Page 1
曜凌光電股份有限公司
住址: 42878 台中市大雅区科雅路 25 號 5F
5F., No.25, Keya Rd., Daya Dist., Taichung
City 428, Taiwan
RC2004A-BIW-ESX
WEB: http://www.Raystar-Optronics.com
E-mail: sales@raystar-optronics.com
Tel:886-4-2565-0761 Fax：886-4-2565-0760
SPECIFICATION
CUSTOMER:
APPROVED BY
PCB VERSION
DATE
FOR CUSTOMER USE ONLY
SALES BY APPROVED BY CHECKED BY PREPARED BY
Release DATE:
Page 1 , Total 23 Pages
Page 2
Revision History
RC2004A-BIW-ESX
VERSION DATE REVISED PAGE NO.
0 2009/12/18 First issue
A 2012/11/23 Modify ST7066U IC
B 2014/11/07 Remove IC
Note
information
information
Page 2 , Total 23 Pages
Page 3
Contents
1.General Specification
2.Module Classification Information
3.Interface Pin Function
4.Contour Drawing &Block Diagram
5.Character Generator ROM Pattern
6.Optical Characteristics
RC2004A-BIW-ESX
7.Absolute Maximum Ratings
8.Electrical Characteristics
9.Backlight Information
10.Reliability
11.Inspection specification
12.Precautions in use of LCD Modules
13.Material List of Components for RoHs
14.Recommendable Storage
Page 3 , Total 23 Pages
Page 4
1.General Specification
The Features is described as follow:
Module dimension: 98.0 x 60.0 x 13.6 (max.) mm
View area: 77.0 x 25.2 mm
Active area: 70.4 x 20.8 mm
Number of Characters: 20 characters x 4 Lines
Dot size: 0.55 x 0.55 mm
Dot pitch: 0.60 x 0.60 mm
RC2004A-BIW-ESX
Character size: 2.95 x 4.75 mm
Character pitch: 3.55 x 5.35 mm
LCD type: STN Negative, Blue Transmissive
Duty: 1/16
View direction: 6 o’clock
Backlight Type: LED White
IC:ST7066U
Page 4 , Total 23 Pages
Page 5
2.Module Classification Information
)
y
K
y
A
A
r
r
r
r
r
RC2004A-BIW-ESX
R C 2004 A
－
－
B I W
－
－
ESX
Item Description
R：Raystar Optronics Inc.
1
2 Display
Number of dots：Character 20 words, 04 Lines.
3
Serials code：
4
5 LCD
Polarizer
Type,
Temperature
6
7 Backlight
8 Special code
range,
View
direction
C：Character Type,
G：Graphic Type
P→TN Positive, Gray V→FSTN Negative, Blue
N→TN Negative, T→FSTN Negative, Black
L→VA Negative D→FSTN Negative (Double film
H→ HTN Positive, Gra
I→HTN Negative, Black
U→HTN Negative, Blue S→FSC Positive
B→STN Negative, Blue E→ISTN Negative, Black
G→STN Positive, Gra
Y→STN Positive, Yellow Green
A：Reflective, N.T, 6:00 K：Transflective, W.T,12:00
D：Reflective, N.T, 12:00 1：Transflective, U.T,6:00
G：Reflective, W. T, 6:00 4：Transflective, U.T.12:00
J：Reflective, W. T, 12:00 C：Transmissive, N.T,6:00
0：Reflective, U. T, 6:00 F：Transmissive, N.T,12:00
3：Reflective, U. T, 12:00 I：Transmissive, W. T, 6:00
B：Transflective, N.T,6:00 L：Transmissive, W.T,12:00
