Page 1
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FEATURES
1
2
3
4
5
6
7
14
13
12
11
10
9
8
1DISCH
1THRES
1CONT
1RESET
1OUT
1TRIG
GND
V
CC
2DISCH
2THRES
2CONT
2RESET
2OUT
2TRIG
NA556...D OR N PACKAGE
NE556...D, N, OR NS PACKAGE
SA556...D OR N PACKAGE
SE556...J PACKAGE
(TOPVIEW)
• Two Precision Timing Circuits Per Package
• Astable or Monostable Operation
• TTL-Compatible Output Can Sink or Source
up to 150 mA
• Active Pullup or Pulldown
• Designed to Be Interchangeable With
Signetics NE556, SA556, and SE556
APPLICATIONS
• Precision Timers From Microseconds to
Hours
• Pulse-Shaping Circuits
• Missing-Pulse Detectors
• Tone-Burst Generators
• Pulse-Width Modulators
• Pulse-Position Modulators
• Sequential Timers
• Pulse Generators
• Frequency Dividers
• Application Timers
• Industrial Controls
• Touch-Tone Encoders
NA556 , NE556 , SA556 , SE556
DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
DESCRIPTION/ORDERING INFORMATION
These devices provide two independent timing circuits of the NA555, NE555, SA555, or SE555 type in each
package. These circuits can be operated in the astable or the monostable mode with external resistor-capacitor
(RC) timing control. The basic timing provided by the RC time constant can be controlled actively by modulating
the bias of the control-voltage input.
The threshold (THRES) and trigger (TRIG) levels normally are two-thirds and one-third, respectively, of V
These levels can be altered by using the control voltage (CONT) terminal. When the trigger input falls below
trigger level, the flip-flop is set and the output goes high. If the trigger input is above the trigger level and the
threshold input is above the threshold level, the flip-flop is reset, and the output is low. The reset (RESET) input
can override all other inputs and can be used to initiate a new timing cycle. When RESET goes low, the flip-flop
is reset and the output goes low. When the output is low, a low-impedance path is provided between the
discharge (DISCH) terminal and ground (GND).
.
CC
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright © 1978–2006, Texas Instruments Incorporated
On products compliant to MIL-PRF-38535, all parameters are
tested unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
Page 2
www.ti.com
OUT
RESETV
CC
CONT
GND
DISCH
THRES
TRIG
RESET can overrideTRIG,which can overrideTHRES.
NA556 , NE556 , SA556 , SE556
DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
ORDERING INFORMATION
T
A
VT(MAX)
V
= 15 V
CC
PACKAGE
PDIP – N Tube of 25 NE556N NE556N
0 ° C to 70 ° C 11.2 V SOIC – D NE556
SOP – NS Reel of 2000 NE556NSR NE556
–40 ° C to 85 ° C 11.2 V PDIP – N Tube of 25 SA556N SA556N
PDIP – N Tube of 25 NA556N NA556N
–40 ° C to 105 ° C 11.2 V Tube of 50 NA556D
SOIC – D NA556
–55 ° C to 125 ° C 10.6 V CDIP – J Tube of 25
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
RESET OUTPUT
TRIGGER THRESHOLD DISCHARGE
VOLTAGE
Low Irrelevant Irrelevant Low On
High <1/3 V
High >1/3 V
High >1/3 V
DD
DD
DD
Tube of 50 NE556D
Reel of 2500 NE556DR
Reel of 2500 NA556DR
FUNCTION TABLE
(each timer)
(1)
(1)
ORDERABLE PART NUMBER TOP-SIDE MARKING
SE556J SE556J
SE556JB SE556JB
VOLTAGE
(1)
Irrelevant High Off
>2/3 V
<2/3 V
DD
DD
Low On
As previously established
SWITCH
(1) Voltage levels shown are nominal.
FUNCTIONAL BLOCK DIAGRAM, EACH TIMER
2
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Page 3
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NA556 , NE556 , SA556 , SE556
DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
V
CC
V
I
I
O
θ
JA
θ
JC
T
J
Supply voltage
Input voltage CONT, RESET, THRES, and TRIG V
Output current ± 225 mA
Package thermal impedance
Package thermal impedance
Operating virtual junction temperature 150 ° C
Lead temperature 1,6 mm (1/16 in) from case for 60 s J package 300 ° C
Lead temperature 1,6 mm (1/16 in) from case for 10 s D, N, or NS package 260 ° C
T
stg
Storage temperature range –65 150 ° C
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to network ground terminal.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD= (TJ(max) – TA)/ θJA. Operating at the absolute maximum TJof 150 ° C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) Maximum power dissipation is a function of TJ(max), θJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD= (TJ(max) – TC)/ θJC. Operating at the absolute maximum TJof 150 ° C can affect reliability.
