
Philips Semiconductors Product specification
Digital Servo Driver (DSD-2) OQ8844
FEATURES
Servo functions
• 1-bit class-D focus actuator driver (3.3 Ω)
• 1-bit class-D radial actuator driver (3.7 Ω)
• 1-bit class-D sledge motor driver (2.5 Ω).
GENERAL DESCRIPTION
The OQ8844 or Digital Servo Driver 2 (DSD2) consists of
1-bit class-D power drivers, which are specially designed
for digital servo applications. Three such amplifiers are
integrated in one chip, to drive the focus and radial
actuators and the sledge motor of a compact disc optical
system.
Other features
• Supply voltage 5 V only
• Small package (SOT163-1)
• Higher efficiency, compared with conventional drivers,
due to the class-D principle
• Built-in digital notch filters for higher efficiency
The main benefits of using this principle are its higher
efficiency grade compared to conventional analog power
amplifiers, its higher integration level, its differential output
and the fact that only a few external components are
needed. When using these digital power drivers in a digital
servo application, the statement ‘complete digital servo
loop’ becomes more realistic.
• Enable input for focus and radial driver
• Enable input for sledge driver
• Differential outputs for all drivers
• Separate power supply pins for all drivers.
QUICK REFERENCE DATA
SYMBOL PARAMETER MIN. TYP. MAX. UNIT
V
DDD
V
DD(F)
V
DD(R)
V
DD(S)
I
DDDq
I
DD(F)
I
DD(R)
I
DD(S)
f
i(clk)
P
tot
T
amb
digital supply voltage 4.5 − 5.5 V
supply voltage focus actuator 4.5 − 5.5 V
supply voltage radial actuator 4.5 − 5.5 V
supply voltage sledge actuator 4.5 − 5.5 V
quiescent supply current digital part −−10 µA
supply current focus − 126 250 mA
supply current radial − 20 250 mA
supply current sledge − 150 560 mA
input clock frequency − 4.2336 5 MHz
total power dissipation − 110 − mW
operating ambient temperature −40 − +85 °C
ORDERING INFORMATION
TYPE
NUMBER
NAME DESCRIPTION VERSION
PACKAGE
OQ8844 SO20 plastic small outline package; 20 leads; body width 7.5 mm SOT163-1
1995 Nov 27 2

Philips Semiconductors Product specification
Digital Servo Driver (DSD-2) OQ8844
FUNCTIONAL DESCRIPTION
Principle of a class-D digital power driver
Figure 3 shows the block diagram of one of the digital
drivers integrated in the DSD2. It consists of a timing block
and four CMOS switches. The input signal is a 1-bit Pulse
Density Modulated (PDM) signal, the output of the digital
servo ICs.
The maximum operating clock frequency of the device is
5 MHz. With the mentioned digital servo ICs, the operating
frequency of the digital drivers is 4.2336 MHz
(96 × 44.1 kHz). The sampling frequency of the 1-bit code
however is 1.0584 MHz, so internally in the DSD2 the
clock speed of the switches will be 1.0584 MHz.
The higher input clock frequency is used to make
non-overlapping pulses to prevent short-circuits between
the supply voltages. For the control of the switches, two
states can be distinguished. If the 1-bit code contains a
logic 1, switches A and D are closed and current will flow
in the direction as shown in Fig.4.
If the 1-bit code contains a logic 0, switches B and C are
closed and current will flow in the opposite direction, as
shown in Fig.5.
This indicates that the difference between the mean
number of ones and zeros in the PDM signal determines
the direction in which the actuator or motor will rotate.
half the sample frequency of 1.0584 MHz. This results in a
high dissipation and the motor does not move.
To improve the efficiency, a digital notch filter is added at
the input of the digital drivers. This filters the Idle mode
pattern (1010101010 etc.) see Fig.6.
The amplitude transfer as a function of frequency is given
in Fig.7.
Figure 7 shows that the filter has a zero on
consequentially filtering out the idle pattern (101010).
The output of this filter is a three-level code (1.5-bit).
For the control of the switches three states (1.5-bit) can be
distinguished: the two states as described earlier and a
third one. This state is used when an idling pattern is
supplied.
Switches C and D are closed (see Fig.8). In this idle mode,
no current will flow and thus the efficiency will be improved.
This mode is also used to short-circuit the inductive
actuator/motor. In this way, high induction voltages are
prevented because the current can commutate via the
filter and the short-circuit in the switches. All three drivers
(radial, focus and sledge) contain a digital notch filter as
described. Each driver has its own power supply pins to
reduce crosstalk because of the relative high current
flowing through the pins.
1
⁄2fs,
If the mean number of ones and zeros is equal (Idle mode)
the current through the motor or actuator is alternated
between the positive and negative direction at a speed of
1995 Nov 27 5

Philips Semiconductors Product specification
Digital Servo Driver (DSD-2) OQ8844
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our
“IC Package Databook”
Reflow soldering
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Several techniques exist for reflowing; for example,
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
(order code 9398 652 90011).
Wave soldering
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Repairing soldered joints
Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
1995 Nov 27 12

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SCD45 © Philips Electronics N.V. 1995
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Printed in The Netherlands
513061/50/01/pp16 Date of release: 1995 Nov 27
Document order number: 9397 750 00471