Datasheet ne1619 DATASHEETS (Philips)

Page 1
INTEGRATED CIRCUITS
NE1619
HECETA 4 Temperature and voltage monitor
Product specification 2000 Jul 13
 
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Philips Semiconductors Product specification

GENERAL DESCRIPTION

The NE1619 is designed for monitoring the temperatures and supply voltages of microprocessor-based systems by measuring those parameters and comparing the readings with programmable limits. The device provides five possible analog inputs, a remote temperature sensor input and on-board local temperature sensor. The device also monitors its own power supply and provides digital inputs for the Pentium/PRO power supply ID code.
The device communicates with the system controller via an SMBus (System Management bus) by which it can be programmed for operation and data collection. Readings come from conversions of the on-board A-to-D converter which cycles through all measurements in sequence in approximately one second when the conversion is started. The device includes a number of registers to store data of the device configuration, status, readings and limits. Except for the temperature-related data which are in 8-bit digital
2’s complement format, all the data are in 8-bit digital straight format.

FEA TURES

•Monitor local and remote temperatures
•Temperature accuracy of ±2 °C for local, and ±3 °C for remote
channel
•Temperature resolution of 1 °C
•2.8 V to 5.5 V supply range
•Monitor different power supplies: 12 V, 5 V, 3.3 V, 2.5 V, V
•V
accuracy of ±2% of full scale
IN
CCP, VDD
•Differential non-linearity of ±1LSB
•No calibration required
•Programmable temperature and voltage limits for alarms
•Programmable Reset low state pulse output
•SMBus 2-wire serial interface
•Small 16-lead QSOP package
•Compatible with Intel “Heceta 4” specification and reference
designs utilizing it

APPLICATIONS

•System thermal and hardware monitor
•Desktop computers
•Notebook computers
•Industrial controllers
•T elecom equipment

ORDERING INFORMATION

PART NUMBER PACKAGE DRAWING NUMBER
NE1619 16-lead QSOP package SOT519-1
2000 Jul 13 853-2202 24122
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
PINNING Pin Configuration
16SDA 15 14 13 12 11 10
SL01228
A0/RESET
/NTEST_OUT
V
CCPVIN
2.5V
IN
3.3V
IN
5V
IN
12VIN/VID4 D+ D–/NTEST_IN
V
DD
1 2
SCL
3
GND
4
/3.3VSB
5
VID0
6
VID1
7
VID2
89
VID3

Pin Description

PIN # SYMBOL FUNCTION DESCRIPTION
1 SDA Digital I/O. SMBus serial bi-directional data. Open-drain output. 2 SCL Digital Input. SMBus serial clock input. 3 GND Ground. To be connected to system ground. 4 VDD/3.3VSB Power supply. Can be connected to +3.3 V standby power if monitoring in low power states is
5 VID0 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status
6 VID1 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 7 VID2 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 8 VID3 Digital Input. For Voltage ID readouts from the processor. This value is read into the VID status register. 9 D–/NTEST_IN Analog/Digital Input. This pin is connected to the negative terminal of the remote temperature sensor for
10 D+ Analog Input. This pin is connected to the positive terminal of the remote temperature sensor. 11 12VIN/VID4 Analog/Digital Input. Defaults at power-up to analog input for monitoring the +12 V supply. This pin is
12 5V 13 3.3V 14 2.5V 15 V
IN
IN IN
CCPVIN
16 A0/RESET/NTEST_IN Digital I/O. At power-up, the logic input of this pin defines the LSB bit of the device slave address.
required. This pin also serves as the analog input to monitor the VDD voltage level.
register (LSB bit).
analog input. If this pin is held high at power-up, for digital input, it enables the NAND-TREE test mode.
programmable to be a digital input for voltage ID readouts from the processor. Its state is read into the
VID4 status register. Analog Input. For monitoring the +5 V supply. Analog Input. For monitoring the +3.3 V supply. Analog Input. For monitoring the +2.5 V supply. Analog Input. For monitoring the processor voltage supply (0 to 3.0 V)
This pin can be configured to give a low pulse reset output of 20ms minimum. This pin also functions as the output in the NAND–TREE test mode.
2000 Jul 13
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor

