Datasheet RF3394 Datasheet (RF Micro Devices)

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RF3394

0

Typical Applications

• Basestation Applications

• Broadband, Low-Noise Gain Blocks

• IF or RF Buffer Amplifiers

Product Description

The RF3394 is a general purpose, low-cost RF amplifier
IC. The device is manufactured on an advanced Gallium
Arsenide Heterojunction Bipolar Transistor (HBT) pro­cess, and has been designed for use as an e asily-cas­cadable 50 Ω gain block. Applications include IF and RF
amplification in wireless voice and data communication
products operating in frequency b ands up to 6000MHz.
The device is self-contained with 50 Ω input and output
impedances and requires only two external DC-biasing
elements to operate as specified. The device is designed
for cost effective high reliability in a plastic package. The
3 mmx3mm footprint is compatible with standard ceramic
and plastic Micro-X packages.

GENERAL PURPOSE AMPLIFIER

• Driver Stage for Power Amplifiers

• Final PA for Low-Power Applications

• High Reliability Applications

2 PLCS

2 PLCS

2 PLCS

-A-

3

0.10 C B

0.10 C A

3.00

1

2.75
SQ

Shaded lead is pin 1.

0.45

0.35

0.10 C A

0.60

0.24
TYP

0.375

0.275

3.00

-B-

2 PLCS

0.10 C B

Dimensions in mm.

0.35

0.30

1.15

0.85

0.65

0.20
REF.

0.10 C ABM

PIN 1 ID
R0.20

1.90

1.60

12°

MAX

-C-

0.05 C

0.90

0.85

0.05

0.00

SEATING

PLANE

Optimum Technology Matching® Applied

Si BJT GaAs MESFETGaAs HBT
Si Bi-CMOS
InGaP/HBT

9

SiGe HBT
GaN HEMT SiGe Bi-CMOS

GND

GND

GND

GND

GND

NC

NC

12 11 10

1

2

3

4 5 6

GND

Si CMOS

9

NC

8

RF OUTRF IN

7

NC

Functional Block Diagram

Package Style: QFN, 12-Pin, 3x3

Features

• DC to >6000MHz Operation

• Internally Matched Input and Output

• 20dB Small Signal Gain

• +32dBm Output IP3

• +18dBm Output Power

• Footprint Compatible with Micro-X

Ordering Information

RF3394 General Purpose Amplifier
RF3394 PCBA Fully Assembled Evaluation Board

RF Micro Devices, Inc.
7628 Thorndike Road
Greensboro, NC 27409, USA

Tel [phone]

Fax [phone]

http://www.rfmd.com

Rev A12 040224

4-583

RF3394

Absolute Maximum Ratings

Parameter Rating Unit

Input RF Power +13 dBm
Operating Ambient Temperature -40 to +85 ° C
Storage Temperature -60 to +150 °C

Caution! ESD sensitive device.

RF Micro Devices belie ves t he furnished inf ormation is correct and accur ate
at the time of this printing. However, RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).

Parameter

Min. Typ. Max.

Overall

Frequency Range DC to >6000 MHz
3dB Bandwidth 3 GHz
Gain 18.7 20.2 dB Freq=500MHz

Noise Figure 3.5 dB Freq=2000MHz
Input VSWR <1.8:1 In a 50Ω system, <500MHz

Output VSWR <2.0:1 In a 50Ω system, <500MHz

Output IP
Output P
Reverse Isolation 22.0 dB Freq=2000MHz

3

1dB

+29.0 +32.0 dBm Freq=2000MHz

Thermal

Theta

JC

Maximum Measured Junction

Temperature at DC Bias Con­ditions

Mean Time To Failure 3065 years T

Power Supply

Device Operating Voltage 4.4 4.5 4.6 V At pin 8 with I

Operating Current 80 mA See Note 2.
Note 1: All specification and characterization data has been gathered on standard FR-4 evaluation boards. These evaluation boards are

not optimized for frequencies above 2.5GHz. Performance above 2.5GHz may improve if a high performance PCB is used.

Note 2: The RF3398 must be operated at or below 80mA in order to achieve the thermal performance listed above. While the RF3398

may be operated at higher bias currents, 65mA is the recommended bias to ensure the highest possible reliability and electrical
performance.

Note 3: Because of process variations from part to part, the current resulting from a fixed bias voltage will vary. As a result, caution

should be used in designing fixed voltage bias circuits to ensure the worst case bias current does not exceed 80mA over all
intended operating conditions.

Specification

18.5 20.0 21.0 dB Freq=850MHz

17.0 18.7 22.0 dB Freq=2000MHz

16.7 dB Freq=3000MHz

15.7 Freq=4000MHz

12.1 Freq=6000MHz

<1.25:1 In a 50Ω system, 500MHz to 5000MHz

<2.2:1 In a 50Ω system, 5000MHz to 6000MHz

<1.35:1 In a 50Ω system, 500MHz to 4000MHz

<1.8:1 In a 50Ω system, 4000MHz to 6000MHz

+17.5 dBm Freq=2000MHz

147 °C/W V
139 °C T

5.5 5.9 6.5 V At evaluation board connectors, I

Unit Condition

T=25°C, ICC=65mA (See Note 1.)

