Datasheet RF3404, RF3404PCBA Datasheet (RF Micro Devices)

Preliminary

RF3404

8

Typical Applications

• CDMA Cellular/PCS Handsets

Product Description

The RF3404 is a fully-functional, integrated dual-band
downconverter module for tri-mode CDMA applications.
The module, which uses SiGe technology, features two
complete RF downconverters with low noise amplifiers,
RF S AW filters, TX LO buffers, and RF matching for PCS
and cellular band frequencies. Additionally, a divide-by-2
prescaler is integrated to allow the use of a single-band
VCO. Multiple gain control options are available to con­serve current and meet IS-98B specifications. The mixer
design allows for a common IF filter for CDMA cellular
and PCS operation, and a second output for the FM out­put. IF matching is external to the module.

DUAL-BAND/TRI-MODE CDMA

LOW NOISE AMPLIFIER/MIXER MODULE

0.5

0.6

CDMAIF+

22

CDMAIF-

23

FM
IF+

FM IF-

DIV

ENABLE

LO IN VCC3

28

PCS LO

OUT

1

21

BAND

SEL

44

ENABLE

29

CELL LO

OUT

SEL

SET

48

IF

IP

VCC4

43

TX BUFFER

ENABLE

30

LNA

GAIN

MIXER

GAIN

8.00
sq.

VCC1

15

39

14

38

35

34

Noteorientation of Pin 1.NOTE: Shaded area representsPin1.

PCS LNAIN

12

CELL LNAIN

11

9

VCC2

8

1.0

0.1

8

Optimum Technology Matching® Applied

Si BJT GaAs MESFETGaAs HBT
Si Bi-CMOS

1960 MHz LNA 1960 MHz Mixer
12

PCS LNA IN

4MIXER GAIN CNTRL

31LNA GAIN CNTRL

11CELL LNA IN

26DIV ENABLE
45IF SEL
44BAND SEL
46IPSET
29ENABLE

TX BUFFER

30

ENABLE

Note orientationof Pin 1.

880 MHzLNA

LOGIC

CONTROL

SiGe HBT

ü

High Band

RF SAW

Filter

Low Band

RF SAW

Filter

880 MHz Mixer

Si CMOS

22 CDMA IF+

23 CDMA IF-

2425FM IF+

1PCSLOOUT

27 LO IN

Divide2

2CELLLOOUT

Functional Block Diagram

FM IF-

Package Style: 8mmx8mm Module

Features

• Complete Dual-Band Receiver Front End

• Integrated RF SAW Filters

• Internal RF Matching and Bias Settings

• Stepped LNA/Mixer Gain Control

• Adjustable LNA Bias Current and IIP3

• Meets IS-98B Specifications

Ordering Information

RF3404 Dual-Band/Tri-Mode CDMA Low Noise Amplifier/

RF3404 PCBA Fully Assembled EvaluationBoard

RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro,NC 27409, USA

Mixer Module

Tel [phone]

Fax [phone]

http://www.rfmd.com

FRONT-ENDS

Rev A1 010918

8-33

RF3404

Absolute Maximum Ratings

Parameter Rating Unit

Supply Voltage -0.5 to +5.0 V
Input LO and RF Levels +6 dBm

Operating Ambient Temperature -30 to +85 °C
Storage Temperature -40 to +150 °C

DC

Preliminary

Caution! ESD sensitive device.

RF Micro Devices believes the furnishedinformation is correct and accurate
at the time of this printing. However, RF Micro Devicesreserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).

8

Parameter

Min. Typ. Max.