(6) The package thermal impedance is calculated in accordance with MIL-STD-883.
(2)
(1)
MIN MAX UNIT
D package 86
(3) (4)
N package 80 ° C/W
NS package 76
(5) (6)
J package 15.05 ° C/W
18 V
CC
V
Recommended Operating Conditions
V
CC
V
I
I
O
T
A
Supply voltage V
Input voltage CONT, RESET, THRES, and TRIG V
Output current ± 200 mA
Operating free-air temperature ° C
MIN MAX UNIT
NA556, NE556, SA556 4.5 16
SE556 4.5 18
NA556 –40 105
NE556 0 70
SA556 –40 85
SE556 –55 125
V
CC
Submit Documentation Feedback
3
Page 4
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NA556 , NE556 , SA556 , SE556
DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
Electrical Characteristics
V
= 5 V to 15 V, TA= 25 ° C (unless otherwise noted)
CC
NA556
PARAMETER TEST CONDITIONS UNIT
V
= 15 V 8.8 10 11.2 9.4 10 10.6
V
I
T
V
I
TRIG
V
I
RESET
I
DISCH
V
V
V
I
CC
Threshold voltage
T
level
Threshold current
Trigger voltage level V
TRIG
Trigger current TRIG at 0 V 0.5 2 0.5 0.9 µ A
Reset voltage level V
RESET
Reset current mA
Discharge switch
off-state current
Control voltage
CONT
(open circuit)
Low-level TA= –55 ° C to 125 ° C 2.7
OL
output voltage
High-level
OH
output voltage
Supply current mA
CC
V
= 5 V 2.4 3.3 4.2 2.7 3.3 4
CC
(1)
V
= 15 V
CC
V
= 5 V
CC
TA= –55 ° C to 125 ° C 3 6
TA= –55 ° C to 125 ° C 1.9
TA= –55 ° C to 125 ° C 1.1
RESET at V
CC
RESET at 0 V –0.4 1.5 –0.4 –1
V
= 15 V
CC
V
= 5 V
CC
V
= 15 V,
CC
IOL= 10 mA
V
= 15 V,
CC
IOL= 50 mA
V
= 15 V,
CC
IOL= 100 mA
V
= 15 V, IOL= 200 mA 2.5 2.5
CC
V
= 5 V,
CC
IOL= 3.5 mA
V
= 5 V,
CC
IOL= 5 mA
V
= 5 V, IOL= 8 mA 0.15 0.3 0.15 0.25
CC
V
= 15 V,
CC
IOH= –100 mA
V
= 15 V, IOH= –200 mA 12.5 12.5 V
CC
V
= 5 V,
CC
IOH= –100 mA
Output low,
No load
Output high,
No load
TA= –55 ° C to 125 ° C 9.6 10.4
TA= –55 ° C to 125 ° C 2.9 3.8
TA= –55 ° C to 125 ° C 0.2
TA= –55 ° C to 125 ° C 1
TA= –55 ° C to 125 ° C 0.35
TA= –55 ° C to 125 ° C 0.8
TA= –55 ° C to 125 ° C 12
TA= –55 ° C to 125 ° C 2
V
= 15 V 20 30 20 24
CC
V
= 5 V 6 12 6 10
CC
V
= 15 V 18 26 18 20
CC
V
= 5 V 4 10 4 8
CC
(1) This parameter influences the maximum value of the timing resistors R and RBin the circuit of Figure 1 . For example, when V
the maximum value is R = RA+ RB≈ 3.4 M Ω , and for V
= 15 V, the maximum value is ≈ 10 M Ω .
