Datasheet NUP46V8P5 Datasheet (ON) [ru]

NUP46V8P5

Low Capacitance
Quad Array for
ESD Protection

This integrated transient voltage suppressor device (TVS) is
designed for applications requiring transient overvoltage protection. It
is intended to be used in sensitive equipment such as wireless headsets,
PDAs, digital cameras, computers, printers, communication systems,
and other applications. The integrated design provides very effective
and reliable protection for four separate lines using only one package.
This device is ideal for situations where board space is at a premium.

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Features

•ESD Protection: IEC61000-4-2: Level 4

•Four Separate Unidirectional Configurations for Protection

•Low Leakage Current < 1 mA @ 3 V

•Small SOT-953 SMT Package

•Low Capacitance

•This is a Pb-Free Device

Benefits

•Provides Protection for ESD Industry Standards: IEC 61000, HBM

•Protects Four Lines Against Transient Voltage Conditions

•Minimize Power Consumption of the System

•Minimize PCB Board Space

Typical Applications

•Cellular and Portable Electronics

•Serial and Parallel Ports

•Microprocessor Based Equipment

•Notebooks, Desktops, Servers

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SOT-953

CASE 526AB

MARKING DIAGRAM

6 M

1

6 = Specific Device Code
M = Date Code

ORDERING INFORMATION

Device Package Shipping

NUP46V8P5T5G SOT-953

(Pb-Free)

4

†

8000 /

Tape & Reel

© Semiconductor Components Industries, LLC, 2008

January, 2008 - Rev. 0

†For information on tape and reel specifications,

including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.

1 Publication Order Number:

NUP46V8P5/D

NUP46V8P5

ELECTRICAL CHARACTERISTICS

(TA = 25°C unless otherwise noted)

Symbol

V

QV

I

V

RWM

V

V

Z

I

Z

Maximum Reverse Peak Pulse Current

PP

Clamping Voltage @ I

C

Working Peak Reverse Voltage

I

Maximum Reverse Leakage Current @ V

R

Breakdown Voltage @ I

BR

I

Test Current

T

Maximum Temperature Coefficient of V

BR

I

Forward Current

F

Forward Voltage @ I

F

Maximum Zener Impedance @ I

ZT

Reverse Current

ZK

Maximum Zener Impedance @ I

ZK

MAXIMUM RATINGS (T

Parameter

PP

T

F

= 25°C unless otherwise noted)

A

ZT

ZK

BR

RWM

VCV

BR

V

RWM

I

I

F

I

V

R

F

I

T

I

PP

Uni-Directional

V

Characteristic Symbol Value Unit

Peak Power Dissipation (8 X 20 ms @ TA = 25°C) (Note 1)

Thermal Resistance Junction-to-Ambient

P

R

Above 25°C, Derate

Maximum Junction Temperature T

Jmax

Operating Junction and Storage Temperature Range TJ T

Lead Solder Temperature (10 seconds duration) T

Human Body Model (HBM)

ESD 8000

Machine Model (MM)

PK

q

JA

stg

L

10 W

560

4.5

°C/W

mW/°C

150 °C

-55 to +150 °C

260 °C

400

V

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.

ELECTRICAL CHARACTERISTICS (T

Device

= 25°C)

A

Device

Marking

Breakdown Voltage

@ 1 mA (Volts)

V

BR

Min Nom Max V

Leakage Current

@ V

I

RM

RM

I

RWM

(mA)

RWM

Typ Capacitance

@ 0 V Bias (pF)

(Note 2)

Typ Capacitance

@ 3 V Bias (pF)

(Note 2)

Typ Max Typ Max

NUP46V8P5 6 6.47 6.8 7.14 4.3 1.0 12 15 6.7 9.5

1. Non-repetitive current per Figure 1.

2. Capacitance of one diode at f = 1 MHz, V

= 0 V, TA = 25°C.

R

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NUP46V8P5

TYPICAL ELECTRICAL CHARACTERISTICS

10

1

, REVERSE LEAKAGE (mA)

R

I

0.1

-100 0 150 200

-50 10050

T, TEMPERATURE (°C)

Figure 1. Reverse Leakage versus

Temperature

100

t

r

90

80

70

60

50

40

30

20

% OF PEAK PULSE CURRENT

10

0

020406080

t

P

PEAK VALUE I

PULSE WIDTH (tP) IS DEFINED
AS THAT POINT WHERE THE
PEAK CURRENT DECAY = 8 ms

HALF VALUE I

t, TIME (ms)

RSM

@ 8 ms

RSM

/2 @ 20 ms

Figure 3. 8 × 20 ms Pulse Waveform

14

12

10

8

6

4

1 MHz FREQUENCY

TYPICAL CAPACITANCE (pF)

2

0

01 2

BIAS VOLTAGE (V)

Figure 2. Capacitance

1

0.1

0.01

, FORWARD CURRENT (A)

F

I

0.001

VF, FORWARD VOLTAGE (V)

Figure 4. Forward Voltage

3

TA = 25°C

1.81.61.41.21.00.80.6

110

100

PP

90

80

70

60

50

40

30

20

% OF RATED POWER OR I

10

0

Figure 5. Power Derating Curve

1501251007550250

TA, AMBIENT TEMPERATURE (°C)

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NUP46V8P5

PACKAGE DIMENSIONS

SOT-953

CASE 527AB-01

ISSUE O

D

45

12 3

e

-Y-

A

L

-X-

E

H

E

C

b

5X

X0.08

Y

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETERS

3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.

MILLIMETERS

DIM MIN NOM MAX

A 0.44 0.48 0.50
b 0.10 0.15 0.20
C 0.05 0.10 0.15
D 0.95 1.00 1.05
E 0.75 0.80 0.85
e 0.35 BSC
L 0.05 0.10 0.15

H

E

0.95 1.00 1.05

INCHES

MIN NOM MAX

0.017 0.019 0.020

0.0039 0.0059 0.0079

0.002 0.004 0.006

0.037 0.039 0.041

0.03 0.032 0.034

0.014 BSC

0.0019 0.0039 0.0059

0.037 0.039 0.041

SOLDERING FOOTPRINT*

0.35

0.35

0.014

0.014

0.90

0.0354

0.20

0.08

0.20

0.08

mm

ǒ

SCALE 20:1

inches

Ǔ

*For additional information on our Pb-Free strategy and soldering

details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
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NUP46V8P5/D

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