Datasheet MSM7512BGS-k, MSM7512BRS Datasheet (OKI)

E2A0014-16-X0

Semiconductor MSM7512B

¡ Semiconductor

This version: Jan. 1998

Previous version: Nov. 1996

MSM7512B

1200 bps Half Duplex FSK Modem – ITU-T V.23

GENERAL DESCRIPTION

The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems,
telecontrol systems, home security systems, etc.
The family version, MSM7510 for ITU-T V.21, will be available following this device.
Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these
devices need two power supplies, +5 V for digital and +12 V for analog.
New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power

consumption.

FEATURES

• Conforms to ITU-T V.23, 1200 bps Half Duplex

• Conforms to ITU-T V.23, 75 bps transmitter

• Single Power Supply: +3 V to +5 V

• Low Power Consumption
Operating Mode: 25 mW Typ.
Power Down Mode: 0.1 mW Max.

• Line Hybrid Circuit on Chip

• Line Direct Drive Capability of Analog Output

• 3.579545 MHz Crystal Oscillator

• Digital Interface: TTL

• Package options:
16-pin plastic DIP (DIP16-P-300–2.54) (Product name: MSM7512BRS)
24-pin plastic SOP (SOP24-P-430-1.27–K) (Product name: MSM7512BGS-K)

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Semiconductor MSM7512B

BLOCK DIAGRAM

AI

(2)

AO
(3)

EAI

(4)

X1
(6)

X2
(7)

CLK

(8)

V

DD

(1)

GND

(5)

*R1

OSC

+

–

*R1

*R2

*R2

–

+

CLK GEN.

SG GEN.

AOG

*R3

*R2

FSK & ANS

Bandpass

Filter

Demodulator

Modulator

CONT.

RD
(9)

CD

(10)

XD

(11)

RS

(12)

TEST

(13)

MOD1

(14)

MOD2

(15)

AOG

(16)

* R1 to R3 ≥ 50 kW

( ) : for MSM7512BRS

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Semiconductor MSM7512B

PIN CONFIGURATION (TOP VIEW)

1

V

DD

2

AI

3

AO

4

EAI

5

GND

6

X1

7

X2

8 9

CLK

16-Pin Plastic DIP

16

15

14

13

12

11

10

AOG

MOD2

MOD1

TEST

RS

XD

CD

RD

1

V

DD

2

NC

3

AI

NC

4

5

AO

6

EAI

GND

7

8

X1

9

NC

10

X2

11

NC

12 13

CLK

24-Pin Plastic SOP

NC : No connect pin

24

23

22

21

20

19

18

17

16

15

14

AOG

NC

MOD2

NC

MOD1

TEST

RS

XD

NC

CD

NC

RD

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Semiconductor MSM7512B

PIN DESCRIPTION

No.

RS GS-VK

11 V

2 3 AI I Analog receive signal input.

3 5 AO O Analog transmit signal output.

4 6 EAI I

5 7 GND — Ground, 0 V.

6 8 X1 I

710 X2 O

8 12 CLK O 3.579545 MHz clock signal output.

913 RD O

10 15 CD O

11 17 XD I*

12 18 RS I*

13 19 TEST I*

14 20 MOD1 I* Operation mode select.

15 22 MOD2 I*

16 24 AOG I*

DD

— +3 V to +5 V Power Supply

External analog signal input.

The signal applied to this pin is transmitted from AO via transmit output

amplifier. When not using this pin, it should be left open.

3.579545 MHz crystal resonator should be connected to X1 and X2.

When applying external clock 3.579545 MHz to the device, it should be

applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1

has to be opened.

Modem receive serial data output.

Digital "1" and "0" correspond to "Mark" and "Space", respectively. When
CD (Carrier Detect) is off, RD is held at "Mark" state.

FSK Receive signal and answer tone detect.

Digital "0" and "1" represent "Detect" and "Non-detect", respectively.

Modem transmit serial data input.

Digital "1" and "0" correspond to "Mark" and "Space", respectively.

FSK signal and answer tone transmit enable.
When digital "0" is applied to RS, transmitting becomes enable.

Chip test input.
TEST should be open or digital "1".

Refer to Table 1.

Analog transmit signal amplitude select.

Digital "1" Æ –10 dBm Typ. at AO

Digital "0" Æ –4 dBm Typ. at AO

DescriptionName I/O

Note : I* : Internally pulled-up input pin.

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Semiconductor MSM7512B

ABSOLUTE MAXIMUM RATINGS

Symbol Condition Rating UnitParameter

Power Supply Voltage V

Input Voltage V

Storage Temperature T

DD

IN

STG

Ta = 25°C,

With respect to GND

RECOMMENDED OPERATING CONDITIONS

–0.3 to +7 V

–0.3 to VDD + 0.3 V

–55 to +150 °C—

Parameter

Power Supply Voltage V+5.5—+2.7—V

Operating Temperature °C+85—–40—T

Input Clock Frequency %+0.1—–0.1To 3.579545 MHzf

VDD Bypass Capacitor mF——10V

DD

op

CLK

VDD

Oscillation Frequency MHz—3.579545———

Frequency Deviation ppm+100—–100+25°C ±5°C—

Temperature Characteristics ppm+50—–50–40°C to +85°C—

Crystal

Equivalent Series Resistance W50————

Load Capacitance pF—16———

ELECTRICAL CHARACTERISTICS

DC Characteristics

Symbol Condition Min. Typ. Max. UnitParameter

Power Supply Current

Digital Input Voltage

Digital Input Leakage Current

Digital Output Voltage

I

DD

I

SS

V

IL

V

IH

I

IL

I

IH

V

OL

V

OH

Operating Mode — 5.0 10.0 mA

Power Down Mode — 5.0 20.0 mA

I

I

OH

UnitMax.Typ.Min.ConditionSymbol

– GNDC

DD

( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)