ICC=65mA, P

=4.2V

PIN

=+85°C

AMB

=+85°C

AMB

With 22Ω bias resistor

=274mW. (See Note 3.)

DISS

=65mA

CC

=65mA

CC

4-584

Rev A12 040224

RF3394

Pin Function Description Interface Schematic

1NC
2RF IN

3NC
4GND
5GND
6GND
7NC
8RF OUT

No internal connections. It is not necessary to ground this pin.
RF input pin. This pin is NOT internally DC blocked. A DC blocking

capacitor, suitable for the frequency of operation, should be used in
most applications. DC coupling of the input is not allowed, because this
will override the internal feedback loop and cause temperature instabil­ity.

No internal connections. It is not necessary to ground this pin.
Ground connection.
Ground connection.
Ground connection.
No internal connections. It is not necessary to ground this pin.
RF output and bias pin. Biasing is accomplished with an external series

resistor and choke inductor to V
DC current into this pin to a desired level. The resistor value is deter-

mined by the following equation:

-------------------------------------------------------

R

=

Because DC is present on this pin, a DC blocking capacitor, suitable for
the frequency of operation, should be used in most applications. The
supply side of the bias network should also be well bypassed.

. The resistor is selected to set the

CC

V

SUPPLYVDEVICE

–()

I

CC

RF IN

RF OUT

9NC
10 GND
11 GND
12 GND

Die

GND

Flag

No internal connections. It is not necessary to ground this pin.
Ground connection.
Ground connection.
Ground connection.
Ground connection. To ensure best performance, avoid placing ground

vias directly beneath the part.

Rev A12 040224

4-585

RF3394

J1

RF IN

Application Schematic

V

CC

10 nF 22 pF

47 nH

12 11 10

RF IN

1

22 pF

2

3

4 5 6

9

8

7

R

BIAS

22 pF

RF OUT

Evaluation Board Schematic

(Download Bill of Materials from www.rfmd.com.)

P1

P1-1 VCC

P1-3 NC

50 Ω µstrip 50 Ω µstrip

1
2
3

CON3

GND

C1

100 pF

12 11 10

1

2

3

4 5 6

R1

22 Ω

9

8

7

L1

100 nH

C3

100 pF

C2

100 pF

C4

1 µF

VCC
P1-1

J2

RF OUT

4-586

NOTE:

Evaluation board optimized for frequencies above 300 MHz and below 2.5 GHz.
For operation below 300 MHz the value of inductor L1 and capcitors C1 and C2
should be increased.

Rev A12 040224

RF3394

Evaluation Board Layout

Board Size 1.195" x 1.000"

Board Thickness 0.033”, Board Material FR-4

Note: A small amount of ground inductance is required to achieve datasheet performance. The necessary inductance
may be generated by ensuring that no ground vias are placed directly below the footprint of the part.

Overlay of Suggested Micro-X and 3 mmx3mm Layouts Showing

Compatibility

Rev A12 040224

4-587

RF3394

Gain versus Frequency Across Temperature

(ICC = 65 mA)

20.0

18.0

16.0

Gain (dB)

14.0

12.0

10.0

0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0

Frequency (MH z)

Output IP3 versus Frequency Across Temperature

(I

=65mA)

36.0

34.0

32.0

30.0

CC

-40°C
25°C
85°C

-40°C
25°C
85°C

Output P1dB versus Frequency Across Temperature

(I

=65mA)

20.0

19.0

18.0

17.0

16.0

15.0

Output Power (dBm)

14.0

13.0

12.0

0.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0 3500.0 4000.0

CC

Frequency (M Hz)

Noise Figure versus Frequency Across Temperature

6.0

5.5

5.0

4.5

(ICC = 65 mA)

-40°C
25°C
85°C

-40°C
25°C
85°C

28.0

OIP3 (dBm)

26.0

24.0

22.0

20.0

0.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0 3500.0 4000.0

Frequency (MH z)

Input VSWR versus Frequency Across Temperature

2.8

2.6

2.4

2.2

2.0

VSWR

1.8

1.6

1.4

1.2

1.0

-40°C
25°C
85°C

0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0

(ICC = 65 mA)

Frequency (M Hz)

4.0

3.5

Noise Figure (dB)

3.0

2.5

2.0

0.0 500.0 1000.0 1500.0 2000.0 2500.0 3000.0

Frequency (dB)

Output VSWR versus Frequency Across Temperature

1.9

1.8

1.7

1.6

1.5

VSWR

1.4

1.3

1.2

1.1

1.0

0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0

(ICC = 65 mA)

