Datasheet OPA4658U, OPA4658U-2K5 Datasheet (Burr Brown)

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®
OPA4658
FEATURES
GAIN BANDWIDTH: 900MHz at G = 2
GAIN OF 2 STABLE
LOW POWER: 50mW PER AMP
LOW DIFF GAIN/PHASE ERRORS:
°
HIGH SLEW RATE: 1700V/µs
PACKAGE: 14-Pin DIP and SO-14
Quad Wideband, Low Power Current Feedback
OPERATIONAL AMPLIFIER
APPLICATIONS
MEDICAL IMAGING
HIGH-RESOLUTION VIDEO
HIGH-SPEED SIGNAL PROCESSING
COMMUNICATIONS
PULSE AMPLIFIERS
ADC/DAC GAIN AMPLIFIER
MONITOR PREAMPLIFIER
CCD IMAGING AMPLIFIER
DESCRIPTION
The OPA4658 is a quad ultra-wideband, low power current feedback video operational amplifier featuring high slew rate and low differential gain/phase error. The current feedback design allows for superior large signal bandwidth, even at high gains. The low differ­ential gain/phase errors, wide bandwidth and low
quiescent current make the OPA4658 a perfect choice for numerous video, imaging and communications applications.
The OPA4658 is internally compensated for stability in gains of 2 or greater. The OPA4658 is also available in dual (OPA2658) and single (OPA658) configurations.
C
COMP
Current Mirror
V
V
+
V
OUT
I
BIAS
I
BIAS
+V
S
–V
S
Current Mirror
Buffer
OPA4658
OPA4658
OPA4658
NOTE: Diagram reflects only one-fourth of the OPA4658.
®
International Airport Industrial Park • Mailing Address: PO Box 11400, Tucson, AZ 85734 • Street Address: 6730 S. Tucson Blvd., Tucson, AZ 85706 • Tel: (520) 746-1111 • Twx: 910-952-1111
Internet: http://www.burr-brown.com/ • FAXLine: (800) 548-6133 (US/Canada Only) • Cable: BBRCORP • Telex: 066-6491 • FAX: (520) 889-1510 • Immediate Product Info: (800) 548-6132
© 1994 Burr-Brown Corporation PDS-1270C Printed in U.S.A. March, 1998
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OPA4658
FREQUENCY RESPONSE
Closed-Loop Bandwidth
(2)
G = +2 450
(1)
MHz
G = +5 195 MHz
G = +10 130 MHz
Slew Rate
(3)
G = +2, 2V Step 1700 1000 V/µs
At Minimum Specified Temperature 1500 900 V/µs
Settling Time: 0.01% G = +2, 2V Step 20 ns
0.1% G = +2, 2V Step 15.1 ns 1% G = +2, 2V Step 4.8 ns
Spurious Free Dynamic Range f = 5MHz, G = +2, V
O
= 2Vp-p 66 dBc
f = 20MHz, G = +2, V
O
= 2Vp-p 57 dBc Third-Order Intercept Point f = 10MHz 38 dBm Differential Gain G = +2, NTSC, V
O
= 1.4Vp-p, RL = 150 0.015 %
Differential Phase G = +2, NTSC, V
O
= 1.4Vp-p, RL = 150 0.02 degrees
Crosstalk Input Referred, 5MHz, Three Active Channels –74 dB
Input Referred, 5MHz, Channel-to-Channel –85 dB
OFFSET VOLTAGE
Input Offset Voltage ±1.5 ±5.5 ±2 ±5mV
Over Temperature ±5 ±8 ±4 ±8mV
Power Supply Rejection V
S
= ±4.5 to ±5.5V 55 70 58 75 dB
INPUT BIAS CURRENT
Non-Inverting V
CM
= 0V ±6.5 ±30 ±18 µA
Over Temperature ±10 ±80 ±35 µA
Inverting V
CM
= 0V ±1.1 ±35 ✻✻ µA
Over Temperature ±30 ±75 ✻✻ µA
NOISE
Input Voltage Noise Density
f = 100Hz 16 nV/Hz f = 10kHz 3.6 nV/Hz f = 1MHz 3.2 nV/Hz f
B
= 100Hz to 200MHz 45 µVrms
Inverting Input Bias Current
Noise Density: f = 10MHz 32 pA/Hz
Non-Inverting Input Current
Noise Density: f = 10MHz 12 pA/Hz
Noise Figure (NF) R
S
= 100 9.5 dBm
R
S
= 50 11 dBm
INPUT VOLTAGE RANGE
