Datasheet RF3321, RF3321PCBA Datasheet (RF Micro Devices)

Page 1
Preliminary
RF3321
2
Typical Applications
• Euro-DOCSIS/DOCSIS Cable Modems
• CATV Set-Top Boxes
• Telephony Over Cable
Product Description
The RF3321 is a variable gain amplifier for use in CATV reverse path (upstream) applications. It is designed to be DOCSIS-compliant for use in cable modems. The gain control covers a 56dB range and is serially programma­ble v ia three-wire digital bus for compatibility with stan­dard baseband chipsets. Amplifier shutdown and transmit disable modes are hardware-controlled. The device oper­ates over the frequency band of 5MHz to 65MHz for use in current U.S. and European systems. The amplifier delivers up to +69dBmV at the output of the balun. Gain iscontrollableinaccurate1dBsteps.Thedeviceispro­vided in a thermally enhanced, exposed die flag package.
REVERSE PATH HIGH OUTPUT POWER
PROGRAMMABLE GAIN AMPLIFIER
•HomeNetworks
• Automotive/Mobile Multimedia
• Coaxial and Twisted Pair Line Driver
-A-
0.05
+ 0.05
Note 3
NOTES:
1. Shaded lead ispin1.
2. Lead coplanarity -0.10with
3. Lead standoff isspecifiedfrom
2.286
respect to datum "A". the lowest point onthepackage
underside.
4.90
+ 0.20
8° MAX
0° MIN
3.90
+ 0.10
6.00
+ 0.20
0.60
+ 0.15
0.24
0.20
0.25
+ 0.05
0.65
1.40
+ 0.10
3.302
EXPOSED DIE
FLAG
3
LINEAR CATV
AMPLIFIERS
Optimum Technology Matching® Applied
Si BJT GaAs MESFETGaAs HBT Si Bi-CMOS
ü
SHDNB
TX EN
NC
VIN
VINB
VCC1
VCC1
RAMP
SiGe HBT
1
2
3
4
5
6
7
8
Power
Control
Gain Control
and Serial Bus
Si CMOS
16
15
14
13
12
11
10
9
GND
NC
NC
VOUT
VOUTB
SDA
CS
SCLK
Functional Block Diagram
Package Style: SSOP16 EDF Slug
• Differential Input and Output
• 31dB Maximum V oltage Gain
• -25dB Minimum Voltage Gain
•5MHzto65MHzOperation
• Sophisticated Power Management
• DOCSIS 1.1 RF Compliant
Ordering Information
RF3321 ReversePath HighOutput Power Programmable
RF3321 PCBA Fully Assembled Evaluation Board
RF Micro Devices, Inc. 7628 ThorndikeRoad Greensboro,NC 27409, USA
Gain Amplifier
Tel (336)664 1233
Fax (336) 664 0454
http://www.rfmd.com
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Page 2
3
RF3321
Absolute Maximum Ratings
Parameter Rating Unit
Supply Voltage (V Supply Voltage (V Input RF Level 12 dBm
Operating Ambient Temperature -40 to +85 °C Storage Temperature -40 to +150 °C Humidity 80 % Maximum Power Dissipation 0.5 W Maximum T
J
) -0.5 to +5.5 V
CC1
) -0.5 to +7.5 V
CC2
150 °C
DC DC
Preliminary
Caution! ESD sensitive device.
RF Micro Devices believes the furnished information is correctand accurate at thetime ofthis printing. However, RFMicro Devices reservesthe right to make changes to its products without notice. RF Micro Devices does not assume responsibility for the use of the described product(s).
LINEAR CATV
Specification
Unit Condition
V
=5V,V
CC1
V
=38dBmV (rms) differential, output
IN
impedance=75through a 2: 1 transformer. Typical performance is at TA=+25°C,
V
=5V.
CC
=7V, TXEN=SHDNB=1,
CC2
AMPLIFIERS
Overall
Parameter
Min. Typ. Max.