Frequency (MH z)

-40°C
25°C
85°C

4-588

Rev A12 040224

RF3394

Reverse Isolation versus Frequency Across

23.0

22.0

21.0

20.0

19.0

Reverse Isolation (dB)

18.0

17.0

0.0 1000.0 2000.0 3000.0 4000.0 5000.0 6000.0

Temperature

(ICC = 65 mA)

Frequency (MH z)

Current versus Voltage

80.0

70.0

60.0

50.0

(mA)

CC

I

40.0

30.0

20.0

10.0

4.0 4.1 4.2 4.3 4.4 4.5 4.6

(At Pin 8 of t he RF339 4)

VPIN (V)

-40°C
25°C
85°C

-40°C
+25°C
+85°C

90.0

80.0

70.0

60.0

50.0

(mA)

CC

I

40.0

30.0

20.0

10.0

(At eva luati on board connector, R

4.5 5.0 5.5 6.0 6.5

VCC (V)

BIAS

= 22Ω)

Power Dissipated versus Voltage at Pin 8

(T

= +85°C)

Current versus Voltage

0.40

0.35

0.30

0.25

0.20

0.15

Power Dissipated (W)

0.10

0.05

0.00

4.00 4.10 4.20 4.30 4.40 4.50 4.60

AMBIENT

VPIN (V)

-40°C
+25°C
+85°C

Junction Temperature versus Power Dissipated

165.00

160.00

155.00

C)

o

150.00

145.00

140.00

Junction Temperature (

135.00

130.00

125.00

0.22 0.24 0.26 0.28 0.30 0.32 0.34

Rev A12 040224

(T

= +85°C)

AMBIENT

Power Dissipated (W atts)

4-589

RF3394

PCB Design Requirements

PCB Surface Finish

The PCB surface finish used for RFMD’s q ua lific ation process is Electroless Nicke l , immer sio n G old . Typical thickness is
3µinch to 8µinch Gold over 180µinch Nickel.

PCB Land Pattern Recommendation

PCB land patterns are based on IPC-SM-782 standards when possible. The pad pattern shown has been developed and
tested for optimized assembly at RFMD; however, it may require some modifications to address company specific
assembly processes. The PCB land pattern has been developed to accommodate lead and package tolerances.

PCB Metal Land Mask Pattern

A = 0.59 x 0.32 (mm) Typ.

0.80 (mm) Typ. 1.00 (mm)

Pin 1

3.20 (mm)
Typ.

0.65 (mm)
Typ.

0.95 (mm)
Typ.

0.30 (mm) Typ.

0.65 (mm) Typ.

Figure 1. PCB Metal Land Pattern (Top View)

A

A

A

1.30 (mm)
Typ.

2.60 (mm)

0.40 (mm) Typ.

0.70 (mm)
Typ.

A

A

A

1.00 (mm)
Typ.

2.20 (mm)
Typ.

4-590

Rev A12 040224

RF3394

PCB Solder Mask Pattern

Liquid Photo-Imageable (LPI) solder mask is recommended. The solder mask footprint will match what is shown for the
PCB metal land pattern with a 2 mil to 3 mil expansion to accommodate solder mask registration clearance a round all
pads. The center-grounding pad shall also have a solder mask clearance. Expansion of the pads to create s older mask
clearance can be provided in the master data or requested from the PCB fabrication supplier.

A = 0.72 x 0.45 (mm) Typ.

0.72 (mm) Typ. 1.15 (mm)

0.41 (mm) Typ.

3.32 (mm)
Typ.

Pin 1

0.65 (mm)
Typ.

1.01 (mm)
Typ.

0.45 (mm) Typ.

0.65 (mm) Typ.

A

A

A

1.30 (mm)
Typ.

0.75 (mm)

A

A

A

2.60 (mm)

Typ.

1.05 (mm)
Typ.

2.27 (mm)
Typ.

Figure 2. PCB Solder Mask (Top View)

Thermal Pad and Via Design

The PCB metal land pattern has been designed with a thermal pad that matches the exposed die paddle size on the bot­tom of the device.

Thermal vias are required in the PCB layout to effectively conduct heat away from the pac kage. The via pattern has been
designed to address thermal, power dissipation and electrical requirements of the device as well as accommodating
routing strategies.

The via pattern used for the RFMD qualification is based on thru-hole vias with 0.203mm to 0.330mm finished hole size
on a 0.5 mm to 1.2mm grid patter n with 0.025mm plating on via walls. If micro vias are used in a design, it is suggested
that the quantity of vias be increased by a 4:1 ratio to achieve similar results.

NOTE: A small amount of ground inductance is required to achieve data sheet performance. The necessary in ductance
may be generated by ensuring that no ground vias are placed directly below the footprint of the part.

Rev A12 040224

4-591

RF3394

4-592

Rev A12 040224