FUNCTIONAL BLOCK DIAGRAM

D+ D-/
NTEST_IN
GND
VDD
V
CCVIN
2.5 VIN
3.3 VIN 5 VIN
12 VIN/
VID4
Local Temp
Sensor
Temp
Mux
A-to-D
Converter
Voltage
Mux
Vin
Attenuators
Switch
Vid4
Register
Control
Logic
Local Temp
RDG Register
Remote Temp RDG Register
VDD Reading
Register
VCCP Reading
Register
2.5 V Reading Register
3.3 V Reading Register
5 V Reading
Register
12 V Reading
Register
SMBus Interface
Configuration
Register
Local Temp
HL Register
Remote Temp
HL Register
VDD HL Register
VCCP HL
Register
2.5 V HL Register
3.3 V HL Register
5 V HL
Register
12 V HL Register
Command
Pointer Register
Local Temp LL Register
Remote Temp
LL Register
VDD LL
Register
VCCP LL
Register
2.5 V LL Register
3.3 V LL Register
5 V LL
Register
12 V LL
Register
Address Decoder
and Register
Status
Register 1
Status
Register 2
Company #
Register
Step Version
Register
Test
Register
Reset Pulse
Circuit
VID 0-3
Register
NTEST
Circuit
A0/
Reset #/
NTEST_OUT
VID3 VID2 VID1
VID0
2000 Jul 13
SCL
SDA
SL01229
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor

TYPICAL OPERATING CIRCUIT

Remote Sensor:
V
DD
SMBus
:
CLOCK DATA
Selectable A0/RESET/NTEST_OUT
Ground
µP On-Board PNP Transistor
See Note 1
or Discrete NPN Transistor
0.1 uF
10
10 k 10 k 100 k
4
2 1
9
16
System Power
Supplies
V
CCP
2.5 V
3.3 V
5.0 V
12.0 V
1. May be required in noisy environment, about 1 nF
15 14 13 12
11
NE1619
5 6 7 8
3
Ground
Processor Voltage
ID Code: VID0 VID1 VID2 VID3 VID4
SL01230

ABSOLUTE MAXIMUM RATINGS

PARAMETER MIN. MAX. UNIT
VDD to GND –0.3 6 V 12VIN to GND –0.3 18 V 5VIN, 3.3VIN, 2.5VIN, V Other pins to GND –0.3 VDD+0.3 V Input current at any pin –5 5 mA Package input current –20 20 mA Operating temperature range 0 +120 °C Maximum junction temperature +150 °C Storage temperature range –65 +150 °C
to GND –0.3 6 V
CCP
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
Temp Error vs PC Board Track Resistance
20 15 10
–5 –10 –15 –20 –25
Remote Temp Error(deg. C)
–30
FROM D+ PIN TO GND
5 0
FROM D+ PIN TO VDD
1 10 100
Leakage Resistance (Mohm)
Figure 1. Temp Error vs PC Board Track Resistance
Temp Error vs D+D– Capacitance
0 –1 –2 –3 –4 –5 –6 –7 –8 –9
Temperature Error (deg. C)
–10
1 2.2 3.3 4.7 6.8 10 22 33 47
D+ to D– Capacitance (nF)
SL01245
SL01244
Standby Current vs Supply Voltage
100
80
60
40
20
Stdby Supply Current (uA)
0
0123456
Supply Voltage (V)
Figure 3. Standby Current vs Supply Voltage
Standby Current vs Temperature
50
40
30
20
10
Stdby Supply Current (uA)
0
–50 –25 0 25 50 75 100 125
VDD = 5.0V
VDD= 3.8V
VDD= 3.3V VDD= 2.8V
Temperatures (deg. C)
SL01243
SL01242
2000 Jul 13
Figure 2. Temp Error vs D+D– Capacitance
Figure 4. Standby Current vs Temperature
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
Standby Supply Current vs SCLK Frequency
250
200
150
100
VDD=5V
50
Stdby Supply Current (uA)
0
1K 10K 100K 1000K
SCLK Frequency (Hz)
VDD=3.3V
Figure 5. Standby Current vs SCLK Frequency
Remote Temp Error vs Common–Mode
Noise Frequency
30
NOISE IS AC COUPLED TO D– PINS
25 20 15 10
5 0
–5
Temperature Error (deg. C)
–10
1K 10K 100K 1000K 10000K 100000K
NOISE=100MVPP
Noise Frequency (Hz)
NOISE=50MVPP
Figure 6. Temp Error vs Common Mode Noise
SL01246
SL01241
Remote Temp Error vs Differential–Mode
Noise Frequency
10
9
NOISE=10MVP–P SQ.WAVE
8
APPLIED BETWEEN D+ & D– PINS
7 6 5 4 3 2 1 0
Temperature Error (deg. C)
–1
1K 10K 100K 1000K 10000K 100000K
Noise Frequency (Hz)
SL01240
Figure 7. Temp error vs Different Mode Noise Frequency
Relationship Between Temperature
and Temp Reading
125
100
75
50
25
Temp Reading (Decimal)
0
0 25 50 75 100 125
Temperature (deg. C)
SL01247
Figure 8.
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Philips Semiconductors Product specification
TAIInternal temperature accurac
TAEExternal temperature accurac
ISRemote source current
NE1619HECETA4 Temperature and voltage monitor

