Page 1
E2E0049-18-95
¡ Semiconductor MSM64162A
This version: Sep. 1998
¡ Semiconductor
MSM64162A
4-Bit Microcontroller with Built-in RC Oscillation Type A/D Converter and LCD Driver
GENERAL DESCRIPTION
The MSM64162A is a low power 4-bit microcontroller that employs Oki's original CPU core nX4/20.
The MSM64162A has 2-channel RC oscillation type A/D converter, LCD driver for up to 80
segments, and buzzer output port. It is best suited for applications such as low power, high
precision thermometers and hygrometers.
FEATURES
• Operating range
Operating frequencies : 32.768 kHz, 400 kHz
Operating voltage : 1.25 to 1.7 V (1.5 V spec.)
2.0 to 3.5 V (3 V spec.)
2.2 to 3.5 V (3 V spec., 1/2 duty)
Operating temperature : –40 to +85°C
• Memory space
Internal program memory : 2016 bytes
Internal data memory : 128 nibbles
• Minimum instruction execution time : 7.5 ms @ 400 kHz
91.6 ms @ 32.768 kHz
• RC oscillation type A/D converter : 2 channels
Time division 2-channel method
• LCD driver : 24 outputs
(1) At 1/4 duty and 1/3 bias : 80 segments (max)
(2) At 1/3 duty and 1/3 bias : 63 segments (max)
(3) At 1/2 duty and 1/2 bias : 44 segments (max)
Voltage Regulator for LCD Driver (selectable by mask option)
The LCD panel display is stable regardless of temporary supply voltage drop, because
the voltage generated by the voltage regulator for LCD driver is supplied to the bias
voltage generator as a reference voltage.
LCD Operating Voltage
When the voltage regulator for LCD driver is used
: 3.6 V (Duty cycle = 1/4 or 1/3)
2.4 V (Duty cycle = 1/2)
When the voltage regulator for LCD driver is not used
: 4.5 V (Duty cycle = 1/4 or 1/3)
3.0 V (Duty cycle = 1/2)
• Buzzer driver : 1 output (4 output modes selectable)
• Capture circuit : 2 channels
• Watchdog timer
• Clock : 32.768 kHz crystal oscillator and 400 kHz RC
oscillator (with an external resistor)
CPU clock : 32.768 kHz/400 kHz (switchable by software)
Time base clock : 32.768 kHz
• Power supply voltage : 1.5 V/3 V (selectable by mask option)
1/40
Page 2
¡ Semiconductor MSM64162A
• I/O port
Input-output port : 2 ports ¥ 4 bits
Input port : 1 port ¥ 4 bits
Output port : 1 port ¥ 4 bits
(8 out of the 24 LCD driver outputs can be used
as output-only ports by mask option.)
• Interrupt sources
External interrupt : 2 sources
Internal interrupt : 7 sources
• Battery check circuit : 1 (incorporated into the input-only port)
• Package:
80-pin plastic QFP (QFP80-P-1420-0.80-BK) : (Product name : MSM64162A-¥¥¥GS-BK)
Chip : (Product name : MSM64162A-¥¥¥)
¥¥¥ indicates a code number.
2/40
Page 3
¡ Semiconductor MSM64162A
BLOCK DIAGRAM
CPU CORE: nX-4/20
OSC2
OSC1
XT
XT
RESET
TST1
TST2
V
SSL
BSR
HALT
MIEF
TIMING
CONTROLLER
2CLK
RSTG
TST
VR
TR2 TR0
(4)
C
BA H L XY
ALU
(4) (4)
PCM
PCL
TR1
PCH
DB7 to DB0 (8)
SP
IR
IR
ROMR
DECODER
TBC
INTC
WDT
5
INT
INT
BC
(8)
A11 to A8
A7 to A0
INT
PORT3
INT
PORT2
ROM
2016B
RAM
128N
P3.3
P3.2
P3.1
P3.0
P2.3
P2.2
P2.1
P2.0
V
V
V
C1
C2
V
V
L0
L1
L23
SS1
SS2
SS3
DD
SS
LCD
BIAS
PORT ADDRESS
DB7 to DB0
BD
CAPR
RT1
RS1
CS1
ADCBD
IN1
RT0
RS0
CRT0
CS0
IN0
INT
PORT1
INT
PORT0
P1.3
P1.2
P1.1
P1.0
P0.3
P0.2
P0.1
P0.0
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Page 4
¡ Semiconductor MSM64162A
PIN CONFIGURATION (TOP VIEW)
TST2
P0.0
P0.1
P0.2
P0.3
RT0
(NC)
CRT0
RS0
CS0
IN0
IN1
CS1
(NC)
RS1
RT1
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
(NC)
P3.2
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
TST1
80
1
2
3
4
5
6
7
8
9
(NC)
RESET
78
79
77
76
75
74
73
DD
(NC)
V
(NC)
XT
XT
OSC1
OSC2
71
72
(NC)
70
L22/P6.2
L23/P6.3
68
69
L21/P6.1
(NC)
66
67
L20/P6.0
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
45
44
43
42
41
L19/P5.3
L18/P5.2
L17/P5.1
L16/P5.0
L15
(NC)
L14
L13
L12
L11
L10
(NC)
L9
L8
L7
L6
L5
L4
L3
L2
L1
L0
C2
C1
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
P3.3
BD
P1.0
P1.1
P1.2
P1.3
(NC)
(NC)
(NC)
SS
SS1
V
V
(NC)
V
SS2
(NC)
SSL
V
V
80-Pin Plastic QFP
Note: Pins marked as (NC) are no-connection pins which are left open.
SS3
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Page 5
¡ Semiconductor MSM64162A
PAD CONFIGURATION
Pad Layout
SS3
C2 33
L0 34
L1 35
L2 36
L3 37
L4 38
L5 39
L6 40
L7 41
L8 42
L9 43
L10 44
L11 45
L12 46
L13 47
L14 48
L15 49
L16 50
L17 51
L18 52
32 C1
31 V
SSL
30 V
(NC)
(NC)
(NC)
SS2
SS1
29 V
28 V
27 VSS26 P1.3
25 P1.2
24 P1.1
23 P1.0
22 BD
21 P3.3
20 P3.2
19 P3.1
18 P3.0
17 P2.3
16 P2.2
15 P2.1
14 P2.0
13 RT1
12 RS1
11 CS1
10 IN1
9 IN0
8 CS0
7 RS0
6 CRT0
5 RT0
4 P0.3
3 P0.2
2 P0.1
1 P0.0
Y
60
DD
XT 61
L19 53
L20 54
L21 55
L22 56
L23 57
OSC1 58
OSC2 59
XT 62
V
RESET 63
TST1 64
TST2 65
Chip Size : 3.96 mm ¥ 4.32 mm
Chip Thickness : 350 mm (typ.)
Coordinate Origin : Chip center
Pad Hole Size : 110 mm ¥ 110 mm
Pad Size : 120 mm ¥ 120 mm
Minimum Pad Pitch : 180 mm
Note: The chip substrate voltage is VDD.