Common-Mode Input Range ±2.9 V
Over Temperature ±2.5 V
Common-Mode Rejection V
CM
= ±1V 45 52 ✻✻ dB
INPUT IMPEDANCE
Non-Inverting 500 || 1 k ||pF Inverting 25
OPEN-LOOP TRANSIMPEDANCE
Open-Loop Transimpedance V
O
= ±2V, RL = 100 150 350 200 360 k
Over Temperature V
O
= ±2V, RL = 100 100 290 150 300 k
OUTPUT
Voltage Output No Load ±2.7 ±3.0 ✻✻ V
Over Temperature ±2.5 ±2.75 ✻✻ V
Voltage Output R
L
= 250Ω±2.7 ±3.0 ✻✻ V
Over Temperature ±2.5 ±2.7 ✻✻ V
Voltage Output R
L
= 100Ω±2.2 ±2.7 ✻✻ V
Over Temperature ±2.0 ±2.5 ✻✻ V
Output Current, Sourcing 80 120 ✻✻ mA
Over Temperature Range 70 mA
Output Current, Sinking 60 80 ✻✻ mA
Over Temperature Range 35 mA Short Circuit Current 150 mA Output Resistance 1MHz, G = +2 0.1
POWER SUPPLY
Specified Operating Voltage ±5 V Operating Voltage Range ±4.5 ±5.5 ✻✻V Quiescent Current All Channels, V
S
= ±5V ±19 ±31 ±13 ±20 ±23 mA
Over Temperature ±20 ±34 ±21 ±26 mA
TEMPERATURE RANGE
Specification: P, U, UB –40 +85 ✻✻°C Thermal Resistance,
θ
JA
P 75 °C/W U 75 °C/W
SPECIFICATIONS
OPA4658P, U OPA4658UB
PARAMETER CONDITION MIN TYP MAX MIN TYP MAX UNITS
At T
A
= +25°C, VS = ±5V, RL = 100, CL = 2pF, RFB = 402, unless otherwise noted.
NOTES: (1) An asterisk () specifies the same value as the grade to the left. (2) Bandwidth can be affected by a non-optimal PC board layout. Refer to the demonstration board layout for details. (3) Slew rate is rate of change from 10% to 90% of output voltage step.
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OPA4658
1 2 3 4 5 6 7
14 13 12 11 10
9 8
Output 4 –Input 4 +Input 4 –V
S
+Input 3 –Input 3 Output 3
Output 1
–Input 1 +Input 1
+V
S
+Input 2 –Input 2
Output 2
ABSOLUTE MAXIMUM RATINGS
Supply ..........................................................................................±5.5VDC
Internal Power Dissipation
(1)
.......................See Applications Information
Differential Input Voltage .............................................................. Total V
S
Input Voltage Range .................................... See Applications Information
Storage Temperature Range: P, U, UB........................ –40°C to +125°C
Lead Temperature (soldering, 10s).............................................. +300°C
(soldering, SOIC 3s) ...................................................................... +260°C
Junction Temperature (T
J
) ............................................................ +175°C
NOTE: (1) Packages must be derated based on specified
θ
JA
. Maximum
T
J
must be observed.
PACKAGE INFORMATION
PACKAGE DRAWING
PRODUCT PACKAGE NUMBER
(1)
OPA4658P 14-Pin Plastic DIP 010 OPA4658U, UB SO-14 Surface Mount 235
NOTE: (1) For detailed drawing and dimension table, please see end of data sheet, or Appendix C of Burr-Brown IC Data Book.
PIN CONFIGURATION
Top View DIP/SO-14
ORDERING INFORMATION
(1)
PRODUCT PACKAGE TEMPERATURE RANGE
OPA4658P 14-Pin Plastic DIP –40°C to +85°C OPA4658U, UB SO-14 Surface Mount –40°C to +85°C
NOTE: (1) The "B" grade of the SOIC package will be marked with a "B" by pin 8. Refer to mechanical section for the location.