DC Specifications
Supply Voltage 1 (VCC1) 4.75 5.0 5.25 V Main chip supply Supply Voltage 2 (VCC2) 6.65 7.0 7.35 V Output stage supply Supply Current
Maximum Gain, SV1 85 100 mA Gain Control Word=56, V Maximum Gain, SV2 135 150 mA Gain Control Word=56, V Low Gain, SV1 75 90 mA Gain Control Word<28, V Low Gain, SV2 55 70 mA Gain Control Word<28, V Transmit Disable 25 35 mA TXEN=0, V Shut Down 5 mA SHDNB=0, V
Logic High Voltage 2 V Logic Low Voltage 0.8 V Logic Leakage Current -1 1 µA
=5Vor 7V
CC2
CC2
CC2 CC2 CC2 CC2
=5Vor 7V
AC Specifications
Voltage Gain
Maximum 29 31 dB Gain Control Word=56, V Minimum -25 -23 dB Gain Control Word=0, V
Bandwidth 100 MHz Intended operating range is 5MHz to Maximum Input Level 40 dBmV(rms)
Maximum Output Level 69 dBmV(rms) Into 75load at balun output (CW),
65 dBmV V
Output Harmonic Distortion -56 -50 dBc Output Level=68dBmV (rms) (CW)
Output Step Size 0.8 1.0 1.1 dB Output Noise
Maximum Gain -35 -30 dBmV/
160kHz
Minimum Gain -50 -45 dBmV/
160kHz
Transmit Disabled -75 -70 dBmV/
160kHz
TX EN Enable Time 0.5 1.0 µS Time for gain to reach 99% of final value. TX EN Transient Duration 2.4 3.0 µS See Note 1.
65MHz.
=7V
V
CC2
=5V
CC2
Maximum Gain, V
V
=5Vor 7V
CC2
=5Vor 7V
V
CC2
TXEN=0, V
See Note 1.
=5Vor 7V
CC2
=5Vor 7V
CC2
CC2
CC2
=5V or 7V =5V or 7V =5V or 7V =5V or 7V
=5V or 7V
=5Vor 7V
2-2
Rev A10 010516
Page 3
Preliminary
RF3321
Parameter
AC Specifications, cont’d
Output Switching Transients
Maximum Gain 10 20 mV MinimumGain 5 7 mV
Output Impedance 300 Chip output impedance is nominally 300Ω.
Input Impedance 75 Differential
Thermal
Theta
JC
Note 1: The enable time is determined by the value of the capacitor on pin 8 (RAMP). A higher capacitor value will increase the enable time, but will reduce the transient voltage
Min. Typ. Max.
Specification
28 °C/W
Unit Condition
P-P P-P
Differential to single-ended output conver­sion to 75is performed in a balun w ith a 2:1 turns ratio,corresponding toa 4:1 imped­ance ratio.
.
3
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AMPLIFIERS
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Page 4
3
RF3321
Preliminary
Pin Function Description Interface Schematic
1 SHDNB 2TXEN 3NC
4VIN
Chip shutdown pin. Forcing a logic low causes all circuits to switch off andgainsettingstobelost.
Signal path enable pin. Logic high turns on signal path. Logic low turns off signal path, but leaves serial bus active.
Not connected. Input pin. This should be externally AC-coupled to signal source.
V
CC
550 550
500 500
V
IN
V
INB
5VINB
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AMPLIFIERS
6 VCC1 7 VCC1 8 RAMP
9SCLK 10 CS 11 SDA 12 VOUTB
13 VOUT 14 NC 15 NC 16 GND
PKG
BASE
Serial Bus Block Diagram
GND
Complementary input pin. This should be externally coupled to signal
See pin 4.
source. For single-ended use, this pin should be AC-coupled to ground. ThispinisconnectedtoVCC1.
Same as pin 6. External capacitor to ground controls start-up time. Serial bus clock input. Serial bus enable. Serial bus data input. Open collector output. Connect to VCC2 via balun primary.
Open collector output. Connect to VCC2 via balun primary. See pin 12. Same as pin 3. Same as pin 3. Connect to ground. Die is mounted ona heat sink slug that shouldbe connected to ground.
Device grounds are internally bonded to the slug.
