• High power gain in C to X band: GS = 4.5 dB TYP. @ f = 12 GHz
• Gate length: Lg = 0.8 µm
• Gate width: Wg = 400 µm
• 4-pin super minimold package
• Tape & reel packaging only available
ORDERING INFORMATION
GaAs MES FET
NE72218
Part NumberPackageSupplying Form
NE72218-T14-pin super minimold
NE72218-T2
Remark
To order evaluation samples, consult your NEC sales representative (Part number for sample order:
•
8 mm wide embossed taping
•
Pin 3 (Source), Pin 4 (Drain) fac e the perforation side of the tape
•
Qty 3 kpcs/reel
•
8 mm wide embossed taping
•
Pin 1 (Source), Pin 2 (Gate) face the perforation side of the t ape
•
Qty 3 kpcs/reel
NE72218).
ABSOLUTE MAXIMUM RATINGS (TA = +25
ParameterSymbolRatingsUnit
Drain to Source VoltageV
Gate to Source VoltageV
Drain CurrentI
Total Power DissipationP
Channel TemperatureT
Storage TemperatureT
DS
GS
D
tot
ch
stg
C)
°°°°
5.0V
−
5.0V
DSS
I
250mW
125
−
65 to +125
mA
°
°
C
C
Because this product uses high-frequency technology, avoid excessive static electricity, etc.
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12750EJ3V0DS00 (3rd edition)
Date Published August 2000 NS CP(K)
Printed in Japan
The mark •••• shows major revised points.
1997, 2000
Page 2
ELECTRICAL CHARACTERISTICS (TA = +25 °°°°C)
ParameterSymbolTest ConditionsMIN.TYP.MAX.Unit
NE72218
Gate to Source Leak CurrentI
Saturated Drain CurrentI
Gate to Source Cutoff VoltageV
Transconductanceg
Phase NoisePN
Power GainG
Output Power at 1 dB Gain
P
Compression Po int
DSS
I
CLASSIFICATION
RankI
DSS
(mA)Marking
5730 to 120V57
5865 to 120V58
5930 to 75V59
GSO
VGS = −5 V
DSS
VDS = 3 V, VGS = 0 V3060120mA
GS (off)VDS
m
= 3 V, ID = 100 µA
VDS = 3 V, ID = 30 mA2045
DS
= 3 V, ID = 30 mA, f = 11 GHz,
V
−
−
0.5
−−
1.010
−
2.0
110
100 kHz offset
VDS = 3 V, ID = 30 mA, f = 11 GHz,
−−90−
10 kHz offset
S
VDS = 3 V, ID = 30 mA, f = 12 GHz
O (1 dB)VDS
= 3 V, ID = 30 mA, f = 12 GHz
−
−
4.5
15.0
−
4.0V
−
−
−
−
µ
A
mS
dBc/Hz
dBc/Hz
dB
dBm
2
Data Sheet P12750EJ3V0DS00
Page 3
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 °°°°C)
(1) Because this device is a GaAs MES FET with a Schottky barrier gate structure, it is necessary that sufficient
care be taken regarding static electricity and strong electric fields.
Take measures against static electricity and make sure the body is earthed when mounting the device.
(2) Follow the procedure below when operating the device by a gate-and-drain-independent dual power supply.
Directly ground both the source pins.
•
Fix VGS to approximately −4 V.
•
Increase VDS to a predetermined voltage level (within the recommended operating range of VDS).
•
Adjust VGS in line with a predetermined ID.
•
(3) It is recommended that the bias application circuit be able to have a fixed voltage and current.
(4) Adjust the I/O matching circuit after turning the bias OFF.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the following recommended conditions. For soldering
methods and conditions other than those recommended below, contact your NEC sales representative.
Soldering MethodSoldering ConditionsRecommended Condition Symbol
Infrared ReflowPac kage peak temperature: 235 °C or below,
Time: 30 seconds or less (at 210 °C or higher),
Count: 3 times or less, Exposure limit: None
VPSPackage peak temperature: 215 °C or below,
Time: 40 seconds or less (at 200 °C or higher),
Count: 3 times or less, Exposure limit: None
Wave SolderingSoldering bath t em perature: 260 °C or below,
Time: 10 seconds or less,
Count: 1 time, Expos ure l i m i t: None
Partial HeatingPin temperature: 230 °C or below,
Time: 10 seconds or less (per pi n row),
Exposure limit: None
After opening the dry pack, store it at 25 °C or less and 65 % RH or less for the allowable storage period.
Note
Note
Note
Note
Note
Caution Do not use different soldering methods together (except for partial heating).
For the details the recommended soldering conditions, refer to the document
MOUNTING TECHNOLOGY MANUAL (C10535E)
.
IR35-00-3
VP15-00-3
WS60-00-1
−
SEMICONDUCTOR DEVICE
Data Sheet P12750EJ3V0DS00
9
Page 10
[MEMO]
NE72218
10
Data Sheet P12750EJ3V0DS00
Page 11
[MEMO]
NE72218
Data Sheet P12750EJ3V0DS00
11
Page 12
NE72218
CAUTION
The great care must be taken in dealing with the devices in this guide.
The reason is that the material of the devices is GaAs (Gallium Arsenide), which is
designated as harmful substance according to the law concerned.
Keep the law concerned and so on, especially in case of removal.
•
The information in this document is current as of August, 2000. The information is subject to
change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or
data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all
products and/or types are available in every country. Please check with an NEC sales representative
for availability and additional information.
•
No part of this document may be copied or reproduced in any form or by any means without prior
written consent of NEC. NEC assumes no responsibility for any errors that may appear in this document.
•
NEC does not assume any liability for infringement of patents, copyrights or other intellectual property rights of
third parties by or arising from the use of NEC semiconductor products listed in this document or any other
liability arising from the use of such products. No license, express, implied or otherwise, is granted under any
patents, copyrights or other intellectual property rights of NEC or others.
•
Descriptions of circuits, software and other related information in this document are provided for illustrative
purposes in semiconductor product operation and application examples. The incorporation of these
circuits, software and information in the design of customer's equipment shall be done under the full
responsibility of customer. NEC assumes no responsibility for any losses incurred by customers or third
parties arising from the use of these circuits, software and information.
•
While NEC endeavours to enhance the quality, reliability and safety of NEC semiconductor products, customers
agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely. To minimize
risks of damage to property or injury (including death) to persons arising from defects in NEC
semiconductor products, customers must incorporate sufficient safety measures in their design, such as
redundancy, fire-containment, and anti-failure features.
•
NEC semiconductor products are classified into the following three quality grades:
"Standard", "Special" and "Specific". The "Specific" quality grade applies only to semiconductor products
developed based on a customer-designated "quality assurance program" for a specific application. The
recommended applications of a semiconductor product depend on its quality grade, as indicated below.
Customers must check the quality grade of each semiconductor product before using it in a particular
application.
"Standard": Computers, office equipment, communications equipment, test and measurement equipment, audio
and visual equipment, home electronic appliances, machine tools, personal electronic equipment
and industrial robots
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
"Specific": Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems and medical equipment for life support, etc.
The quality grade of NEC semiconductor products is "Standard" unless otherwise expressly specified in NEC's
data sheets or data books, etc. If customers wish to use NEC semiconductor products in applications not
intended by NEC, they must contact an NEC sales representative in advance to determine NEC's willingness
to support a given application.
(Note)
(1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries.
(2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for
NEC (as defined above).
M8E 00. 4
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