ELECTROSTATIC DISCHARGE SENSITIVITY
This integrated circuit can be damaged by ESD. Burr-Brown recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
The information provided herein is believed to be reliable; however, BURR-BROWN assumes no responsibility for inaccuracies or omissions. BURR-BROWN assumes no responsibility for the use of this information, and all use of such information shall be entirely at the user’s own risk. Prices and specifications are subject to change without notice. No patent rights or licenses to any of the circuits described herein are implied or granted to any third party. BURR-BROWN does not authorize or warrant any BURR-BROWN product for use in life support devices and/or systems.
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OPA4658
TYPICAL PERFORMANCE CURVES
At TA = +25°C, VS = ±5V, RL = 100, CL = 2pF, RFB = 402Ω, unless otherwise noted.
OUTPUT CURRENT vs TEMPERATURE
60
55
50
45
40
–75 –50 –25 0 25 50 75 100 125
Output Current (mA)
Temperature (°C)
IO+
I
O
NON-INVERTING INPUT BIAS CURRENT
vs TEMPERATURE
10
8
6
4
2
–75 –50 –25 0 25 50 75 100 125
Non-Inverting Input Bias Current I
B
+ (µA)
Temperature (°C)
OUTPUT SWING vs TEMPERATURE
4
3
2
1
0
–75 –50 –25 0 25 50 75 100 125
Output Swing (V)
Temperature (°C)
±V
O
RL = 250
±V
O
RL = 100
INVERTING INPUT BIAS CURRENT
vs TEMPERATURE
8
6
4
2
0
–75 –50 –25 0 25 50 75 100 125
Inverting Input Bias Current I
B
– (µA)
Temperature (°C)
PSRR AND CMRR vs TEMPERATURE
85 80 75 70 65 60 55 50 45
–75 –50 –25 0 25 50 75 100 125
PSRR , CMRR (dB)
Temperature (°C)
PSRR
PSR+ PSR–
CMRR
SUPPLY CURRENT vs TEMPERATURE
(Total of All Four Op Amps)
21
20
19
18
17
–75 –50 –25 0 25 50 75 100 125
Supply Current (±mA)
Temperature (°C)
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OPA4658
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±5V, RL = 100, CL = 2pF, RFB = 402Ω, unless otherwise noted.
OPEN-LOOP GAIN AND PHASE vs FREQUENCY
Frequency (Hz)
60
40
20
0
–20
–40
–60
0
–45
–90
–135
–180
–225
1k 10k 100k 1M 10M 100M 1G
Open-Loop Gain (dB)
Open-Loop Phase (°)
Gain
Phase
COMMON-MODE REJECTION
vs INPUT COMMON-MODE VOLTAGE
55
50
45
40
35
30
4–3–2–101234
Common-Mode Rejection (dB)
Common-Mode Voltage (V)
CLOSED-LOOP BANDWIDTH (G = +5)
Frequency (Hz)
20
17
14
11
8
5
2
1M 10M 100M 1G
Bandwidth = 205MHz
Gain (dB)
10
6
10
5
10
4
10
3
10
2
10
1
1
0
–45
–90
–135
–180
–225
1k 10k 100k 1M 10M 100M 1G
OPEN-LOOP TRANSIMPEDANCE AND PHASE
vs FREQUENCY
Frequency (Hz)
Transimpedance ()
Open-Loop Phase (°)
Phase
Transimpedance
CLOSED-LOOP BANDWIDTH (G = +10)
Frequency (Hz)
26 23 20 17 14 11
8 5 2
1M 10M 100M 1G
Gain (dB)
Bandwidth = 134MHz
CLOSED-LOOP BANDWIDTH (G = +2)
Frequency (Hz)
12
9 6 3
0 –3 –6 –9
–12
1M 10M 100M 1G 10G
Gain (dB)
SO-14 Bandwidth = 458MHz
(Dashed Line)
DIP Bandwidth = 435M
(Solid Line)
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OPA4658
At TA = +25°C, VS = ±5V, RL = 100, CL = 2pF, RFB = 402Ω, unless otherwise noted.