E：Transflective, N.T.12:00 2：Transmissive, U. T, 6:00
H：Transflective, W.T,6:00 5：Transmissive, U.T,12:00
N→ Without backlight W→LED, White H→LED, High light White
P→EL, Blue
T→EL, Green R→LED, Red J→DIP LED, Blue
D→EL, White O→LED, OrangeK→DIP LED, White
M→EL, Yellow Green B→LED, Blue E→DIP LED, Yellow
F→CCFL, White X→LED, Dual colo
Y→LED, Yellow Green C→LED, Full colo
G→LED, Green
ES:English and European standard font
X : Without negative voltage
→LED, Ambe
T:TAB Type
X:COG Type
F→FSTN Positive
→FSC Negative
C→CSTN Negative, Black
→ASTN Negative, Black
S→LED, Full colo
L→DIP LED, Ambe
I→DIP LED, Red
Page 5 , Total 23 Pages
Page 6
3.Interface Pin Function
Pin No. Symbol Level Description
1 VSS 0V Ground
2 VDD 5.0V Supply Voltage for logic
3 VO (Variable) Operating voltage for LCD
4 RS H/L H: DATA, L: Instruction code
5 R/W H/L H: Read (Module --> MPU) L: Write(MPU --> Module)
6 E H,H→L Chip enable signal
RC2004A-BIW-ESX
7 DB0 H/L Data bus line
8 DB1 H/L
9 DB2 H/L
10 DB3 H/L
11 DB4 H/L
12 DB5 H/L
13 DB6 H/L
14 DB7 H/L
15 A
16 K
－
－
Data bus line
Data bus line
Data bus line
Data bus line
Data bus line
Data bus line
Data bus line
Power supply for B/L(+)
Power supply for B/L(-)
Page 6 , Total 23 Pages
Page 7
4.Contour Drawing &Block Diagram
RC2004A-BIW-ESX
0.6 96.8
10.5
13.8
10.0 P2.54*15=38.1
19.6
17.4
2.555.0
10.3539.3
60.0 0.5
25.2(VA)
20.8(AA)
16- 1.0PTH
16- 2.0PAD
49.0
98.0 0.5
77.0(VA)
70.4(AA)
1.8
93.02.5
13.6 MAX
9.0
2.5
4- 2.5 PTH
4-
5.0 PAD
2.95 0.60
0.60
0.55
0.55
0.60
4.750.60
The non-specified tolerance of dimension is 0.3mm.
1.60
Vss1
2
Vdd
3
Vo
4
RS
5
R/W
6
DB0
7
8
DB1
9
DB2
10
DB3
DB4
11
12
DB5
13 DB6
14
DB7
E
A15
K16
RS
MPU
80 series
or
68 series
External contrast adjustment.
R/W
E
DB0~DB7
VR
10K~20K
Vdd
Vo
Vss
Character located
DDRAM address
DDRAM address
DDRAM address
DDRAM address
Controller/Com Driver
ST7066U
or
Equivalent
Bias and
N.V.
Generator Power Circuit
Optional
02
01
00
42
41
40
16 17 18 19 1A1B1C1D 1E 1F 20 21 22 23
14 15
54 55
03
43
04
44
DOT SIZE
SCALE 5/1
Com1~16
Com17~32
Seg1~40
D
M
CL1
CL2
Vdd,Vss,V1~V5
08
07
06
05
48
47
46
45
09
49
0A
4A
20X4 LCD
0D
0C
0B
4D
4C
4B
Seg Driver
15 161311 12 1410987654213
0F
0E
4F
4E
62 63605E 5F 615C5A 5B5856 57 59 5D
11 12 13
10
50
64
65
Seg120~200Seg41~120
Seg Driver
19 2017 18
52 53
2726245125
66 67
Page 7 , Total 23 Pages
Page 8
5.Character Generator ROM Pattern
Table.2
Upper
4 bit
Lower
4 bit
LLLL
LLLH
LLHL
LLHH
LHLL
LHLH
LHHL
LHHH
HLLL
HLLH
HLHL
HLHH
HHLL
HHLH
HHHL
HHHH
LLLL LLLH LLHL LLHH LHLL LHLH LHHL LHHH HLLL HLLH HLHL HLHH HHLL HHLH HHHL