X
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¡ Semiconductor MSM64162A
Pad Coordinates
Pad No. Y (µm)X (µm)Pad Name Pad No. Y (µm)X (µm)Pad Name
1 P0.0 1828.80 –1940.40
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20 1769.70
21 1589.70
22 1317.60
P0.1
P0.2
P0.3
RT0
CRT0
RS0
CS0
IN0
IN1
CS1
RS1
RT1
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
P3.3
BD
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
1828.80
23 P1.0 999.30
24 P1.1 674.70
25 P1.2 354.90
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
P1.3
V
SS
V
SS1
V
SS2
V
SSL
V
SS3
C1
C2
L0
L1
L2
L3
L4
L5
L6
30.30
–231.00
–411.00
–647.10
–1289.40
–1469.40
–1649.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1719.30
–1539.30
–1310.10
–1048.50
–831.30
–651.30
–396.00
–208.20
–12.90
175.50
390.30
580.50
794.10
1001.70
1194.00
1374.00
1555.20
1735.20
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1957.80
1704.00
1524.00
1344.00
1111.20
919.50
739.50
559.50
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
L7
L8
L9
L10
L11
L12
L13
L14
L15
L16
L17
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40
–1829.40 –1710.00
L18 –1829.40
L19
L20
L21
L22
L23
OSC1
OSC2
V
DD
XT
XT
RESET
TST1
TST2
–1495.20
–1226.70
–958.80
–694.80
–448.80
–243.00
24.90
300.60
480.60
660.60
979.50
1247.70
1599.90
379.50
199.50
10.20
–232.20
–412.20
–592.20
–772.20
–1008.00
–1290.00
–1470.00
–1928.10
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
–1957.50
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Page 7
¡ Semiconductor MSM64162A
PIN DESCRIPTIONS
Basic Functions
Function Symbol Pin Pad Type Description
V
DD
74
60
— 0 V power supply
Negative power supply:
V
SS
34
27
—
Ground V
Ground V
. (for 1.5 V spec.)
SS1
. (for 3.0 V spec.)
SS2
Negative power supply (for 1.5 V spec.)
Bias output for drivig LCD (–1.5 V) (for 3.0 V spec.)
Power
Supply
V
SS1
V
SS2
V
SS3
C1
C2
35
37
40
41
42
28
—
29 —
31
32
33
—
—
—
Bias output for driving LCD (–1.2 V) (when the voltage
regulator for LCD driver is used)
Negative power supply (for 3.0 V spec.)
Bias output for driving LCD (–3.0 V) (for 1.5 V spec.)
Bias output for driving LCD (–4.5 V).
Pins for connecting a capacitor for generating LCD
driving bias
Negative power supply for internal logic
V
SSL
39 30
—
(An internally generated constant voltage is present at
this pin.)
61
62
58
59
I
O
I
O
Low-speed clock oscillation input and output pins:
Connect to a crystal (32.768 kHz).
High-speed clock oscillation input and output pins:
Connect to an external resistor for oscillation (R
Input pins for testing.
A pull-up resistor is internally connected to these pins.
Oscillation
Test
XT
XT
OSC1
OSC2
TST1
TST2
76
77
71
72
80 64 I
165 I
System reset input pin.
Setting this pin to "L" level puts this device into a reset state.
Reset
RESET
79
63
I
Then, setting this pin to "H" level starts executing an
instruction from address 000H.
A pull-up resistor is internally connected to this pin.
OS
).
7/40
Page 8
¡ Semiconductor MSM64162A
Basic Functions (continued)
Function Symbol Pin Pad Type Description
P0.0 2 1 I
P0.1 3 2 I
P0.2 4 3 I
P0.3 5 4 I
4-bit input port (P0):
Selectable as pull-up resistor input, pull-down resistor
input, or high impedance input by the port 01 control
register (P01CON).
As secondary functions, P0.0 to P0.3 are assigned
external interrupt functions, P0.0 and P0.1 are assigned
a capture trigger function, and P0.3 is assigned an
analog comparator input for battery check.
Ports
Buzzer
A/D
Converter
P1.0 27 23 O
P1.1 28 24 O
P1.2 29 25 O
P1.3 30 26 O
P2.0 17 14 I/O
P2.1 18 15 I/O
P2.2 19 16 I/O
P2.3 20 17 I/O
P3.0 21 18 I/O
P3.1 22 19 I/O
P3.2 24 20 I/O
P3.3/MON 25 21 I/O
26 22 O Output pin for the buzzer driverBD
RT0
CRT0
IN0
RT1
65O
86O
97ORS0 Reference resistor connection pin (for channel 0)
10 8 OCS0 Reference capacitor connection pin (for channel 0)
11 9 I Input pin for RC oscillator circuit (for channel 0)
16 13 O
15 12 ORS1 Reference resistor connection pin (for channel 1)
13 11 OCS1 Reference capacitor connection pin (for channel 1)
12 10 IIN1 Input pin for RC oscillator circuit (for channel 1)
4-bit output port (P1):
Selectable as NMOS open drain output or CMOS output
by the port 01 control register (P01CON). P1.0 is a
high current drive output port.
4-bit input-output port (P2):
Following can be specified for each bit by the port 2
control registers 0 to 3 (P20CON to P23CON): (1) input
or output, (2) pull-up/pull-down resistor input or high
impedance input, and (3) NMOS open drain output or
CMOS output.
As secondary functions, P2.0 to P2.3 are assigned
external interrupt functions.
4-bit input-output port (P3):
Following can be specified for each bit by the port 3
control registers 0 to 3 (P30CON to P33CON): (1) input
or output, (2) pull-up/pull-down resistor input or high
impedance input, and (3) NMOS open drain output or
CMOS output.
As secondary functions, P3.0 to P3.3 are assigned
external interrupt functions, P3.3 is assigned a function
that monitors the RC oscillation clock for A/D converter.
Resistance temperature sensor connection pin
(for channel 0)
Resistance/capacitance temperature sensor connection
pin (for channel 0)
Resistance temperature sensor connection pin
(for channel 1)
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Page 9
¡ Semiconductor MSM64162A
Basic Functions (continued)
Function Symbol Pin Pad Type Description
LCD
Driver
L1
43 34 OL0
44 35 O
45 36 OL2
46 37 OL3
47 38 OL4
48 39 OL5
49 40 OL6
50 41 OL7
51 42 OL8
52 43 OL9
54 44 OL10
55 45 OL11
56 46 OL12
57 47 OL13
58 48 OL14
60 49 OL15
LCD segment and common signals output pins.
61 50 OL16/P5.0
62 51 OL17/P5.1
63 52 OL18/P5.2
64 53 OL19/P5.3
65 54 OL20/P6.0
66 55 OL21/P6.1
68 56 OL22/P6.2
69 57 OL23/P6.3
LCD segment and common signals output pins.
Functions as output ports by mask option.
9/40
Page 10
¡ Semiconductor MSM64162A
Secondary Functions
Function Symbol Pin Pad Type Description
14
15
16
17
18
19
20
21
21
1
2
3
4
4
I
I
I
O
I
Secondary functions of P0.0 to P0.3:
Level-triggered external interrupt input pins.
The change of input signal level causes an interrupt to
occur.
Secondary functions of P2.0 to P2.3 and P3.0 to P3.3:
Level-triggered external interrupt input pins.
The change of input signal level causes an interrupt to
occur.
Secondary functions of P0.0 and P0.1:
Capture circuit trigger input pins.
Secondary function of P3.3:
Monitor output pin for an RC oscillation clock for A/D
converter and a 400 kHz RC oscillation clock for the
system clock.
