A= Assembly Location
Y= Year
WW= Work Week
G=Pb−Free Package
U8xxxE = Device Code
KA= Diode Polarity
ORDERING INFORMATION
DevicePackageShipping
MUR8100ETO−22050 Units / Rail
MUR8100EGTO−220
MUR880ETO−220
Preferred devices are recommended choices for future use
and best overall value.
xxx = 100 or 80
(Pb−Free)
(Pb−Free)
50 Units / Rail
50 Units / Rail
50 Units / RailMUR880EGTO−220
MUR8100E/D
Page 2
MUR8100E, MUR880E
MAXIMUM RATINGS
RatingSymbolValueUnit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking VoltageMUR880E
MUR8100E
Average Rectified Forward Current
(Rated VR, TC = 150°C) Total Device
Peak Repetitive Forward Current
(Rated VR, Square Wave, 20 kHz, TC = 150°C)
Non−Repetitive Peak Surge Current
(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)
Operating Junction and Storage Temperature RangeTJ, T
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
CharacteristicSymbolValueUnit
Maximum Thermal Resistance, Junction−to−Case
V
RRM
V
RWM
V
I
F(AV)
I
I
FSM
R
FM
q
V
R
800
1000
8.0A
16A
100A
stg
JC
−65 to +175°C
2.0°C/W
ELECTRICAL CHARACTERISTICS
CharacteristicSymbolValueUnit
Maximum Instantaneous Forward Voltage (Note 1)
(iF = 8.0 A, TC = 150°C)
(iF = 8.0 A, TC = 25°C)
Maximum Instantaneous Reverse Current (Note 1)
(Rated DC Voltage, TC = 100°C)
(Rated DC Voltage, TC = 25°C)
Maximum Reverse Recovery Time
(IF = 1.0 A, di/dt = 50 A/ms)
(IF = 0.5 A, iR = 1.0 A, I
* The curves shown are typical for the highest voltage device in the voltage
* grouping. Typical reverse current for lower voltage selections can be
1000
* estimated from these same curves if V
is sufficiently below rated VR.
R
m, AVERAGE FORWARD CURRENT (AMPS)
100
175°C
150°C
10
1.0
, REVERSE CURRENT ( A)
R
II
0.1
100°C
TJ = 25°C
0.01
0
2004006008001000
VR, REVERSE VOLTAGE (VOLTS)
Figure 2. Typical Reverse Current*
10
9.0
8.0
7.0
6.0
SQUARE WAVE
5.0
4.0
3.0
2.0
1.0
F(AV)
1.80.4
0
150140
160
TC, CASE TEMPERATURE (°C)
RATED VR APPLIED
dc
170180
10
9.0
8.0
7.0
6.0
5.0
4.0
3.0
2.0
, AVERAGE FORWARD CURRENT (AMPS)I
1.0
F(AV)
SQUARE WAVE
SQUARE WAVE
0
20600
Figure 1. Typical Forward Voltage
Figure 3. Current Derating, Case
14
R
= 16°C/W
q
JA
R
= 60°C/W
q
JA
(No Heat Sink)
dc
TJ = 175°C
12
SQUARE WAVE
10
8.0
6.0
dc
80120100
140160200180
TA, AMBIENT TEMPERATURE (°C)
, AVERAGE POWER DISSIPATION (WATTS)
F(AV)
P
4.0
2.0
0
1.00
2.03.05.0
I
, AVERAGE FORWARD CURRENT (AMPS)
F(AV)
4.040
6.09.07.08.010
Figure 4. Current Derating, AmbientFigure 5. Power Dissipation
http://onsemi.com
3
dc
Page 4
MERCURY
SWITCH
MUR8100E, MUR880E
+V
DD
I
L
40 mH COIL
BV
DUT
V
D
I
D
I
I
S
1
DUT
L
D
V
DD
Figure 6. Test CircuitFigure 7. Current−Voltage Waveforms
The unclamped inductive switching circuit shown in
Figure 6 was used to demonstrate the controlled avalanche
capability of the new “E’’ series Ultrafast rectifiers. A
mercury switch was used instead of an electronic switch to
simulate a noisy environment when the switch was being
opened.
