The NE/SE5539 is a very wide bandwidth, high slew rate, monolithic
operational amplifier for use in video amplifiers, RF amplifiers, and
extremely high slew rate amplifiers.
Emitter-follower inputs provide a true differential input impedance
device. Proper external compensation will allow design operation
over a wide range of closed-loop gains, both inverting and
non-inverting, to meet specific design requirements.
FEA TURES
•Bandwidth
– Unity gain - 350MHz
– Full power - 48MHz
– GBW - 1.2GHz at 17dB
•Slew rate: 600/Vµs
•A
: 52dB typical
VOL
•Low noise - 4nV√Hz typical
•MIL-STD processing available
APPLICA TIONS
•High speed datacom
•Video monitors & TV
PIN CONFIGURA TION
D, F, N Packages
OS
A
V
NC
NC
ADJ
ADJ
NC
1
2
3
4
5
/
6
7
+ INPUT
-V
SUPPLY
V
GROUND
Top View
Figure 1. Pin Configuration
•Satellite communications
•Image processing
•RF instrumentation & oscillators
•Magnetic storage
•Military communications
+–
14
- INPUT
13
NC
FREQUENCY
12
COMPENS.
NC
11
10
+V
9
NC
8
OUTPUT
SL00570
ORDERING INFORMATION
DESCRIPTIONTEMPERATURE RANGEORDER CODEDWG #
14-Pin Plastic Dual In-Line Package (DIP)0 to +70°CNE5539NSOT27-1
14-Pin Plastic Small Outline (SO) package0 to +70°CNE5539DSOT108-1
14-Pin Ceramic Dual In-Line Package0 to +70°CNE5539F0581B
14-Pin Ceramic Dual In-Line Package-55 to +125°CSE5539F0581B
ABSOLUTE MAXIMUM RATINGS
SYMBOL
V
CC
P
DMAX
T
A
T
STG
T
J
T
SOLD
NOTES:
1. Differential input voltage should not exceed 0.25V to prevent excesive input bias current and common-mode voltage 2.5V. These voltage
limits may be exceeded if current is limited to less than 10mA.
2. Derate above 25°C, at the following rates:
Supply voltage±12V
Maximum power dissipation,
= 25°C (still-air)
T
A
F package
N package
D package
Operating temperature range
NE
SE
Storage temperature range-65 to +150°C
Max junction temperature150°C
Lead soldering temperature (10sec max)+300°C
F package at 9.3mW/°C
N package at 11.6mW/°C
D package at 7.9mW/°C
VCC = ±6V, RL = 150Ω to GND and 390Ω to -VCC, unless otherwise specified.
Gain bandwidth productACL = 7700
Small signal bandwidthACL = 2
t
Settling timeACL = 2
S
SRSlew rateACL = 2
t
Propagation delayACL = 2
PD
Full power responseACL = 2
NOTES:
1. External compensation.
1
1
1
1
1
12001200MHz
110110MHz
1515ns
600600V/µs
77ns
4848MHz
2020MHz
SE5539
MINTYPMAX
120
23ns
330V/µs
4.5ns
20MHz
z
TYPICAL PERFORMANCE CURVES
NE5539 Open-Loop Phase
0
90
180
PHASE (DEG)
270
360
1 MHz10MHz100MHz1GHz
FREQUENCY (Hz)
Figure 3. NE5539 Open-Loop Phase
1992 Apr 15
SL00572
NE5539 Open-Loop Gain
60
50
40
30
GAIN (dB)
20
10
0
1 MHz10MHz100MHz1GHz
FREQUENCY (Hz)
SL00573
Figure 4. NE5539 Open-Loop Gain
5
Page 6
Philips SemiconductorsProduct specification
NE/SE5539High frequency operational amplifier
TYPICAL PERFORMANCE CURVES (Continued)
Power Bandwidth (SE)Power Bandwidth (NE)
4
5
3
4
3dB B.W
3
p–p OUTPUT (V)
GAIN (—2)
= +8V
V
2
1
CC
= 2kΩ
R
L
1 MHz10MHz100MHz300Mhz
FREQUENCY (Hz)
2
p–p OUTPUT (V)
1
0
1 MHz10MHz100MHz300Mhz
VCC = +6V
= 150kΩ
R
L
GAIN (—2)
3dB B.W.