Secondary function of P0.3:
Analog comparator input pin for battery check.
External
Interrupt
Capture
Trigger
RC Oscillation
Monitor
Battery
Check
P0.0
P0.1
P0.2
P0.3
P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2
P3.3
P0.0
P0.1
P3.3
P0.3
2
3
4
5
17
18
19
20
21
22
24
25
21
32
25
5
10/40
Page 11
¡ Semiconductor MSM64162A
,
,
,
MEMORY MAPS
Program Memory
Test program area
07FFH
07E0H
03EH
,,,,,,,,,,,
,,,,,,,,,,,
,,,,,,,,,,,
Interrupt area
32 bytes
2016 bytes
03BH
038H
032H
02FH
02CH
029H
026H
023H
020H
Contents of interrupt area
Watchdog interrupt
External interrupt (0)
External interrupt (1)
ADC interrupt
256 Hz interrupt
32 Hz interrupt
16 Hz interrupt
1 Hz interrupt
4 Hz interrupt
020H
CZP area
010H
Start address
000H
8 bits
Program Memory Map
Address 000H is the instruction execution start address by the system reset.
The CZP area from address 010H to address 01FH is the start address for the CZP subroutine of
1-byte call instruction.
The start address of interrupt subroutine is assigned to the interrupt address from address 020H
to 03DH.
The user area has 2016 bytes of address 000H to address 07DFH. No program can be stored in
the test program area.
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Page 12
¡ Semiconductor MSM64162A
Data Memory
The data memory area consists of 8 banks and each bank has 256 nibbles (256 ¥ 4 bits).
The data RAM is assigned to BANK 7 and peripheral ports are assigned to BANK 0.
7FFH
780H
77FH
700H
BANK 7
Data RAM area
Unused area
Inaccessible area
Data/Stack area (128 nibbles)
Contents of 000H to 07FH
07FH
SFR area
100H
0FFH
080H
07FH
000H
Unused area
BANK 0
000H
4 bits
Data Memory Map
The data RAM area (128 nibbles) is shared by the stack area. The stack is a memory starting from
address 7FFH toward the low-order addresses where 4 nibbles are used by Subroutine Call
Instruction and 8 nibbles are used by an interrupt.
The addresses 080H to 0FFH of BANK 0 and the addresses 700H to 77FH of BANK 7 are not
assigned as the data memory, so access to these addresses has no effect. Moreover, it is
impossible to access BANK 1 to BANK 6.
12/40
Page 13
¡ Semiconductor MSM64162A
ABSOLUTE MAXIMUM RATINGS (1.5 V Spec.)
(V
= 0 V)
DD
Parameter Symbol Condition Rating Unit
Power Supply Voltage 1 V
Power Supply Voltage 2 V
Power Supply Voltage 3 V
Power Supply Voltage 4 V
Power Supply Voltage 5 V
Input Voltage 1 V
Input Voltage 2 V
Input Voltage 3 V
Output Voltage 1 V
Output Voltage 2 V
Output Voltage 3 V
Output Voltage 4 V
Output Voltage 5 V
Storage Temperature T
SS
SS1
SS2
SS3
SSL
IN1
IN2
IN3
OUT1
OUT2
OUT3
OUT4
OUT5
STG
Ta = 25°C –2.0 to +0.3 V
Ta = 25°C –2.0 to +0.3 V
Ta = 25°C –4.0 to +0.3 V
Ta = 25°C –5.5 to +0.3 V
Ta = 25°C –2.0 to +0.3 V
V
Input, Ta = 25°C V
SS
V
Input, Ta = 25°C V
SS1
V
Input, Ta = 25°C V
SSL
V
Output, Ta = 25°C V
SS
V
Output, Ta = 25°C V
SS1
V
Output, Ta = 25°C V
SS2
V
Output, Ta = 25°C V
SS3
V
Output, Ta = 25°C V
SSL
—
– 0.3 to +0.3 V
SS
– 0.3 to +0.3 V
SS1
– 0.3 to +0.3 V
SSL
– 0.3 to +0.3 V
SS
– 0.3 to +0.3 V
SS1
– 0.3 to +0.3 V
SS2
– 0.3 to +0.3 V
SS3
– 0.3 to +0.3 V
SSL
–55 to +150 °C
RECOMMENDED OPERATING CONDITIONS (1.5 V Spec.)
Parameter Symbol Condition Range Unit
Operating Temperature
Operating Voltage
External 400 kHz RC Oscillator
Resistance
Crystal Oscillation Frequency
T
op
V
, V
SS
SS1
R
OS
f
XT
V
SS1
—
is grounded
—
—
(V
= 0 V)
DD
–40 to +85 °C
–1.7 to –1.25 V
250 to 500 k
30 to 35 kHz
W
13/40
Page 14
¡ Semiconductor MSM64162A
ELECTRICAL CHARACTERISTICS (1.5 V Spec.)
DC Characteristics
(VDD = 0 V, VSS = V
= –1.5 V, Ta = –40 to +85°C unless otherwise specified)
SS1
Parameter
V
Voltage V
SS2
Voltage V
V
SS3
Voltage V
V
SSL
Crystal Oscillation
Start Voltage
Crystal Oscillation
Hold Voltage
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
POR Generation
Voltage
POR Non-generation
Voltage
Battery Check
Reference Voltage
Temperature
V
RB
Variation
Symbol
SS2Ca
SS3Ca
SSL
V
STA
V
HOLD
T
STOP
C
G
C
GEX
C
D
C
OS
f
OSC
V
POR1
V
POR2
V
RB
DV
RB
Condition Min. Typ. Max. Unit
+100%
, Cb, C
= 0.1 mF –3.2 –3.0 –2.8 V
12
–50%
+100%
, Cb, C
= 0.1 mF –4.7 –4.5 –4.3 V
12
–50%
— –1.5 –1.3 –0.6 V
Oscillation start time:
within 5 seconds
— — –1.45 V
— — — –1.25 V
— 0.1 — 1000 ms
— 101520pF
When external CG used 10 — 30 pF
— 101520pF
— 8.0 12 16 pF
External resistor R
= –1.25 to –1.7 V
V
SS
When VSS is between V
and –1.5 V
= 300 kW
OS
POR1
80 220 350 kHz
–0.4 — 0 V
No POR when VSS is between
V
POR2
and –1.5 V
–1.5 — –1.2 V
Ta = 25°C –0.73 –0.63 –0.53 V
— –2.0 — mV/°C—
Measuring
Circuit
1
2
Notes: 1. "POR" denotes Power On Reset.
2. "T
" indicates that if the crystal oscillator stops over the value of T
STOP
system reset occurs.