TYPICAL PERFORMANCE CURVES (CONT)
5MHz HARMONIC DISTORTION vs OUTPUT SWING
(G = +2)
01234
Output Swing (Vp-p)
Harmonic Distortion (dBc)
–50
–60
–70
–80
–90
–100
3f
O
2f
O
10MHz HARMONIC DISTORTION vs OUTPUT SWING
(G = +2)
01234
Output Swing (Vp-p)
Harmonic Distortion (dBc)
–50
–60
–70
–80
–90
–100
3f
O
2f
O
100k 1M 10M 100M
–40
–60
–80
–100
Harmonic Distortion (dBc)
Frequency (Hz)
HARMONIC DISTORTION vs FREQUENCY
(G = +2, V
O
= 2Vp-p)
2f
O
3f
O
SMALL SIGNAL TRANSIENT RESPONSE
(G = +2)
Time (5ns/div)
160 120
80 40
0 –40 –80
–120 –160
Output Voltage (mV)
LARGE SIGNAL TRANSIENT RESPONSE
(G = +2)
Time (5ns/div)
1.6
1.2
0.8
0.4 0
–0.4 –0.8 –1.2 –1.6
Output Voltage (V)
40
35
30
25
20
15
10
10
1009080706050403020
RECOMMENDED ISOLATION RESISTANCE
vs CAPACITIVE LOAD
Capacitive Load (pf)
Isolation Resistance
G = +2
C
L
1k
R
ISO
402
402
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OPA4658
TYPICAL PERFORMANCE CURVES (CONT)
At TA = +25°C, VS = ±5V, RL = 100, CL = 2pF, RFB = 402Ω, unless otherwise noted.
HARMONIC DISTORTION vs GAIN
(f
O
= 5MHz, VO = 2Vp-p)
Non-Inverting Gain (V/V)
Harmonic Distortion (dBc)
–50
–55
–60
–65
–70
2345
678910
2f
O
3f
O
–60
–65
–70
–40 –20 0 20 40 60 80 100
Temperature (°C)
HARMONIC DISTORTION vs TEMPERATURE
(G = +2, V
O
= 2Vp-p, fO = 5MHz)
Harmonic Distortion (dBc)
3f
O
2f
O
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OPA4658
For non-inverting operation, the input signal is applied to the non-inverting (high impedance buffer) input. The output (buffer) error current (IE) is generated at the low impedance inverting input. The signal generated at the output is fed back to the inverting input such that the overall gain is (1 + RFB/RFF). Where a voltage-feedback amplifier has two symmetrical high impedance inputs, a current feedback amplifier has a low inverting (buffer output) impedance and a high non-inverting (buffer input) impedance.
The closed-loop gain for the OPA4658 can be calculated using the following equations:
(1)
(2)
At higher gains the small value inverting input impedance causes an apparent loss in bandwidth. This can be seen from the equation:
(3)
This loss in bandwidth at high gains can be corrected without affecting stability by lowering the value of the feedback resistor from the specified value of 402Ω.
OFFSET VOLTAGE AND NOISE
The output offset is the algebraic sum of the input offset voltage and bias current errors. The output offset for non­inverting operation is calculated by the following equation:
(4)
If all terms are divided by the gain (1 + R
FB/RFF
) it can be observed that input referred offsets improve as gain increases. The effective noise at the output can be determined by taking
APPLICATIONS INFORMATION
THEORY OF OPERATION
Conventional op amps depend on feedback to drive their inputs to the same potential, however the current feedback op amp’s inverting and non-inverting inputs are connected by a unity gain buffer, thus enabling the inverting input to automatically assume the same potential as the non-invert­ing input. This results in very low impedance at the inverting input to sense the feedback as an error current signal.
DISCUSSION OF PERFORMANCE
The OPA4658 is a low-power, unity gain stable, current feedback operational amplifier which operates on ±5V power supply. The current feedback architecture offers the follow­ing important advantages over voltage feedback architec­tures: (1) the high slew rate allows the large signal perfor­mance to approach the small signal performance, and (2) there is very little bandwidth degradation at higher gain settings.
