

t

rD

t

fD

t

HD;STA

t

t

LOW

rC

t

HIGH

START condition

t

STOP condition

t

fC

t

SU;DAT1

t

HD;DAT

t

SU;DAT2

SU;STA

t

SU;STO

0.7V

0.3V

t

SU;DAT3

DD
DD

t

BUF

0.7V

0.3V

MLC104

DD
DD

Fig.13 I2C-bus interface timing.

handbook, full pagewidth

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

CLOCK GENERATOR

The oscillator circuit is a single-stage inverting amplifier in a Pierce oscillator configuration. The circuitry between pins
XTALI and XTALO is basically an inverter biased to the transfer point. A crystal must be used as the feedback element
to complete the oscillator circuitry. It is operated in parallel resonance. XTALI is the high gain amplifier input and XTALO
is the output.

To drive the device externally XTALI is driven from an external source and XTALO is left open-circuit.

handbook, halfpage

(1) The values of C1 and C2 depend on the crystal specification:

C1 = C2 = 2C

.

L

C1

C2

(1)

(1)

OSCGND

XTALI

XTALO

40

41

42

MGL415

Fig.14 Oscillator circuit.

handbook, halfpage

not connected

external clock

not connected

OSCGND

XTALI

XTALO

40

41

42

MGL416

Fig.15 Oscillator circuit driven from external

source.

1998 Apr 22 22

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

EMC GUIDELINES

Optimization of circuit return paths and minimisation of
common mode noise will be assisted by using a
double-sided PCB with a low inductance ground plane.

On a single-sided PCB a local ground plane under the
whole IC should be present, as shown in Fig.16. This
should be connected by the widest possible connection
back to the PCB ground connection and bulk electrolytic
decoupling capacitor. It should preferably not connect to
other grounds on the way and no wire links should be
present in this connection. The use of wire links increases
ground bounce by introducing inductance into the ground.

The supply pins can be decoupled at the pin to the ground
plane under the IC. This is easily accomplished using
surface mount capacitors, which are more effective than
leaded components at high frequency. Using a device
socket will unfortunately add to the area and inductance of
the external bypass loop.

A ferrite bead or inductor with resistive characteristics at
high frequency may be utilized in the supply line close to
the decoupling capacitor to provide a high impedance.
To prevent pollution by conduction onto signal lines (which
may then radiate) signals connected to the +5 V supply via
a pull up resistor should not be connected to the IC side of
the ferrite component.

OSCGND should be connected only to the crystal load
capacitors and not the local or circuit ground.

Keep physical connection distances to associated active
devices short.

Route output traces with close proximity mutually coupled
ground return paths.

handbook, full pagewidth

under-IC GND plane
GND connection
note: no wire links

other
GND
connections

+5 V

GND

V

DDD(M)

electrolytic decoupling capacitor (2.2 µF)

ferrite components

SM decoupling capacitors (22 to 100 nF)

SSD

V

DDA

V

SSA

V

DDD(T)

V

Fig.16 Power supply and ground connections for SOT247-1.

under-IC GND plane

IC(SAA5290)

MGL414

1998 Apr 22 23

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1998 Apr 22 24

V

DDD(M)

V

DDD(M)

APPLICATION INFORMATION

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

V

SSD

4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7

V

SSD1

CVBS1
CVBS2

4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7

V

DDD(M)

1

A0

2

A1

3

A2

4

V

PCF8582P

SS

V

DDD(M)

MGL419

V

DD

PTC
SCL
SDA

kΩ

8
7
6
5

4.7
kΩ

100 nF

56 kΩ

3.3 nF

100 nF

100 nF

4.7
kΩ

V

SSD

4.7
kΩ

V

SSA

kΩ

V

V

SSD1

SSA

27 kΩ

1
2

3
4
5
6
7

8
9
10
11
12
13

SAA526xPS

14
15
16
17
18
19
20
21
22
23
24
25
26

4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7kΩ4.7

52
51
50
49

48
47
46

45
44

43
42

41
40
39
38
37
36
35
34
33

32
31
30
29
28
27

2.2 µF

22 pF 22 pF

V

SSD2

12 MHz

1 kΩ

V

DDD(M)

1 kΩ

100 nF

V

SSD2

V

DDD(M)

4.7 kΩ

kΩ

220 Ω
220 Ω

V

SSD2

V

SSD2

SDA2
SCL2

V

SSD2

V

DDD(T)

V

DDA

VSYNC
HSYNC

VDS
R

G
B

PON
COR

FRAME

Fig.17 Application diagram.

handbook, full pagewidth

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

PACKAGE OUTLINE

SDIP52: plastic shrink dual in-line package; 52 leads (600 mil)

D

seating plane

L

Z

52

pin 1 index

e

b

SOT247-1

M

E

A

2

A

A

1

w M

b

1

27

E

c

(e )

M

1

H

1

0 5 10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

A

A

UNIT b

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

mm

OUTLINE

VERSION

SOT247-1

max.

