The RF3108 is a high-power,high-efficiencypoweramplifier module offering high performance in GSM or GPRS
applications. The device is self-contained with 50Ω input
and output terminals. The device is manufactured on an
advancedGaAs HBT process, and hasbeen designed for
use as the final RF amplifier in GSM/DCS and PCS hand
held-digital c ellular equipment and other applications in
the 880 M Hz to 915 MHz and 1710MHz to 1910MHz
bands. On-board power control provides over 70dB of
control range with an analog voltage input, and provides
power down with a logic "low" for standby operation. The
device is packaged in an ultra-small (9mmx10mm) LCC,
minimizing the required board space.
TRIPLE- BAND GSM/DCS/PCS
POWER AMP MODULE
• Portable Battery-Powered Equipment
•GPRSCompatible
1.40
1.40
1.40
0.90
10.0 + 0.10
1.00
typ.
typ.
0.38
Ref.
1.40
1.40
1.40
1.30
0.30
NOTE: Shaded area represents Pin 1.
0.60
typ.
9.0 + 0.10
Noteorientation of Pin 1.
1.55
+0.10
2
POWER AMPLIFIERS
Optimum Technology Matching® Applied
Si BJTGaAs MESFETGaAs HBT
Si Bi-CMOS
VCC
1
PCS IN
2
PCS V
GSM V
3
APC
GND
4
5
APC
GSM IN
6
7
VCCGSM OUT
ü
SiGe HBT
Si CMOS
14
13
12
11
10
9
8
Functional Block Diagram
PCS OUT
GND
GND
VCC
GND
GND
Package Style: Module
Features
• Single 2.9V to 4.7V Supply Voltage
• +35.5dBm GSM Output Pwr at 3.5V
• +33.0dBm DCS/PCS Output Pwr at 3.5V
• 55% GSM and 50% DCS/PCS Efficiency
• Supports GSM, E-GSM and DCS/PCS
•9mmx10mmPackageSize
Ordering Information
RF3108Triple-Band GSM/DCS/PCS Power Amp Module
RF3108 PCBAFully Assembled Evaluation Board
RF Micro Devices, Inc.
7625 Thorndike Road
Greensboro,NC 27409, USA
Tel (336) 664 1233
Fax (336) 664 0454
http://www.rfmd.com
Rev A3 010702
2-261
2
RF3108
Absolute Maximum Ratings
ParameterRatingUnit
Supply Voltage-0.5 to +6.0V
Power Control Voltage (V
)-0.5 to +3.0V
APC1,2
DC Supply Current2400mA
Input RF Power+13dBm
Duty Cycle at Max Power50%
Output Load VSWR8:1
Operating Case Temperature-40 to +85°C
Storage Temperature-55 to +150°C
DC
Caution! ESD sensitive device.
RF Micro Devices believesthe furnishedinformation is correctand accurate
at the time of this printing. However,RF Micro Devices reserves the right to
make changes to its products without notice. RF Micro Devices does not
assume responsibility for the use of the described product(s).
Specification
UnitCondition
Temp= +25°C, VCC=3.5V,V
P
=6dBm, Freq=880MHz to 915MHz,
IN
POWER AMPLIFIERS
Overall (GSM Mode)
Parameter
Min.Typ.Max.
25% Duty Cycle, Pulse Width=1154µs
Operating Frequency Range880 to 915MHz
Maximum Output Power+34.535.5dBmTemp = 25°C, V
+32.0dBmTemp=+85°C, V
Total Efficiency4755%At P
OUT,MAX,VCC
=3.5V,V
CC
=2.9V,V
CC
=3.5V
Input Power for Max Output+4+6+8dBm
Output No ise Power-72dBmRBW=100kHz, 925MHz to 935MHz,
> 34.5 dBm
P
OUT
-81dBmRBW=100kHz, 935MHz to 960MHz,
> 34.5 dBm
P
OUT
Forward Isolation-30dBmV
=0.2V,PIN=+8dBm
APCGSM
Second Harmonic-40-35dB c
Third Harmonic-50-43dBc
All other non harmonic spurious-36dBm
Input Impedance50Ω
Input VSWR2.5:1P
Output Load VSWR8:1Spurious<-36dBm, V
OUT,MAX
-5dB<P
OUT<POUT,MAX
APCGSM
RBW=100kHz
Output Load Impedance50ΩLoad impedan ce presented at RF OUT pad
Power Control V
Power Control “ON”2.6VMax. P
Power Control “OFF”0.20.5VMin. P
Power Control Range70dBV
Gain Control Slope100dB/VP
APC1
, Voltage supplied to the input
OUT
, Voltage supplied to the input
OUT
=0.2Vto 2.6V
APC1,2
=-10 dBmto35dBm
OUT
APC Input Capacitance10pFDC to 2MHz
APC Input Current4.55mAV
10µAV
Turn On/Off Time2µSV
=2.6V
APC
=0V
APC
=0to2.6V
APC
Overall Power Supply
Power Supply Voltage3.5VSpecifications
2.94.7VNominal operating limits, P
Power Supply Current2ADC Current at P
110µAPIN<-30 dBm,V
Temp= -40to +85°C
OUT,MAX
APC1,2
=0.2V,
=2.6V,
APCGSM
APCGSM
=2.6V
=2.6V
APCGSM
=0.2V to 2.6V,
<+33dBm
OUT
2-262
Rev A3 010702
RF3108
Parameter
Min.Typ.Max.