The current feedback architecture of the OPA4658 provides the traditional strength of excellent large signal response plus wide bandwidth, making it a good choice for use in high resolution video, medical imaging and DAC I/V Conver­sion. The low power requirements make it an excellent choice for numerous portable applications.
DC GAIN TRANSFER CHARACTERISTICS
The circuit in Figure 1 shows the equivalent circuit for calculating the DC gain. When operating the device in the inverting mode, the input signal error current (I
E
) is ampli-
fied by the open loop transimpedance gain (T
O
). The output
signal generated is equal to T
O
x IE. Negative feedback is
applied through R
FB
such that the device operates at a gain
equal to –R
FB/RFF
.
FIGURE 1. Equivalent Circuit.
V
O
T
O
C
C
L
SRS
(50)
C
1
V
I
V
N
R
FF
R
FB
I
E
+
Inverting Gain =
R
FB
R
FF
 
 
1 +
1
Loop Gain
NonInverting Gain =
1 +
R
FB
R
FF
 
 
1 +
1
Loop Gain
whereLoop Gain =
T
O
RFB+ RS1 +
R
FB
R
FF
 
 
    
    
ƒ
ACTUAL
BW
ƒ
AV=+2
()
BW
[]
x1.25
()
1+
R
S
R
FB
 
 
× 1 +
R
FB
R
FF
 
 
 
 
 
 
VIO1 +
R
FB
R
FF
 
 
± Ib
I
× R
FB
OutputOffsetVoltage =±IbN× RN1 +
R
F
B
R
FF
 
 
±
FIGURE 2. Output Offset Voltage Equivalent Circuit.
R
FB
R
FF
Ib
I
R
N
Ib
N
V
IO
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OPA4658
The feedback resistor value acts as the frequency response compensation element for a current feedback type amplifier. The 402 used in setting the specification achieves a nomi­nal maximally flat butterworth response while assuming a 2pF output pin parasitic. Increasing the feedback resistor will over compensate the amplifier, rolling off the frequency response, while decreasing it will decrease phase margin, peaking up the frequency response.
d) Connections to other wideband devices on the board may be made with short direct traces or through on-board transmission lines. For short connections, consider the trace and the input to the next device as a lumped capacitive load. Relatively wide traces (50 to 100 mils) should be used, preferably with ground and power planes opened up around them. Estimate the total capacitive load and set R
ISO
from
the plot of recommended R
ISO
vs capacitive load. Low
parasitic loads may not need an R
ISO
since the OPA4658 is
nominally compensated to operate with a 2pF parasitic load. If a long trace is required and the 6dB signal loss intrinsic to
doubly terminated transmission lines is acceptable, imple­ment a matched impedance transmission line using microstrip or stripline techniques (consult an ECL design handbook for microstrip and stripline layout techniques). A 50 environ­ment is not necessary on board, and in fact a higher imped­ance environment will improve distortion as shown in the distortion vs load plot. With a characteristic impedance defined based on board material and desired trace dimen­sions, a matching series resistor into the trace from the output of the amplifier is used as well as a terminating shunt resistor at the input of the destination device. Remember also that the terminating impedance will be the parallel combination of the shunt resistor and the input impedance of the destination device; the total effective impedance should match the trace impedance. Multiple destination devices are best handled as separate transmission lines, each with their own series and shunt terminations.
If the 6dB attenuation loss of a doubly terminated line is unacceptable, a long trace can be series-terminated at the source end only. This will help isolate the line capacitance from the op amp output, but will not preserve signal integrity as well as a doubly terminated line. If the shunt impedance at the destination end is finite, there will be some signal attenuation due to the voltage divider formed by the series and shunt impedances.
e) Socketing a high speed part like the OPA4658 is not recommended. The additional lead length and pin-to-pin
capacitance introduced by the socket creates an extremely troublesome parasitic network which can make it almost impossible to achieve a smooth, stable response. Best results are obtained by soldering the part onto the board. If socket­ing for the DIP package is desired, high frequency flush mount pins (e.g., McKenzie Technology #710C) can give good results.
the root sum of the squares of equation (4) and applying the spectral noise values found in the Typical Performance Curve graph section. This applies to noise from the op amp only. Note that both the noise figure (NF) and the equivalent input offset voltages improve as the closed loop gain increases (by keeping R
FB
fixed and reducing RFF with RN = 0).
