Datasheet NL17SZ32DFT2, NL17SZ32XV5T2 Datasheet (ON) [ru]

Page 1
NL17SZ32
Single 2-Input OR Gate
The NL17SZ32 is a single 2-input OR Gate in two tiny footprint packages. The device performs much as LCX multi-gate products in speed and drive. They should be used wherever the need for higher speed and drive are needed.
Features
Tiny SOT-353 and SOT-553 Packages
2.4 ns T
Source/Sink 24 mA at 3.0 V
Over-Voltage Tolerant Inputs
Pin For Pin with NC7SZ32P5X, TC7SZ32FU and TC7SZ32AFE
Chip Complexity: FETs = 20
Designed for 1.65 V to 5.5 V V
Pb-Free Packages are Available
at 5.0 V (typ)
PD
B
Operation
CC
5
1
V
CC
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5
1
SOT-353/SC70-5/SC-88A
DF SUFFIX
CASE 419A
5
1
SOT-553
XV5 SUFFIX
CASE 463B
MARKING
DIAGRAMS
5
L4 M G
G
1
5
L4 M G
G
1
A
2
3
GND
Figure 1. Pinout (Top View)
A
B
w1
Figure 2. Logic Symbol
L4 = Specific Device Code M = Date Code G = Pb-Free Package
4
Y
(Note: Microdot may be in either location)
PIN ASSIGNMENT
Pin
1
2
3
Y
4
5
Function
B
A
GND
Y
V
CC
FUNCTION TABLE
Output
Input
A
L
L
H
H
B
L
H
L
H
Y = A ) B
Y
L
H
H
H
© Semiconductor Components Industries, LLC, 2008
April, 2008 - Rev. 7
ORDERING INFORMATION
See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet.
1 Publication Order Number:
NL17SZ32/D
Page 2
NL17SZ32
MAXIMUM RATINGS
Symbol Parameter Value Unit
V
V
V
OUT
I
I
OK
I
OUT
I
CC
T
STG
T
T
q
P
MSL Moisture Sensitivity Level 1
F
ESD ESD Classification Human Body Model (Note 2)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2-ounce copper trace with no air flow.
2. Tested to EIA/JESD22-A114-A, rated to EIA/JESD22-A114-B.
3. Tested to EIA/JESD22-A115-A, rated to EIA/JESD22-A115-A.
4. Tested to JESD22-C101-A.
DC Supply Voltage *0.5 to )7.0 V
CC
DC Input Voltage *0.5 to )7.0 V
IN
DC Output Voltage *0.5 to VCC )0.5 V
DC Input Diode Current *50 mA
IK
DC Output Diode Current *50 mA
DC Output Sink Current $50 mA
DC Supply Current per Supply Pin $100 mA
Storage Temperature Range *65 to )150 °C
Lead Temperature, 1 mm from Case for 10 Seconds 260 °C
L
Junction Temperature Under Bias )150 °C
J
Thermal Resistance SOT-353 (Note 1)
JA
Power Dissipation in Still Air at 85°C SOT-353
D
Flammability Rating Oxygen Index: 28 to 34 UL 94 V-0 @ 0.125 in
R
SOT-553
SOT-553
350 496
186 135
Class Z
Machine Model (Note 3)
Charged Device Model (Note 4)
Class A
N/A
°C/W
mW
V
RECOMMENDED OPERATING CONDITIONS
Symbol Parameter Min Max Unit
V
V
V
OUT
T
tr, t
DC Supply Voltage 1.65 5.5 V
CC
DC Input Voltage 0 5.5 V
IN
DC Output Voltage 0 VCC + 0.5 V
Operating Temperature Range *40 )85 °C
A
Input Rise and Fall Time VCC = 3.0 V $0.3 V
f
V
= 5.0 V $0.5 V
CC
0 0
100
20
ns/V
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Page 3
DC ELECTRICAL CHARACTERISTICS
Symbol Parameter Condition
V
High-Level Input Voltage 1.65 to 1.95
IH
V
Low-Level Input Voltage 1.65 to 1.95
IL
V
V
High-Level Output Voltage
OH
IN
IN
= V
= V
or V
IL
IH
or V
IH
OH
V
Low-Level Output Voltage
OL
V
I
Input Leakage Current VIN = VCC or GND 0 to 5.5 $0.1 $1.0
IN
I
Quiescent Supply Current VIN = VCC or GND 5.5 1 10
CC
IOH = 100 mA
I
= -3 mA
OH
I
= -8 mA
OH
I
= -12 mA
OH
I
= -16 mA
OH
I
= -24 mA
OH
I
= -32 mA
OH
IOL = 100 mA
I
= 3 mA
OL
I
= 8 mA
OL
I
= 12 mA
OL
I
= 16 mA
OL
I
= 24 mA
OL
I
= 32 mA
OL
NL17SZ32
V
CC
(V)
2.3 to 5.5
2.3 to 5.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
1.65 to 5.5
1.65
2.3
2.7
3.0
3.0
4.5
TA = 255C *405C v TA v 855C
Min Typ Max Min Max
0.75 V
CC
0.7 V
CC
VCC - 0.1
1.29
1.9
2.2
2.4
2.3
3.8
V
CC
1.52
2.1
2.4
2.7
2.5
4.0
0.25 V
0.3 V
CC
CC
0.75 V
CC
0.7 V
CC
VCC - 0.1
1.29
1.9
2.2
2.4
2.3
3.8
0.1
0.08
0.20
0.22
0.28
0.38
0.42
0.24
0.3
0.4
0.4
0.55
0.55
0.25 V
0.3 V
0.1
0.24
0.3
0.4
0.4
0.55
0.55
CC
CC
Unit
V
V
V
V
mA
mA
AC ELECTRICAL CHARACTERISTICS t
Symbol Parameter Condition
t
PLH
t
PHL
Propagation Delay (Figure 3 and 4)
RL = 1 MW, C
RL = 1 MW, C
RL = 1 MW, C
RL = 1 MW, C
RL = 500 W, C
RL = 1 MW, C
RL = 500 W, C
= tF = 3.0 ns
R
= 15 pF
L
= 15 pF
L
= 15 pF
L
= 15 pF
L
= 50 pF
L
= 15 pF
L
= 50 pF
L
V
CC
(V)
TA = 255C *405C v TA v 855C
Min Typ Max Min Max
1.65 2.0 5.5 12.0 2.0 12.7
1.8 2.0 4.6 10 2.0 10.5
2.5 $ 0.2 0.8 3.0 7 0.8 7.5
3.3 $ 0.3
0.5 2.6 4.7 0.5 5.0
1.5 3.0 5.2 1.5 5.5
5.0 $ 0.5
0.5 2.2 4.1 0.5 4.4
0.8 2.4 4.5 0.8 4.8
Unit
ns
CAPACITIVE CHARACTERISTICS
Symbol Parameter Condition Typical Unit
C
C
5. CPD is defined as the value of the internal equivalent capacitance which is calculated from the operating current consumption without load.
