Datasheet MSM6408-xxxRS, MSM6408-xxxGS-2K, MSM6408-xxxGS-K Datasheet (OKI)

E2E0014-38-93

¡ Semiconductor

This version: Sep. 1998

Previous version: Mar. 1996

MSM6408¡ Semiconductor

MSM6408

High speed and High performance 4-Bit Microcontroller

GENERAL DESCRIPTION

The MSM6408 microcontroller is a low-power, single-chip device implemented in complementary
metal-oxide semiconductor technology.
The MSM6408 is optimized for high-speed processing and complicated-control applications, in
which conventional microcontrollers are difficult to use.

FEATURES

• Mask ROM : 8096 words ¥ 8 bits

• RAM (including the stack area) : 256 words ¥ 4 bits

• I/O port
Input-output port : 8 ports ¥ 4 bits
Input port : 1 port ¥ 4 bits

4 bits are for input ports having a latch; the other 32 bits are for input/output ports that
allow bit manipulation

• Three built-in counters : 12-bit time-base counter

12-bit programmable timer
8-bit high-speed programmable timer/event

counter

• Built-in 8-bit serial I/O register (with 3-bit counter)

• Five interrupts with five priority levels (4 internal, 1 external)

• 32 stack levels (in RAM)

• Power down features

• Minimum instruction execution time : 1.0 ms @ 4.0 MHz clock

• Instruction systems suitable for control

• Fully static operation

• Low power consumption

• Single 5 V power supply

• Package options:
42-pin plastic DIP (DIP42-P-600-2.54) (Product name : MSM6408-¥¥¥RS)
44-pin plastic QFP (QFP44-P-910-0.80-K) (Product name : MSM6408-¥¥¥GS-K)
44-pin plastic QFP (QFP44-P-910-0.80-2K) (Product name : MSM6408-¥¥¥GS-2K)

¥¥¥ indicates a code number.

1/19

BLOCK DIAGRAM

MSM6408¡ Semiconductor

P8

3210

16 ¥ 16 ¥ 4 bits

P7

3210

P6

3210

RAM

DEC

HSP L

P5

3210

P9 8-bit T/C12-bit Timer

P4

3210

P3

3210

C

PA 8-bit SR

P2

3210

INT

P1

3210

TCK

ACC

ALU

CIN

TMO

P0

3210

SCK, CTO, CLK

SO

SI

INSTR

Interrupt

Control

12-bit TBC

DEC

F

PC INTE

PD IRQ

ROM

8096 ¥ 8 bits

DEC

12 0

PC

PB

Timing

&

Control

OSC

0

OSC

1

TEST

RESET

V

DD

GND

2/19

PIN CONFIGURATION (TOP VIEW)

MSM6408¡ Semiconductor

P4.0

P4.1

P4.2

P4.3

P3.0

P3.1

P3.2

P3.3

OSC

OSC

RESET

TEST

P2.0

P2.1

P2.2

P2.3

P0.0
P0.1

P0.2

P0.3

1

2

3

4

5

6

7

8

9

0

10

1

11

12

13

14

15

16

17
18

19

20

21GND P1.022

42

41

40

39

38

37

36

35

34

33
32

31

30

29

28

27

26
25

24

23

V

DD

P5.3

P5.2

P5.1

P5.0

P6.3

P6.2

P6.1

P6.0

P7.3
P7.2

P7.1

P7.0

P8.3

P8.2

P8.1

P8.0
P1.3

P1.2

P1.1

42-Pin Plastic DIP

3/19

PIN CONFIGURATION (TOP VIEW) (continued)

MSM6408¡ Semiconductor

P3.1

P3.2

P3.3

OSC

OSC

RESET

TEST

P2.0

P2.1

P2.2

P2.3

P3.0

P4.3

P4.2

P4.1

44

43

42

41

1

2

3

4

0

5

1

6

7

8

9

10

11

12

13

14

15

P0.0

P0.1

P0.2

P0.3

P4.0

40

16

GND

DD

V

39

17

NC

P5.3

38

18

P1.0

P5.2

37

19

P1.1

P5.1

36

20

P1.2

P5.0

35

21

P1.3

P6.3

34

22

P8.0

33

32

31

30

29

28

27

26

25

24

23

P6.2

P6.1

P6.0

NC

P7.3

P7.2

P7.1

P7.0

P8.3

P8.2

P8.1

NC : No-connection pin

44-Pin Plastic QFP

4/19

MSM6408¡ Semiconductor

PIN DESCRIPTIONS

Symbol Type Description During reset

P0.0
P0.1/SCK

P0.2/SO

I/O

P0.3/SI
P1.0/CIN
P1.1/TMO P1.1 is shared with timer output (TMO).
P1.2/TCK

I/O

P1.3
P2.0/INT

P2.1

I

P2.3

P3.0 to 3.3

P4.0 to 4.3

P5.0 to 5.3

P6.0 to 6.3

P7.0 to 7.3

OSC

0

OSC

1

I/O

I/O

I/O

I/O

I/O

I/O

I

O

P0.1 is shared with serial clock (SLK) input/output.