DC ELECTRICAL CHARACTERISTICS

VDD = 3.3 V, T
SYMBOL
V
DD
I
DD
I
DD
t
C
T
R
Voltage-to-Digital converter (12VIN, 5VIN, 3.3VIN, 2.5VIN, V
VUE Unadjusted error ±2.0 %FS VDNL Dif ferential non-linearity error ±1.0 LSB VRIN VIN input resistance 100 200 kΩ VPSS VIN power supply sensitivity ±1.0 %/V
Digital output (SDA, A02)
V
OH
V
OL
I
OH
SMB digital input voltages (SDA, SCL)
V
IH
V
IL
Digital input voltages (A0, VID0–4, NT_IN3)
V
IH
V
IL
Digital input current (all digital inputs)
I
IH
I
IL
C
IN
NOTES:
1. Total monitoring cycle time includes all temperature conversions and all voltage conversions.
2. When A0 is selected as output in NAND-TREE test mode.
3. When D– is selected as input in NAND-TREE test mode.
= 0°C to +120°C unless otherwise specified.
amb
PARAMETER CONDITION MIN. TYP. MAX. UNIT
Supply voltage 2.8 3.3 5.5 V Supply current Standby mode 100 µA Supply current Operating mode 250 500 µA Total monitoring cycle time
1
All conversions 0.25 0.50 sec
T emperature resolution Local and Remote ±1.0 °C
T
= 25°C ±2.0 °C
p
p
y
y
amb
T
= 0°C to +120°C ±3.0 °C
amb
T
= 25°C ±3.0 °C
amb
T
= 0°C to +120°C ±5.0 °C
amb
High level 100 µA Low level 10 µA
, VDD)
CCP
Output High voltage I Output Low voltage I Output High leakage current V
Input High voltage 0.6V Input Low voltage 0.3V
= –3.0 mA, VDD = 2.8 V 2.4 V
OUT
= 3.0 mA, VDD = 3.8 V 0.4 V
OUT
OUT
= V
DD
0.1 10.0 µA
DD DD
Input High voltage 2.0 V Input Low voltage 0.4 V
Input High current VIN = V
DD
–1.0 µA Input Low current VIN = GND 1.0 µA Input capacitance 20.0 pF
V V
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor

SMBUS INTERFACE AC CHARACTERISTICS

VDD = 3.3 V, T
SYMBOL
t
SCL
t
BUF
t
LOW
t
HIGH
t
SU:STA
t
HD:STA
t
SU:STO
t
SU:DAT
t
HD:DAT
t
F
NOTE:
1. These specifications are guaranteed by design and not tested in production.
= 0°C to +120°C unless otherwise specified.
amb
PARAMETER CONDITION MIN. TYP. MAX. UNIT
SCL clock frequency 400 kHz SMBus free time 4.7 µs SCL Low time 4.7 µs SCL High time 4.0 µs Start setup time 100 ns Start hold time 100 ns Stop setup time 4.0 µs Data setup time 250 ns Data hold time 0 ns Fall time 1.0 µs

TIMING DIAGRAM

SCL
SDA
S: Start Condition P: Stop Condition
t
HIGH
t
SU:DAT
t
SU:STA
t
F
t
HD:STA
t
BUF
t
LOW
t
HD:DAT
PS PS
t
SU:STO
SL01231
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
Table 1. List of registers
NAME COMMAND OR ADDRESS R/W POR STATE DESCRIPTION
CR 40h R/W 0000 1000 Configuration register SR1 41h Read only 0000 0000 Status register #1 SR2 42h Read only 0000 0000 Status register #2 VID 47h Read only 0000 xxxx VID register, xxxx = VID3–VID0 VID4 49h Read only 1000 000x VID4 register, x = VID4 CID 3Eh Read only TBD Company number SID 3Fh Read only TBD Stepping version number TEST 15h R/W N/A Manufacturer test register
2.5VR 20h Read only N/A 2.5VIN reading register VCCPR 21h Read only N/A V
3.3VR 22h Read only N/A 3.3VIN reading register 5VR 23h Read only N/A 5VIN reading register 12VR 24h Read only N/A 12VIN reading register VDDR 25h Read only N/A VDD reading register ETR 26h Read only N/A External or remote temperature reading register ITR 27h Read only N/A Internal or local temperature reading register
2.5VHL 2Bh R/W 0000 0000 2.5VIN high limit register
2.5VLL 2Ch R/W 0000 0000 2.5VIN low limit register VCCPHL 2Dh R/W 0000 0000 V VCCPLL 2Eh R/W 0000 0000 V
3.3VHL 2Fh R/W 0000 0000 3.3VIN high limit register
3.3VLL 30h R/W 0000 0000 3.3VIN low limit register 5VHL 31h R/W 0000 0000 5VIN high limit register 5VLL 32h R/W 0000 0000 5VIN low limit register 12VHL 33h R/W 0000 0000 12VIN high limit register 12VLL 34h R/W 0000 0000 12VIN low limit register VDDHL 35h R/W 0000 0000 V VDDLL 36h R/W 0000 0000 V ETHL 37h R/W 0000 0000 External or remote temperature high limit register ETLL 38h R/W 0000 0000 External or remote temperature low limit register ITHL 39h R/W 0000 0000 Internal or local temperature high limit register ITLL 3Ah R/W 0000 0000 Internal or local temperature low limit register
reading register
CCPVIN
high limit register
CCPVIN
low limit register
CCPVIN
high limit register
DDVIN
low limit register
DDVIN
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
Table 2. Configuration Register (CR, 40h, default = 0000 1000)
BIT NAME R/W DESCRIPTION
0 START R/W Logic 1 enables startup of monitor device, logic 0 places the device in standby mode.
1 Reserved Read Power-up default = 0. 2 Reserved Read Power-up default = 0. 3 Reserved Read Power-up default = 1. 4 RESET R/W Setting this bit generates a minimum 20ms low pulse on the Reset pin, if the reset
5 12VIN/VID4
SELECT 6 Reserved Read Power–up default = 0. 7 Initialization R/W Logic 1 restores power–up default values to the configuration register and the status
R/W Selects whether pin 11 acts as a 12 volt analog input monitoring pin, or as a VID[4] input.
Table 3. Status Register 1 (SR1, 41h, default = 0000 0000)
BIT NAME R/W DESCRIPTION
0 +2.5V_ERROR Read A one indicates 2.5VIN High or Low limit has been exceeded.
Power–up default = 0. At startup, limit checking functions and scanning begins. Note, all High and Low limits
should be set into the ASIC prior turning on this bit.
function is enabled. Power-up default = 0.
This pin defaults to the 12 volt analog input. Power–up default = 0.
registers. This bit automatically clears itself. Power–up default = 0.
1 VCCP_ERROR Read A one indicates V 2 +3.3V_ERROR Read A one indicates 3.3VIN High or Low limit has been exceeded. 3 +5V_ERROR Read A one indicates 5VIN High or Low limit has been exceeded. 4 Internal Temp Error Read A one indicates internal or local temp High or Low limit has been exceeded. 5 External Temp Error Read A one indicates external or remote temp High or Low limit has been exceeded. 6 Reserved Read 7 Reserved Read
High or Low limit has been exceeded.
CCPVIN
Table 4. Status Register 2 (SR2, 42h, default = 0000 0000)
BIT NAME R/W DESCRIPTION
0 +12V_ERROR Read A one indicates 12VIN High or Low limit has been exceeded. 1 VDD_ERROR Read A one indicates VDD High or Low limit has been exceeded. 2 Reserved Read Undefined. 3 Reserved Read Undefined. 4 Reserved Read Undefined. 5 Reserved Read Undefined. 6 Remote Diode Fault Read A one indicates either a short or open circuited fault on the remote thermal diode inputs. 7 Reserved Read Undefined.
Table 5. VID (VID, 47h, default = 0000 VID[3:0] )
BIT NAME R/W DESCRIPTION
0–3 VID[0:3] Read The VID[0:3] inputs from Pentium/PRO power supplies ID to indicate the operating
4–6 Reserved Read Undefined.
7 RESET ENABLE Read When set to 1, enables the RESET pin output function.
voltage (e.g. 1.5V to 2.9V). Power–up default = VID[0:3].
This bit defaults to 0 at Power–up and enables addressing function.
Table 6. VID4 (VID4, 49h, default = 1000 000VID[4] )
BIT NAME R/W DESCRIPTION
0 VID4 Read VID4 input, if selected, from Pentium/PRO power supplied ID.
1–7 Reserved Read Power-up default = 1000 000
2000 Jul 13
Power–up default = 0 and pin 11 is not selected for VID4.
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
FUNCTIONAL DESCRIPTION SMBus serial interface
The NE1619 can be connected to a compatible 2-wire serial interface SMBus as a slave device under the control of a master device or controller, using two device terminals SCL and SDA. The controller will provide a clock signal to the device SCL pin and write/read data to/from the device through the SDA pin.
Data of 8-bit digital byte or word are used for communication between the controller and the device.
Notice that external pull-up resistors, about 10 kΩ, are needed for the two terminals SCL and SDA.