Average operating current can be obtained by the equation: I power consumption; P
Input Capacitance VCC = 5.5 V, VI = 0 V or V
IN
Power Dissipation Capacitance
PD
(Note 5)
D
= CPD V
2
fin + ICC VCC.
CC
10 MHz, VCC = 3.3 V, VI = 0 V or V
10 MHz, VCC = 5.5 V, VI = 0 V or V
= CPD VCC fin + ICC. CPD is used to determine the no-load dynamic
)
CC(OPR
CC
CC
CC
u4 pF
25 pF
30
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Page 4
NL17SZ32
tf = 3 ns
INPUT
A and B
OUTPUT Y
90%
90%
t
PHL
50%
10%
50%
50%
Figure 3. Switching Waveform
t
50%
PLH
10%
tf = 3 ns
V
CC
GND
V
OH
V
OL
INPUT
R
L
A 1 MHz square input wave is recommended for
propagation delay tests.
Figure 4. Test Circuit
C
OUTPUT
L
ORDERING INFORMATION
Device Order
Number
NL17SZ32DFT2 SC70-5/SC-88A/SOT-353 3000 / Tape & Reel
NL17SZ32DFT2G SC70-5/SC-88A/SOT-353
NL17SZ32XV5T2 SOT-553* 4000 / Tape & Reel
NL17SZ32XV5T2G SOT-553* 4000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
*All Devices in Package SOT553 are Inherently Pb-Free.
Package
Typ e
(Pb-Free)
Tap e a n d
Reel Size
3000 / Tape & Reel
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Page 5
NL17SZ32
PACKAGE DIMENSIONS
SC-88A, SOT-353, SC-70
CASE 419A-02
A
G
45
D
5 PL
-B-
MM
B0.2 (0.008)
S
12 3
N
C
ISSUE J
J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. 419A-01 OBSOLETE. NEW STANDARD 419A-02.
4. DIMENSIONS A AND B DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS.
INCHES
DIMAMIN MAX MIN MAX
B 1.15 1.350.045 0.053 C 0.80 1.100.031 0.043 D 0.10 0.300.004 0.012 G 0.65 BSC0.026 BSC H --- 0.10---0.004
J 0.10 0.250.004 0.010 K 0.10 0.300.004 0.012 N 0.20 REF0.008 REF S 2.00 2.200.079 0.087
MILLIMETERS
1.80 2.200.071 0.087
H
K
SOLDERING FOOTPRINT*
0.50
0.0197
0.65
0.025
0.65
0.40
0.0157
1.9
0.0748
SCALE 20:1
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
0.025
mm
ǒ
inches
Ǔ
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Page 6
NL17SZ32
PACKAGE DIMENSIONS
SOT-553
XV5 SUFFIX
5-LEAD PACKAGE
CASE 463B-01
ISSUE B
D
-X-
45
12 3
e
STYLE 1:
PIN 1. BASE 1
2. EMITTER 1/2
3. BASE 2
4. COLLECTOR 2
5. COLLECTOR 1
E
-Y-
5 PL
b
0.08 (0.003) X
M
STYLE 2:
Y
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
1.35
0.0531
A
L
H
E
c
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIMAMIN NOM MAX MIN
b 0.17 0.22 0.27 0.007 c D 1.50 1.60 1.70 0.059 E 1.10 1.20 1.30 0.043 e 0.50 BSC L 0.10 0.20 0.30 0.004
H
E
SOLDERING FOOTPRINT*
0.3
0.0118
1.0
0.0394
MILLIMETERS
0.50 0.55 0.60 0.020
0.08 0.13 0.18
1.50 1.60 1.70 0.059 0.063 0.067
INCHES
NOM MAX
0.022 0.024
0.009 0.011
0.003 0.005 0.007
0.063 0.067
0.047 0.051
0.020 BSC
0.008 0.012
0.45
0.0177
0.0197
SCALE 20:1
ǒ
inches
mm
Ǔ
0.5
0.5
0.0197
*For additional information on our Pb-Free strategy and soldering
details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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6
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