CC
NE556 SE556
SA556
MIN TYP MAX MIN TYP MAX
30 250 30 250 nA
4.5 5 5.6 4.8 5 5.2
1.1 1.67 2.2 1.45 1.67 1.9
0.3 0.7 1 0.3 0.7 1
0.1 0.4 0.1 0.4
20 100 20 100 nA
9 10 11 9.6 10 10.4
2.6 3.3 4 2.9 3.3 3.8
0.1 0.25 0.1 0.15
0.4 0.75 0.4 0.5
2 2.5 2 2.2
0.1 0.25 0.1 0.15
12.75 13.3 13 13.3
2.75 3.3 3 3.3
V
V
V
= 5 V,
CC
4
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Page 5
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NA556 , NE556 , SA556 , SE556
DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
Operating Characteristics
V
= 5 V and 15 V
CC
NA556
NE556 SE556
SA556
MIN TYP MAX MIN TYP MAX
1 3 0.5 1.5
2.25% 1.5%
50 30 100
150 90
0.1 0.5 0.05 0.2
0.3 0.15
(4)
(4)
(4)
(4)
(4)
CONDITIONS
TA= 25 ° C
TEST
(1)
Initial error of timing
interval
PARAMETER UNIT
Each timer,
monostable
(2)
Each timer, astable
(3)
(5)
Timer 1 – Timer 2 ± 1 ± 0.5
Temperature
coefficient of timing TA= MIN to MAX ppm/ ° C
interval
monostable
Each timer, astable
Each timer,
(3)
(5)
Timer 1 – Timer 2 ± 10 ± 10
Supply voltage
sensitivity of timing TA= 25 ° C %/V
interval
monostable
Each timer, astable
Each timer,
(3)
(5)
Timer 1 – Timer 2 ± 0.2 ± 0.1
Output-pulse rise time 100 300 100 200
Output-pulse fall time 100 300 100 200
CL= 15 pF,
TA= 25 ° C
CL= 15 pF,
TA= 25 ° C
ns
ns
(1) For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions.
(2) Timing-interval error is defined as the difference between the measured value and the average value of a random sample from each
process run.
(3) Values specified are for a device in a monostable circuit similar to Figure 2 , with the following component values: RA= 2 k Ω to 100 k Ω ,
C = 0.1 µ F.
(4) On products compliant to MIL-PRF-38535, this parameter is not production tested.
(5) Values specified are for a device in an astable circuit similar to Figure 1 , with the following component values: RA= 1 k Ω to 100 k Ω ,
C = 0.1 µ F.
Submit Documentation Feedback
5
Page 6
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R
A
R
L
OUT
V
CC
(5V to 15V)
V
CC
CONT
RESET
DISCH
THRES
TRIG
GND
OUT
Input
0.01 µF
C
R
B
C
R
A
Open
(see Note A)
R
L
OUT
V
CC
(5V to 15V)
V
CC
CONT
RESET
DISCH
THRES
TRIG
GND
OUT
NOTE A:
Bypassing the control-voltage input to ground with a
capacitor might improve operation.This should be evaluated
for individual applications.
NA556 , NE556 , SA556 , SE556
DUAL PRECISION TIMERS
SLFS023G – APRIL 1978 – REVISED JUNE 2006
Figure 1. Circuit for Astable Operation Figure 2. Circuit for Monostable Operation
APPLICATION INFORMATION
6
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Page 7
PACKAGE OPTION ADDENDUM
www.ti.com
PACKAGING INFORMATION
Orderable Device Status
JM38510/10902BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510
M38510/10902BCA ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 JM38510
NA556D ACTIVE SOIC D 14 50 Green (RoHS
NA556DR ACTIVE SOIC D 14 2500 Green (RoHS
NA556N ACTIVE PDIP N 14 25 Green (RoHS
NE556D ACTIVE SOIC D 14 50 Green (RoHS
NE556DBR ACTIVE SSOP DB 14 2000 Green (RoHS
NE556DR ACTIVE SOIC D 14 2500 Green (RoHS
NE556DRE4 ACTIVE SOIC D 14 2500 Green (RoHS
NE556DRG4 ACTIVE SOIC D 14 2500 Green (RoHS
NE556N ACTIVE PDIP N 14 25 Green (RoHS
NE556NE4 ACTIVE PDIP N 14 25 Green (RoHS
NE556NSR ACTIVE SO NS 14 2000 Green (RoHS
SA556N ACTIVE PDIP N 14 25 Green (RoHS
SA556NE4 ACTIVE PDIP N 14 25 Green (RoHS
SE556J ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 SE556J
Package Type Package
(1)
Drawing
Pins Package
Qty
Eco Plan
(2)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