When S1 is closed at t0 the current in the inductor IL ramps
up linearly; and energy is stored in the coil. At t1 the switch
is opened and the voltage across the diode under test begins
to rise rapidly, due to di/dt effects, when this induced voltage
reaches the breakdown voltage of the diode, it is clamped at
BV
and the diode begins to conduct the full load current
DUT
which now starts to decay linearly through the diode, and
goes to zero at t2.
By solving the loop equation at the point in time when S
is opened; and calculating the energy that is transferred to
the diode it can be shown that the total energy transferred is
equal to the energy stored in the inductor plus a finite amount
of energy from the VDD power supply while the diode is in
t
0
t
1
breakdown (from t1 to t2) minus any losses due to finite
component resistances. Assuming the component resistive
elements are small Equation (1) approximates the total
energy transferred to the diode. It can be seen from this
equation that if the VDD voltage is low compared to the
breakdown voltage of the device, the amount of energy
contributed by the supply during breakdown is small and the
total energy can be assumed to be nearly equal to the energy
stored in the coil during the time when S1 was closed,
Equation (2).
The oscilloscope picture in Figure 8, shows the
MUR8100E in this test circuit conducting a peak current of
one ampere at a breakdown voltage of 1300 V, and using
Equation (2) the energy absorbed by the MUR8100E is
approximately 20 mjoules.
1
Although it is not recommended to design for this
condition, the new “E’’ series provides added protection
against those unforeseen transient viruses that can produce
unexplained random failures in unfriendly environments.
t
2
t
EQUATION (1):
W
AVAL
EQUATION (2):
W
AVAL
[
[
1
LI
2
1
LI
2
2
LPK
2
LPK
CH1
CH2
BV
DUT
ǒ
BV
DUT
Ǔ
V
DD
50mV
ACQUISITIONS
1217:33 HRS
SAVEREF SOURCE
CH1CH2REFREF
Figure 8. Current−Voltage Waveforms
http://onsemi.com
4
A
20ms
953 VVERT500V
STACK
CHANNEL 2:
I
L
0.5 AMPS/DIV.
CHANNEL 1:
V
DUT
500 VOLTS/DIV.
TIME BASE:
20 ms/DIV.
Page 5
MUR8100E, MUR880E
1.0
0.7
D = 0.5
0.5
0.3
0.2
0.1
0.1
0.05
0.07
(NORMALIZED)
0.05
0.01
0.03
r(t), TRANSIENT THERMAL RESISTANCE
0.02
SINGLE PULSE
0.01
0.010.020.050.10.20.5200500 1000
2.05.0102050
t, TIME (ms)
Figure 9. Thermal Response
1000
300
P
(pk)
t
1
t
2
DUTY CYCLE, D = t1/t
TJ = 25°C
Z
(t) = r(t) R
q
JC
R
q
JC
q
JC
= 1.5°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
T
2
J(pk)
- TC = P
1
(pk)
1001.0
Z
(t)
q
JC
100
C, CAPACITANCE (pF)
30
10
101.0
VR, REVERSE VOLTAGE (VOLTS)
Figure 10. Typical Capacitance
100
SWITCHMODE is a trademark of Semiconductor Components Industries, LLC.
http://onsemi.com
5
Page 6
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SCALE 1:1
Q
B
4
13
H
L
G
F
A
K
D
TO−220, 2−LEAD
CASE 221B−04
ISSUE F
C
T
U
R
J
DATE 12 APR 2013
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
S
2. CONTROLLING DIMENSION: INCH.
DIM MINMAXMINMAX
A 0.595 0.620 15.11 15.75
B 0.380 0.4059.65 10.29
C 0.160 0.1904.064.82
D 0.025 0.0390.641.00
F 0.142 0.1613.614.09
G 0.190 0.2104.835.33
H 0.110 0.1302.793.30
J 0.014 0.0250.360.64
K 0.500 0.562 12.70 14.27
L 0.045 0.0601.141.52
Q 0.100 0.1202.543.04
R 0.080 0.1102.042.79
S 0.045 0.0551.141.39
T 0.235 0.2555.976.48
U 0.000 0.050 0.0001.27
MILLIMETERSINCHES
STYLE 1:
PIN 1. CATHODE
2. N/A
3. ANODE
4. CATHODE
STYLE 2:
PIN 1. ANODE
2. N/A
3. CATHODE
4. ANODE
DOCUMENT NUMBER:
DESCRIPTION:
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