Slave address

The NE1619 slave address on the SMBus is defined by the hardware connection applied to the device pin 16. At power-up this pin is automatically reset to its address sensing function A0. This logic input will set up the value of the LSB bit of the 7-bit address. Because A0 is a two-level digital input and the other 6 bits of the address are predefined to 010110, only two slave addresses can be used as listed below for the device:
Table 7.
A0 connection (Pin 16) Slave address
GND 0101 100
V
DD
0101101
Because all limit registers are reset to zero, writing limits into the limits registers should usually be the first action to be performed after power-on reset.

Initialization

Initialization or software reset of the NE1619 can be initiated by setting bit 7 of the configuration register. This bit automatically clears itself after being set. The initialization performs a similar reset function to power-on reset, except that the reading and limit registers are not reset.

Starting conversion

The NE1619 monitoring function is started by setting (to 1) the STAR T bit (bit 0) of the configuration register. The device then performs a loop of monitoring about every second. In monitoring function, the device cycles sequentially through all measurements of temperatures and voltages and also performs the comparisons between readings and limits accordingly. The inputs are sampled in this order: Remote diode temperature, Local temperature, V 12V
, 5VIN. 3.3V
IN
Measured values are stored in reading registers and results of limit comparison are reflected by the state of the flag bits in the status registers. Reading and status data can be read at any time. Limit values should be written into limit registers before starting conversion to avoid false conditions of the status.
Resetting (to 0) the STAR T bit (bit 0) of the configuration register will stop the monitoring function and put the device into its standby mode thereby reducing power consumption.
2.5VIN and V
IN,
CCPVIN
.
DDVIN
,
Because the logic is sampled and latched into the device storage only at power-up, the device pin 16 can be programmed for different functions while power is on without effecting the address definition.