Overall (DCS/PCS Mode)
Operating Frequency Range1710 to 1910MHz
Maximum Output Power+32+33dBmTemp=25°C, V
Total Efficiency4552%At P
Recommended Input Power
Range
Output Noise Power-77dBmRBW=100kHz, 1805MHz to 1880MHz and
Forward Isolation-37-30dBmV
Second Harmonic-60-45dBcP
Third Harmonic-65-50dBc
All other spurious-36dBm
Input Impedance50Ω
Input VSWR-2.5P
Output Load VSWR8:1Spurious<-36dBm,
Output Load Impedance50ΩLoad impedance presented at RF OUT pin
Power Control V
Power Control “ON”2.6VMax. P
Power Control “OFF”0.20.5VMin. P
Power Control Range6268dBV
Gain Control Slope100dB/VP
APC Input Capacitance10pFDC to 2 MHz
APC Input Current4.55mAV
Turn On/Off TIme100nsV
APC2
Specification
31.532.5dBm1850MHz to 1910MHz
29.029.5dBmTemp=+85°C, V
29.530dBm1710MHz to 1785MHz
4047%At P
+4+6+8dBm
10µAV
UnitCondition
Temp=25°C, VCC=3.5V,
V
APCDCS/PCS
Freq=1710MHz to 1910MHz,
25% Duty Cycle, Pulse Width=1154µs
V
APCDCS/PCS
1850MHz to 1910MHz
OUT,MAX,VCC
1710MHz to 1785MHz
OUT,MAX,VCC
1850MHz to 1910MHz
1930MHz to 1990MHz,
P
OUT
APCDCS/PCS
OUT,
OUT,MAX
V
APCDCS/PCS
APC1,2
OUT
APC
=0V
APC
APC
=2.6V,PIN=6dBm,
=3.5V,
CC
=2.6V, 1710MHz to 1785MHz
=2.9V,V
CC
=3.5V,
=3.5V,
> 34.5dBm, VCC=3.5V
=0.2V,PIN=+8dBm
=+32.5dBm
-5dB<P
OUT<POUT,MAX
=0.2V to 2.6V, RBW=100kHz
, Voltage supplied to the input
OUT
, Voltage supplied t o the input
OUT
=0.2V to 2.6V, PIN=+8dBm
=-10dBm to +33dBm
=2.6V
=0to2.6V
APC
=2.6V,
Overall Power Supply
Power Supply Voltage3.5VSpecifications
2.94.7VNominal operating limits, P
Power Supply Current1.3ADC Current at P
110µAPIN<-30dBm, V
Temp =-40 to +85 °C
OUT,MAX
APC1,2
=0.2V,
OUT
<+33dBm
2
POWER AMPLIFIERS
Rev A3 010702
2-263
2
RF3108
PinFunctionDescriptionInterface Schematic
1VCC1
2DCS/PCS IN
3DCS/PCS
V
APC
4GND
5GSMV
APC
6GSMIN
7VCC2
8GSMOUT
9GND
POWER AMPLIFIERS
10GND
11VCC3
12GND
13GND
14DCS/PCS
OUT
Pkg
GND
Base
Power Supply for the driver stage of the DCS/PCS band.
RF Input to the DCS/PCS band. This is a 50Ω input.
Power control for the pre-amplifier, driver, and output stage of the DCS/
PCS band.
Ground connection to overall package.
Power control for the pre-amplifier, driver, and output stage of the GSM
band.
RF input to the GSM band. This is a 50Ω input.
Power supply for the driver stage of the GSM band.
RF output for the GSM band. This is a 50Ω output. The output load line
matching i s contained internal to the package.
Ground connection to overall package.
Ground connection to overall package.
Power supply for the pre-amplifier and output stage for both the DCS/
PCS and GSM bands.
Ground connection to overall package.
Ground connection to overall package.
RF output for the DCS /PCS band. This is a 50Ω output. The output
load line matching is contained internal to the package.
Ground connection to overall package.
2-264
Rev A3 010702
RF3108
Theory of Operation and Application Information
The RF3108 is a triple-band, GSM/DCS/PCS power
amplifier with two separate RF inputs and outputs that
are internally matched to 50Ω. Pins 2 and 14 of the
device provide the RF input and output for the DCS/
PCS band, which is optimized for performance
between 1710MHz and 1910MHz. Pins 5 and 8 of the
device provide the RF input and output for the GSM
band, which is optimized for performance between
880 MHz and 915MHz. Both bands include an internal
DC-blocking capacitor to protect the device from external DC source inputs and block internal DC from exiting the inputs and outputs of the module. The
performance is similar to the performance of the
RF2173 and RF2174 MIMIC devices used in dual- or
triple-band applications. However, the RF3108 module
includes the matching and bypass capacitors required
for operation internal to the 9mm x10mm module.