Overall

RF Frequency Range 869 to 894 MHz

IF Frequency Range 0.1 to 400 MHz
LO Input Level -10 -7 0 dBm

Cellular Band (CDMA)

Specification

1930 to 1990 MHz

Unit Condition

T= 25°C, VCC=2.75V

RF Freq=869MHz to 894MHz
LO Freq=1053MHz to 1078MHz

LNA On

Gain 23.0 25.0 dB LNA set for max IIP3; Mixer RF amp ON

24.5 dB LNA set for Nominal IIP3; Mixer RF amp ON

16.0 dB LNA set for max IIP3; Mixer RF amp OFF

15.0 dB LNA set for Nominal IIP3; Mixer RF amp

Noise Figure 2.0 2.5 dB LNA set for max IIP3; Mixer RF amp ON

2.1 dB LNA set for Nominal IIP3; Mixer RF amp ON

4.0 dB LNA set for max IIP3; Mixer RF am p OFF

4.5 dB LNA set for Nominal IIP3; Mixer RF amp

Input IP3 -9.0 dBm LNA set for max IIP3; Mixer RF amp ON

-8.0 dBm LNA set for Nomin al IIP3; Mixer RF amp ON

FRONT-ENDS

1.5 dB m LN A set for max IIP3; Mixer RF amp OFF

2.0 dBm LNA set for Nominal IIP3; Mixer RF amp

+10.0 dBm LNA only, set for max IIP3

OFF

OFF

OFF

LNA Off

Gain 5 dB Mixer RF amp ON

-3 dB Mixer RF amp OFF

Noise Figure 15 dB Mixer RF amp ON

22 dB Mixer RF amp OFF

Input IP3 +10.0 dBm Mixer RF amp ON

+20.0 dBm Mixer RF amp OFF

8-34

Rev A1 010918

Preliminary

RF3404

Parameter

Cellular Band (FM)

Min. Typ. Max.

Specification

Unit Condition

RF Freq=869MHz to 894MHz
LO Freq=1053MHz to 1078MHz

LNA On

Gain 23.0 dB LNA set for max IIP3; Mixer RF amp ON

23.0 dB LNA set for Nominal IIP3; Mixer RF amp ON

13.0 dB LNA set for max IIP3; Mixer RF amp OFF

13.0 dB LNA set for Nominal IIP3; Mixer RF amp

Noise Figure 2.1 2.6 dB LNA set for max IIP3; Mixer RF amp ON

2.2 dB LNA set for Nominal IIP3; Mixer RF amp ON

5.0 dB LNA set for max IIP3; Mixer RF amp OFF

5.0 dB LNA set for Nominal IIP3; Mixer RF amp

Input IP3 -8.0 dBm LNA set for max IIP3; Mixer RF amp ON

-8.0 dBm LNA set for Nominal IIP3; Mixer RF amp ON

3.5 dB m LNA set for max IIP3; Mixer RF amp OFF

4.0 dB m LNA set for Nominal IIP3; Mixer RF amp

PCS Band

OFF

OFF

OFF
RF Freq=1930MHz to 1990MHz

LO Freq=2114MHz to 2174MHz

LNA On

Gain 23.0 25.0 dB LNA set for max IIP3; Mixer RF amplifier ON

24.0 dB LNA set for Nominal IIP3; MixerRF amplifier
16 dB LNA set for max IIP3; Mixer RF amp OFF

15 dB LNA set for Nominal IIP3; MixerRF amplifier

Noise Figure 2.2 2.7 dB LNA set for max IIP3; Mixer RF amplifier ON

2.3 dB LNA set for Nominal IIP3; Mixer RF amplifier

5.0 dB LNA set for max IIP3; Mixer RF amp OFF

6.0 dB LNA set for Nominal IIP3; Mixer RF amplifier

Input IP3 -12.0 -8.5 dBm LNA set for max IIP3; Mixer RF amplifier ON

-7.5 dBm LNA set for Nominal IIP3; Mixer RF amplifier

2 dBm LNA set for max IIP3; Mixer RF amp OFF
1 dBm LNA set for Nominal IIP3; MixerRF amplifier

+10.0 dBm LNA only, set for max IIP3

ON

OFF

ON

OFF

ON

OFF

LNA Off

Gain 5 dB Mixer RF amplifier ON

-4 dB Mixer RF amplifier OF F

Noise Figure 15 dB Mixer RF amplifier ON

22 dB Mixer RF amplifier OFF

Input IP3 +10.0 dBm Mixer RF amplifier ON

+20.0 dBm Mixer RF amplifier OFF

8

FRONT-ENDS

Rev A1 010918

8-35

RF3404

Preliminary

8

Parameter

Min. Typ. Max.

