Datasheet NTE6850 Datasheet (NTE)

Page 1
NTE6850
Integrated Circuit
NMOS, Asynchronous Communications
Interface Adapter
Description:
The NTE6850 Asynchronous Communications Interface Adapter provides the data formatting and control to interface serial asynchronous data communications information to bus organized systems such as the NTE6800 Microprocessing Unit.
Features:
D 8–Bit and 9–Bit Transmission D Optional Even and Odd Parity D Parity, Overrun and Framing Error Checking D Programmable Control Register D Optional ÷1, ÷16, and ÷64 Clock Modes D Up to 1.0 Mbps Transmission D False Start Bit Deletion D Peripheral/Modem Control Functions D Double Buffered D One–Stop or Two–Stop Bit Operation
Absolute Maximum Ratings:
Supply Voltage, VCC –0.3 to +7.0V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage, Vin –0.3 to +7.0V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range, TA 0° to 70°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage Temperature Range, T Thermal Resistance, Junction–to–Ambient, R
Note 1. This device contains circuitry to protect the inputs against damage due to high static voltages
or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage higher than maximum rated voltages to this high impedance circuit. Reliability of operation is enhanced if unused inputs are tied to an appropriate logic voltage level (e.g. either VSS or VCC).
–55° to +150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
stg
thJA
120°C/W. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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Electrical Characteristics: (VCC = 5V ± 5%, VSS = 0, TA = 0° to +70°C unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Input High Voltage V Input Low Voltage V Input Leakage Current
IH IL
I
Vin = 0 to 5.25V 1.0 2.5 µA
in
VSS+2.0 V VSS–0.3 VSS+0.8 V
R/W, CS0, CS1, CS2, Enable, RS, RX D, RX C, CTS, DCD
Hi–Z (Off–State) Input Current
I
Vin = 0.4 to 2.4V 2.0 10.0 µA
TSI
D0 – D7
Output High Voltage
V
OHILoad
= 205µA, Enable Pulse Width < 25µs VSS+2.4 V
D0 – D7
Output High Voltage
TX Data, RTS Output Low Voltage V Output Leakage Current
I
LOH
I
= 100µA, Enable Pulse Width < 25µs VSS+2. V
Load
I
OL
= 1.6A, Enable Pulse Width < 25µs VSS+0.4 V
Load
VOH = 2.4V 1.0 10 µA
(Off–State) IRQ Internal Power Dissipation P
TA = 0°C, Note 2 300 525 mW
INT
Internal Input Capacitance
D0 – D7 C
Vin = 0, TA = +25°C, f = 1MHz 10.0 12.5 pF
in
Internal Input Capacitance
E, TX CLK, RX CLK, R/W,
7.0 7.5 pF RS, RX Data, CS0, CS1, CS2, CTS, DCD
Output Capacitance
RTS, TX Data C
Vin = 0, TA = +25°C, f = 1MHz 10 pF
out
Output Capacitance
IRQ 5 pF
CC
V
Note 2. For temperatures less than TA = 0°C, P
Serial Data Timing Characteristics:
Parameter Symbol Test Conditions Min Typ Max Unit
Data Clock Pulse Width, Low PW
Data Clock Pulse Width, High PW
Data Clock Frequency f
Data Clock–to–Data Delay for Transmitter t Receive Data Setup Time t Receive Data Hold Time t Interrupt Request Release Time t Request–to–Send Delay Time t Input Rise and Fall Times tr, t
CL
CH
C
TDD RDS RDH
R
RTS
f
maximum will increase.
INT
B16, B64 Modes 600 450 ns B1 Mode 900 650 ns B16, B64 Modes 600 450 ns B1 Mode 900 650 ns B16, B64 Modes 0.8 MHz B1 Mode 500 kHz
600 ns
B1 Mode 250 ns B1 Mode 250 ns
1.2 µs 560 ns
or 10% of the pulse width if smaller 1.0 µs
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Bus Timing Characteristics: (VL 4V, VH 2.4V, measurement points 0.8V and 2V unless
otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Cycle Time t
cyc
Pulse Width, E Low PW Pulse Width, E High PW Clock Rise and Fall Time tr, t Address Hold Time t Address Setup Time Before E t Chip Select Setup Time Before E t Chip Select Hold Time t Read Data Hold Time t Write Data Hold Time t Output data Delay Time t Input Data Setup Time t
AH AS CS
CH
DHR DHW DHW DSW
EL EH
f
Note 3 20 50 ns
1.0 10.0 µs 430 9500 ns 450 9500 ns
25 ns 10 ns 80 ns 80 ns 10 ns
10 ns
290 ns
165 ns
Note 3. The data bu s out put bu ffers ar e no longer sourcing or sinking current by t
Impedance).
Pin Connection Diagram
V
SS
Rx Data
Cx Clk
Tx Clk
RTS
IRQ
CS2
CS1
RS
V
DD
1 2 3 4 5 6Tx Data 7 8CS0
9 16 10 11 12 13
24
CTS
23
DCD
22 21D0D1 20
D2
19 D3
D4
18
D5
17
D6 D7
15 14
E
R/W
max (High
DHR
24 13
112
1.300 (33.02) Max
.100 (2.54)
1.100 (27.94)
.225
(5.73)
Max
.126
(3.22)
Min
.520
(13.2)
.600
(15.24)
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