CG
RAM
( 1 )
CG
RAM
( 2 )
CG
RAM
( 3 )
CG
RAM
( 4 )
CG
RAM
( 5 )
CG
RAM
( 6 )
CG
RAM
( 7 )
CG
RAM
( 8 )
CG
RAM
( 1 )
CG
RAM
( 2 )
CG
RAM
( 3 )
CG
RAM
( 4 )
CG
RAM
( 5 )
CG
RAM
( 6 )
CG
RAM
( 7 )
CG
RAM
( 8 )
RC2004A-BIW-ESX
HHHH
Page 8 , Total 23 Pages
Page 9
6.Optical Characteristics
Item Symbol Condition Min Typ Max Unit
RC2004A-BIW-ESX
θ CR 2≧ 0
θ CR 2≧ 0
－
－
20 ψ= 180°
40 ψ= 0°
View Angle
θ CR 2≧ 0
θ CR 2≧ 0
Contrast Ratio CR
T rise
－ －
－ －
－
－
3
30 ψ= 90°
30 ψ= 270°
－ －
150 200 ms
Response Time
T fall
－ －
150 200 ms
Definition of Operation Voltage (Vop) Definition of Response Time ( Tr , Tf )
Inten sity
100％
Cr Max
Selected Wave
Non-selected Wave
Cr = Lon / Loff
Non-selected
Condition
Intensity
100%
Selected Condition
90%
Non-selected
Condition
10%
Conditions :
Vop
[positiv e ty p e ]
Driving Voltage(V)
Tr
Tf
【Positive type】
Operating Voltage : Vop Viewing Angle(θ，φ) : 0°， 0°
Frame Frequency : 64 HZ Driving Waveform : 1/N duty , 1/a bias
Definition of viewing angle(CR 2)≧
θb
φ= 180°
θr
φ= 90°
Page 9 , Total 23 Pages
θf
θl
φ= 270°
φ= 0°
Page 10
RC2004A-BIW-ESX
7.Absolute Maximum Ratings
Item Symbol Min Typ Max Unit
Operating Temperature TOP -20 － +70 ℃
Storage Temperature TST -30 － +80 ℃
Input Voltage VI V
SS
－
VDD V
Supply Voltage For Logic VDD-VSS -0.3 － 7 V
Supply Voltage For LCD VDD-Vo -0.3 － 13 V
Page 10 , Total 23 Pages
Page 11
8.Electrical Characteristics
Item Symbol Condition Min Typ Max Unit
RC2004A-BIW-ESX
Supply Voltage For Logic VDD-VSS
Supply Voltage For LCD
*Note
VDD-V0
Input High Volt. VIH
Input Low Volt. VIL
Output High Volt. VOH
Output Low Volt. VOL
Supply Current IDD V
－
Ta= -2 0℃
Ta= 25 ℃
Ta= 70 ℃
－
－
－
－
=5.0V 1.0 1.2 1.5 mA
DD
4.5 5.0 5.5 V
－
4.4
3.8
0.7 V
VSS
3.9
0
DD
－
4.5
－
－
－
－
－
* Note: Please design the VOP adjustment circuit on customer's main board
VR
10K~20K
Vdd
Vo
VSS
LCM
Module
5.3
4.6
－
V
V
V
VDD V
0.6 V
VDD V
0.4 V
Page 11 , Total 23 Pages
Page 12
RC2004A-BIW-ESX
9.Backlight Information
Specification
PARAMETER SYMBOL MIN TYP MAX UNIT TEST CONDITION
Supply Current ILED
Supply Voltage V 3.4 3.5 3.6 V
Reverse Voltage VR
Luminance
IV 448 560
(Without LCD)
LED Life Time
(For Reference
only)
Color White
Note: The LED of B/L is drive by current only, drive voltage is for reference only.
drive voltage can make driving current under safety area (current between
－ －
－
－ －
48 60 mA V=3.5V
50K
5 V
－
－
CD/M
Hr.
2
－
－
ILED=48mA
ILED=48mA
25 ,50℃ -60%RH,
(Note 1)
minimum and maximum).
Note 1:50K hours is only an estimate for reference.
