Datasheet MSM7512B Datasheet (OKI)

E2A0014-16-X0

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Semiconductor MSM7512B

¡ Semiconductor

This version: Jan. 1998

Previous version: Nov. 1996

MSM7512B

1200 bps Half Duplex FSK Modem – ITU-T V.23

GENERAL DESCRIPTION

The MSM7512B is useful for the ITU-T V.23 modem, for examples, low cost built-in modems,
telecontrol systems, home security systems, etc.
The family version, MSM7510 for ITU-T V.21, will be available following this device.
Oki has been mass-producing and delivering the MSM6926 and 6927 for a long time, but these
devices need two power supplies, +5 V for digital and +12 V for analog.
New generation devices, MSM7510/7512B, work with single rail +3 V to +5 V and low power

consumption.

FEATURES

• Conforms to ITU-T V.23, 1200 bps Half Duplex

• Conforms to ITU-T V.23, 75 bps transmitter

• Single Power Supply: +3 V to +5 V

• Low Power Consumption
Operating Mode: 25 mW Typ.
Power Down Mode: 0.1 mW Max.

• Line Hybrid Circuit on Chip

• Line Direct Drive Capability of Analog Output

• 3.579545 MHz Crystal Oscillator

• Digital Interface: TTL

• Package options:
16-pin plastic DIP (DIP16-P-300–2.54) (Product name: MSM7512BRS)
24-pin plastic SOP (SOP24-P-430-1.27–K) (Product name: MSM7512BGS-K)

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BLOCK DIAGRAM

AI

(2)

AO
(3)

EAI

(4)

X1
(6)

X2
(7)

CLK

(8)

V

DD

(1)

GND

(5)

*R1

OSC

+

–

*R1

*R2

*R2

–

+

CLK GEN.

SG GEN.

AOG

*R3

*R2

* R1 to R3 ≥ 50 kW

FSK & ANS

Bandpass

Filter

Demodulator

Modulator

CONT.

RD
(9)

CD

(10)

XD

(11)

RS

(12)

TEST

(13)

MOD1

(14)

MOD2

(15)

AOG

(16)

( ) : for MSM7512BRS

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PIN CONFIGURATION (TOP VIEW)

1

DD

2

AI

3

AO

4

EAI

5

GND

6

X1

7

X2

8 9

CLK

16-Pin Plastic DIP

16V

15

14

13

12

11

10

AOG

MOD2

MOD1

TEST

RS

XD

CD

RD

1

DD

2

NC

3

AI

4

NC

5

AO

6

EAI

7

GND

8

X1

9

NC

10

X2

11

NC

12 13

CLK

24-Pin Plastic SOP

NC : No connect pin

24V

23

22

21

20

19

18

17

16

15

14

AOG

NC

MOD2

NC

MOD1

TEST

RS

XD

NC

CD

NC

RD

3/12

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PIN DESCRIPTION

No.

RS GS-VK

11 VDD— +3 V to +5 V Power Supply

2 3 AI I Analog receive signal input.

3 5 AO O Analog transmit signal output.

External analog signal input.

4 6 EAI I

5 7 GND — Ground, 0 V.

6 8 X1 I

710 X2 O

8 12 CLK O 3.579545 MHz clock signal output.

913 RD O

10 15 CD O

11 17 XD I*

12 18 RS I*

13 19 TEST I*

14 20 MOD1 I* Operation mode select.

15 22 MOD2 I*

16 24 AOG I*

The signal applied to this pin is transmitted from AO via transmit output

amplifier. When not using this pin, it should be left open.

3.579545 MHz crystal resonator should be connected to X1 and X2.

When applying external clock 3.579545 MHz to the device, it should be

applied to X2 (not X1) via an AC-coupling capacitor of 100 pF and X1

has to be opened.

Modem receive serial data output.

Digital "1" and "0" correspond to "Mark" and "Space", respectively. When
CD (Carrier Detect) is off, RD is held at "Mark" state.

FSK Receive signal and answer tone detect.

Digital "0" and "1" represent "Detect" and "Non-detect", respectively.

Modem transmit serial data input.

Digital "1" and "0" correspond to "Mark" and "Space", respectively.

FSK signal and answer tone transmit enable.
When digital "0" is applied to RS, transmitting becomes enable.

Chip test input.
TEST should be open or digital "1".

Refer to Table 1.

Analog transmit signal amplitude select.

Digital "1" Æ –10 dBm Typ. at AO

Digital "0" Æ –4 dBm Typ. at AO

DescriptionName I/O

Note : I* : Internally pulled-up input pin.

4/12

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ABSOLUTE MAXIMUM RATINGS

Symbol Condition Rating UnitParameter

Power Supply Voltage V

Input Voltage V

Storage Temperature T

DD

IN

STG

Ta = 25°C,

With respect to GND

–0.3 to +7 V

–0.3 to VDD + 0.3 V

–55 to +150 °C—

RECOMMENDED OPERATING CONDITIONS

Parameter

Power Supply Voltage V+5.5—+2.7—V

Operating Temperature °C+85—–40—T

Input Clock Frequency %+0.1—–0.1To 3.579545 MHzf

VDD Bypass Capacitor mF——10V

DD

op

CLK

VDD

Oscillation Frequency MHz—3.579545———

Frequency Deviation ppm+100—–100+25°C ±5°C—

Temperature Characteristics ppm+50—–50–40°C to +85°C—

Crystal

Equivalent Series Resistance W50————

Load Capacitance pF—16———

ELECTRICAL CHARACTERISTICS

DC Characteristics

Symbol Condition Min. Typ. Max. UnitParameter

Power Supply Current

Digital Input Voltage

Digital Input Leakage Current

Digital Output Voltage

I

DD

I

SS

V

IL

V

IH

I

IL

I

IH

V

OL

V

OH

Operating Mode — 5.0 10.0 mA

Power Down Mode — 5.0 20.0 mA

I

– GNDC

DD

( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)