STOP
, the
14/40
Page 15
¡ Semiconductor MSM64162A
DC Characteristics (continued)
(VDD = 0 V, VSS = V
= –1.5 V, Ta = –40 to +85°C unless otherwise specified)
SS1
Parameter Symbol Condition Min. Typ. Max. Unit
Supply Current 1 I
Supply Current 2 I
CPU in halt state
DD1
(400k RC oscillation halt)
CPU in operating state
DD2
(400k RC oscillation halt)
Ta = –40 to +40°C
Ta = +40 to +85°C
Ta = –40 to +40°C
Ta = +40 to +85°C
— 2.0 5.0 mA
— 2.0 30 mA
— 5.0 15 mA
— 5.0 40 mA
CPU in operating state
Supply Current 3 I
Supply Current 4 I
(400k RC oscillation in operation)
DD3
R
= 300 kW
OS
CPU in halt state
(400k RC oscillation
halt), RC oscillator for
DD4
A/D converter is in
operating state
RT0 = 10 kW
RT0 = 2 kW
—4080mA
— 150 230 mA
— 600 900 mA
Battery check circuit in operating
Supply Current 5 I
state, CPU in operating state
DD5
— 25 125 mA
(400k RC oscillation halt)
Measuring
Circuit
1
15/40
Page 16
¡ Semiconductor MSM64162A
DC Characteristics (continued)
(V
= 0 V, V
DD
SS
= V
SS1
= V
= –1.5 V, V
SSL
= –3.0 V, V
SS2
SS3
Ta = –40 to +85°C unless otherwise specified)
= –4.5 V,
Parameter
(Pin Name)
Output Current 1
(P1.0)
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Output Current 3
(BD)
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
Output Current 5
(When L16 to L23 are
configured as output
ports)
Output Current 6
(OSC2)
Symbol
I
OH1
I
OL1
I
OH2
I
OL2
I
OH3
I
OL3
I
OH4
I
OL4
I
OH5
I
OL5
I
OH6
I
OL6
Condition Unit
V
= –0.5 V
OH1
V
= VSS + 0.5 V 1.0 3.0 9.0 mA
OL1
= –0.5 V
V
OH2
V
= V
+ 0.5 V 0.1 0.5 2.1 mA
SS
= –0.7 V –1.8 –0.4 –0.1 mA
= V
+ 0.7 V 0.1 0.4 1.8 mA
SS
= –0.1 V –1.1 –0.4 –0.2 mA
= V
+ 0.1 V 0.2 0.4 1.1 mA
SS
= –0.5 V –1.5 –0.4 –0.08 mA
= V
+ 0.5 V 0.08 0.4 1.5 mA
SS
= –0.5 V –2.1 –0.5 –0.1 mA
= V
+ 0.5 V 0.1 0.5 2.1 mA
SS
V
V
V
V
V
V
V
V
OL2
OH3
OL3
OH4
OL4
OH5
OL5
OH6
OL6
Min. Typ. Max.
–2.1 –0.5 –0.1 mA
–2.1 –0.5 –0.1 mA
Measuring
Circuit
2
Output Current 7
(L0 to L23)
Output Leakage Current
(P1.0 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
I
OH7
I
OMH7VOMH7
I
OMH7SVOMH7S
I
OML7VOML7
I
OML7SVOML7S
I
I
OOH
I
OOL
OL7
V
V
V
V
OH7
OL7
OH
OL
= V
= V
= V
= –0.2 V
= V
SS1
= V
SS1
= V
SS2
= V
SS2
+ 0.2 V
SS3
DD
SS
+ 0.2 V
– 0.2 V
+ 0.2 V
– 0.2 V
(VDD level)
(V
level)
SS1
(V
level)
SS1
(V
level)
SS2
(V
level)
SS2
(V
level)
SS3
— — –4.0 mA
4.0 — — mA
— — –4.0 mA
4.0 — — mA
— — –4.0 mA
4.0 — — mA
— — 0.3 mA
–0.3 — — mA
16/40
Page 17
¡ Semiconductor MSM64162A
DC Characteristics (continued)
(V
= 0 V, V
DD
SS
= V
SS1
= V
= –1.5 V, V
SSL
= –3.0 V, V
SS2
SS3
Ta = –40 to +85°C unless otherwise specified)
= –4.5 V,
Parameter
(Pin Name)
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)
Input Current 2
(IN0, IN1)
Input Current 3
(OSC1)
Input Current 4
(RESET, TST1, TST2)
Symbol Condition Unit
I
I
I
IH1Z
I
IL1Z
I
I
IH2Z
I
IL2Z
I
I
IH3Z
I
IL3Z
I
I
IH1
IL1
IH2
IL3
IH4
IL4
V
= V
IH1
V
IL1
V
IH1
V
IL1
V
IH2
V
IH2
V
IL2
V
IL3
V
IH3
V
IL3
V
IH4
V
IL4
(when pulled down)
DD
= V
(when pulled up) –60 –10 –2.0
SS
(in a high impedance state)
= V
DD
= V
(in a high impedance state)
SS
= V
(when pulled down) 2.0 10 60
DD
(in a high impedance state)
= V
DD
= V
(in a high impedance state)
SS
= V
(when pulled up) –60 –18 –4.0
SS
(in a high impedance state)
= V
DD
= V
(in a high impedance state)
SS
= V
DD
= V
SS
Min. Typ. Max.
2.0 10 60
m
m
0 — 1.0
–1.0 — 0
m
m
m
0 — 1.0
–1.0 — 0
m
m
m
0 — 1.0
–1.0 — 0
m
m
0 — 1.0 mA
–1.5 –0.75 –0.3 mA
A
A
A
A
A
A
A
A
A
A
Measuring
Circuit
3
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Input Voltage 2
(IN0, IN1, OSC1)
Input Voltage 3
(RESET, TST1, TST2)
V
IH1
V
IL1
V
IH2
V
IL2
V
IH3
V
IL3
— –0.3 — 0 V
— –1.5 — –1.2 V
— –0.3 — 0 V
— –1.5 — –1.2 V
— –0.3 — 0 V
— –1.5 — –1.2 V
4
17/40
Page 18
¡ Semiconductor MSM64162A
DC Characteristics (continued)
(V
= 0 V, V
DD
SS
= V
SS1
= V
= –1.5 V, V
SSL
= –3.0 V, V
SS2
Ta = –40 to +85°C unless otherwise specified)
= –4.5 V,
SS3
Parameter
(Pin Name)
Hysteresis Width
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Hysteresis Width
(RESET, TST1, TST2)
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Symbol
DV
T1
DV
T2
C
IN
Condition Unit
Min. Typ. Max.
— 0.05 0.1 0.3 V
— 0.05 0.1 0.3 V
— — — 5.0 pF
Measuring
Circuit
4
1
18/40
Page 19
¡ Semiconductor MSM64162A
Measuring circuit 1
CS0
RT0 RI0
R
OS
C
l
V
Measuring circuit 2
OSC1
OSC2
V
SSL
RT0 CS0 IN0
XT
Crystal
32.768 kHz
XT
C1
C
12
C2
V
DD
V
SS
A
V
V
SS1
SS2
C
a
V
SS3
C
b
V V
C
l
Ca, Cb, C
R
OS
RT0
CS0
RI0
12
: 0.47 mF
: 0.1 mF
W
: 300 k
: 10 kW/2 k
: 820 pF
W
: 10 k
W
(*2)
V
IH
(*1)
OUTPUT
A
INPUT
V
IL
V
DD
V
SS
V
SS1VSS2
V
SS3
V
SSL
19/40
Page 20
¡ Semiconductor MSM64162A
Measuring circuit 3
(*3)
A
Measuring circuit 4
V
IH
(*3)
V
IL
INPUT
V
INPUT
DD
OUTPUT
V
SS
V
SS1
V
SS2
V
SS3
V
SSL
Waveform
OUTPUT
Monitoring
DD
V
V
SS
V
SS1
V
SS2
V
SS3
V
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
SSL
20/40
Page 21
¡ Semiconductor MSM64162A
(
)
A/D Converter Characteristics
= 0 V, V
(V
DD
Parameter Symbol Condition
RS0, RS1,
Resistor
for Oscillation
RT0,
RT0-1,
CS0, CT0, CS1 ≥ 740 pF
RT1
Input Current
Limiting Resistor
Oscillation
Frequency
RI0, RI1
f
OSC1
f
OSC2
f
OSC3
Kf1
Resistor for oscillation = 2 kW
Resistor for oscillation = 10 kW
Resistor for oscillation = 200 kW
RT0, RT0-1, RT1 = 2 kW
RS•RT Oscillation
Frequency Ratio (*)
Kf2
Kf3
RT0, RT0-1, RT1 = 10 kW
RT0, RT0-1, RT1 = 200 kW
SS
—
= V
= –1.5 V, Ta = –40 to +85°C unless otherwise specified)
SS1
Min. Typ. Max.