INCREASING BANDWIDTH AT HIGH GAINS
The closed-loop bandwidth can be extended at high gains by reducing the value of the feedback resistor R
FB
. This band­width reduction is caused by the feedback current being split between RS and R
FF
(refer to Figure 1). As the gain increases
(for a fixed R
FB
), more feedback current is shunted through
R
FF
, which reduces closed-loop bandwidth.
CIRCUIT LAYOUT AND BASIC OPERATION
Achieving optimum performance with a high frequency am­plifier like the OPA4658 requires careful attention to layout parasitics and selection of external components. Recommen­dations for PC board layout and component selection include:
a) Minimize parasitic capacitance to any ac ground for all of the signal I/O pins. Parasitic capacitance on the output and inverting input pins can cause instability; on the non­inverting input it can react with the source impedance to cause unintentional bandlimiting. To reduce unwanted ca­pacitance, a window around the signal I/O pins should be opened in all of the ground and power planes. Otherwise, ground and power planes should be unbroken elsewhere on the board.
b) Minimize the distance (< 0.25") from the two power pins to high frequency 0.1µF decoupling capacitors. At the pins, the ground and power plane layout should not be in close proximity to the signal I/O pins. Avoid narrow power and ground traces to minimize inductance between the pins and the decoupling capacitors. Larger (2.2µF to 6.8µF) decoupling capacitors, effective at lower frequencies, should also be used. These may be placed somewhat farther from the device and may be shared among several devices in the same area of the PC board.
c) Careful selection and placement of external compo­nents will preserve the high frequency performance of the OPA4658. Resistors should be a very low reactance type.
Surface mount resistors work best and allow a tighter overall layout. Metal film or carbon composition axially-leaded resistors can also provide good high frequency performance. Again, keep their leads as short as possible. Never use wirewound type resistors in a high frequency application.
Since the output pin and the inverting input pin are most sensitive to parasitic capacitance, always position the feed­back and series output resistor, if any, as close as possible to the package pins. Other network components, such as non­inverting input termination resistors, should also be placed close to the package.
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OPA4658
ESD PROTECTION
ESD damage has been well recognized for MOSFET de­vices, but any semiconductor device is vulnerable to this potentially damaging source. This is particularly true for very high speed, fine geometry processes.
ESD damage can cause subtle changes in amplifier input characteristics without necessarily destroying the device. In precision operational amplifiers, this may cause a noticeable degradation of offset voltage and drift. Therefore, ESD handling precautions are strongly recommended when han­dling the OPA4658.
OUTPUT DRIVE CAPABILITY
The OPA4658 has been optimized to drive 75 and 100 resistive loads. The device can drive 2Vp-p into a 75 load. This high-output drive capability makes the OPA4658 an ideal choice for a wide range of RF, IF, and video applica­tions. In many cases, additional buffer amplifiers are un­needed.
Many demanding high-speed applications such as ADC/DAC buffers require op amps with low wideband output impedance. For example, low output impedance is essential when driving the signal-dependent capacitances at the inputs of flash A/D converters. As shown in Figure 3, the OPA4658 maintains very low closed-loop output impedance over frequency. Closed-loop output impedance increases with frequency since loop gain is decreasing with frequency.
max = (±VS)2 /4RL. Note that it is the voltage across the output transistor, and not the load, that determines the power dissipated in the output stage.
The short-circuit condition represents the maximum amount of internal power dissipation that can be generated. The variation of output current with temperature is shown in the Typical Performance Curves.
CAPACITIVE LOADS
The OPA4658’s output stage has been optimized to drive low resistive loads. Capacitive loads, however, will decrease the amplifier’s phase margin which may cause high fre­quency peaking or oscillations. Capacitive loads greater than 5pF should be buffered by connecting a small resistance, usually 5 to 25, in series with the output as shown in Figure 4. This is particularly important when driving high capacitance loads such as flash A/D converters.