& no Sb/Br)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
NIPDAU Level-1-260C-UNLIM -40 to 105 NA556
NIPDAU Level-1-260C-UNLIM -40 to 105 NA556
NIPDAU N / A for Pkg Type -40 to 105 NA556N
NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NIPDAU Level-1-260C-UNLIM 0 to 70 N556
NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NIPDAU N / A for Pkg Type 0 to 70 NE556N
NIPDAU N / A for Pkg Type 0 to 70 NE556N
NIPDAU Level-1-260C-UNLIM 0 to 70 NE556
NIPDAU N / A for Pkg Type -40 to 85 SA556N
NIPDAU N / A for Pkg Type -40 to 85 SA556N
6-Feb-2020
Samples
(4/5)
/10902BCA
/10902BCA
SE556JB ACTIVE CDIP J 14 1 TBD Call TI N / A for Pkg Type -55 to 125 SE556JB
Addendum-Page 1
Page 8
PACKAGE OPTION ADDENDUM
www.ti.com
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
6-Feb-2020
Addendum-Page 2
Page 9
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2018
TAPE AND REEL INFORMATION
*All dimensions arenominal
Device Package
NA556DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
NE556DR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
NE556NSR SO NS 14 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
Type
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm)B0(mm)K0(mm)P1(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
Page 10
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Dec-2018
*All dimensions arenominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
NA556DR SOIC D 14 2500 367.0 367.0 38.0
NE556DR SOIC D 14 2500 367.0 367.0 38.0
NE556NSR SO NS 14 2000 367.0 367.0 38.0
Pack Materials-Page 2
Page 11
Page 12
PACKAGE OUTLINE
12X .100
[2.54]
PIN 1 ID
(OPTIONAL)
1
14
A
-.785.754
-19.9419.15[ ]
SCALE 0.900
4X .005 MIN
14X -.065.045
[0.13]
-1.651.15[ ]
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
TYP-.060.015
-1.520.38[ ]
14X -.026.014
-0.660.36[ ]
.010 [0.25] C A B
7
B -.283.245
AT GAGE PLANE
NOTES:
1. All controlling linear dimensions are in inches. Dimensions in brackets are in millimeters. Any dimension in brackets or parenthesis are for
reference only. Dimensioning and tolerancing per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This package is hermitically sealed with a ceramic lid using glass frit.
4. Index point is provided on cap for terminal identification only and on press ceramic glass frit seal only.
5. Falls within MIL-STD-1835 and GDIP1-T14.
0
-7.196.22[ ]
-.314.308
-7.977.83[ ]
-15
TYP
8
.015 GAGE PLANE
[0.38]
14X .008-.014
[0.2-0.36]
.2 MAX TYP
[5.08]
C
.13 MIN TYP
[3.3]
SEATING PLANE
4214771/A 05/2017
www.ti.com
Page 13
SEE DETAIL A
(.300 ) TYP
[7.62]
EXAMPLE BOARD LAYOUT
CDIP - 5.08 mm max heightJ0014A
CERAMIC DUAL IN LINE PACKAGE
SEE DETAIL B
12X (.100 )
[2.54]
14X ( .039)
[1]
1
7
SYMM
LAND PATTERN EXAMPLE
NON-SOLDER MASK DEFINED
SCALE: 5X
14
SYMM
8
MAX.002
[0.05]
ALL AROUND
(R.002 ) TYP
[0.05]
(.063)
[1.6]
DETAIL A
SCALE: 15X
SOLDER MASK
OPENING
METAL
www.ti.com
METAL
SOLDER MASK
OPENING
( .063)
[1.6]
.002 MAX
[0.05]
ALL AROUND
DETAIL B
13X, SCALE: 15X
4214771/A 05/2017
Page 14
Page 15
Page 16
Page 17
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**) PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,65
28
1
2,00 MAX
0,38
0,22
15
14
A
0,05 MIN
0,15
5,60
5,00
M
8,20
7,40
Seating Plane
0,10
0,25
0,09
0°–ā8°
Gage Plane
0,25
0,95
0,55
PINS **
DIM
A MAX
A MIN
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
14
6,50
6,50
5,905,90
2016
7,50
6,90
24
8,50
28
10,50
9,907,90
30
10,50
9,90
38
12,90
12,30
4040065 /E 12/01
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
Page 18
Page 19
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