V
OUTVOUTB
300
RE
2-4
CS
SDA
SCLK
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
DCKQ
CLR
D0D1D2D3D4D5D6
DCKQ
CLR
POR
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Preliminary
Table 1. Serial Interface Control Word Format
Bit Mnemonic Description
MSB 6 D6 Sleep Mode (Software Shutdown)
5 D5 Gain Control, BitMSB 4 D4 Gain Control, Bit 4 3 D3 Gain Control, Bit 3 2 D2 Gain Control, Bit 2 1 D1 Gain Control, Bit 1
LSB 0 D0 Gain Control, Bit LSB
RF3321
Serial Bus Timing D iagram
TES TDS TDH TEH
CS
SCLK
SDA
(Data)
TDATAH,TDATAL
D0 D1
D2
TWH
TC
D3 D4 D5 D6
3
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AMPLIFIERS
Table 2. Timing Data
Parameter Symbol Min T yp Max Units
SCLK Pulsewidth T SCLK Period T Setup Time, SDA versus S CLK T Setup Time, CS versus S CLK T Hold Time, SDA versus S CLK T Hold Time, CS versus S CLK T SCLK Pulsewidth, High T SCLK Pulsewidth, Low T
Table 3. Programming State
WH
C DS ES DH EH
DAT AH
DATAL
50 ns
100 ns
10 ns 10 ns 20 ns 20 ns 50 ns 50 ns
TX SHDND MSB6
Enter Sleep Mode X H L H=High Voltage Logic Exit Sleep Mode X H H* L=Low Voltage Logic Enter Shutdown X L X X=Don’t Care Exit Shutdown X H H* *Gain Control Data Must be Re-Sent TX Enable H X X TX Disable L X X
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Page 6
RF3321
Preliminary
Application Schematic
3
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SHDNB
TXEN
10 nF
VIN
10 nF
VINB
V
CC1
AMPLIFIERS
220 pF
1
2
3
4
5
6
7
8
Power
Control
Gain Control
and Serial Bus
PACKAGE BASE
16
15
14
13
12
100 pF
11
10
9
4:1
V
CC2
VOUT
SDA
CS
SCLK
2-6
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Preliminary
J1
1 2
CS
3
SDA
4
SCLK
5
J5-1
6
J3-1
7 8
9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25
Notes:
1. 4-layer board.
2. Underside of package must solder to ground.
3. Place C5and C6 as close to pin aspossible.
4. C1 andC10 are tantalum, size code Y.
5. All other componentsare 0603size.
6. ReplaceR6with0resistor if 7 5 connector is used.
VCC
R1
100 k
R2
100 k
NC CS SDA SCLK SHDNB TXEN NC NC NC VCC NC
NC NC VCC NC NC GND GND GND GND GND GND GND GND
Evaluation Board Schemati c
(Download Bill of Materials from www.rfmd.com.)
VCC2
VCC
VCC1
Power
Control
GainControl
and Serial Bus
L4 (Ferrite)
30
L2 (Ferrite)
30
L3 (Ferrite)
30
J6
RF IN
VCC1
J1-6 TXEN
J1-5 SHDNB
T1 1:1
3 2 1
R5
75
4 5 6
R4
75
C5
0.1 µF
J2
1 2 3
J4
1 2 3
C3
1nF
C4
1nF
C6
220 pF
VCC
GND
VCC
GND
1
2
3
4
5
6
7
8
PACKAGEBASE
3321400C
J3
1 2 3
J5
1 2 3
RF3321
R7
R8
L5 (Ferrite)
30
+
C11 1nF
L1 (Ferrite)
30
+
C2
1nF
16
15
14
13
12
11
10
9
15 pF
VCC
15 pF
C7
C8
C10 10 µF (10 V)
C1 10 µF (10 V)
T2 4:1
3 2 1
C9
100 pF
Q1
JP1
1
VCC 9V
2
VCC2 VCC1
3
GND
4
R6
24
4 5 6
VCC2
J7
RF OUT
SDA
CS
SCLK
3
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AMPLIFIERS
Rev A10 010516
2-7
Page 8
3
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RF3321
Preliminary
Evaluation Board Layout
Board Size 2.5” x 2.5”
Board T hickness 0.058”, Board Material FR-4, Multi-Layer
AMPLIFIERS
2-8
Rev A10 010516
Page 9
Preliminary
RF3321
Gain versus Frequency
30.0
20.0
10.0
0.0
-10.0
Voltage Gain(dB)
-20.0
-30.0
-40.0 0 50 100 150 200 250
Frequency (MHz)