2.0
1.0
165
41.8
2.55
3.89
0.990
0.0561
——
10
221
52.2
3.04
4.18
1.0
0.0584
—
256
60.6
3.53
4.35
1.010
0.0637
Unit
kW
kW
kHz
kHz
kHz
—
—
—
Measur-
ing
Circuit
5
* Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
Kfx =
(RT0–CS0 Oscillation)
f
OSCX
f
(RS0–CS0 Oscillation)
OSCX
x = 1, 2, 3
f
(RT0-1–CS0 Oscillation)
OSCX
,,
f
(RS0–CS0 Oscillation)
OSCX
f
(RT1–CS1 Oscillation)
OSCX
f
(RS1–CS1 Oscillation)
OSCX
21/40
Page 22
¡ Semiconductor MSM64162A
Measuring circuit 5
(CROSC1) (CROSC0)
RT1
RS1
CS1
RI1
RT1 RS1 CS1 IN1 IN0 CS0 RS0 CRT0 RT0
RESET
TST1
TST2
P0.0
D. U. T.
P0.1
RI0
CS0
RS0
CT0
RT0-1
P3.3
RT0
Frequency
Measurement
(f
)
OSCX
P0.2
Oscillation Mode Designation
P0.3
V
DD
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
C
= 0.1 mF
l
V
SSL
V
C
l
SS
V
SS1
22/40
Page 23
¡ Semiconductor MSM64162A
ABSOLUTE MAXIMUM RATINGS (3.0 V Spec.)
(V
= 0 V)
DD
Parameter Symbol Condition Rating Unit
Power Supply Voltage 1 V
Power Supply Voltage 2 V
Power Supply Voltage 3 V
Power Supply Voltage 4 V
Power Supply Voltage 5 V
Input Voltage 1 V
Input Voltage 2 V
Input Voltage 3 V
Output Voltage 1 V
Output Voltage 2 V
Output Voltage 3 V
Output Voltage 4 V
Output Voltage 5 V
Storage Temperature T
SS
SS1
SS2
SS3
SSL
IN1
IN2
IN3
OUT1
OUT2
OUT3
OUT4
OUT5
STG
Ta = 25°C –4.0 to +0.3 V
Ta = 25°C –2.0 to +0.3 V
Ta = 25°C –4.0 to +0.3 V
Ta = 25°C –5.5 to +0.3 V
Ta = 25°C –4.0 to +0.3 V
V
Input, Ta = 25°C V
SS
V
Input, Ta = 25°C V
SS2
V
Input, Ta = 25°C V
SSL
V
Output, Ta = 25°C V
SS
V
Output, Ta = 25°C V
SS1
V
Output, Ta = 25°C V
SS2
V
Output, Ta = 25°C V
SS3
V
Output, Ta = 25°C V
SSL
—
– 0.3 to +0.3 V
SS
– 0.3 to +0.3 V
SS2
– 0.3 to +0.3 V
SSL
– 0.3 to +0.3 V
SS
– 0.3 to +0.3 V
SS1
– 0.3 to +0.3 V
SS2
– 0.3 to +0.3 V
SSL
– 0.3 to +0.3 V
SSL
–55 to +150 °C
RECOMMENDED OPERATING CONDITIONS (3.0 V Spec.)
Parameter Symbol Condition Range Unit
Operating Temperature T
Operating Voltage
External 400 kHz RC Oscillator
Resistance
Crystal Oscillation Frequency f
op
Using LCD driver with
V
SS
V
SS2
"duty 1/2"
,
Except using LCD driver
with "duty 1/2"
R
OS
XT
— –40 to +85 °C
— 90 to 500 kW
— 30 to 66 kHz
–3.5 to –2.2
–3.5 to –2.0
(V
DD
= 0 V)
V
23/40
Page 24
¡ Semiconductor MSM64162A
ELECTRICAL CHARACTERISTICS (3.0 V Spec.)
DC Characteristics
Parameter
V
Voltage V
SS1
Voltage V
V
SS3
Voltage V
V
SSL
Crystal Oscillation
Start Voltage
Crystal Oscillation
Hold Voltage
Crystal Oscillation
Stop Detection Time
Internal Crystal
Oscillator Capacitance
External Crystal
Oscillator Capacitance
Internal Crystal
Oscillator Capacitance
Internal 400k RC
Oscillator Capacitance
400k RC Oscillation
Frequency
POR Generation
Voltage
POR Non-generation
Voltage
Battery Check
Reference Voltage
Temperature
V
RB
Variation
Symbol
SS1Ca
SS3Ca
SSL
V
STA
V
HOLD
T
STOP
C
G
C
GEX
C
D
C
OS
f
OSC
V
POR1
V
POR2
V
RB
DV
RB
(V
= 0 V, V
DD
SS
= V
= –3.0 V, Ta = –40 to +85°C unless otherwise specified)
SS2
Condition Min. Typ. Max. Unit
+100%
, Cb, C
= 0.1 mF –1.7 –1.5 –1.3 V
12
–50%
+100%
, Cb, C
= 0.1 mF –4.7 –4.5 –4.3 V
12
–50%
— –1.9 –1.3 –0.6 V
Oscillation start time:
within 5 seconds
— — –2.0 V
— — — –2.0 V
— 0.1 — 1000 ms
— 101520pF
When external CG used 10 — 30 pF
— 101520pF
— 8.0 12 16 pF
External resistor R
= –2.0 to –3.5 V
V
SS
When VSS is between V
and –3.0 V
= 100 kW
OS
POR1
300 400 620 kHz
–0.7 — 0 V
No POR when VSS is between
V
POR2
and –3.0 V
–3.0 — –2.0 V
Ta = 25°C –0.73 –0.63 –0.53 V
— –2.0 — mV/°C—
Measuring
Circuit
1
2
Notes: 1. "POR" denotes Power On Reset.
2. "T
" indicates that if the crystal oscillator stops over the value of T
STOP
system reset occurs.