Specification

Unit Condition

Isolation (PCS, Cellular
CDMA, Cellular FM)

LO to IF Isolation 15 dB
LO to RF Isolation 35 dB
LO Output to LO Input Isolation 30 dB
RF to LO Input Isolation 20 dB
RF to LO Output Isolation 30 dB
IF to RF Isolation 40 dB
Transmit Band Rejection 20 dB

Power Supply

Supply Voltage 2.7 2.75 3.0 V Specifications
Logic High 1.8
Logic Low 0.4

Cellular

LNA Current 7 mA Cellular; LNA On, Max IIP3

5 mA Cellular; LNA On, Nominal IIP3
0 mA Cellular; LNA Off

Mixer Current 16 mA Cellular; Mixer RF Amplifier ON

10 mA Cellular; Mixer RF Amplifier OFF

PCS

LNA Current 7 mA PCS; LNA On, Max IIP3

5 mA PCS; LNA On, Nominal IIP3
0mAPCS;LNAOff

Mixer Current 16 mA PCS; Mixer RF Amplifier ON

10 mA PCS; Mixer RF Amplifier OFF

Power Down 1 µA Enable=0

Local Oscillator Input

Cellular - CDMA/FM

Input Power -10 -7 0 dBm
Input Frequency 685-710 MHz IF=184MHz

FRONT-ENDS

PCS

Input Power -10 -7 0 dBm
Input Frequency 1746-1806 MHz IF=184MHz

1053-1078 MHz IF=184 MHz
1370-1420 MHz IF=184MHz with divider enabled.
2106-2156 MHz IF=184MHz with divider enabled.

2114-2174 MHz IF=184MHz

Local Oscillator Output TX
Buffer

Cellular - CDMA/FM

Output Power -12 dBm Single-ended 50Ω load
Output Frequency 685-710 MHz IF=184MHz

1053-1078 MHz IF=184MHz

685-710 MHz IF=184MHz with divider enabled.

1053-1078 MHz IF=184MHz with divider enabled.

Current Consumption 2 mA

PCS

Output Power -12 dBm Single-ended 50Ω load
Output Frequency 1746-1806 MHz IF=184MHz

2114-2174 MHz IF=184MHz

Current Consumption 2 mA

8-36

Rev A1 010918

Preliminary

RF3404

State Table (Typical Values for VCC=2.75V)

Cellular PCS

Parameter

Gain (dB) 25 16 24.5 15 4 -3 25 15 24 15.5 5 -4
Noise Figure (dB) 2.0 4 2.1 4.5 15 22 2.2 5.0 2.3 6 15 22
Input IP3 (dBm) -9 1.5 -8 2 +10 +20 -8.5 2 -7.5 1 +10 +20
Total Current 29.5 23.5 28 22 24 18 29.5 23.5 28 22 24 18

LNA at Max IIP3 LNA at Nom IIP3 LNA at Ma x IIP3 LNA at Nom IIP3

Mixer

Amp On

RF3404 Control States

LNA On LNA Off LNA On LNA Off

Mixer

Amp Off

Mixer

Amp On

Mixer

Amp Off

Mixer

Amp On

Mixer

Amp Off

Mixer

Amp On

Mixer

Amp Off

Mixer

Amp On

Mixer

Amp Off

Amp On

Mixer

Mixer

Amp Off

BAND SEL IF SEL LNA GAIN MIX GAIN ENABLE

PCSCDMAHighGain10111
PCSCDMAMid1Gain10101
PCSCDMAMid2Gain10011
PCSCDMALowGain10001
CellCDMAHighGain00111
CellCDMAMid1Gain00101
CellCDMAMid2Gain00011
CellCDMALowGain00001
CellFMHighGain01111
CellFMMid1Gain01101
CellFMMid2Gain01011
CellFMLowGain 01001
Shutdown XXXX0
Not Defined 1 1 X X 1