Gain versus Supply Voltage (V
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
Voltage Gain(dB)
-1.4
-1.6
-1.8
-2.0
4.70 4.80 4.90 5.00 5.10 5.20 5.30
at Gain Control Word =25
SupplyVoltage V
Gain Control Word=56 Gain Control Word=25 Gain Control Word=0
CC1
(V)
CC1
)
5MHz 42 MHz 65 MHz
Gain versus Supply Voltage (V
29.2
29.1
29.0
28.9
28.8
28.7
28.6
Voltage Gain(dB)
28.5
28.4
28.3
28.2
4.70 4.80 4.90 5.00 5.10 5.20 5.30
at Gain Control Word =56
Supply Voltage V
CC1
Gain versus Supply Voltage (V
29.2
29.1
29.0
28.9
28.8
28.7
Voltage Gain(dB)
28.6
28.5
28.4
28.3
6.65 6.75 6.85 6.95 7.05 7.15 7.25 7.35
at Gain Control Word =56
Supply Voltage V
CC2
(V)
(V)
CC1
CC2
)
)
5MHz 42 MHz 65 MHz
5MHz 42 MHz 65 MHz
3
LINEAR CATV
AMPLIFIERS
0.0
-0.2
-0.4
-0.6
-0.8
-1.0
-1.2
Voltage Gain(dB)
-1.4
-1.6
-1.8
-2.0
6.65 6.75 6.85 6.95 7.05 7.15 7.25 7.35
Rev A10 010516
Gain versus Supply Voltage (V
at Gain Control Word =25
SupplyVoltage V
CC2
(V)
CC2
)
5MHz 42 MHz 65 MHz
2-9
Page 10
RF3321
Preliminary
3
LINEAR CATV
Gain versus Gain Control Word at 5 MHz
30.0
20.0
10.0
0.0
Voltage Gain(dB)
-10.0
-20.0
AMPLIFIERS
-30.0 01020304050
GainControlWord
Voltage Gain(dB)
30.0
20.0
10.0
0.0
-10.0
-20.0
-30.0
Gain versus Gain Control Word at 65 MHz
-30
-40
-50
-60
Second Harmonic(dBc)
-70
Voltage Gain(dB)
30.0
20.0
10.0
0.0
-10.0
-20.0
Gain versus Gain Control Word at 42 MHz
01020304050
GainControlWord
Second Harmonic versus Frequency andOutput Level
65 MHz 42 MHz 5MHz
2-10
-30.0 01020304050
GainControlWord
Third Harmonic versus Frequency andOutput Level
-50
-55
-60
-65
-70
Third Harmonic(dBc)
-75
-80
30 35 40 45 50 55 60
PowerOut (dBmV)
65 MHz 42 MHz 5MHz
-80 30 35 40 45 50 55 60
Output Level (dBmV)
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Page 11
Preliminary
RF3321
-1 dBCompression Point
72.0
70.0
68.0
66.0
Power Out(dBmV)
64.0
62.0
60.0
33.0 35.0 37.0 39.0 41.0 43.0 45.0
at Gain Control Word =56
Gain Control Word=56 Trend
Power In(dBmV)
-1 dBCompression Point
44.0
43.0
42.0
41.0
40.0
39.0
Power Out(dBmV)
38.0
37.0
36.0
35.0
38.0 39.0 40.0 41.0 42.0 43.0 44.0 45.0 46.0 47.0
at Gain Control Word =29
GainControl Word=29 Trend
Power In(dBmV)
3
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AMPLIFIERS
Rev A10 010516
2-11
Page 12
RF3321
Preliminary
Evaluation Kit
3
General Description
The RF3321 PCBA is a fully assembled evaluation board of the RF3321 reverse path high output power programmable gain amplifier, useful for providing a demonstration of the RF3321’s functionality. The RF3321 PCBA is a digitally controlled variable gain amplifiercapable of driving a 75source. The RF3321 is designed to send cable modem data with QPSK or QAM modulated format at frequencies between 5 MHz and 65MHz. The gain is controlled by an 7-bit serial data word which adjusts the output gain from -25dB to +31dB.
The kit includes a fully functional evaluation board
AMPLIFIERS
LINEAR CATV
along with a serial data cable and software. The cable connects directly to the parallel port of a standard PC. The software is used to control the serially programma­ble gain through a s imple, easy to understand user interface.