Registers

The NE1617 contains a number of registers, as listed in Table 1, in order to store data of the device setup and operation results. The table indicates the command value and read/write capability of each register for SMBus communication and also the power-up default values for some registers. It includes: – Configuration register to provide control and configuration as well
as initialization the NE1619,
– Status registers to provide the flags resulting from limit
comparisons, – Reading registers to store results of measurements, – Limit registers to store programmable limit data, – ID and test registers.
Data are stored in registers by 8-bit digital byte, either in 2’s complement format for temperature-related data or in straight format for others. Writing and reading registers will be done on the SMBus by a controller using the SMBus protocols that will be described more in the last section of this functional description. Notice that attempting to write to a “Read only” register will produce an invalid result.

Power-on reset

When the power is applied to the NE1619, also called hardware reset, the registers are reset to their default value, if defined, as shown in Table 1. The content of registers which have indeterminate default value such as reading registers will be unknown. The on-board A-to-D converter is disabled and the monitoring function is not started. The device enters standby mode and draws a supply current less than 100µA.

T emperature measurement

The NE1619 contains an on-chip temperature sensor to measure the local or internal temperature and provides input pins (D– and D+) to measure the remote or external temperature with the use of a remote diode-type sensor. The remote sensor should be connected to the D– and D+ pins properly.
The method of temperature measurement is based on the change of the diode VBE at two different operating current levels given by:
∆VBE = (KT/q)*LN(N)
where:
K: Boltzmann’s constant T: absolute temperature in °K q: charge on the electron N: ratio of the two currents LN: natural logarithm
The NE1619 provides two current sources of about 10µA and 100µA
during the measurement of the remote diode VBE and the sensed voltage between two pins D– and D+ is limited within 0.25V and
0.95V. The external diode should be selected to meet this current and
voltage requirements. The diode-connected PNP transistor provided on the Pentium series microprocessor is typically used, or the discrete diode-connected transistor 2N3904 is recommended.
For temperature measurement, local or remote, the ∆VBE is converted into digital data by the on-chip sigma-delta A-to-D converter. The result is stored in the temperature reading register and is also compared with the limits stored in the temperature limit registers in order to set the temperature flag bits in the status register as described in Table 3.
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
Temperature data is represented by a digital 8-bit byte or word in two’s complement format with a resolution of 1°C. Theoretically , the temperature value can be from –128°C to +127°C but, practically, the operation range is limited to (0°C, 120°C). Here are some of temperature values and data:
Table 8.
TEMPERATURE VALUE (°C) TEMPERATURE DATA
+127 0111 1111 +126 0111 1110 +100 01 10 0100
+25 0001 1001
+1 0000 0001
0 0000 0000
–1 1111 1111 –25 1110 0111 –50 1100 1 110