8

Control Logic

Mode BAND_SEL IF_SEL ENABLE TX BUF DIVIDER ENABLE

Cellular FM 0 1 1 X X
Cellular CDMA 0 0 1 X X
PCS CDMA 1 0 1 X X
Power Down 1 1 1 X X
Power Down 2 X X 0 X X
TX Buffer Enabled X X 1 1 X
Divider Enabled X X 1 X 1

Gain Control Logic

LNA Mode Mixer Mode LNA GAIN MIX GAIN IP SET

High Gain High Gain 1 1 1
High Linearity (off-chip)
High Gain Low Gain 1 0 1
High Linearity (off-chip)
High Gain High Gain 1 1 0
Low Linearity (on-chip)
High Gain Low Gain 1 0 0
Low Linearity (on-chip)
Low Gain High Gain 0 1 X
Low Gain Low Gain 0 0 X

FRONT-ENDS

Rev A1 010918

8-37

RF3404

Preliminary

Pin Function Description Interface Schematic

1PCSLO

PCS LO output. Internal DC block.

OUT

2CELLLO

Cellular LO output. Internal DC block.

OUT
3GND
4 MIXER

GAIN

Low-inductance ground r equired.
Logic input. Controls switch around mixer pream p. High selects maxi-

mum mixer gain.

MIX GAIN

8

FRONT-ENDS

5GND
6GND
7GND
8 VCC2

9GND

10 GND
11 CELL LNA

IN

12 PCS LNA IN

13 GND
14 GND
15 GND
16 VCC1
17 GND
18 GND
19 GND
20 GND
21 GND
22 CDMA IF+

Low-inductance ground r equired.
Low-inductance ground r equired.
Low-inductance ground r equired.
PCS LNA VCC. External bypass capacitor between 10pF and 47nF

required.
Low-inductance ground r equired.

Low-inductance ground r equired.
Cellular LNA input. Internally ma tched to 50Ω. DC-blocking internal to

module.

PCS LNA input. Internally matched to 50Ω. DC-blocking internal to
module.

Low-inductance ground r equired.
Low-inductance ground r equired.
Low-inductance ground r equired.
Cellular LNA VCC. External bypass may be required.
Low-inductance ground r equired.
Low-inductance ground r equired.
Low-inductance ground r equired.
Low-inductance ground r equired.
Low-inductance ground r equired.
CDMA IF output. Open collector. “Current combiner” IF interface to

SAW filter recommended.

V

CC

CELL LNA IN

V

CC

PCS LNA IN

CDMA+ CDMA-

23 CDMA IF-

8-38

CDMA IF output. Open collector. “Current combiner” IF interface to
SAW filter recommended.

See pin 22.

Rev A1 010918

Preliminary

RF3404

Pin Function Description Interface Schematic

24 FM IF+

FM IF output. Open collector. “Current combiner” IF interface to SAW
filter recommended.

FM+ FM-

25 FM IF­26 DIVIDER

ENABLE

27 LO IN

28 GND
29 ENABLE

30 TX BUFFER

ENABLE

31 LNA GAIN

32 GND
33 GND
34 GND
35 GND
36 GND
37 GND
38 GND
39 GND
40 GND
41 GND
42 GND
43 VCC4

44 BAND SEL

FM IF output. Open collector. “Current combiner” IF interface to SAW
filter recommended.

Logic input. High enable frequency divide by 2 circuitry in cellular
mode.

LO single-end input.Internal DC block.