— 0 — 0.8 V

— 2.2 — V

DD

VI = 0 V * –80 — 10 mA

VI = 5 V –10 — 10 mA

I

= 1.6 mA 0 0.2 0.4 V

OL

= –0.4 mA 2.4 — V

OH

DD

UnitMax.Typ.Min.ConditionSymbol

V

V

* Internally pulled-up pins

5/12

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AC Characteristics

Modulator/analog output (AO) characteristics

(VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)

Symbol Condition Min. Typ. Max. UnitParameter

FSK Transmit

Signal Frequency

FSK Transmit Signal

Answer Tone amplitude

Analog External

Input Signal Gain

FSK Transmit

Signal Amplitude

Ratio

Out-of-band

Energy

Output Offset Voltage

Output Load Resistance

V

V

V

V

V

f

DM

f

f

BM

f

AO1

AO2

EA1

EA2

AOD

SPS

1200 bps Transmit Mode

DS

75 bps Transmit Mode

BS

P : In-band Signal
Energy

OFF

AO

V

O

VAO – V

(MARK) – VAO(SPACE) –2 0 2 dBV

V

AO

EAI

To V

DD

— 600 — — WR

XD = "1"

XD = "0"

XD = "1"

XD = "0"

AOG = "0"

AOG = "1"

AOG = "0"

AOG = "1"

4 kHz to 8 kHz

1296

2096

386

446

–6

–12

–2

–8

1300

2100

390

450

–4

–10

0

–6

——P–20

8 kHz to 12 kHz——

More than12 kHz — — P–60 dB

/2 –150 — +150 mVV

1304

2104HzHz

394

454HzHz

–2–8dBm

dBm

2

–4dBdB

P–40dBdB

* 0 dBm = 0.775 Vrms

6/12

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Demodulator analog input (Al, EAI) characteristics

( VDD = +2.7 V to +5.5 V, Top = –40°C to +85°C)

Symbol Condition Min. Typ. Max. UnitParameter

Receive Signal

Amplitude

Receive Signal
Detect Amplitude (CD)
Hysteresis (CD)

CD Delay Time
CD Hold Time

Receive Data (RD)

Bias Distortion

Input Resistance

V

V

AI

ON

OFF

HYS

CDD

CDH

BS

AI

EAI

FSK Signal, (1:1) at AI

1200 bps, 1:1 Pattern –10 — 10 %D

FSK Signal, at AI — — –6 dBmV

VON Æ V

See Fig. 1

OFF Æ ON

OFF Æ OFF—–48

OFF

—2—dBV

—

—

51520mst

20 40 60 mst

AI — 10 — MWR

EAI 20 — — kWR

* 0 dBm = 0.775 Vrms

–42 dBm

dBm

—

AI

CD

t

CDD

t

CDH

Figure 1 Carrier Detect (CD) Timing

7/12

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OPERATION MODE

Table 1 Operation Mode

MOD2 MOD1

00

01

10

11

AI

Phone
Line

AO

Receive Filter

SG V

Transmit Filter

Figure 2 FSK Transmit Mode

AI

Phone
Line

AO

Receive Filter

Transmit Filter

Mode

FSK Transmit Mode (Fig.2)

FSK Receive & 75 bps Transmit Mode (Fig.3)

Analog Loop Back Test Mode (Fig. 4)

Power Down Mode

Demodulator

Modulator

Demodulator

Modulator

DD

RD

DTE

XD

RD

DTE

XD

Figure 3 FSK Receive Mode

AI

Phone
Line

Receive Filter

Demodulator

AO

Transmit Filter

Modulator

SG

Figure 4 Analog Loop Back Test Mode

RD

DTE

XD

8/12

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APPLICATION CIRCUIT

➀

MSM7512BRS

➁

Line

600 W :

Line

600 W

600 W :

2.2 mF

600 W

External Clock

3.58 MHz

600 W

2.2 mF

3.58 MHz

600 W

+

10 mF

100 pF

1

–

8

V
AI
AO
EAI

DD

AOG
MOD
MOD

TEST

GND
X1
X2
CLK RD

MSM7512BRS

1

V

DD

AI
AO
EAI

–

+

GND

10 mF

X1
X2
CLK RD

8

16

2
1

RS

XD

CD

9

To other circuit

AOG

MOD

2

MOD

1

TEST

RS

XD

CD

CONT.

16

CONT.

9

External Analog

2.2 mF

Transmit Signal

9/12

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An Example of the External Adjustment for a transmitting Level and detecting Level

If you desire to change the transmitting level or detecting level, adjust the external circuit
by referring to the following circuit.

51 kW

VAOL

Line

51 kW

–

+

600 W

600 W

VAIL

Line transmitting level :

V

AOL

IC input level : VAI = V

R2

R1

–

+

R4

R3

–

+

= VAO ¥ (R2/R1)

¥ (R4/R3)

AIL

2.2 mF

2.2 mF

VAO

AO

51 kW

51 kW

AI

VAI

10/12

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PACKAGE DIMENSIONS

DIP16-P-300-2.54

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.99 TYP.

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SOP24-P-430-1.27-K

Mirror finish

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.58 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

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