Datasheet sa630 DATASHEETS (Philips)

Download

Page 1

RF COMMUNICATIONS PRODUCTS

INPUT/OUTPUT

OUTPUT/INPUT

ENCH1

SA630

Single pole double throw (SPDT) switch

Product Specification Replaces data of October 10, 1991

IC17 Data Handbook

1997 Nov 07

Philips Semiconductors

Page 2

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

DESCRIPTION

The SA630 is a wideband RF switch fabricated in BiCMOS technology and incorporating on-chip CMOS/TTL compatible drivers. Its primary function is to switch signals in the frequency range DC 1GHz from one 50Ω channel to another. The switch is activated by a CMOS/TTL compatible signal applied to the enable channel 1 pin (ENCH1).

The extremely low current consumption makes the SA630 ideal for portable applications. The excellent isolation and low loss makes this a suitable replacement for PIN diodes.

The SA630 is available in an 8-pin dual in-line plastic package and an 8-pin SO (surface mounted miniature) package.

FEA TURES

•Wideband (DC - 1GHz)

•Low through loss (1dB typical at 200MHz)

•Unused input is terminated internally in 50Ω

•Excellent overload capability (1dB gain compression point +18dBm

at 300MHz)

•Low DC power (170µA from 5V supply)

•Fast switching (20ns typical)

•Good isolation (off channel isolation 60dB at 100MHz)

PIN CONFIGURATION

D and N Packages

•Low distortion (IP

GND

INPUT

ENCH1

Figure 1. Pin Configuration

intercept +33dBm)

OUT

AC GND

GND OUT

•Good 50Ω match (return loss 18dB at 400MHz)

•Full ESD protection

•Bidirectional operation

APPLICA TIONS

•Digital transceiver front-end switch

•Antenna switch

•Filter selection

•Video switch

•FSK transmitter

SR00578

ORDERING INFORMATION

DESCRIPTION TEMPERATURE RANGE ORDER CODE DWG #

8-Pin Plastic Dual In-Line Package (DIP) -40 to +85°C SA630N SOT97-1 8-Pin Plastic Small Outline (SO) package (Surface-mount) -40 to +85°C SA630D SOT96-1

BLOCK DIAGRAM

OUTPUT/INPUT

INPUT/OUTPUT

OUTPUT/INPUT

ENCH1

SR00579

Figure 2. Block Diagram

RECOMMENDED OPERATING CONDITIONS

SYMBOL PARAMETER RATING UNITS

Supply voltage 3.0 to 5.5V V Operating ambient temperature range

SA Grade

Operating junction temperature range

SA Grade

-40 to +85 °C

-40 to +105 °C

1997 Nov 07 853-1577 18666

Page 3

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

EQUIVALENT CIRCUIT

+5V

20kΩ

CONTROL

LOGIC

50Ω

OUT

AC BYPASS

INPUT

ENCH1

50Ω

20kΩ

OUT

SR00580

Figure 3. Equivalent Circuit

ABSOLUTE MAXIMUM RATINGS

SYMBOL PARAMETER RATING UNITS

P T

JMAX

MAX STG

Supply voltage -0.5 to +5.5 V Power dissipation, TA = 25oC (still air)

8-Pin Plastic DIP 8-Pin Plastic SO

1160

780

mW Maximum operating junction temperature 150 °C Maximum power input/output +20 dBm Storage temperature range -65 to +150 °C

NOTES:

1. Maximum dissipation is determined by the operating ambient temperature and the thermal resistance, θ 8-Pin DIP: θ 8-Pin SO: θ

= 108°C/W

= 158°C/W

DC ELECTRICAL CHARACTERISTICS

VDD = +5V, TA = 25°C; unless otherwise stated.

LIMITS

SYMBOL PARAMETER TEST CONDITIONS SA630 UNITS

MIN TYP MAX

NOTE:

1. The ENCH1 input must be connected to a valid Logic Level for proper operation of the SA630.

Supply current 40 170 300 µA

TTL/CMOS logic threshold voltage

Logic 1 level Enable channel 1 2.0 V

Logic 0 level Enable channel 2 -0.3 0.8 V

ENCH1 input current ENCH1 = 0.4V -1 0 1 µA

ENCH1 input current ENCH1 = 2.4V -1 0 1 µA

1.1 1.25 1.4 V

1997 Nov 07

Page 4

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

AC ELECTRICAL CHARACTERISTICS1 - D PACKAGE

VDD = +5V, TA = 25°C; unless otherwise stated.

LIMITS

SYMBOL PARAMETER TEST CONDITIONS SA630 UNITS

MIN TYP MAX

DC - 100MHz

S21, S12Insertion loss (ON channel)

S21, S12Isolation (OFF channel)

S11, S22Return loss (ON channel)

S11, S22Return loss (OFF channel)

Switching speed (on-off delay) 50% TTL to 90/10% RF 20 ns

tr, t

IP IP

NF Noise figure (ZO = 50Ω )

NOTE:

1. All measurements include the effects of the D package SA630 Evaluation Board (see Figure 4B). Measurement system impedance is 50Ω .