Low-inductance ground required.
Logic input. Low levelshuts down IC. IC can be shut down by setting

pins 44 and 45 high and TX Buffer Enable low as well.

Logic input. High enables TX LO buffer amplifiers.

Logic input. Controls LNA bypass switch. High selects maximum LNA
gain.

Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
Low-inductance ground required.
VCCconnection for internal references, logic, and mix preamps. Inter-

nal RF bypass capacitor. External bypass capacitor between 1nF and
47nF may be required.

Logic input. High level selects PCS band; lower level selects cellular
band.

See pin 24.

LO IN

ENABLE

TX BUF

8

LNA GAIN

FRONT-ENDS

BAND SEL

45 IF SEL

Rev A1 010918

Logic input. High selects FM IF outputs in cellular mode; low selects
CDMA IF outputs.

IF SEL

8-39

RF3404

Preliminary

Pin Function Description Interface Schematic

46 IP SET

Logic input. High selects maximum IIP3 mode.

IP SET

8

FRONT-ENDS

47 GND
48 VCC3

Low-inductance ground r equired.
VCC connection for internal LO amplifiers. Internal RF bypass capaci-

tor. External bypass between 1nF and 47nF may be required.

Outline Drawing

0.2500

1.6000

1.60

0.25

22

CDMA IF+

BAND SEL VCC4

CDMA IF-

44

23

FM IF+

0.10

0.1000

1.50

8.00

1.5000

8.0000

IF SEL

24

45

FM IF-

IP SET

25

46

Divider Enable

26

LO IN VCC3

48

27

28

PCS

LO OUT

1

TX BUFFER

ENABLE

ENABLE

29

Cell

LO OUT

24

43

LNA

GAIN

30 31

MIXER

GAIN

1.50

1.5000

0.50

0.5000

GND

16

VCC1

39

38

35

34

15

LNA IN

12

LNA IN

VCC2

PCS

11

8

0.60

Cell

1.00

9

0.50

8-40

8.00

8.0000

Rev A1 010918

Preliminary

RF3404

Overview

Why Design with Receive Modules?

The RF3404 is a fully integrated dual-band, tri-mode
module contains an LNA, RF image-rejection SAW fil­ter, mixer, mixer preamplifier, and local oscillator (LO)
buffer amplifiers as shown in the block diagram. The
module also contains all of the RF matching compo­nents, bias-setting components, and decoupling com­ponents required. The differentialIF output matching is
external to the module in part due to the varying range
of IFs used by customers and the physical size of IF
SAW filters. The module, which measures only

DC

2

of PCB

supply.

2

8.0 m mx8.0 m m and takes up only 64mm
area, is less than half the size of available alternative

solutions, which typically occupy over 200mm
board area. The RF3404 is control-compatible with
existing IF-to-baseband solutions.

Electrical Design Over view

The heart ofthe module is the RF2489 SiGe monolithic
microwave integrated circuit (MMIC) based on a high­performance silicon germanium (SiGe) process. The
SiGe process is capable of fabr icating transistors with
an Ft of 47 GHz. The module achieves 30dB of gain
control in the 880MHz band. The gain-control range is
obtained with switches around the LNA and mixer
preamplifier. By itself, the cellular LNA features 15dB
small-signal gain and a typical noise figure of 1.1dB
when drawing 6mA current from a +2.75V

A CMOS-enabled control line makes it possible to
select an increased LNA input third-order intercept
point of +10dBm to meet the cross modulation require­ments of the IS-95B CDMA specification. The
RF3404's LNA is followed by a miniature RF SAW filter.
It provides RF image rejectionas well as transmit-band
rejection. All impedance matching to the RF SAW filter
is contained within the module. The module's RF2489
SiGe MMIC contains two high-frequency mixers that
handle downconversion of the CDMA and AMPS sig­nals at 880MHz. The module provides a common IF
port for the CDMA cellular and PCS band output signal
and a separate IF output port for the AMPS-band IF
signal. The mixers and their integrated preamplifiers
achieve a noise figure of 7dB, gain of 14dB, and input
third-order intercept point of +3dBm. A bypass switch
around the m ixer preamplifier is integrated to support
those systems using a two-step gain approach for
meeting the three test conditions of IS-95B intermodu­lation performance