P0.2 is shared with serial data (SO) output.

P0.3 is shared with serial data (SI) input.
P1.0 is shared with counter input (CIN).

P1.2 is shared with timer clock input (TCK).

P2.0 is shared with external interrupt input (INT).

Input ports with a latch, with built-in pull-up resistor.P2.2

—

—

—

—

—

—

Crystal connection pins for clock oscillation.

The latch is

reset.

Oscillation

waveform

"1"

"1"

"1"

"0"

"0"

"0"

"0"

"0"P8.0 to 8.3

TEST

RESET

V

DD

—

O

I

Input pin for system reset.

Power supply voltage pins.

GND

Note: 1. The pins except for pins P2.0 to P2.3 are pseudo bidirectional ports.

2. When each port is used for output, the MSM6408 can drive one TTL (one input).

Pulse output(Test pin for manufacturer)

—

—

5/19

INSTRUCTION LIST

Mnemonic Byte DescriptionCode Cycle

LAI n 1 A¨n9n 1

LLI n 1 L¨n8n 1

LHLI nn 2 HL¨nn15nn 2

LMI nn 2 M(w)¨nn14nn 2

LAL 1 A¨L21 1

LLA 1 L¨A2D 1

LAH 1 A¨H22 1

LHA 1 H¨A2E 1

LAM 1 A¨M38 1

LMA 1 M¨A2F 1

LAM+ 1 A¨M, L¨L + 1,Skip if L = 024 1

LAM– 1 A¨M, L¨L – 1,Skip if L = F25 1

LMA+ 1 M¨A, L¨L + 1,Skip if L = 026 1

LMA– 1 M¨A, L¨L – 1,Skip if L = F27 1

Load, Push, PopExchange

LAMM n

LAMD mm 2 A¨Md10mm 2

LMAD mm 2 Md¨A11mm 2

LMTD mm 2 Md(w)¨T (M(w), A), T = ROM table19mm 3

LMCT 2 M(w)¨CT3E59 2

LCTM 2 CT¨M(w)3E51 2

LMSR 2 M(w)¨SR3E5A 2

LSRM 2 SR¨M(w)3E52 2

LTMM 2 TM¨(M(w), A)3E50 2

PUSH 1 ST¨C, A, H, L, SP¨SP – 41C 3

POP 1 C, A, H, L, ¨ST SP¨SP + 41D 3

X1A´M28 1

XM n

X+ 1 A´M, L¨L+1, Skip if L = 03C 1

X– 12C 1

INA 1 A¨A + 1, Skip if A = 030 1

INM 1 A¨M + 1, Skip if M = 033 1

INL 1 L¨L + 1, Skip if L = 031 1

Decrement

Increment/

2

2

39-3B 1

29-2B 1

1A¨M, H¨H n

1A´M, H¨H n

MSM6408¡ Semiconductor

2

2

A´M, L¨L–1, Skip if L = F

6/19

INSTRUCTION LIST (continued)

Mnemonic Byte DescriptionCode Cycle

INH 1 H¨H + 1, Skip if M = 032 1

INMD mm 2 Md¨Md + 1, Skip if Md = 012mm 2

DCA 1 A¨A – 1, Skip if A = F34 1

DCM 1 M¨M – 1, Skip if M = F37 1

DCL 1 L¨L – 1, Skip if L = F35 1

DCH 1 H¨H – 1, Skip if H = F36 1

Increment/DecrementBit manipulation

DCMD mm 2 Md¨Md – 1, Skip if Md = F13mm 2

ADS 1 A¨A + M, Skip if Cy = 102 1

ADCS 1 A, C¨A + M + C, Skip if Cy =101 1

ADC 1 A, C¨A + M + C03 1

AIS n 2 A¨A + n, Skip if Cy = 13E4n 2

DAA 1 A¨A + 606 1

DAS 1 A¨A + 100A 1

AND 1 A¨A M0D 1

OR 1 A¨A M05 1

EOR 1 A¨A M04 1

ArithmeticCompare

CMA 1 A¨A0B 1
CIA 1 A¨A + 10C 1

RAL 1 Rotate left with C0E 1

RAR 1 Rotate right with C0F 1

TC 1 Skip if C = 109 1

SC 1 C¨107 1

RC 1 C¨008 1

CAI n 2 Skip if A = n3E0n 2

CLI n 2 Skip if L = n3E2n 2

CPI p, n 2 Skip if Pp = n17pn 2

CMI n 2 Skip if M = n3E1n 2

CAM 1 Skip if A = M16 1

TAB n

2

RAB n

2

SAB n

2

TMB n

2

RMB n

2

154-57 1

1 Abit (n2)¨064-67 1

1 Abit (n2)¨174-77 1

1 Skip if Mbit (n2) = 158-5B 1

1 Mbit (n2)¨068-6B 1

MSM6408¡ Semiconductor

Skip if Abit (n2) = 1

7/19

INSTRUCTION LIST (continued)