STOP
, the
24/40
Page 25
¡ Semiconductor MSM64162A
DC Characteristics (continued)
Parameter
Symbol
Supply Current 1 I
Supply Current 2 I
Supply Current 3 I
Supply Current 4 I
Supply Current 5 I
(VDD = 0 V, VSS = V
Condition Min. Typ. Max. Unit
CPU in halt state
DD1
(400k RC oscillation halt)
CPU in operating state
DD2
(400k RC oscillation halt)
CPU in operating state
(400k RC oscillation in operation)
DD3
R
= 100k
OS
CPU in halt state
(400k RC oscillation
halt), RC oscillator for
DD4
A/D converter is in
operating state
W
Battery check circuit in operating
state, CPU in operating state
DD5
(400k RC oscillation halt)
= –3.0 V, Ta = –40 to +85°C unless otherwise specified)
SS2
Ta = –40 to +40°C
Ta = +40 to +85°C
Ta = –40 to +40°C
Ta = +40 to +85°C
RT0 = 10 k
RT0 = 2 k
W
W
— 1.5 4.5
— 1.5 30
— 5.0 15
— 5.0 40
— 220 450
— 300 450
— 1300 2000
— 55 150
m
A
m
A
m
A
m
A
m
A
m
A
m
A
m
A
Measuring
Circuit
1
25/40
Page 26
¡ Semiconductor MSM64162A
DC Characteristics (continued)
(V
DD
= 0 V, V
SS1
= V
= –1.5 V, V
SSL
SS
= V
= –3.0 V, V
SS2
Ta = –40 to +85°C unless otherwise specified)
= –4.5 V,
SS3
Parameter
(Pin Name)
Output Current 1
(P1.0)
Output Current 2
(P1.1 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Output Current 3
(BD)
Output Current 4
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
Output Current 5
(When L16 to L23 are
configured as output
ports)
Output Current 6
(OSC2)
Symbol Condition Unit
I
OH1
I
OL1
I
OH2
I
OL2
I
OH3
I
OL3
I
OH4
I
OL4
I
OH5
I
OL5
I
OH6
I
OL6
V
= –0.5 V
OH1
V
= V
+ 0.5 V 3.0 8.0 25 mA
SS
= –0.5 V
= V
+ 0.5 V 0.4 1.5 6.0 mA
SS
= –0.7 V –6.0 –2.0 –0.4 mA
= V
+ 0.7 V 0.4 2.0 6.0 mA
SS
= –0.1 V –2.5 –0.8 –0.3 mA
= V
+ 0.1 V 0.3 0.8 2.5 mA
SS
= –0.5 V –1.5 –0.6 –0.15 mA
= V
+ 0.5 V 0.15 0.6 1.5 mA
SS
= –0.5 V –6.0 –2.0 –0.4 mA
= VSS + 0.5 V 0.4 2.0 6.0 mA
V
V
V
V
V
V
V
V
V
V
OL1
OH2
OL2
OH3
OL3
OH4
OL4
OH5
OL5
OH6
OL6
Min. Typ. Max.
–6.0 –1.5 –0.4 mA
–6.0 –1.5 –0.4 mA
Measuring
Circuit
2
Output Current 7
(L0 to L23)
Output Leakage Current
(P1.0 to P1.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
(RT0, RT1, RS0, RS1,
CRT0, CS0, CS1)
I
OH7
I
OMH7VOMH7
I
OMH7SVOMH7S
I
OML7VOML7
I
OML7SVOML7S
I
OL7
I
OOH
I
OOL
V
V
V
V
OH7
OL7
OH
OL
= V
= V
= V
= –0.2 V
= V
SS1
= V
SS1
= V
SS2
= V
SS2
+ 0.2 V
SS3
DD
SS
+ 0.2 V
– 0.2 V
+ 0.2 V
– 0.2 V
(VDD level)
(V
level)
SS1
(V
level)
SS1
(V
level)
SS2
(V
level)
SS2
(V
level)
SS3
— — –4.0 mA
4.0 — — mA
— — –4.0 mA
4.0 — — mA
— — –4.0 mA
4.0 — — mA
— — 0.3 mA
–0.3 — — mA
26/40
Page 27
¡ Semiconductor MSM64162A
DC Characteristics (continued)
Parameter
(Pin Name)
Input Current 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Input Current 2
(IN0, IN1)
Input Current 3
(OSC1)
Symbol
I
IH1
I
IL1
I
IH1Z
I
IL1Z
I
IH2
I
IH2Z
I
IL2Z
I
IL3
I
IH3Z
I
IL3Z
(V
DD
= 0 V, V
SS1
= V
= –1.5 V, V
SSL
SS
= V
= –3.0 V, V
SS2
= –4.5 V,
SS3
Ta = –40 to +85°C unless otherwise specified)
Condition Unit
V
= V
IH1
V
IL1
V
IH1
V
IL1
V
IH2
V
IH2
(when pulled down)
DD
= V
(when pulled up) –300 –60 –20
SS
= V
(in a high impedance state)
DD
= V
(in a high impedance state)
SS
= V
(when pulled down) 20 60 300
DD
= V
(in a high impedance state)
DD
Min. Typ. Max.
20 60 300
0 — 1.0
–1.0 — 0
0 — 1.0
m
m
m
m
m
m
Measuring
Circuit
A
A
A
A
A
A
3
V
= V
(in a high impedance state)
IL2
SS
V
= V
IL3
V
IH3
V
IL3
(when pulled up) –300 –110 –30
SS
(in a high impedance state)
= V
DD
= V
(in a high impedance state)
SS
–1.0 — 0
0 — 1.0
–1.0 — 0
A
m
A
m
A
m
A
m
Input Current 4
(
RESET, TST1, TST2
Input Voltage 1
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Input Voltage 2
(IN0, IN1, OSC1)
Input Voltage 3
(RESET, TST1, TST2)
I
)
I
V
V
V
V
V
V
IH4
IL4
IH1
IL1
IH2
IL2
IH3
IL3
V
= V
IH4
DD
V
= V
IL4
SS
0 — 1.0
m
–3.0 –1.5 –0.75 mA
A
— –0.6 — 0 V
— –3.0 — –2.4 V
— –0.6 — 0 V
4
— –3.0 — –2.4 V
— –0.6 — 0 V
— –3.0 — –2.4 V
27/40
Page 28
¡ Semiconductor MSM64162A
DC Characteristics (continued)
(V
= 0 V, V
DD
SS1
= V
= –1.5 V, V
SSL
SS
= V
= –3.0 V, V
SS2
SS3
Ta = –40 to +85°C unless otherwise specified)
= –4.5 V,
Parameter
(Pin Name)
Hysteresis Width
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Hysteresis Width
(RESET, TST1, TST2)
Input Pin Capacitance
(P0.0 to P0.3)
(P2.0 to P2.3)
(P3.0 to P3.3)
Symbol
DV
T1
DV
T2
C
IN
Condition Unit
Min. Typ. Max.
— 0.2 0.5 1.0 V
— 0.2 0.5 1.0 V
— — — 5.0 pF
Measuring
Circuit
4
1
28/40
Page 29
¡ Semiconductor MSM64162A
Measuring circuit 1
CS0
RT0 RI0
R
OS
C
l
V
Measuring circuit 2
OSC1
OSC2
V
SSL
RT0 CS0 IN0
XT
Crystal
32.768 kHz
XT
C1
C
12
C2
V
DD
V
SS
A
V
V
SS2
SS1
C
a
V
SS3
C
b
V V
C
l
Ca, Cb, C
R
OS
RT0
CS0
RI0
12
: 0.47 mF
: 0.1 mF
: 100 kW
: 10 kW/2 kW
: 820 pF
: 10 kW
(*2)
V
IH
(*1)
OUTPUT
A
INPUT
V
IL
V
DD
V
SS
V
SS1
V
SS2
V
SS3
V
SSL
29/40
Page 30
¡ Semiconductor MSM64162A
Measuring circuit 3
(*3)
A
Measuring circuit 4
V
IH
(*3)
V
IL
INPUT
V
DD
INPUT
OUTPUT
V
SS
V
SS1
V
SS2
V
SS3
V
SSL
Waveform
OUTPUT
Monitoring
V
DD
V
SS
V
SS1
V
SS2
V
SS3
*1 Input logic circuit to determine the specified measuring conditions.
