The MSM6948/6948V is a single chip MSK (Minimum Shift Keying) modem which is fabricated by
Oki’s low power consumption CMOS silicon gate technology.
The demodulator receives the data to be transmitted (SD) synchronized with the transmit timing
clock (ST) generated by the on-chip clock generator. The signal, which is modulated by MSK method,
is output.
The demodulator converts the received MSK signal to the received data (RD) by means of a delay
detection technique after limiting the band of the received MSK signal. This signal is input to the
digital PLL and the re-generated timing clock (RT) is output from the demodulator, synchronized
with the RD.
FEATURES
• Signal power supply: +5 V
• On-chip SCF (Switched Capacitor Filter)
• The transmit filter can be also used as voice splatter filter.
• The receive timing re-generator has two different lock-in time performance options to be chosen
from.
• Built-in crystal oscillation circuit.
• Small number of external components for easy application.
• Wide application-wireless data equipment, MCA system.
Crystal connection pins.
A 3.6864 MHz crystal shall be connected.
When an external clock is applied for MSM6948's oscillation source, it has to be input to X2.
In this case, X2 has to be AC-coupled by the capacitor of 200 pF. X1 shall be left open.
*MCK
ME
SD
ST
SG
3.6864 MHz ±0.02% clock output.
This can be used for other devices under limited load conditions.
When digital "1" is put on this pin, MSK modulator output is connected to the input of
transmit LPF.
When digital "0" is put on, the input of transmit LPF is connected to TI that is voice signal input.
The data put on ME terminal is synchronized with the rising edge of ST and input to internal
logic as a control data. The rising edge of this synchronized data resets MSK modulator.
Transmit data input.
The data on this pin is synchronized with the rising edge of ST and input to MSK modulator
as an actual transmit data.
SD
50%SD
ST
50%SD
MSK
Modulated
Data
t
setup
t
; Min. 300 ns
setup
; Min. 300 ns
t
hold
t
hold
ST is synchronizing signal used for ME and SD.
This is made from master clock and is usually 1200 Hz.
Built-in analog signal ground.
The DC voltage is approximately half of V
, so the analog signals of AI, AO, and TI interfaces
DD
with peripheral circuits which must be implemented by AC-coupling. To make this voltage
source impedance lower and ensure the device performance, it is necessary to put a bypass
capacitor on SG in close physical proximity to the device.
AG
*NC : MSM6948V
Analog ground.
This pin should be common with DG at the system ground point as close as possible.
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¡ SemiconductorMSM6948/6948V
NameDescription
DG
TI
Digital ground.
This pin should be common with AG at the system ground point as close as possible.
Voice signal input.
The signal input to this pin can be sent out to AO through the transmit LPF, the characteristics
of which, gives the splatter filter for voice band signal.
When this function is used, digital "0" must be input to ME.
TI is biased internally to SG with about 100 kW.
Transmit analog signal output.
According to the control data on ME and FT, AO is set to various state as an output terminal as
follows.
FTMETransmit LPFState of AO
"1""1"
Power On
"1""0"Transmit LPFVoice Signal
"0""1"
Power Down
"0""0"
The output ofMSK Signal
The Output of Receive BPF
(Used for Device Test Only)
No-signal Output
(DC-biased to SG)
AO
AI
TI
Modu-
SD
The state when FT and ME = "0" is shown above. When the input digital data on FT changes to
"1" from "0", AO remains to be connected to SG during about 12 ms and after that, and AO is
switched to transmit LPF.
This delay time prevents AO from outputting meaningless signal during transient time from
power down to on of LPF.
Receive analog signal input.
AI is biased internally to SG with about 100 kW same as TI. Receive BPF and demodulator
extract the information in this signal and convert it into a serial data stream at RD output.
lator
Power down
Transmit LPF
Receive BPF
SG
+
–
AO
AI
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¡ SemiconductorMSM6948/6948V
NameDescription
RD
Demodulated serial data output.
This data is synchronized with the re-generated timing clock RT.
Receive data timing clock output.
This signal is re-generated by internal digital PLL.
Synchronizing to falling edge of RT, RD is output.
RT
CF
CT
RT
RD
Delay time (RT Æ RD) < 300 ns
Receive data timing clock is re-generated by digital PLL of which phase correcting speed can
be selected with CF.
When a digital "1" is put on CF and phase difference between receive data timing and RT is
more than 22.5 degree, phase correcting speed is high. In this case, as the phase difference
enters within 22.5 degrees, that speed changes to low immediately.
When digital "0" is input to CF, phase correcting speed of PLL remains low regardless of the
phase difference.
Usually, CF is connected to digital "1".
PLL's lock-in characteristics can be selected with CT.
When digital "1" is put on CT, PLL requires max. 50-bit alternative data pattern. On the other
hand, when digital "0" is input to CT,
PLL can be locked in below 18-bit data.
Refer to column AO.
When digital "0" is input to this pin, transmit LPF enters in power down mode, but the output
buffer operational amplifier remains active.
+5 V power supply.
V
DD
This device is sensitive to supply noises as switched capacitor techniques are utilized.
Bypass capacitors of more than 2.2 mF between V
and AG, and between VDD and DG are
DD
indispensable to ensure the performance.
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¡ SemiconductorMSM6948/6948V
ABSOLUTE MAXIMUM RATINGS
ParameterSymbolConditionRatingUnit
Power Supply VoltageV
Digital Input Voltage *2 V
Operating TemperatureT
Storage TemperatureT
DD
IA
ID
op
STG
Ta = 25°C
With respect to AG and DG
—
—
–0.3 to 7.0
–0.3 to VDD + 0.3
–0.3 to VDD + 0.3
–25 to 70
–55 to 150
VAnalog Input Voltage *1 V
°C
*1 TI, AI
*2 ME, SD, CF, CT, FT
RECOMMENDED OPERATING CONDITIONS
ParameterSymbolConditionTyp.Unit
V
Power Supply VoltageV
DD
With respect to AG and DG54.755.25
Min.Max.
AG, DG—0——
Operating Temperature
Crystal Resonant Frequency
Data SpeedT
C1—2.2——
C2, C6—0.1——
C3—0.047——mF
C4R
C5—0.047——
Temperature
Characteristics
Equivalent Series
Crystal
Resistance
T
f
X' TAL
—
—
—
—
—
—
—
—
—
op
—25–2570°C
—3.68643.68603.6868MHz
S
—1200——bit/sec
≥ 100 kW0.01——
LX
25 ±5°C—–100+100Frequency Deviation
ppm
At –40°C to +85°C—–100+100
—
—
——100W
16——pFLoad Capacitance
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¡ SemiconductorMSM6948/6948V
ELECTRICAL CHARACTERISTICS
DC and Digital Interface Characteristics
(V
= 5 V ±5%, Ta = –25°C to 70°C)
DD
ParameterSymbolConditionTyp.UnitMin.Max.
Normal Operating Mode3—6Power Supply CurrentmA
f
= 3.6864 MHz ±0.01%3.68643.68573.6871Oscilating Frequency
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.30 TYP.
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¡ SemiconductorMSM6948/6948V
(Unit : mm)
SOP24-P-430-1.27-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.58 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
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