2. The placement of the AC bypass capacitor is critical to achieve these specifications. See the applications section for more details.

Switching speeds (on-off rise/fall time) 90%/10% to 10%/90% RF 5 ns

Switching transients 165 mV 1dB gain compression DC - 1GHz +18 dBm

-1dB

Third-order intermodulation intercept 100MHz +33 dBm

Second-order intermodulation intercept 100MHz +52 dBm

500MHz 900MHz

10MHz 100MHz 500MHz 900MHz

DC - 400MHz

900MHz

DC - 400MHz

900MHz

100MHz 900MHz

1.4 2

80 60 50 30

20 12

17 13

1.0

2.0

2.8

P-P

AC ELECTRICAL CHARACTERISTICS1 - N PACKAGE

VDD = +5V, TA = 25°C; all other characteristics similar to the D-Package, unless otherwise stated.

LIMITS

SYMBOL PARAMETER TEST CONDITIONS SA630 UNITS

MIN TYP MAX

DC - 100MHz

S21, S12Insertion loss (ON channel)

S21, S12Isolation (OFF channel)

NF Noise figure (ZO = 50Ω )

NOTE:

1. All measurements include the effects of the N package SA630 Evaluation Board (see Figure 4C). Measurement system impedance is 50Ω .

APPLICATIONS

The typical applications schematic and printed circuit board layout of the SA630 evaluation board is shown in Figure 4. The layout of the board is simple, but a few cautions need to be observed. The input and output traces should be 50Ω. The placement of the AC bypass capacitor is two channels is desired. The trace from Pin 7 should be drawn back towards the package and then be routed downwards. The capacitor

extremely critical

if a symmetric isolation between the

500MHz 900MHz

10MHz 100MHz 500MHz 900MHz

100MHz 900MHz

should be placed straight down as close to the device as practical. For better isolation between the two channels at higher frequencies, it is also advisable to run the two output/input traces at an angle. This also minimizes any inductive coupling between the two traces. The power supply bypass capacitor should be placed close to the device. Figure 10 shows the frequency response of the SA630. The loss matching between the two channels is excellent to 1.2GHz as shown in Figure 13.

1.4

2.5 68

50 37 15

1.0

2.5

1997 Nov 07

Page 5

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

+5V

0.1µF

INPUT

0.01µF

a. Evaluation Board Schematic

D and N Packages

GND

ENCH

AC GND

GND

0.01µF

OUT

1997 Nov 07

b. 630 D-Package Board Layout

630N1 7/91

c. 630 N-Package Board Layout

Figure 4. Board and Package Graphics

SR00581

Page 6

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

The isolation and matching of the two channels over frequency is shown in Figures 15 and 17, respectively.

The SA630 is a very versatile part and can be used in many applications. Figure 5 shows a block diagram of a typical Digital RF transceiver front-end. In this application the SA630 replaces the duplexer which is typically very bulky and lossy. Due to the low power consumption of the device, it is ideally suited for handheld applications such as in CT2 cordless telephones. The SA630 can also be used to generate Amplitude Shift Keying (ASK) or On-Off Keying (OOK) and Frequency Shift Keying (FSK) signals for digital RF communications systems. Block diagrams for these applications are shown in Figures 6 and 7, respectively.

For applications that require a higher isolation at 1GHz than obtained from a single SA630, several SA630s can be cascaded as

5200

630

Tx/Rx

5200 VCO

shown in Figure 8. The cascaded configuration will have a higher loss but greater than 35dB of isolation at 1GHz and greater than 65dB @ 500MHz can be obtained from this configuration. By modifying the enable control, an RF multiplexer/ de-multiplexer or antenna selector can be constructed. The simplicity of SA630 coupled with its ease of use and high performance lends itself to many innovative applications.

The SA630 switch terminates the OFF channel in 50Ω. The 50Ω resistor is internal and is in series with the external AC bypass capacitor. Matching to impedances other than 50Ω can be achieved by adding a resistor in series with the AC bypass capacitor (e.g., 25Ω additional to match to a 75Ω environment).

602A IF OUT

MICRO

CONTROLLER

MODULATION

KEYPAD

DISPLAY

Figure 5. A Typical TDMA/Digital RF Transceiver System Front-End

ASK OUTPUT

630

OSCILLATOR

ENABLE

TTL DATA

CH1

50Ω

SR00583

Figure 6. Amplitude Shift Keying (ASK) Generator

FSK OUTPUT

630

ENABLE

CH1

TTL DATA

SR00584

Figure 7. Frequency Shift Keying (FSK) Gnerator

IN/OUT

630

ENABLE

SR00582

OUT1/IN1

630

OUT2/IN2

SR00585

Figure 8.