Voltage measurement

The NE1619 provides 5 analog inputs for directly monitoring the power supplies typically found in a PC, having nominal values of +2.5 V, +3.3 V, +5.0 V, +12.0 V and V monitors its own V
which nominal value is 3.3 V. Notice that, at
DD
power-up, the device Pin 11 is defaulted to its 12V
(2.25 V). The device also
CCP
function. These
IN
inputs are internally attenuated by on-chip resistor networks to the reference levels that are then multiplexed to a 8-bit Delta-Sigma A-to-D converter for converting into digital data. Each V
input is
IN
overall scaled in such a way that the decimal value of the data for its nominal voltage value is equal to 192. It means that the overall step size of the conversion for each V value. Reading data are stored in the V also compared with the limits stored in the V
is equal to 1/
IN
IN
192
reading registers and are
limit registers in order
IN
of its nominal
to set the voltage flag bits in the status registers as described in Tables 3 and 4.
The V
data, different with the temperature data, is represented by
IN
a digital 8-bit byte or word in straight format with a resolution LSB equal to This is how to calculate the V input including V
1
/
of the nominal value, and has any value from 0 to 255.
192
DD
:
error from the VIN reading at any
IN
Resolution in volts: LSB = (VIN nominal in volt)/192 Full scale in volts: FS= 255 * LSB Reading value in volts: V
Reading error in volts: V VIN error in % of FS: V
value =
IN
(decimal value of V
error = (VIN value) – (VIN applied)
IN
error % = 100*(VIN error)/FS
IN
reading) * LSB
IN
Applied value < 0 results in a reading of about 0 Applied value > FS results in a reading of about 255

Input safety

Since the power supply voltages will appear directly at VIN pins, a small external resistor, about 500Ω, should be connected in series with each pin in order to prevent damaging the power supplies due to accidental short. These resistors are recommended but not
necessary. No external resistor-divider should be used for the V
IN
pins because of the effect of the internal input resistors, about 140 kΩ at each pin, on the divider accuracy.

Processor Voltage ID (VID)

The NE1619 provides 5 digital pins (VID0–VID4) to read the processor voltage ID code and store it into the VID registers so that the code can be read over the SMBus:
VID register: bit 0–bit3 reflect VID0–VID3 respectively VID4 register: bit 0 reflects VID4
Because the VID4 function of 12V
at power-up (default function of this pin is 12V
/VID4 pin (Pin 11) is not selected
IN
), the process of
IN
selecting this pin must be performed, if VID4 is needed, by setting (to 1) bit 5 (12V
/VID4 SELECT) of the configuration register.
IN
The default value of bit 0 of the VID4 register is 0. The VID inputs should not be left floating because they are not
internally biased. If they are not used then they should be connected
to either GND or V
with resistors.
DD

Limit data

High and Low limits for temperatures and voltages should be programmed into the limit registers using the format as described above. During monitoring cycle, the measured data is automatically compared with the limits and flag bits in the status registers are set accordingly to the results. The assignment of the status bits are listed in Tables 3 and 4.

Status registers

Results of limits comparisons are reflected by status or flag bits stored in the status register 1 and 2. If the reading is within the limits then the corresponding flag bit will be cleared to 0. Otherwise, it will be set to 1. Status data can be read over the SMBus. Notice that because the flag bits are automatically updated at every monitoring cycle, their states only reflect the last measurements.

Diode fault status

The hardware connection at the diode pins (D+ and D–) are also checked at the measurement of external temperature and the fault
condition is indicated by the flag bit 6 of the status register 2. This bit
is set to 1 if either short or open circuit fault is detected.

RESET output function

The NE1619 Pin 16 can be selected as a reset pulse output. When this function is selected and the reset pulse is initiated, this pin will output a single (minimum 20ms) low state pulse.
The reset output function is selected by setting (to 1) the RESET ENABLE bit (bit 7) of the VID register. Thereafter, the reset pulse is generated whenever the RESET bit (bit 4) of the configuration register is programmed to change from 0 to 1.
Because Pin 16 becomes an open-drain output when it is selected as an output, an external pull-up resistor, about 100 kΩ is needed for the output operation. This will restrict the address function on Pin 16 to being high at power-up. Therefore, if multiple NE1619’s are connected on the same bus, only one can have this function enabled at one time.
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NE1619HECETA4 Temperature and voltage monitor