Input and output to the evaluation board is provided through 50SMA connectors. The input and output of the evaluation board is matched to 50and connected through a balun for single-ended operation. This allows easy connection to test equipment, but the evaluation board can easily be converted to a 75input and out­put, or for differential input and output. The output cir­cuit is matched using a 24series resistor which is used to bring the load impedance up to 75when using standard 50test equipment. This will introduce a loss which must be accounted for in all measure­ments (see measurementsection and evaluation board schematic for more detail.)
device to 75. This introduces a voltage loss of 3.5dB which must be accounted for in all measurements. Some spectrum analyzershave a setting to account for this method of 75testing (e.g., on a Rhode & Schwartz spectrum analyzer the input can be set to '”75RAZ” and the loss is accounted for automati­cally). A more accurate way of making this measure­ment is to use a 75spectrum analyzer, or use a matching transformer or minimum loss pad. This ensures that the s ource impedance seen by the equip­ment is also 75Ω.Ifa75Ω output is required, simply replace the 50SMA connector (J7) with a 75F­style connector and replace R5 with a 0jumper. The evaluation board is tested with a Coilcraft balun; how­ever, additional baluns may be used as long as care is taken in modifying the decoupling capacitors around the balun. These capacitors can greatly affect the har­monic s uppression. Other baluns may be used but should be tested for second and third order harmonic suppression.
Transmit Enable
The transmit enable can be set to “continuous on” by placing the TXEN jumper in the up position (up position when viewing the top of the evaluation board with the 25-pin connector closest to the viewer) and placing the associated GND/VCC jumper in the “VCC” position. The transmit enable can be set to “continuous off” by placing the GND/VCC jumper in the “GND” position. If a computer controlled signal is used (J1), place the TXEN jumper in the down position.
GND VCC
GND VCC
GND VCC
PCBA Details
Input Circuit
The input to the RF3321 is differential and the imped­ance is 75; However, for ease of testing, the evalua­tion board has been changed to single-ended and the impedance has been matched to 50Ω.Ifa75Ω input is required, simply replace the 50SMA connector with a75Ω F-style connector and remove R4 and R5.
Output Circuit
The output of the RF3321 is differential and the imped­ance is 300. In nor m al applications this is converted into a single-ended 75output using a 2:1 (voltage ratio) transformer with a center-tap on the secondary which supplies power to the output stage. The evalua­tion board is configured for use with 50test equip­ment. This has been achieved with a 24resistor in series with the output to increase the load seen by the
2-12
TX EN
Continuous ON
A
TX EN
Continuous OFF
B
Figure 1. TX Enable Configuration
TX EN
Software Controlled
C
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Page 13
Preliminary
RF3321
Shutdown Enable
Shutdown enable can be set to be “continuous on” (chip enabled) by placing the SHDN jumper in the up position and placing the associated GND/VCC jumper in the “VCC” position. Shutdown enable can be set to “continuous off” (chip disabled) by placing the associ­ated GND/VCC jumper in the “GND” position. If a com­puter controlled signal is used (J1), place the SHDN jumper in the down position.
GNDVCC
C
SHDN
Continuous OFF
A
GNDVCC
SHDN
GNDVCC
Continuous ON
B
SHDN
Software Controlled
Figure 2. SHDN Enable Configuration
V
Settings
CC
V
should be set to 5.0VDC.
CC1
should be set to 7.0VDC.
V
CC2
Evaluation Board Setup
Equipment Needed
• Signal Generator
• Spectrum Analyzer
• Power Supply (5.0V@300mA)
• RF3321 PCBA
• Serial Cable (included with kit)
• Standard PC
• Three-Wire Bus Software
Optional Equipment
• Variable Low-Pass or Band-Pass Filters
• Power Meter
• Second Signal Generatorwith ModulationforACPR and IP2, IP3 Testing
• Arbitrary Wave Generator
• Two-Channel Oscilloscope
Unzip the file using WinZip 7.0 or higher (http:// www.winzip.com). Unzip to a temporary directory and run RF3321.exe.