*2 Measured at the specified output pins.
*3 Measured at the specified input pins.
V
SSL
30/40
Page 31
¡ Semiconductor MSM64162A
(
)
A/D Converter Characteristics
(V
= 0 V, V
DD
SS
= V
= –3.0 V, Ta = –40 to +85°C unless otherwise specified)
SS2
Parameter Symbol Condition
Min. Typ. Max.
Unit
Measur-
ing
Circuit
RS0, RS1,
Resistor
for Oscillation
RT0,
RT0-1,
CS0, CT0, CS1 ≥ 740 pF
1.0
——
kW
RT1
Input Current
Limiting Resistor
RI0, RI1
—
1.0
10
—
kW
5
Oscillation
Frequency
f
OSC1
f
OSC2
f
OSC3
Kf1
Resistor for oscillation = 2 kW
Resistor for oscillation = 10 kW
Resistor for oscillation = 200 kW
RT0, RT0-1, RT1 = 2 kW
200
46.5
2.79
4.115
239
55.4
3.32
4.22
277
64.3
3.85
4.326
kHz
kHz
kHz
—
RS•RT Oscillation
Frequency Ratio(*)
Kf2
Kf3
RT0, RT0-1, RT1 = 10 kW
RT0, RT0-1, RT1 = 200 kW
0.990
0.0573
1.0
0.0616
1.010
0.0659
—
—
* Kfx is the ratio of the oscillation frequency by a sensor resistor to the oscillation frequency
by a reference resistor in the same condition.
Kfx =
f
(RT0–CS0 Oscillation)
OSCX
f
(RS0–CS0 Oscillation)
OSCX
x = 1, 2, 3
f
(RT0-1–CS0 Oscillation)
OSCX
,,
(RS0–CS0 Oscillation)
f
OSCX
f
(RT1–CS1 Oscillation)
OSCX
(RS1–CS1 Oscillation)
f
OSCX
31/40
Page 32
¡ Semiconductor MSM64162A
Measuring circuit 5
(CROSC1) (CROSC0)
RT1
RS1
CS1
RI1
RT1 RS1 CS1 IN1 IN0 CS0 RS0 CRT0 RT0
RESET
TST1
TST2
P0.0
D. U. T.
P0.1
RI0
CS0
RS0
CT0
RT0-1
P3.3
RT0
Frequency
Measurement
(f
)
OSCX
P0.2
Oscillation Mode Designation
P0.3
V
DD
RT0, RT0-1, RT1 = 2 kW/10 kW/200 kW
RS0, RS1 = 10 kW
RI0, RI1 = 10 kW
CS0, CT0, CS1 = 820 pF
C
= 0.47 mF
l
V
SSL
V
C
l
SS
V
SS2
32/40
Page 33
¡ Semiconductor MSM64162A
RECOMMENDED OPERATING CONDITIONS (When Voltage Regulator for LCD
Driver Used)
(V
= 0 V)
DD
Parameter Symbol Condition Range Unit
Operating Temperature T
Operating Voltage V
External 400 kHz RC Oscillator
Resistance
Crystal Oscillation Frequency f
op
SS
V
= –1.7 V to –1.25 V 250 to 500
R
OS
XT
SS
= –3.5 V to –2.0 V 90 to 500
V
SS
— –40 to +85 °C
— –3.5 to –1.25 V
kW
— 30 to 66 kHz
ELECTRICAL CHARACTERISTICS (When Voltage Regulator for LCD Driver Used)
DC Characteristics
(V
= 0 V, V
DD
Parameter Symbol Condition Unit
Voltage
V
SS1
Voltage V
V
SS2
V
Voltage V
SS3
Supply
Current 1
Supply
Current 2
V
SS1VSS
DV
SS1
SS2VSS
SS3VSS
I
DD1
I
DD2
= –3.5 to –1.25, Ta = 25°C V
—
= –3.5 to –1.25 VTyp. – 0.1 2 ¥ V
= –3.5 to –1.25 VTyp. – 0.2 3 ¥ V
= –1.5 V
V
SS
(CPU in halt state)
= –3.0 V
V
SS
(CPU in halt state)
= –1.5 V
V
SS
(CPU in operating state)
= –3.0 V
V
SS
(CPU in operating state)
Ta = –40 to +40°C
Ta = +40 to +85°C
Ta = –40 to +40°C
Ta = +40 to +85°C
Ta = –40 to +40°C
Ta = +40 to +85°C
Ta = –40 to +40°C
Ta = +40 to +85°C
= –3.0 V, Ta = –40 to +85°C unless otherwise specified)
SS
Min. Typ. Max.
–1.35 –1.2 –1.05
—–4—
Typ. + 0.1
SS1
Typ. + 0.2
SS1
mV/°C
— 2.5 7.5
— 2.5 35
mA
— 2.3 7.5
— 2.3 35
—515
—540
mA
—515
—540
Mea-
suring
Circuit
1
* The other electrical characteristics are the same as those for the 1.5 V and 3.0 V specifications.
33/40
Page 34
¡ Semiconductor MSM64162A
Measuring circuit 1
CS0
RT0 RI0
RT0 CS0 IN0
OSC1
XT
Crystal
32.768 kHz
R
OS
OSC2
XT
C1
C
12
C2
V
SSL
V
C
l
V
DD
V
SS
V
A
C
a
SS1
V
SS2VSS3
C
b
C
V
l
Ca, Cb, Cc, C
R
OS
C
c
RT0
CS0
RI0
: 0.47 mF
: 0.1 mF
12
: 100 kW
: 10 kW/2 kW
: 820 pF
: 10 kW
34/40
Page 35
¡ Semiconductor MSM64162A
FUNCTIONAL DESCRIPTION
• A/D converter (ADC)
The MSM64162A has a built-in 2-channel RC oscillation type A/D converter. The A/D converter
is composed of a 2-channel oscillation circuit, Counter A (CNTA0-4, a 4.8-digit decade counter),
Counter B (CNTB0-3, a 14-bit binary counter), and A/D Converter Control Registers 0 and 1
(ADCON0, ADCON1).
By counting oscillation frequencies that vary depending on a resistor or capacitor connected to
the RC oscillation circuit, the A/D converter converts resistance values or capacitance values to
corresponding digital values. By using a thermistor or humidity sensor as a resistance, a
thermometer or a hygrometer can be constructed. By applying a separate sensor to each channel
of the 2-channel RC oscillation circuit, it is also possible to extend measure ranges or measure at
two places.
• LCD driver (LCD)
The MSM64162A has a built-in LCD driver for 24 outputs.
The LCD driver consists of 21 ¥ 4-bit display registers (DSPR0-20), the Display Control Register
(DSPCON), a 24-output LCD driver circuit, and a bias generation circuit (BIAS).
