Datasheet NDL7705P, NDL7705P1, NDL7705P2 Datasheet (NEC)

DATA SHEET

LASER DIODE

NDL7705P Series

1 500 nm OPTICAL FIBER COMMUNICATIONS

InGaAsP MQW-DFB LASER DIODE COAXIAL MODULE

DESCRIPTION

The NDL7705P Series is a 1 550 nm phase-shifted DFB (Distributed Feed-Back) laser diode module with optical
isolator. Multiple Quantum Well (MQW) structure is adopted to achieve stable dynamic single longitudinal mode
operation over wide temperature range of 40 to +85 C.

It is designed for all STM-1 and STM-4 applications.

FEATURES

• Peak emission wavelength

• Optical output power Pf = 2.0 mW

• Wide operating temperature range TC = 

•/4-phase-shifted DFB

• InGaAs monitor PIN-PD

• Internal optical isolator

p = 1 550 nm

40 to +85 C

NDL7705P

Optical Fiber
SM-9/125
Length: 1 m

φ

7±0.2

3.4±0.8

6±0.1

φ

PIN CONNECTIONS

φ

P.C.D. = 2

43

1

2

3.2±0.25

φ

7±0.2

φ

15

27.8±1.0

8.2

4.6±0.8

20±1.0

4
1

Case

PACKAGE DIMENSIONS

in millimeters

NDL7705P1

φ

0.45
±0.05

3
2

Optical Fiber
SM-9/125
Length: 1 m

φ

7±0.2

Optical Fiber

3
2

SM-9/125
Length: 1 m

φ

0.45
±0.05

P.C.D. = 2

φ

7±0.2

φ

φ

2– 2.2

6±1.0

φ

12.7±0.2

17.0±0.2

PIN CONNECTIONS

φ

43

2

1

3.2±0.25

15

8.2

1.0±0.1

4.0±0.2

20±1.0 27.8±1.0

2.0±0.2

3.7±0.3

0.9

φ

4
1

7.2±0.3

Case

PD

LD

φ

0.9

PD

LD

0.5±0.2

φ

16

NDL7705P2

15

8.2

2.5±1.0

–

φ

2

2.5

φ

28.1±1.0

19.5±1.0

φ

7±0.2

3.2±0.25

φ

0.3

PIN CONNECTIONS

P.C.D. = 2

2

1

3

4

12±0.15

16.0

0.9

3

PD

0.3

2

LD

4

φ

4– 0.45
±0.05

1

Case

The information in this document is subject to change without notice.

Document No. P12438EJ3V0DS00 (3rd edition)
Date Published September 1997 NS
Printed in Japan

The mark

 shows major revised points.

©

1996

ORDERING INFORMATION

Part Number Available Connector Flange Type
NDL7705P Without Connector No flange
NDL7705PC With FC-PC Connector
NDL7705PD With SC-PC Connector
NDL7705P1 Without Connector Flat Mount Flange
NDL7705P1C With FC-PC Connector
NDL7705P1D With SC-PC Connector
NDL7705P2 Without Connector Vertical Mount Flange
NDL7705P2C With FC-PC Connector
NDL7705P2D With SC-PC Connector

NDL7705P Series

ABSOLUTE MAXIMUM RATINGS (TC = 25

Parameter Symbol Ratings Unit
Optical Output Power P
Forward Current of LD I
Reverse Voltage of LD V
Forward Current of PD I
Reverse Voltage of PD V
Operating Case Temperature T
Storage Temperature T
Lead Soldering Temperature (10 s) T

f

F

R

F

R

C

stg

sld

C, unless otherwise specified)





5.0 mW

Ith+50 mA

2.0 V

2.0 mA
15 V



40 to +85



40 to +85

260



C



C



C

2

NDL7705P Series

ELECTRO-OPTICAL CHARACTERISTICS (TC =

40 to +85

C, unless otherwise specified)

Parameter Symbol Conditions MIN. TYP. MAX. Unit
Forward Voltage V
Threshold Current I

Differential Efficiency form Fiber

F

IF = 30 mA 0.9 1.3 V

th

TC = 25 C15mA

C

T

= 85 C3550

d



TC = 25 C 0.070 0.120 W/A
TC = 85 C 0.035 0.075

Temperature Dependence of
Differential Effi c i ency from Fiber

Peak Emission Wavel ength

d



d = 10 log

p



Pf = 1 mW 1 530 1 550 1 570 nm

d (85 C)

d

(25 C)





3



2dB

Side Mode Suppression Ratio SMSR Pf = 1 mW 30 dB
Rise Time t
Fall Time t
Monitor Current I
Monitor Dark Current I
Tracking Error

r

Ib = 0.9  I

f

Ib = 0.9  I

m

VR = 5 V, Pf = 2 mW 300 2 500

D

VR = 5 V, TC = 25 C0.15nA

*1



Im = const. (Pf = 2 mW, TC = 25 C) 1.0 dB

Relative Intensity Noise RIN Ref = 14 dB, Pf = 1 mW

th

th



140

0.5 ns

0.5 ns



130 dB/Hz



A

*1

= 10 log



f

P

2.0 mW

(mW)

P

f

2

P

f

0

I

m

(@ P

f

(25 ˚C) = 2 mW)

TC = 25 ˚C

T

C

= –40 to +85 ˚C

I

m

3

NDL7705P Series

TYPICAL CHARACTERISTICS (TC = 25

OPTICAL OUTPUT POWER vs.