The 7-bit Gain Control Word (GCW) in the data latch determines the gain setting in the RF3321. The gain control data (SDA) load sequence is initiated by a fall­ing edge on CS. The SDA is serially loaded (LSB first) into the 7-bit shift register at each rising edge of the clock. W hile CS is low, the data latch holds the previ­ous data word allowing the gain level to remain unchanged. After seven clock cycles the new data word is fully loaded and CS is switched high. This enables the data latch and the loaded register data is passed to the gain control block with the updated gain value. Also at this CS transition, the internal clock is disabled, thus inhibiting new serial input data.
Software and Cable
Figure 3 shows the cable configuration. Connect the cable into the LPT1 port of the computer running the software. Connect the other end of the cable to the 25­pin connector of the evaluation board. Executing the software (RF3321.exe) will produce the screen shown in Figure 4. The user may set the gain of the evaluation board by sliding the gain control switch to the desired gain setting. Pressing the Preset Gain Value buttons automatically sets the gain of the unit to the value shown on the button. The Automatic Gain Adjustment when set to “Cycle” will automatically cycle through all of the gain steps (0-56) in seconds (at the rate set by the user). The user may place the unit in sleep, shut­down and transmit enable/disable m odes by checking the corresponding box. The bit pattern being sent to the PCBA is shown at the bottom of the screen. See README_3321.txt file for proper pin/signal mapping for the 25 pin interface.
3
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AMPLIFIERS
Software Setup
To install the software, you need a computer with the following.
• 133MHz Pentium processor
•16MBRAM
• Hard Drive with 5MB free space
• Free 25-pin LPT por t
• VGA Monitor
The software may be downloaded from www.rfmd.com by following these steps.
Select the “Product Support” tab; Select “Evaluation Board Information”; Select “RF3321”.
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Page 14
Preliminary
RF3321
RF3321 PCBA Cable
3
6 TX Enable Line
18Ground
5SHUTDOWNLine
4 CLK Line
3DataLine
2CSLine
25 Pin D-Connector (Back View)
Figure 3. Cable Configuration Hardware Setup
Gain and Harmonic Distortion Test Setup
To test the gain of the RF3321 PCBA, connect a low­pass or band-pass filter to the output of the signal gen­erator. Use a filter just above the frequency youwantto test. The filter is used to attenuate any harmonics out­put by the signal generator. Connect the signal genera­tor to the power meter and measure the power. Compare with modulation enabled and disabled to make sure the meter was measuring average rather than peak power. No more than 0.2dB difference in powershouldbeobserved.An offset on the signal gen­erator may be needed to match the level shown on the power meter. The signal generator should then be con­nected directly to a spectrum analyzer. M ake sure the output of the signal generator is the same as the input read by the spectrum analyzer. Adjust the offset of the spectrum analyzer until the signal out is the same as the signal in on the spectrum analyzer. Turn off the RF and modulation. Check positioning of the jumpers on the board. Refer to the PCBA section of this applica­tion note to verify proper positions. Connect the output of the signal generator to J6: RFIN of the PCB. Con­nect J7: RFOUT to the spectrum analyzer. Ensure that
Figure 4. On-Screen Display
you are accounting correctly for the losses in the 75 to 50conversion at the output of the device; there is an output voltage loss of 3.5dB for the evaluation board in its standard configuration (see output stage circuit description). Connect one end of the serial cable into the computer and the other end into J1 of the PCB. Connect +5.0V
Turn on the DC power and turn on RF from the signal generator. Set the GCW to 56 and make sure TX Enable is checked. The amplified signal should be dis­played on the spectrum analyzer. The harmonics can also be viewed with this setup. As you change the GCW from 56 to 0 (in steps of one), there will be a 1dB change in the output of the PCB.
into V+ and ground into GND(JP1).
DC
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AMPLIFIERS
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Page 15
Preliminary
RF3321
ACPR Test Setup
To test the ACPR of the RF3321 PCBA set modulation to:
•QPSK
• 2Bits/Sym
• 160ksps
α=0.25
• PRBS-20bit Data
Set signal generator to:
•45MHz,
- 13.0dBm output power,
• 0dB offset.
Connect 50MHz coaxial filter to output, then to output cable.