The bias generation circuit for LCD driver (BIAS) generates bias voltages for the LCD driver by
rising or dropping the power supply voltage by externally installing capacitors. Alternatively,
it generates bias voltages by rising the constant voltage (V
regulator for LCD driver. Which way is to be used is specified by mask option.
There are three types of driving methods: 1/4 duty, 1/3 duty and 1/2 duty. Software selects the
duty mode.
A mask option can select either a common driver or a segment driver for each LCD driver pin.
A mask option can also specify assignment of each bit of the display register to each segment.
All the display registers must be selected by a mask option.
L16 to L23 of the LCD driver can be configured to be output ports by a mask option.
The relationship between the duty, the bias method, and the maximum segment number follows:
1/4 duty 1/3 bias method ------- 80 segments
1/3 duty 1/3 bias method ------- 63 segments
1/2 duty 1/2 bias method ------- 44 segments
= –1.2 V) generated by the voltage
SS1
• Buzzer driver (BD)
The MSM64162A has a built-in buzzer driver with 2 buzzer output frequencies and 4 buzzer
output modes. Each buzzer output is selected by the Buzzer Control Register (BDCON) and the
Buzzer Frequency Control Register (BFCON).
• Capture circuit (CAPR)
The MSM64162A captures 32 Hz to 256 Hz output of the time base counter at the falling of Port
0.0 or 0.1 (P0.0 or P0.1) to "L" level when the pull-up resistor input is chosen, or at the rising to
"H" level when the pull-down resistor input is chosen. The capture circuit is composed of the
Capture Control Register (CAPCON) and the Capture Registers (CAPR0, CAPR1) that fetch
output from the time base counter.
• Watchdog timer (WDT)
The MSM64162A has a built-in watchdog timer to detect CPU malfunction. The watchdog timer
is composed of a 6-bit watchdog timer counter (WDTC) to count a 16 Hz output and a watchdog
timer control register (WDTCON) to reset WDTC.
35/40
Page 36
¡ Semiconductor MSM64162A
• Clock generation circuit (2CLK)
The clock generation circuit (2CLK) in the MSM64162A contains a 32.768 kHz crystal oscillation
circuit, a 400 kHz RC oscillation circuit, and a clock control port. This circuit generates the system
clock (CLK) and the time base clock (32.768 kHz).
The system clock drives the CPU while the time base clock drives the time base counter and the
buzzer driver.
Via the contents of the frequency Control Register (FCON), the system clock can be switched
between 32.768 kHz (the output of the crystal oscillation circuit) and 400 kHz (the output of the
RC oscillation circuit).
Note: The oscillation frequency of the RC oscillation circuit varies depending on the value of
an external resistor (ROS), operating power supply voltage (VDD), and ambient
temperatures (Ta).
• Time base counter (TBC)
The MSM64162A has a built-in time base counter (TBC) that generates clocks to be supplied to
internal peripheral circuits. The time base counter is composed of 15 binary counters. The count
clock of the time base is driven by the oscillation clock (32.768 kHz) of the crystal oscillation
circuit. The output of the time base counter is used for the buzzer driver, the system reset circuit,
the watchdog timer, the time base interrupt, the sampling clocks of each port, and the capture
circuit.
• I/O port
Input-output ports (P2, P3) (8 bits) : Pull-up (pull-down) resistor input or high-
impedance input, CMOS output or NMOS
open drain output: these can be specified for
each bit; external 0 interrupt
Input port (P0) (4 bits) : Pull-up (pull-down) resistor input or high-
impedance input; external 1 interrupt
Output port (P1) (4 bits) : CMOS output or NMOS open drain output
• Interrupt (INTC)
The MSM64162A has 9 interrupt sources (9 vector addresses), of which two are external
interrupts from ports and seven are internal interrupts.
Of the nine interrupt sources, only the watchdog interrupt cannot be disabled (non-maskable
interrupt). The other eight interrupts are controlled by the master interrupt enable flag (MI) and
the interrupt enable registers (IE0, IE1 and IE2). When an interrupt condition is met, the CPU
branches to a vector address corresponding to the interrupt source.
• Battery check circuit (BC)
The battery check circuit (BC) detects the level of the supply voltage by comparing the voltage
generated by an external supply-voltage dividing resistor (RBLD) with the internal reference
voltage (Vrb).
36/40
Page 37
37/40
¡ Semiconductor MSM64162A
APPLICATION CIRCUITS
1.5 V Spec. Application Circuit
L23 L0
OSC2
OSC1
XT
XT
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
TST1
TST2
V
SSL
V
SS1
V
SS2
V
SS3
C1
C2
V
DD
1.5 V
C1
C
12
C
b
C
l
R
OS
Crystal
32.768 kHz
Switch matrix (4 ¥ 4)
RT1 RS1 CS1 RI1
RS0
RT0
Buzzer
OSC monitor
IN0
CS0
RS0
CRT0
RT0
IN1
CS1
RS1
RT1
BD
P3.3
MSM64162A-xxx
(1.5 V spec.)
L C D
C
a
RI0
CS0
• Temperature
measurement
by two thermistors
• C
G
of crystal
oscillator : Internal
V
SS
Page 38
38/40
¡ Semiconductor MSM64162A
RT1 RS1 CS1 RI1
L23 L0OSC2
OSC1
XT
XT
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
TST1
TST2
V
SSL
V
SS1
V
SS2
V
SS3
C1
C2
V
DD
3 V
C2
C
12
C
b
C
a
C
l
R
OS
Crystal
32.768 kHz
C
GEX
RI0
RT0
RBLD
Buzzer
OSC monitor
IN0
CS0
RS0
CRT0
RT0
IN1
CS1
RS1
RT1
BD
P3.3
P3.1
MSM64162A-xxx
(3.0 V spec.)
L C D
CS0
RS0
• Temperature
measurement
by two thermistors
• Battery check
circuit is used
• C
GEX
of crystal
oscillator : External
Switch matrix (4 ¥ 4)
V
SS
APPLICATION CIRCUITS (continued)
3.0 V Spec. Application Circuit
Page 39
39/40
¡ Semiconductor MSM64162A
APPLICATION CIRCUITS (continued)
RT1 RS1 CS1 RI1
L23 L0OSC2
OSC1
XT
XT
RESET
P1.0
P1.1
P1.2
P1.3
P0.0
P0.1
P0.2
P0.3
TST1
TST2
V
SSL
V
SS1
V
SS2
V
SS3
C1
C2
V
DD
3 V
C2
C
12
C
c
C
a
C
l
R
OS
Crystal
32.768 kHz
C
GEX
RI0
RT0
RBLD
Buzzer
OSC monitor
IN0
CS0
RS0
CRT0
RT0
IN1
CS1
RS1
RT1
BD
P3.3
P3.1
MSM64162A-xxx
(3.0 V spec.)
L C D
CS0
RS0
• Temperature
measurement
by two thermistors
• Battery check
circuit is used
• C
GEX
of crystal
oscillator : External
Switch matrix (4 ¥ 4)
V
SS
C
b
3.0 V Spec. Application Circuit
(Voltage Regulator for LCD Driver Used)
Page 40
¡ Semiconductor MSM64162A
PACKAGE DIMENSIONS
(Unit : mm)
QFP80-P-1420-0.80-BK
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
1.27 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
40/40
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