The 1960MHz PCS CDMA signal path is similar to the
cellular path in many ways. The PCS LNA has a typical
gain of 16dB with a noise figure of 1.3dB. The LNA can
also be bypassed and also has a setting for high input
third-order intercept point of +8dBm. The PCS mixer
features 13 dB gain, 7dB noise figure, and input third­order intercept point of +3dBm. Again, all of the RF
impedance matching to the LNA and SAW filters is
included in the module.

The RF3404 module is flexible enough to accommo­date either single or dual voltage-controlled-oscillator
(VCO) architectures. The cellular band has the select-

of

able option of running the LO directly to the cellular
mixers or routed through a divide-by-2 frequency pres­calerforsystemsthathavemigratedtoasingleVCO
architecture. A buffered transmit LO output with

-12dBm output poweris also supplied for both the PCS
and cellular bands. The RF3404 requires an input LO
power range of -10dBm to -4dBm. The LO input port is
matchedto50Ω. The LO outputs can be tied together
externally to support single transmit LO a pplications
and each is matched to 50Ω.

Mechanical Layout Overview

The RF3404 is builtaround a laminate module technol­ogy geared to high-volume manufacturing and the low
cost structure mandated by the wireless industry. RF
Micro Devices has already built millions of power
amplifier (PA) modules using the same materials sets,
supply chain, and m anufacturing rules used for the
RF3404.

The module is overmolded with a compound that has a
finished overall thickness of 1.6mm. The backside pat­tern of the 8.0mmx8.0mm module is a 48-pin land grid
array (LGA) with a double row of input/output(I/O) con­nections to ease trace routing as shownin the interface
outline drawing. A total of 21 of these I/O pads are
actual signal interconnections, with the remainder
being ground connections.

The I/O pads are a generous 0.5mmx0.6mm in size
on a 1.0mm pitch. The outer ring of I/O pads contains
all of the RF connections along with the voltage supply
and some control lines. The inner ring of I/Os contains
only DC control signal lines and V

1.5 m m square ground pad in the center of the module
backplane supplies additional RF grounding and also
assures a very robust mechanical attachment to the
cellular/PCS telephone PCB. The dual row I/Os aid in
the telephone PCB layout by reducing the number of

connections. A

CC

8

FRONT-ENDS

Rev A1 010918

8-41

RF3404

Preliminary

8

traces required to converge on the perimeter of the
module. Routing is eased by viaholes that can be
placed between the inner row of connections and the
center ground pad in the cellular/PCS telephone PCB.

Why Use Integrated Modules?
Decreased Board Area

Table A shows a comparison between the leading four
design approaches for dual-band/tri-mode CDMA front
ends:

1. discrete LNAs and discrete mixers with off-chip
matching for each component,

2. single band cellular and PCS LNA/Mixer MMICs
with off-chip matching,

3. single MMIC dualband chips with off-chip matching
and finally

4. fully integrated modules like the RF3404.

Table A summarizes the number of SMD components
for each approach as well as the typical amount of
phone board space required for a complete layout.The
RF3404 represents a 50 percent to 70 percent reduc­tion in the amount of board space required when com­pared with the most highly integrated chip solutions on
the market today. Furthermore, it represents the larg­est percentage improvement in board space savings
for any of the other increased integration gains in
recent years.

Reduced BOM Counts

Another area where one can see marked improvement
is in BOM reduction. The RF3404 reduces the BOM

FRONT-ENDS

from the most highly integrated alternatives available
today that contain approximately 25 components to
only three. The three are VCC-bypassing capacitors
that depend on the frequency response of the phone
board power supply and a resistor.