Zero and calibrate the power meter. Connect signal generator to power meter and set offset on signal gen­erator until power meter reads -13.0dBm. Make sure power meter reads the same (±0.2dBm) with modula­tion enabled and disabled to verify power meter is measuring average power rather than peak power. Check positioning of the jumpers on the board. Refer to the PCBA section of this application note to verify proper positions. Connect the output of the signal gen­erator to J6: RFIN of the PCB. Connect J7: RFOUT to the power meter. Connect one end of the serial cable into the computer and the other end into P1 of the PCB. Connect+5.0V
Turn on the DC power and turn on RF and modulation from the signal generator. Set the GCW to 56 and make sure TX Enable is checked. Measure and record channel power at RFOUT using the power meter (accounting for 75/50 conversion losses). Connect RFOUT to spectrum analyzer and adjust offset of the spectrum analyzer until the channel power displayed by the spectrum analyzerisequaltothe channelpower recorded in the previous step (Channel bandwidth = 200 kHz). Now use the spectrum analyzer to measure relative ACP (this way the uncertainties in the spec­trum analyzer power measurement are immaterial). The ACP is measured in 200 kHz channel bandwidths at a 220kHz offset (i.e., from 20kHz to 220kHz outside the channel). As you increase the input power, you will notice a degradation of the ACP upper and lower bands.
into VCCand ground into GND.
DC
Transmit Turn-On and Turn-Off Transients
UseanArbitraryWaveformGeneratorsettoa3V square wave, 5% duty cycle, 120Hz as the input to the transmit enable. Set a signal generator to 10 MHz,
-13.0 dbm output power, 0dB offset. Connect output of the signal generator to J6, RFIN of the PCB. Remove the TXEN jumper and connect the arbitrary wave gen­erator square wave output to the center pin of the TXEN 3-pin header. Connect the output of the evalua­tion board to the oscilloscope (channel 1). Connect the TXEN signal from the arbitrary wave generator to channel 2 of the oscilloscope and tr igger off of the ris­ing edge. As the TXEN line is sent, the oscilloscope will trigger and capture the pulsed RFOUT signal. This will be displayed on the oscilloscope. Measure the amount of time between 90% of the TXEN turn-on to where the output signal reaches 90% of full turn-on. This is defined as the transmit turn-on time.
To measure the transient pulse, replace the signal gen­erator input with a 50terminator and repeat the steps above. Measure the size of the transient. This can be affected by the C
balun and capacitor values around the balun. Larger values of C
and increase the TX enable time.
PCB Layout Considerations
The RF3321 Evaluation board can be used as a guide for the layout in your application. Care should be taken in laying out the RF3321 in other applications. The RF3321 will have similar results if the following guide­lines are taken into consideration:
• Make sure underside of package is soldered to a good ground on the PCB.
• Move C2, C7, C8, and C9 as close to T1 as possi­ble.
• Keep input and output traces as short as possible.
• Ensure a good ground plane by using multiple vias to the ground plane.
• Use a low noise power supply along with decou­pling capacitors
RAMP
capacitor (C6), and the output
RAMP
will decrease the transient voltage
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Preliminary
Special Handling Information for Shrunk Small Outline Package (SSOP1-EPP) Products
These packages are considered JEDEC Level 5 for moisture sensitivity and require special handling to assure reliable performance.
The exposed copperslugonthebottomofthepackage improves both thermal and electrical performance. Since the RFIC is mounted directly on the thermal slug, and the slug is soldered directly on the PCB, the thermal resistance to the PCB is minimized. Also, the RF ground for the amplifier is established through this copper slug as it is soldered to the ground plane on the PCB. This offers the least inductance ground path available.
RF3321
3
Care must be taken when soldering these packages to the PCB. They are currently considered JEDEC Level 5 for moisture sensitivity. Therefore the parts must be handled in a dry environment prior to soldering, as is specified in the JEDEC specification. Specifically, RFMD recommends the following procedure prior to assembly:
1. Dr y-bake the par ts at 125°C for 24 hours minimum. Note: the shipping tubes cannot withstand 125°C baking temperature.
2. Parts delivered on tape and reel are already dry­baked and dry-packed. These may be stored for up to one year, but must be assembledwithin 48 hours after opening the bag.
3. Assemble the dry-baked parts within two days of removal from the oven.
4. During this two-dayperiod, the parts mustbestored in humidity less than 60%.
IMPORTANT! If the two-day period is exceeded, then this procedure must be repeated prior to assembly.
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