— 0 — 0.8 V

— 2.2 — V

DD

VI = 0 V * –80 — 10 mA

VI = 5 V –10 — 10 mA

= 1.6 mA 0 0.2 0.4 V

OL

= –0.4 mA 2.4 — V

DD

V

V

* Internally pulled-up pins

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Semiconductor MSM7512B

AC Characteristics

Modulator/analog output (AO) characteristics

Symbol Condition Min. Typ. Max. UnitParameter

f

FSK Transmit

Signal Frequency

FSK Transmit Signal

Answer Tone amplitude

Analog External

Input Signal Gain

FSK Transmit

Signal Amplitude

Ratio

Out-of-band

Energy

Output Offset Voltage

Output Load Resistance

V

V

V

V

V

DM

f

f

BM

f

AO1

AO2

AOD

SPS

DS

BS

EA1

EA2

OFF

AO

1200 bps Transmit Mode

75 bps Transmit Mode

V

O

VAO – V

V

AO

EAI

(MARK) – VAO(SPACE) –2 0 2 dBV

P : In-band Signal
Energy

To V

(VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)

XD = "1"

XD = "0"

XD = "1"

XD = "0"

AOG = "0"

AOG = "1"

AOG = "0"

AOG = "1"

4 kHz to 8 kHz

8 kHz to 12 kHz——

1296

2096

386

446

–6

–12

–2

–8

1300

2100

390

450

–4

–10

0

–6

—

—

More than12 kHz — — P–60 dB

/2 –150 — +150 mVV

DD

— 600 — — WR

1304

2104HzHz

394

454HzHz

–2–8dBm

dBm

2

dB

–4

dB

P–20

P–40dBdB

* 0 dBm = 0.775 Vrms

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Semiconductor MSM7512B

Demodulator analog input (Al, EAI) characteristics

Symbol Condition Min. Typ. Max. UnitParameter

Receive Signal

Amplitude

Receive Signal
Detect Amplitude (CD)
Hysteresis (CD)

CD Delay Time
CD Hold Time

V

V

AI

ON

OFF

HYS

CDD

CDH

FSK Signal, (1:1) at AI

FSK Signal, at AI — — –6 dBmV

VON Æ V

See Fig. 1

OFF

Receive Data (RD)

Bias Distortion

Input Resistance

BS

AI

EAI

1200 bps, 1:1 Pattern –10 — 10 %D

AI — 10 — MWR

EAI 20 — — kWR

* 0 dBm = 0.775 Vrms

( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)

OFF Æ ON

OFF Æ OFF

—

–48

—

—

–42 dBm

dBm

—

—2—dBV

51520mst

20 40 60 mst

AI

CD

t

CDD

t

CDH

Figure 1 Carrier Detect (CD) Timing

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Semiconductor MSM7512B

OPERATION MODE

Table 1 Operation Mode

MOD2 MOD1

00

01

10

11

Phone
Line

AI

SG V

Receive Filter

AO

Transmit Filter

Figure 2 FSK Transmit Mode

Mode

FSK Transmit Mode (Fig.2)

FSK Receive & 75 bps Transmit Mode (Fig.3)

Analog Loop Back Test Mode (Fig. 4)

Power Down Mode

Demodulator

Modulator

DD

RD

DTE

XD

Phone
Line

Phone
Line

AI

AO

AI

AO

SG

Receive Filter

Transmit Filter

Figure 3 FSK Receive Mode

Receive Filter

Transmit Filter

Demodulator

Modulator

Demodulator

Modulator

RD

DTE

XD

RD

DTE

XD

Figure 4 Analog Loop Back Test Mode

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Semiconductor MSM7512B

APPLICATION CIRCUIT

➀

MSM7512BRS

➁

Line

600 W :

600 W

2.2 mF

600 W

10 mF

3.58 MHz

1

V

DD

AI
AO
EAI

–

+

GND
X1
X2
CLK RD

8

16

AOG

MOD

2

MOD

1

TEST

RS

XD

CD

9

To other circuit

MSM7512BRS

CONT.

600 W :

Line

External Clock

3.58 MHz

600 W

2.2 mF

600 W

100 pF

2.2 mF

+

10 mF

1

V

DD

AI
AO
EAI

–

GND
X1
X2
CLK RD

8

16

AOG

MOD

2

MOD

1

TEST

RS

XD

CD

9

External Analog

Transmit Signal

CONT.

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Semiconductor MSM7512B

An Example of the External Adjustment for a transmitting Level and detecting Level

If you desire to change the transmitting level or detecting level, adjust the external circuit
by referring to the following circuit.

51 kW

VAOL

Line

600 W

VAIL

Line transmitting level :

51 kW

–

+

600 W

V

AOL

IC input level : VAI = V

R2

R1

–

+

R4

R3

–

+

= VAO ¥ (R2/R1)

¥ (R4/R3)

AIL

2.2 mF

2.2 mF

VAO

AO

51 kW

51 kW

AI

VAI

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Semiconductor MSM7512B

PACKAGE DIMENSIONS

DIP16-P-300-2.54

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.99 TYP.

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Semiconductor MSM7512B

SOP24-P-430-1.27-K

Mirror finish

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.58 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

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