FORWARD CURRENT

4.0

+25 ˚C

= –40 ˚C

3.0

(mW)

f

2.0

1.0

Optical Output Power P

0

C

T

20 40 60 80 100

Forward Current IF (mA)

OPERATING CURRENT AND THRESHOLD
CURRENT vs. CASE TEMPERATURE

100

Iop@Pf = 2 mW

(mA),

(mA)

th

op

I

10

th

C, unless otherwise specified)

OPTICAL OUTPUT POWER vs.
MONITOR CURRENT

4.0

+85 ˚C

3.0

(mW)

f

2.0

1.0

Optical Output Power P

0.0

50

40

(mA)

F

30

20

TC = –40 ˚C

+25 ˚C

+85 ˚C

0.4 0.8 1.2 1.6 2.0
Monitor Current Im (mA)

FORWARD CURRENT vs.
FORWARD VOLTAGE

Threshold Current I

Operating Current I

1
–60 0 40 80 100–40 –20 20 60

Case Temperature TC (˚C)

TEMPERATURE DEPENEDENCE OF

DIFFERENTIAL EFFICIENCY FROM FIBER

0.18

(W/A)

d

η

0.12

0.06

0.00

Differential Efficiency from Fiber

–40–60 –20 0 20 40 60 80 100

Case Temperature TC (˚C)

Forward Current I

10

0

0.5 1.0 1.5 2.0 2.5

Forward Voltage VF (V)

TEMPERATURE DEPENDENCE OF

PEAK EMISSION WAVELENGTH

1 560

(nm)

p

1 555

1 550

1 545

Peak Emission Wavelength λ

1 540

–20 0 40 80 100–60 –40 20 60

Case Temperature TC (˚C)

4

NDL7705P Series

LONGITUDINAL MODE FROM FIBER

10

0
–10
–20
–30
–40
–50

Relative Intensity (dB)

–60
–70

1 540.4 1 550.4 1 560.4

Wavelength λ (nm)

ERROR RATE CHARACTERISTICS

10

10

10

–6

TC = –40 ˚C,
Ref = –14 dB,

–7

–8

622 Mbps-NRZ,
2 V

p-p

,

b

= Ith × 0.9

I

10

10

10

–6

–7

–8

Relative Intensity

TC = 25 ˚C,
Ref = –14 dB,
622 Mbps-NRZ,
2 V

p-p

,

b

= Ith × 0.9

I

EYE DIAGRAM

622 Mb/s-NRZ, Ref = –14 dB,

p-p

(6 dB ATT), Ib = Ith × 0.9

2 V

Time Base (500 ps/div.)

–6

10

–7

10

–8

10

TC = 85 ˚C,
Ref = –14 dB,
622 Mbps-NRZ,
2 V

p-p

,

b

= Ith × 0.9

I

–9

10

Bit Error Rate

–10

10

back to back

–11

10

after 200 km

–12

10

–40 –39 –38 –37 –36 –35 –34 –33

–9

10

–10

10

back to back

–11

10

after 200 km

–12

10

–40 –39 –38 –37 –36 –35 –34 –33

Average Received Power P (dBm)

–9

10

–10

10

back to back

–11

10

after 200 km

–12

10

–40 –39 –38 –37 –36 –35 –34 –33

5

DFB-LD FAMILY FOR TELECOM

Absolute Maximum Rat i ngs Typical Characteristi cs

C

Part Number

T

(C)

T

(C)

NDL7705P Series

C

stg

th

I

(mA)

P

(mW)

f

TYP. MIN. TYP.



(nm)

SDH Application Package

NDL7603P Series –40 to +85 –40 to [phone]
NDL7620P Series 0 to +70 –40 to +85 45 (MAX.) 2 1 310
NDL7701P Series –20 to +85 –40 to [phone]
NDL7705P Series –40 to +85 –40 to [phone]
NDL7740PA –20 to +65 –40 to +85 40 20 (TYP.) 1 550

NDL7910P –20 to +65 –40 to +70 7 3 (TYP.) 1 550



STM-4 : 622 Mb/s Coaxial



STM-16: 2.5 Gb/s Coaxial



STM-4 : 622 Mb/s Coaxial



STM-4 : 622 Mb/s Coaxial



STM-16: 2.5 Gb/s

BFY
CW Light Source for
external modulator



STM-16: 2.5 Gb/s

BFY
EA modulator
integrate DFB-LD

6

NDL7705P Series

REFERENCE

Document Name Document No.
NEC semiconductor device reliability/quality control system C11159E
Quality grades on NEC semic onductor devices C11531E
Semiconductor device mounting technology manual C10535E
Guide to quality assurance for semiconductor devic es MEI-1202
Semiconductor selection guide X10679E

7

NDL7705P Series

CAUTION

Within this device there exists GaAs (Gallium Arsenide) material which is a
harmful substance if ingested. Please do not under any circumstances break the
hermetic seal.

NEC Corporation

DANGER

INVISIBLE LASER RADIATION
AVOID DIRECT EXPOSURE TO BEAM

OUTPUT POWER mW MAX
WAVELENGTH nm
CLASS lllb LASER PRODUCT

The export of this product from Japan is prohibited without governmental license. To export or re-export this product from
a country other than Japan may also be prohibited without a license from that country. Please call an NEC sales
representative.

SEMICONDUCTOR LASER

AVOID EXPOSURE-Invisible
Laser Radiation is emitted from
this aperture

No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this
document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual
property rights of third parties by or arising from use of a device described herein or any other liability arising
from use of such device. No license, either express, implied or otherwise, is granted under any patents,
copyrights or other intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on
a customer designated "quality assurance program" for a specific application. The recommended applications
of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each
device before using it in a particular application.

Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.

NEC Building, 7-1, Shiba 5-chome,
Minato-ku, Tokyo 108-01, Japan

Type number:
Manufactured:
Serial Number:
This product conforms to FDA
regulations as applicable
to standards 21 CFR Chapter 1.
Subchapter J.

M4 96. 5