In general, capacitive loads should be minimized for opti­mum high frequency performance. Coax lines can be driven if the cable is properly terminated. The capacitance of coax cable (29pF/foot for RG-58) will not load the amplifier when the coaxial cable or transmission line is terminated with its characteristic impedance.
FIGURE 3. Closed-Loop Output Impedance vs Frequency.
100
10
1
0.1
0.01
0.001 10k 100k
1M
10M
100M
Output Impedance ()
Frequency (Hz)
G = +2
THERMAL CONSIDERATIONS
The OPA4658 does not require a heat sink for operation in most environments. At extreme temperatures and under full load conditions a heat sink may be necessary.
The internal power dissipation is given by the equation P
D
= P
DQ
+ PDL, where PDQ is the quiescent power dissipa-
tion and P
DL
is the power dissipation in the output stage due
to the load. (For ±V
S
= ±5V, P
DQ
= 10V x 34mA = 340mW,
max). For the case where the amplifier is driving a grounded load (RL) with a DC voltage (±V
OUT
) the maximum value of
P
DL
occurs at ±V
OUT
= ±VS/2, and is equal to PDL,
OPA4658
C
L
R
L
50
R
S
(R
S
typically 5 to 25)
402402
1/4
COMPENSATION
The OPA4658 is internally compensated and is stable in gains of two or greater, with a phase margin of approxi­mately 66° in a gain of +2V/V. (Note that, from a stability standpoint, an inverting gain of –1V/V is equivalent to a noise gain of 2.) Gain and phase response for other gains are shown in the Typical Performance Curves.
The high-frequency response of the OPA4658 in a good layout is very flat with frequency.
DISTORTION
The OPA4658’s Harmonic Distortion characteristics into a 100 load are shown vs frequency and power output in the Typical Performance Curves. Distortion can be further im­proved by increasing the load resistance as illustrated in Figure 5. Remember to include the contribution of the feedback resistance when calculating the effective load re­sistance seen by the amplifier.
FIGURE 4. Driving Capacitive Loads.
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OPA4658
–50
–60
–70
–80
–90
–100
Load Resistance ()
Harmonic Distortion (dBc)
10 100 1k
2f
O
3f
O
G = +2
The third-order intercept is an important parameter for many RF amplifier applications. Figure 6 shows the OPA4658’s two tone, third-order intercept vs frequency. This curve is particularly useful for determining the magnitude of the third harmonic as a function of frequency, load resistance, and gain. For example, assume that the application requires the OPA4658 to operate in a gain of +2V/V and drive 2Vp-p into 100 at a frequency of 10MHz. Referring to Figure 6 we find that the intercept point is +38dBm. The magnitude of the third harmonic can now be easily calcu­lated from the expression:
Third Harmonic (dBc) = 2(OPI
3
P – PO)
where OPI
3
P = third-order output intercept, dBm
P
O
= output level, dBm
For this case OPI
3
P = 38dBm, PO = 7dBm, and the third Harmonic = 2(38 – 7) = 62dB below the fundamental. The OPA4658’s low distortion makes the device an excellent choice for a variety of RF signal processing applications.
CROSSTALK
Crosstalk is the undesired result of the signal of one channel mixing with and reproducing itself in the output of another
channel or channels. Crosstalk is inclined to occur in most multichannel integrated circuits. In quad devices, the effect of crosstalk is measured by driving three channels and observing the output of the undriven channel over various frequencies. The magnitude of this effect is referenced in terms of channel­to-channel isolation and expressed in decibels. Input referred points to the fact that there is a direct correlation between gain and crosstalk, therefore at increased gain, crosstalk also in­creases by a factor equal to that of the gain. Figure 7 illustrates the measured effect of crosstalk in the OPA4658U.
FIGURE 5. 5MHz Harmonic Distortion vs Load Resistance.
FIGURE 6. Third Order Intercept Point vs Frequency.
70
60
50
40
30
20
100k 1M 10M 100M
Third Order Intercept Point (dBm)
Frequency (Hz)
G = +2
(G = +2, R
L
= 100, RFB = 402)
FIGURE 8. Configuration for Testing Differential Gain/Phase.