FREQUENCY (Hz)
SE5539 Open-Loop Gain vs FrequencyPower Bandwidth
50
40
30
VCC = +6V
20
GAIN (dB)
10
o
0
1 MHz10MHz100MHz300Mhz
R
= 126Ω
L
FREQUENCY (Hz)
SE5539 Open-Loop Phase vs FrequencyGain Bandwidth Product vs Frequency
0°
45°
90°
PHASE (DEG)
135°
180°
VCC = ±6V
RL = 126Ω
1MHz10MHz100MHz
FREQUENCY (Hz)
300MHz
REF
3.04V
P-P
–2
–4
–6
–8
dB BELOW REF
–10
–12
22
20
18
GAIN (dB)
16
14
12
GAIN (–7)
RL = 150Ω
1MHz10MHz100MHz
A
= X10
V
AV = X7.5
1MHz10MHz100MHz
FREQUENCY (Hz)
3dB BANDWIDTH
3dB BANDWIDTH
FREQUENCY (Hz)
300MHz
VCC = ±6V
RL = 150Ω
300MHz
NOTE:
1992 Apr 15
Indicates typical
distribution –55°C ≤ T
≤ 125°C
A
SL00574
Figure 5. Typical Performance Curves
6
Page 7
Philips SemiconductorsProduct specification
NE/SE5539High frequency operational amplifier
CIRCUIT LAYOUT CONSIDERATIONS
As may be expected for an ultra-high frequency, wide-gain
bandwidth amplifier, the physical circuit is extremely critical.
OPTIONAL
OFFSET
+V–V
R1 = 75Ω 5% CARBON
= 75Ω 5% CARBON
R
2
R
= 75Ω 5% CARBON
3
= 36K 5% CARBON
R
4
ADJ.
R
5
R
4
R
1
75
V
IN
R
2
75
Bread-boarding is not recommended. A double-sided copper-clad
printed circuit board will result in more favorable system operation.
An example utilizing a 28dB non-inverting amp is shown in Figure 6.
R
F
1nF
+V
RFC
–14
NE5539
7
+1
RFC
—V
R5 = 20k TRIMPOT (CERMET)
R
= 1.5k (28dB GAIN)
F
R6 = 470Ω 5% CARBON
1nF
10
8
470
3
1nF
1nF
75
R
3
R
6
V
OUT
RFC 3T # 26 BUSS WIRE ON
FERROXCUBE VK 200 09/3B CORE
BYPASS CAPACITORS
1nF CERAMIC
(MEPCO OR EQUIV.)
75
TERM
Ω
Top Plane Copper
(Component Side)
1
Component Side
(Component Layout)
—V
RFC
X
R
2
(1)
X
V
IN
XX
X
X
R
5
R
6
R
4
X
X
XX
R
Bottom Plane
X
R
1
+V
X
C
C
RFC
R
F
5
Copper
1
SL00575
Figure 6. 28dB Non-Inverting Amp Sample PC Layout
1992 Apr 15
7
Page 8
Philips SemiconductorsProduct specification
NE/SE5539High frequency operational amplifier
NE5539 COLOR VIDEO AMPLIFIER
The NE5539 wideband operational amplifier is easily adapted for
use as a color video amplifier. A typical circuit is shown in Figure 7
along with vector-scope1 photographs showing the amplifier
differential gain and phase response to a standard five-step
modulated staircase linearity signal (Figures 8, 9 and 10). As can
be seen in Figure 9, the gain varies less than 0.5% from the bottom
to the top of the staircase. The maximum differential phase shown
in Figure 10 is approximately +0.1°.