Simplify the Supply Chain

The supply chain can be significantly simplified with
the elimination of two dozen components that would
not need to be source selected, qualified, purchased,
received, stored, coordinated or delivered to the fac­tory floor.

Decreased Engineering and Product Cycle Time

With a single module solution the RF engineering
required to design the front end is significantly
reduced. The RF3404 module allows for a design-in
solution meeting all of the IS95B requirements, which
requires significantly less engineering.

Decreased Assembly Costs

Accordingly, assembly costs are also reduced. With
SMD placement costs running in the range of 1.0cents
to 1.3cents per placement and with the placement of
die packages, SAWs, and modules costing even more
per placement, one can eliminate somewhere around
35 cents from the cost of assembly with modules and
improve factory throughput.

Improve Phone Level Yield

Known good RF performance at the module level is
available with integrated modules that have been RF
tested. Phone level yield can be improved, in addition
to the improvement in yield from placing two dozen
fewer components.

Improved Reliability

Mechanical attachment and reliability is improved with
this module technology due to a variety of factors. The
first is the elimination of numerous components and
thus solder joints, which directly aids overall phone reli­ability. Another important factor is the matched coeffi­cient of thermal expansion (CTE) between the laminate
module and the cellular/PCS telephone PCB that elimi­nates much of the solder stress potential found in low­temperature-cofired-ceramic (LTCC) or chip-scale
modules and should provide the most robust solution
for the stringent mechanical shock and drop tests that
mobile telephone hardware must survive.

Table A. Comparison of Alternate CDMA Front-End Solution Approaches

Number of Components*

Level of Integration Caps Resistors Inductors Saws Total

Components

RF3404 Module 2 1 0 0 3 67
Dual Band Integrated MMIC 11 4 7 2 24 ~200
Single Band Integrated MMIC 19 8 6 2 35 ~280
LNA/Mixer Discrete Solution 24 8 6 2 40 ~350

*Does not include IF matching components to IF SAW filters.

8-42

Board Area

(sq. mm)

Rev A1 010918

Preliminary

RF3404

Evaluation Board Schemati c

C11

10 pF - 47 nF

11
10

9
8
7
6
5
4
3
2
1

P1

COMPONENT1

P1-11

P1-8
P1-7
P1-6
P1-5
P1-4
P1-3
P1-2
P1-1

VCC

J1

CDMA OUT

VCC

J2

FM OUT

P1-3
P1-8

J5

LO INPUT

C12

33 nF

C22

33 nF

L1

390 nH

82 nH

C17

10 pF

0402

L4

180 nH

C21

15 pF

C14

0805

R1

L2

0603

10 kΩ

0402

0603

L3

0603

72 nH

0402

R2

2.4 kΩ

12 pF

C15

10 pF

0402

C18

15 pF

C19

15 pF

0402

0402

J6

PCS LO

OUTPUT

0402

P1-4 P1-5 P1-11 P1-11

P1

VCC1

39

38

35

34

PCS LNAIN

CELL LNAIN

R3

5.1 Ω

P1-11P1-2P1-7P1-1P1-11

14

12

11

VCC2

15

9

8

Note orientation of pin 1

0402

LNA HB INPUT

LNA LB INPUT

3404400, Rev. 4

J3

J4

8

P1-6

22

CDMAIF+

CDMAIF-

23

FM IF+

FM IF-

DIV ENABLE

LO IN VCC3

28

PCS LO

OUT

1

J7
CELL LO
OUTPUT

21

44

BAND SEL

IF SEL

IP SET

48

ENABLE

29

CELL

LO OUT

VCC4

43

30

TX BUFFER

ENABLE

LNA

GAIN

MIXER

GAIN

FRONT-ENDS

Rev A1 010918

8-43

RF3404

Preliminary

Evaluation Board Layout

Board Size 2.0” x 2.0”

Board Thickness 0.030” , Board Material FR-4, Multi

8

FRONT-ENDS

8-44

Rev A1 010918