OPA4658
75
75
402
402
75
75
TEK TSG 130A
TEK VM700A
1/4
DIFFERENTIAL GAIN AND PHASE
Differential Gain (DG) and Differential Phase (DP) are criti­cal specifications for video applications. DG is defined as the percent change in closed-loop gain over a specified change in output voltage level. DP is defined as the change in degrees of the closed-loop phase over the same output voltage change. Both DG and DP are specified at the NTSC sub-carrier frequency of 3.58MHz and the PAL subcarrier of 4.43MHz. All NTSC measurements were performed using a Tektronix model VM700A Video Measurement Set.
DG and DP of the OPA4658 were measured with the amplifier in a gain of +2V/V with 75 input impedance and the output back-terminated in 75. The input signal selected from the generator was a 0V to 1.4V modulated ramp with sync pulse. With these conditions the test circuit shown in Figure 8 delivered a 100IRE modulated ramp to the 75 input of the video analyzer. The signal averaging feature of the analyzer
FIGURE 7. Channel-to-Channel Isolation (three active channels).
Frequency (Hz)
10
0 –10 –20 –30 –40 –50 –60 –70 –80 –90
1M 10M 100M
Isolation (dB)
G = +2
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OPA4658
FIGURE 9. Noise Figure vs Source Resistance.
10 100 1k 10k 100k
40
30
20
10
0
Noise Figure (dB)
Source Resistance ()
NF = 10LOG 1 +
e
n
2
+ (InRs)
2
4KTR
S
TYPICAL APPLICATIONS
FIGURE 10. Low Distortion Video Amplifier.
OPA4658
V
OUT
402402
Video
Input
75
75
75 Transmission Line
75
1/4
was used to establish a reference against which the perfor­mance of the amplifier was measured. Signal averaging was also used to measure the DG and DP of the test signal in order to eliminate the generator’s contribution to measured ampli­fier performance. Typical performance of the OPA4658 is
0.015% differential gain and 0.02° differential phase to both NTSC and PAL standards.
NOISE FIGURE
The OPA4658’s voltage and current noise spectral densities are specified in the Typical Performance Curves. For RF applications, however, Noise Figure (NF) is often the pre­ferred noise specification since it allows system noise per­formance to be more easily calculated. The OPA4658’s Noise Figure vs Source Resistance is shown in Figure 9.
SPICE MODELS
Computer simulation using SPICE is often useful when analyzing the performance of analog circuits and systems. This is particularly true for Video and RF amplifier circuits where parasitic capacitance and inductance can have a major effect on circuit performance. SPICE models using MicroSim Corporation’s PSpice are available for the OPA4658. Evalu­ation PC boards are also available. Contract Burr-Brown applications departments to receive a SPICE Diskette.
DEMONSTRATION BOARD PACKAGE PRODUCT
DEM-OPA465xP 8-Pin DIP OPA4658P DEM-OPA465xU SO-8 OPA4658U
OPA4658UB
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OPA4658
FIGURE 11. Circuit Detail for the PC Board Layout of Figure 12.
R
23
R
28
Out
D
J
12
1
2
GND
–5V
P2
R
24
R
22
+In
D
R
26
R
31
R
27
R
25
–In
D
J
10
J
11
13
11
14
12
C30.1µF
C42.2µF
R
20
R
15
OPA4658
OPA4658
Out
C
J
7
R
21
R
19
+In
C
R
17
R
18
R
32
R
16
–In
C
J
9
J
8
9
4
8
10
C22.2µF
C10.1µF
C
7
C
8
1/4
1/4
1
2
GND
+5V
P1
R
6
R
1
Out
A
J
1
R
7
R
5
+In
A
R
3
R
4
R
29
R
5
–In
A
J
3
J
2
213
OPA4658
C
5
1/4
R
9
R
14
Out
B
J
6
R
10
R
8
+In
B
R
12
R
13
R
30
R
11
–In
B
J
4
J
5
675
OPA4658
C
6
1/4
U1
OPA465xP
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OPA4658
DEM-OPA465xP Demonstration Board Layout
(A) (B)
FIGURE 12a. Board Silkscreen (Bottom). 12b. Board Silkscreen (Top). 12c. Board Layout (Solder Side). 12d. Board Layout
(Component Side).
(C)
(D)
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