Page 12 , Total 23 Pages
Page 13
10.Reliability
Content of Reliability Test (Wide temperature, -20℃~70 )℃
Environmental Test
Test Item Content of Test Test Condition Note
High Temperature
storage
Low Temperature
storage
High Temperature
Operation
Low Temperature
Operation
High Temperature/
Humidity storage
Thermal shock
resistance
Endurance test applying the high storage temperature
for a long time.
Endurance test applying the low storage temperature
for a long time.
Endurance test applying the electric stress (Voltage &
Current) and the thermal stress to the element for a
long time.
Endurance test applying the electric stress under low
temperature for a long time.
The module should be allowed to stand at
60 ,90%RH max℃
For 96hrs under no-load condition excluding the
polarizer,
Then taking it out and drying it at normal temperature.
The sample should be allowed stand the following 10
cycles of operation
-20 25 70℃℃℃
30min 5min 30min
1 cycle
RC2004A-BIW-ESX
80℃
200hrs
-30℃
200hrs
70℃
200hrs
-20℃
200hrs
60 ,90%RH℃
96hrs
-20 /70℃℃
10 cycles
Total fixed amplitude :
2
1,2
——
1
1,2
——
1.5mm
Vibration Frequency :
10~55Hz
One cycle 60
seconds to 3
directions of X,Y,Z for
Each 15 minutes
VS=800V,RS=1.5kΩ
CS=100pF
1 time
Vibration test
Static electricity test
Endurance test applying the vibration during
transportation and using.
Endurance test applying the electric stress to the
terminal.
Note1: No dew condensation to be observed.
Note2: The function test shall be conducted after 4 hours storage at the normal
Temperature and humidity after remove from the test chamber.
Note3: The packing have to including into the vibration testing.
3
——
Page 13 , Total 23 Pages
Page 14
RC2004A-BIW-ESX
11.Inspection specification
NO Item Criterion AQL
1.1 Missing vertical, horizontal segment, segment contrast
defect.
1.2 Missing character , dot or icon.
01
Black or white
02
spots on LCD
(display only)
Electrical
Testing
LCD black
spots, white
1.3 Display malfunction.
1.4 No function or no display.
1.5 Current consumption exceeds product specifications.
1.6 LCD viewing angle defect.
1.7 Mixed product types.
1.8 Contrast defect.
2.1 White and black spots on display ≦0.25mm, no more than
three white or black spots present.
2.2 Densely spaced: No more than two spots or lines within 3mm
3.1 Round type : As following drawing
Φ=( x + y ) / 2
SIZE Acceptable Q TY
Φ≦0.10
0.10＜Φ≦0.20
0.20＜Φ≦0.25
0.25＜Φ
Accept no dense
2
1
0
0.65
2.5
2.5
03
contamination
(non-display)
04
spots,
Polarizer
bubbles
3.2 Line type : (As following drawing)
Length Width Acceptable Q TY
---
L≦3.0 0.02＜W≦0.03
L≦2.5 0.03＜W≦0.05
If bubbles are visible,
judge using black spot
specifications, not easy
to find, must check in
specify direction.
---
W≦0.02
0.05＜W
Size Φ Acceptable Q TY
Φ≦0.20
0.20＜Φ≦0.50
0.50＜Φ≦1.00
1.00＜Φ
Total Q TY 3
Accept no dense
2
As round type
Accept no dense
3
2
0
2.5
2.5
Page 14 , Total 23 Pages
Page 15
RC2004A-BIW-ESX
NO Item Criterion AQL
05 Scratches Follow NO.3 LCD black spots, white spots, contamination
Symbols Define:
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length:
6.1 General glass chip :
6.1.1 Chip on panel surface and crack between panels:
06
Chipped
glass
z: Chip thickness y: Chip width x: Chip length
Z≦1/2t
Not over viewing
x≦1/8a
area
1/2t＜z≦2t
Not exceed 1/3k
x≦1/8a
☉If there are 2 or more chips, x is total length of each chip.
6.1.2 Corner crack:
z: Chip thickness y: Chip width x: Chip length
Z≦1/2t
Not over viewing
x≦1/8a
2.5
area
1/2t＜z≦2t
Not exceed 1/3k
x≦1/8a
☉If there are 2 or more chips, x is the total length of each chip.