The amplifier circuit was optimized for a 75Ω input and output
termionation impedance with a gain of approximately 10 (20dB).
NOTE:
1. The input signal was 200mV and the output 2V . V
750
75
—
V
IN
+
75
—V
22nF
14
10
8
3
7
1
—V
22nF
1
75
470
—V
was ±8V.
CC
6dB LOSS—1
Z
= 75Ω
O
75
SL00578
Figure 9. Differential Gain <0.5%
NOTE:
Instruments used for these measurements were Tektronix 146
NTSC test signal generator, 520A NTSC vectorscope, and 1480
waveform monitor.
and include allowance for glass overrun and meniscus
on the seal line, and lid to base mismatch.
constrained to be perpendicular to plane T.
shown in parentheses.
NOTES:
1. Controlling dimension: Inches. Millimeters are
2. Dimension and tolerancing per ANSI Y14. 5M-1982.
3. “T”, “D”, and “E” are reference datums on the body
0.110 (2.79)
0.050 (1.27)
0.286 (7.26)
0.245 (6.22)
counterclockwise to Pin #14 when viewed
from the top.
4. These dimensions measured with the leads
5. Pin numbers start with Pin #1 and continue
(NOTE 4)
0.320 (8.13)
0.290 (7.37)
0.175 (4.45)
0.145 (3.68)
0.200 (5.08)
0.165 (4.19)
0.045 (1.143)
0.020 (0.51)
0.165 (4.19)
0.125 (3.18)
BSC
(NOTE 4)
0.300 (7.62)
0.010 (0.254)TED
0.395 (10.03)
0.300 (7.62)
0.015 (0.38)
0.010 (0.25)
853-0581B 06688
April 15, 1992
0.110 (2.79)
0.050 (1.27)
– E –
0.100 (2.54) BSC
PIN # 1
0.785 (19.94)
0.753 (19.13)
– D –
0.070 (1.78)
0.050 (1.27)
12
0.023 (0.58)
0.015 (0.38)
PLANE
SEATING
– T –
Page 13
Philips SemiconductorsProduct specification
NE/SE5539High frequency operational amplifier
DEFINITIONS
Data Sheet IdentificationProduct StatusDefinition
Objective Specification
Preliminary Specification
Product Specification
Formative or in Design
Preproduction Product
Full Production
Philips Semiconductors and Philips Electronics North America Corporation reserve the right to make changes, without notice, in the products,
including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright,
or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified. Applications that are described herein for any of these products are for illustrative purposes
only. Philips Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing
or modification.
LIFE SUPPORT APPLICA TIONS
Philips Semiconductors and Philips Electronics North America Corporation Products are not designed for use in life support appliances, devices,
or systems where malfunction of a Philips Semiconductors and Philips Electronics North America Corporation Product can reasonably be expected
to result in a personal injury. Philips Semiconductors and Philips Electronics North America Corporation customers using or selling Philips
Semiconductors and Philips Electronics North America Corporation Products for use in such applications do so at their own risk and agree to fully
indemnify Philips Semiconductors and Philips Electronics North America Corporation for any damages resulting from such improper use or sale.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Sunnyvale, California 94088–3409
Telephone 800-234-7381
This data sheet contains the design target or goal specifications for product development. Specifications
may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips
Semiconductors reserves the right to make changes at any time without notice in order to improve design
and supply the best possible product.
This data sheet contains Final Specifications. Philips Semiconductors reserves the right to make changes
at any time without notice, in order to improve design and supply the best possible product.
Philips Semiconductors and Philips Electronics North America Corporation
register eligible circuits under the Semiconductor Chip Protection Act.
Copyright Philips Electronics North America Corporation 1992
All rights reserved. Printed in U.S.A.
April 15, 1992
13
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