5.08 0.51 4.0

12

min.

max.

IEC JEDEC EIAJ

1.3

0.8

b

1

0.53

0.40

REFERENCES

0.32

0.23

cEe M

(1) (1)

D

47.9

47.1

1998 Apr 22 25

14.0

13.7

26

(1)

Z

1

L

M

E

3.2

15.80

2.8

15.24

EUROPEAN

PROJECTION

17.15

15.90

e

w

H

0.181.778 15.24

ISSUE DATE

90-01-22
95-03-11

max.

1.73

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

SOLDERING
Introduction

There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.

This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our

“Data Handbook IC26; Integrated Circuit Packages”

(order code 9398 652 90011).

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.

The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T

stg max

). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.

Repairing soldered joints

Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.

260 °C; solder at this temperature must not be in contact

DEFINITIONS

Data sheet status

Objective specification This data sheet contains target or goal specifications for product development.
Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.
Product specification This data sheet contains final product specifications.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the specification.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.

PURCHASE OF PHILIPS I

2

C COMPONENTS

Purchase of Philips I

2

C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.

1998 Apr 22 26

Philips Semiconductors Product specification

10-page intelligent teletext decoders SAA5261; SAA5262; SAA5263

NOTES

1998 Apr 22 27

Philips Semiconductors – a worldwide company

Argentina: see South America
Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113,

Tel. [phone], Fax. [phone]
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. [phone],

Fax. [phone]
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,

220050 MINSK, Tel. [phone], Fax. [phone]

Belgium: see The Netherlands
Brazil: see South America
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,

51 James Bourchier Blvd., 1407 SOFIA,
Tel. [phone], Fax. [phone]

Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. [phone]

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. [phone], Fax. [phone]

Colombia: see South America
Czech Republic: see Austria
Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. [phone], Fax. [phone]
Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. [phone], Fax. [phone]
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,

Tel. [phone], Fax. [phone]
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. [phone], Fax. [phone]
Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. [phone], Fax. [phone]

Hungary: see Austria
India: Philips INDIA Ltd, Band Box Building, 2nd floor,

254-D, Dr. Annie Besant Road, Worli, MUMBAI 400 025,
Tel. [phone], Fax. [phone]

Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. [phone] ext. 2501, Fax. [phone]

Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. [phone], Fax. [phone]

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, PO Box 18053,
TEL AVIV 61180, Tel. [phone], Fax. [phone]

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,
20124 MILANO, Tel. [phone], Fax. [phone]

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,
Tel. [phone], Fax. [phone]

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. [phone], Fax. [phone]

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. [phone], Fax. [phone]

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. [phone]

Middle East: see Italy
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,

Tel. [phone], Fax. [phone]
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,

Tel. [phone], Fax. [phone]
Norway: Box 1, Manglerud 0612, OSLO,

Tel. [phone], Fax. [phone]

Pakistan: see Singapore
Philippines: Philips Semiconductors Philippines Inc.,

106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. [phone], Fax. [phone]

Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA,
Tel. [phone], Fax. [phone]

Portugal: see Spain
Romania: see Italy
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. [phone], Fax. [phone]
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,

Tel. [phone], Fax. [phone]

Slovakia: see Austria
Slovenia: see Italy
South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,
Tel. [phone], Fax. [phone]

South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. [phone], Fax. [phone]

Spain: Balmes 22, 08007 BARCELONA,
Tel. [phone], Fax. [phone]

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. [phone], Fax. [phone]

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. [phone] Fax. [phone]

Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. [phone], Fax. [phone]

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,
209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
Tel. [phone], Fax. [phone]

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. [phone], Fax. [phone]

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,
252042 KIEV, Tel. [phone], Fax. [phone]

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. [phone], Fax. [phone]

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. [phone]

Uruguay: see South America
Vietnam: see Singapore
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. [phone], Fax.[phone]

For all other countries apply to: Philips Semiconductors,
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. [phone]

© Philips Electronics N.V. 1998 SCA59
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.

Internet: http://www.semiconductors.philips.com

Printed in The Netherlands 545104/00/01/pp28 Date of release: 1998 Apr 22 Document order number: 9397 750 03442