Page 15 , Total 23 Pages
Page 16
RC2004A-BIW-ESX
NO Item Criterion
Symbols :
x: Chip length y: Chip width z: Chip thickness
k: Seal width t: Glass thickness a: LCD side length
L: Electrode pad length
6.2 Protrusion over terminal :
6.2.1 Chip on electrode pad :
y: Chip width x: Chip length z: Chip thickness
y≦0.5mm x≦1/8a 0 ＜ z ≦ t
6.2.2 Non-conductive portion:
AQL
06
Glass
2.5
crack
y: Chip width x: Chip length z: Chip thickness
y≦ L x≦1/8a 0 ＜ z ≦ t
☉If the chipped area touches the ITO terminal, over 2/3 of the ITO
must remain and be inspected according to electrode terminal
specifications.
☉If the product will be heat sealed by the customer, the alignment
mark not be damaged.
6.2.3 Substrate protuberance and internal crack.
y: width x: length
y≦1/3L x ≦ a
Page 16 , Total 23 Pages
Page 17
RC2004A-BIW-ESX
NO Item Criterion AQL
07 Cracked glass The LCD with extensive crack is not acceptable. 2.5
8.1 Illumination source flickers when lit.
Backlight
8.2 Spots or scratched that appear when lit must be judged.
08
elements
8.3 Backlight doesn’t light or color wrong.
9.1 Bezel may not have rust, be deformed or have fingerprints,
09 Bezel
9.2 Bezel must comply with job specifications.
10.1 COB seal may not have pinholes larger than 0.2mm or
10.2 COB seal surface may not have pinholes through to the IC.
10.3 The height of the COB should not exceed the height
10.4 There may not be more than 2mm of sealant outside the
10.5 No oxidation or contamination PCB terminals.
10
PCB、COB
10.6 Parts on PCB must be the same as on the production
10.7 The jumper on the PCB should conform to the product
10.8 If solder gets on bezel tab pads, LED pad, zebra pad or
10.9 The Scraping testing standard for Copper Coating of PCB
Using LCD spot, lines and contamination standards.
stains or other contamination.
contamination.
indicated in the assembly diagram.
seal area on the PCB. And there should be no more than
three places.
characteristic chart. There should be no wrong parts,
missing parts or excess parts.
characteristic chart.
screw hold pad, make sure it is smoothed down.
0.65
2.5
0.65
2.5
0.65
2.5
2.5
0.65
2.5
2.5
0.65
0.65
2.5
11.1 No un-melted solder paste may be present on the PCB.
11.2 No cold solder joints, missing solder connections, oxidation
11 Soldering
11.3 No residue or solder balls on PCB.
11.4 No short circuits in components on PCB.
Y
or icicle.
X
X * Y<=2mm2
2.5
2.5
2.5
2.5
0.65
Page 17 , Total 23 Pages
Page 18
RC2004A-BIW-ESX
NO Item Criterion AQL
12
General
appearance
12.1 No oxidation, contamination, curves or, bends on interface
Pin (OLB) of TCP.
12.2 No cracks on interface pin (OLB) of TCP.
12.3 No contamination, solder residue or solder balls on product.
12.4 The IC on the TCP may not be damaged, circuits.
12.5 The uppermost edge of the protective strip on the interface
pin must be present or look as if it cause the interface pin to
sever.
12.6 The residual rosin or tin oil of soldering (component or chip
component) is not burned into brown or black color.
12.7 Sealant on top of the ITO circuit has not hardened.
12.8 Pin type must match type in specification sheet.
12.9 LCD pin loose or missing pins.
12.10 Product packaging must the same as specified on
packaging specification sheet.
12.11 Product dimension and structure must conform to product
2.5
0.65
2.5
2.5
2.5
2.5
2.5
0.65
0.65
0.65
0.65
specification sheet.
12.12 Visual defect outside of VA is not considered to be rejection.
Page 18 , Total 23 Pages
Page 19
RC2004A-BIW-ESX
12.Precautions in use of LCD Modules
(1)Avoid applying excessive shocks to the module or making any alterations or modifications
to it.