1997 Nov 07

Page 7

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

200

180

160

140

120

100

SUPPLY CURRENT ( A)

3 3.5 4 4.5 5 5.5 6

SUPPLY VOLTAGE (V)

Figure 9. Supply Current vs. VDD and Temperature

–2

+85°C

+25°C

-40°C

SR00586

–1

S (dB)

–2

10 100 1000

= +25°C

FREQUENCY (MHz)

Figure 11. Loss vs. Frequency and VDD for

D-Package-Expanded Detail-

–2

SR00588

–4

S (dB)

–6

TA = +25°C

–8

10 100 1000 2000

FREQUENCY (MHz)

Figure 10. Loss vs. Frequency and VDD for D-Package

SR00587

–4

S (dB)

–6

–8

VDD = 5V

= +25°C

–10

10 100 1000 2000

FREQUENCY (MHz)

CH2

SR00589

Figure 12. Loss Matching vs. Frequency for N-Package (DIP)

1997 Nov 07

Page 8

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

–1

–10

–2

–20

–3

–30

–4

S (dB)

–5

CH1

–6

–7

–8

10 100 1000 2000

FREQUENCY (MHz)

VDD = T

= +25°C

SR00590

Figure 13. Loss Matching vs. Frequency; CH1 vs. CH2 for

D-Pakage

–40

S (dB)

–50

–60

–70

–80

10 100 1000 2000

FREQUENCY (MHz)

TA = +25°C

SR00592

Figure 15. Isolation vs. Frequency and VDD for D-Package

–1

–2

–3

–4

S (dB)

–5

–6

–7

–8

10 100 1000 2000

FREQUENCY (MHz)

+25°C

-40°C

+85°C

VDD = 5V

Figure 14. Loss vs. Frequency and Temperature for

D-Package

SR00591

–10

–20

–30

–40

S (dB)

–50

–60

–70

–80

10 100 1000 2000

CH2

TA = +25°C V

FREQUENCY (MHz)

= 5V

SR00593

Figure 16. Isolation Matching vs. Frequency for N-Package

(DIP)

1997 Nov 07

Page 9

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

–10

–20

–30

–40

S (dB)

–50

–60

–70

–80

10 100 1000 2000

FREQUENCY (MHz)

CH2

CH1

VDD = +5V TA = +25°C

SR00594

Figure 17. Isolation Matching vs. Frequency; CH1 vs. CH2 for

D-Package

–5

–10

–15

S (dB)

–20

–25

–30

10 100 1000 2000

FREQUENCY (MHz)

VDD = 5V

= +25°C

Figure 19. Output Match On-Channel vs. Frequency

SR00597

–5

–10

–15

S (dB)

–20

–25

–30

10 100 1000 2000

TA = +25°C

FREQUENCY (MHz)

SR00595

Figure 18. Input Match On-Channel vs. Frequency and V

–5

–10

CH1: 3V

–15

S (dB)

–20

–25

–30

CH1: 5V

CH2: 5V

= +25°C

10 100 1000 2000

FREQUENCY (MHz)

Figure 20. OFF-Channel Match vs. Frequency and V

SR00597

1997 Nov 07

Page 10

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

–5

–10

–15

S (dB)

–20

–25

–30

10 100 1000 2000

+85°C

+25°C

-40°C

VDD = 5V

FREQUENCY (MHz)

Figure 21. OFF Channel Match vs. Frequency and

Temperature

SR00598

IP2

INTERCEPT POINT (dBm)

3 3.5 4 4.5 5 5.5 6

IP3

TA = +25°C

SUPPLY VOLTAGE (V)

Figure 23. Intercept Points vs.V

SR00633

-1

P (dBm)

10 100 1000 2000

TA = +25°C

FREQUENCY (MHz)

Figure 22. P-1 dB vs. Frequency and V

SR00599

4.5

3.5

2.5

NOISE FIGURE (dB)

1.5

0.5

= +25°C

= 50Ω

10 100 1000 2000

FREQUENCY (MHz)

SR00634

Figure 24. Noise Figure vs. Frequency and VDD for D-Package

1997 Nov 07

Page 11

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

ENCH1 (Pin4)

OUT1 (Pin 8)

Figure 25. Switching Speed; fIN = 100MHz at -6dBm, VDD = 5V

SR00635

1997 Nov 07

Page 12

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

SO8: plastic small outline package; 8 leads; body width 3.9mm SOT96-1

1997 Nov 07

Page 13

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1

1997 Nov 07

Page 14

Philips Semiconductors Product specification

SA630Single pole double throw (SPDT) switch

DEFINITIONS

Data Sheet Identification Product Status Definition

Objective Specification

Preliminary Specification

Product Specification

Formative or in Design

Preproduction Product

Full Production

Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

LIFE SUPPORT APPLICA TIONS Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices, or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected

to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.

Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381

This data sheet contains the design target or goal specifications for product development. Specifications may change in any manner without notice.

This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.

This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes at any time without notice, in order to improve design and supply the best possible product.

 Copyright Philips Electronics North America Corporation 1997

 

1997 Nov 07