However, some external components are required to
improve stability, isolation and noise power performance. These components are included on the evaluation board and schematic, and will be described in the
following paragraphs.
The GSM 900MHz band provides 32dB and the DCS/
PCS 1710 MHz to 1910MHz band provides 28dB of
small signal gain at full output power. Therefore, the
drive level required to fully saturate the output is
+4 dBm for each band. Based upon HBT (Heterojunction Bipolar Transistor) technology, the part requires
only a single positive 3V supply to operate to full specification. The DCS/PCS band input is located at pin 2
of the device and requires no external components.
The GSM 900MHz band input is located at pin 6 of the
device and also does not require external components.
However, a 180Ω resistor is included at the input of the
GSM band to improve the input impedance and isolation performance at low V
both high and low bands are internally m atched to 50Ω
at the output of pin 14 and 8. A 50Ω microstrip should
be used to interface to the input and output connections.
levels. The output for
APC
Power control for the GSM 900MHz band is provided
through pin 5 of the device, and pin 3 for the DCS/PCS
band. The V
bypass capacitors and will require some external filtering. Because the V
the device, the user has the option of choosing a
capacitor value that meets the control loop BW and filtering requirement for various applications. In most typical applications with a closed loop power control, the
recommended bypass capacitor for this input is
approximately 33 pF for the GSM band, and 12pF for
the DCS/PCS band. However in open loop operation, a
10 nF V
bands to filter noise from the external V
10nF capacitor is installed on pins 3 and 5 on the cur-
rent evaluation board (see the evaluation board schematic). Noise on the V
power perfor mance of the device, so c are should be
used to providea clean V
cially impor tant when measuring noise power or stability performance.
The voltage supply V
capacitors and inductors to filter unwanted noise on
the DC supply voltage. However, the main V
the device at pin 11 requires some additional bypass
capacitors as shown in the evaluation board schematic. C5 (1uF) and C4 (3.3uF) are required to
improve the stability performance.
All the internal ground connections are connected to a
series of ground pads located on the backside of the
package as shown in the pin out diagram. Pins 4, 9,
10, 12, and 13 are also ground connections. The final
stages of both bands are connected to the ground
pads on the backside of the package. Therefore this
ground connection is essential to dissipate heat and to
provide proper current flow. Refer to the evaluation
board layout as an example of the vias locations and
quantity required for proper connection.
APC
inputs do not contain any internal
APC
filtering capacitor is external to
APC
bypass capacitor is recommended for both
source. A
APC
input will degrade the noise
APC
input signal. This is espe-
APC
contains internal bypass
CC
input to
CC
2
POWER AMPLIFIERS
Rev A3 010702
2-265
RF3108
Pin Out
2
VCC
PCS IN
PCS VAPC
GND
114GNDGNDGNDGND
2
GND
3
4
GNDGND
GNDGND
GNDGND
GNDGND
13
12
11
PCS OUT
GND
GND
VCC
POWER AMPLIFIERS
GSM VAPC
GSM IN
VCCGSM OUT
5
GND
6
78GNDGNDGNDGND
GNDGND
GNDGND
Top View
10
GND
9
GND
2-266
Rev A3 010702
RF3108
Application Schemati c
V
CC
DCS/PCS
RF IN
DCS/PCS
VAPC
GSM
VAPC
GSM
RF IN
50
Ω µ
1µF
50
Ω µ
strip
4.7µF
strip
50
Ω µ
strip
50
Ω µ
strip
50
Ω µ
strip
V
CC
1
2
3
4
5
6
7
14
13
12
11
10
9
8
PCS/DCS
RF OUTPUT
V
CC
RF OUTPUT
GSM
2
POWER AMPLIFIERS
Evaluation Board Schemati c
(Download Bill of Materials from www.rfmd.com.)
C1*
1nF
VCC
C2*
10 nF
P1
1
CON1
GND
P2-1VCC
P2
1
CON1
J1
DCS/PCS
RF IN
J5
DCS/PCS
VAPC2
J6
GSM
VAPC1
J3
GSM
RF IN
VCC
Rev A3 010702
50 Ω µstrip
50 Ω µstrip
C7
10 nF
50 Ω µstrip
C6
10 nF
50 Ω µstrip
180 Ω
C3*
10 nF
R1
J2
PCS/DCS
RF OUTPUT
+
J4
GSM
RF OUTPUT
C5
1 µF
50 Ω µstrip
VCC
C4
3.3 µF
50 Ω µstrip
1
2
3
4
5
6
7
Components w ith (*) following the reference designator
should not be populated on the evaluation board.
14
13
12
11
10
9
8
3108400B
2-267
2
RF3108
Evaluation Board Layout
Board Size 2.0” x 2.0”
Board Thickness 0.031”; Board Material FR-4; Multi-Layer