(2)Don’t make extra holes on the printed circuit board, modify its shape or change the
components of LCD module.
(3)Don’t disassemble the LCM.
(4)Don’t operate it above the absolute maximum rating.
(5)Don’t drop, bend or twist LCM.
(6)Soldering: only to the I/O terminals.
(7)Storage: please storage in anti-static electricity container and clean environment.
(8) Raystar have the right to change the passive components, including R3,R6 & backlight
adjust resistors. (Resistors,capacitors and other passive components will have different
appearance and color caused by the different supplier.)
(9)Raystar have the right to change the PCB Rev. (In order to satisfy the supplying stability,
management optimization and the best product performance...etc, under the premise of not
affecting the electrical characteristics and external dimensions, Raystar have the right to
modify the version.)
Page 19 , Total 23 Pages
Page 20
RC2004A-BIW-ESX
13.Material List of Components for RoHs
1. RAYSTAR Display Co., Ltd hereby declares that all of or part of products (with the mark
“#”in code), including, but not limited to, the LCM, accessories or packages, manufactured
and/or delivered to your company (including your subsidiaries and affiliated company)
directly or indirectly by our company (including our subsidiaries or affiliated companies) do
not intentionally contain any of the substances listed in all applicable EU directives and
regulations, including the following substances.
Exhibit A：The Harmful Material List
Material (Cd) (Pb) (Hg) (Cr6+) PBBs PBDEs
Limited
Valu e
Above limited value is set up according to RoHS.
2.Process for RoHS requirement：
(1) Use the Sn/Ag/Cu soldering surface；the surface of Pb-free solder is rougher than we used
before.
(2) Heat-resistance temp.：
Reflow：250 ,30 seconds Max.℃ ；
Connector soldering wave or hand soldering：320 , 10 seconds max.℃
(3) Temp. curve of reflow, max. Temp.：235±5℃；
Recommended customer’s soldering temp. of connector：280 , 3 se℃ conds.
100
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
1000
ppm
Page 20 , Total 23 Pages
Page 21
RC2004A-BIW-ESX
14.Recommendable Storage
1. Place the panel or module in the temperature 25°C±5°C and the humidity below 65% RH
2. Do not place the module near organics solvents or corrosive gases.
3. Do not crush, shake, or jolt the module.
Page 21 , Total 23 Pages
Page 22
LCM Sample Estimate Feedback Sheet
Module Number：
1、Panel Specification：
RC2004A-BIW-ESX
Page: 1
1. Panel Type：
2. View Direction：
3. Numbers of Dots：
4. View Area：
5. Active Area：
6.Operating Temperature：
7.Storage Temperature：
8.Others：
2、Mechanical Specification：
1. PCB Size：
2.Frame Size：
3.Materal of Frame：
4.Connector Position：
5.Fix Hole Position：
6.Backlight Position：
7. Thickness of PCB：
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
8. Height of Frame to PCB：
9.Height of Module：
10.Others：
3、Relative Hole Size：
1.Pitch of Connector：
2.Hole size of Connector：
3.Mounting Hole size：
4.Mounting Hole Type：
5.Others：
4、Backlight Specification：
1.B/L Type：
2.B/L Color：
3.B/L Driving Voltage (Reference for LED Type)：□ Pass □ NG ,
4.B/L Driving Current：
5.Brightness of B/L：
6.B/L Solder Method：
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
7.Others：
□ Pass □ NG ,
＞＞ Go to page 2 ＜＜
Page 22 , Total 23 Pages
Page 23
Module Number：
5、Electronic Characteristics of Module：
RC2004A-BIW-ESX
Page: 2
1.Input Voltage：
2.Supply Current：
3.Driving Voltage for LCD：
4.Contrast for LCD：
5.B/L Driving Method：
6.Negative Voltage Output：
7.Interface Function：
8.LCD Uniformity：
9.ESD test：
10.Others：
6、Summary：
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
□ Pass □ NG ,
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Page 23 , Total 23 Pages
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