NAND-tree test

A NAND tree is provided in the NE1619 for Automated Test Equipment (A TE) board level connectivity testing. The device is placed into NAND tree test mode by powering up with Pin 9 (D–/NTEST_IN) held high. In this test mode Pin 16 (A0/RESET input pins become NAND-tree inputs as illustrated in Figure 1.
/NTEST_OUT) becomes the NAND-tree output and all
SDA
SCL
VID0
VID1
Figure 1. NAND-tree circuitry
To perform a NAND tree test all pins should be initially driven low. Then one-by-one toggle them high (and keep them high), starting with the input closest to the output, cycling toward the farthest, the NAND tree output will toggle with each input change.
VID2
VID3
VID4
NTEST_OUT
SL01232
Table 9. NAND-tree test vectors
VECTOR # SDA SCL VID0 VID1 VID2 VID3 VID4 NTEST_OUT
1 L L L L L L L H 2 L L L L L L H L 3 L L L L L H H H 4 L L L L H H H L 5 L L L H H H H H 6 L L H H H H H L 7 L H H H H H H H 8 H H H H H H H L
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NE1619HECETA4 Temperature and voltage monitor

SMBus interface protocol

The NE1619 can communicate over a compatible 2-wire serial interface SMBus using the two device pins SCL and SDA. The device employs three standard SMBus protocols: Write Byte, Read Byte and Receive byte.
Data formats of those protocols are shown below with following notices:
•The SMBus controller initiates data transfer by establishing a start
condition (S) and terminates data transfer by generating a stop condition (P).
•Data is sent over the serial bus in sequence of 9 clock pulses for
each 8-bit data byte followed by 1-bit status of the device acknowledgement (A).
Write Byte Format:
SCL
SDA
SCL (continued)
SDA (continued)
123456789123456789
010110a0
SWA A
DEVICE ADDRESS
123456789
D7 D6 D5 D4 D3 D2 D1 D0
DATA TO BE WRITTEN TO REGISTER
•The 7-bit slave address is replaced by the selected address of the
device.
•The command byte is replaced by the selected command of the
device register.
•The receive byte format is used for quickly transfer data from a
reading register which was previously selected by a read.
•During the transition between start and stop conditions, data must
be stable and valid when the SCL is high.
(TO NEXT)
D7 D6 D5 D4 D3 D2 D1 D0
DEVICE REGISTER COMMAND
AP
(TO NEXT)
Read Byte Format:
SCL
SDA
SCL (continued)
SDA (continued)
Receive Byte Format:
SCL
SDA
123456789123456789
(TO NEXT)
010110a0
SWA AP
DEVICE ADDRESS
123456789123456789
0 1 0 1 1 0 a0 D7 D6 D5 D4 D3 D2 D1 D0
SRA NAP
RESTART DEVICE ADDRESS
123456789123456789
010110a0 D7D6D5D4D3D2D1D0
SRA NAP
DEVICE ADDRESS
(end)
D7 D6 D5 D4 D3 D2 D1 D0
DATA REGISTER COMMAND
DATA FROM DEVICE REGISTER
DATA FROM DEVICE REGISTER
(TO NEXT)
STOP
STOP
SL01233
Figure 2. NE1619 SMBus interface protocols
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NE1619HECETA4 Temperature and voltage monitor
NOTES
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Philips Semiconductors Product specification
NE1619HECETA4 Temperature and voltage monitor
SSOP16: plastic shrink small outline package; 16 leads; body width 3.9 mm;

lead pitch 0.635 mm SOT519-1

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NE1619HECETA4 Temperature and voltage monitor

Data sheet status

Data sheet status
Objective specification
Preliminary specification
Product specification
Product status
Development
Qualification
Production
Definition
This data sheet contains the design target or goal specifications for product development. Specification may change in any manner without notice.
This data sheet contains preliminary data, and supplementary data will be published at a later date. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
This data sheet contains final specifications. Philips Semiconductors reserves the right to make changes at any time without notice in order to improve design and supply the best possible product.
[1]
[1] Please consult the most recently issued datasheet before initiating or completing a design.

Definitions

Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook. Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification.

Disclaimers

Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury . Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Right to make changes — Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.
Philips Semiconductors 811 East Arques Avenue P.O. Box 3409 Sunnyvale, California 94088–3409 Telephone 800-234-7381
Copyright Philips Electronics North America Corporation 2000
All rights reserved. Printed in U.S.A.
Date of release: 07-00
Document order number: 9397 750 07323
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