Mnemonic Byte DescriptionCode Cycle

SMB n 1 Mbit (n

TFB n

2

RFB n

2

SFB n

2

TPB n

2

RPB n

2

SPB n

Bit manipulation

Interrupt

2

TPBD pn

RPBD pn

SPBD pn

2

2

2

0-3

4-7

MEI 2 MEIF¨13E60 2

MDI 2 MEIF¨03E61 2

EITB 2 EITBF¨13DC9 2

EITM 2 EITMF¨13DCA 2

EICT 2 EICTF¨13DCB 2

EIEX 2 EIEXF¨13DC8 2

DITB 2 EITBF¨03DC5 2

DITM 2 EITMF¨03DC6 2

DICT 2 EICTF¨03DC7 2

DIEX 2 EIEXF¨03DC4 2

TITB 2 Skip if EITBF = 13DC1 2

TITM 2 Skip if EITMF = 13DC2 2

TICT 2 Skip if EICTF = 13DC3 2

TIEX 2 Skip if EIEXF = 13DC0 2

TQEX 2 Skip if IRQEX = 13D20 2

TQTB 2 Skip if IRQTB = 13DD0 2

TQTM 2 Skip if IRQTM = 13DD1 2

TQCT 2 Skip if IRQCT = 13DD2 2

TQSR 23DD3 2

RQEX 23D24 2

RQTB 23DD4 2

RQTM 23DD5 2

RQCT 23DD6 2

RQSR 23DD7 2

)¨178-7B 1

2

1 Skip if Fbit (n2) = 15C-5F 1

1 Fbit (n2)¨06C-6F 1

1 Fbit (n2)¨17C-7F 1

1 Skip if Pbit (n2) = 150-53 1

1 Pbit (n2)¨060-63 1

1 Pbit (n2)¨170-73 1

2 Skip if Ppbit (n2) = 130 p

2 Ppbit (n2) = 03D p

2

2

2 Ppbit (n2) = 13D p8-B2

Skip if IRQSR = 1

IRQ EX¨0

IRQ TB¨0

IRQ TM¨0

IRQ CT¨0

IRQ SR¨0

MSM6408¡ Semiconductor

8/19

INSTRUCTION LIST (continued)

Mnemonic Byte DescriptionCode Cycle

ECT 2 CTF¨1 (start)3DBB 2

ESR 2 SRF¨1 (start)3DBA 2

DCT 2 CTF¨0 (stop)3DB7 2

control

DSR 2 SRF¨0 (stop)3DB6 2

TCT 2 Skip if CTF = 13DB3 2

TSR 2 Skip if SRF = 13DB2 2

Counter/Shift register

JCP a

6

JP a

12

LJP a

13

CZP a 1 ST¨PC + 1, PC¨2a, SP¨SP – 4Ba 4

CAL a

Branch

12

RT 1 PC¨ST, SP¨SP + 4IE 4

RTS 1 PC¨ST, SP¨SP + 4, Unconditional skipIF 4

JA 1 PC¨(PC¨A) + 1IA 1

JM 1 PC¨(M(w), A)IB 2

IP 1 A¨P20 1

IPD p 2 A¨Pp3DpD 2

OP 1 P¨A23 1

Input/Output

OPD p 2 Pp¨A3DpC 2

NOP 1 No operation00 1

HALT 2 Halt CPU3DB8 2

CPU

control

STOP 2 Stop clock3DB9 2

C0-FF 1

4a

12

3F 4

12

1PC¨a

2PC¨a

2

3PC¨a

2ST¨PC + 2, PC¨a12, SP¨SP – 4Aa

4

MSM6408¡ Semiconductor

6

12

13

Notes: a : ROM address data

m : RAM address data
n : Immediate data
p : Port address data

9/19

ABSOLUTE MAXIMUM RATINGS

Parameter Symbol Condition Rating Unit

Power Supply Voltage V

Input Voltage V

Output Voltage V

DD

I

O

Ta = 25°C

Ta = 25°C per package 200 mW

Power Dissipation P

Storage Temperature T

D

STG

Ta = 25°C per output 50 mW

— –55 to +150 °C

RECOMMENDED OPERATING CONDITIONS

Parameter Symbol Condition Range Unit

f

£ 1 MHz 3 to 6 V

Power Supply Voltage V

Data-Hold Voltage V

DDH

Operating Temperature T

Fan Out N

DD

op

OSC

f

£ 4.0 MHz

OSC

f

= 0 Hz 2 to 6

OSC

—

MOS load 15

TTL load 1

MSM6408¡ Semiconductor

–0.3 to +7 V

–0.3 to V

–0.3 to V

4.5 to 5.5 V

–40 to +85 °C

DD

DD

V

V

V

—

10/19

ELECTRICAL CHARACTERISTICS

DC Characteristics

(V

= 5 V ±10%, Ta = –40 to +85°C)

DD

Parameter Symbol Condition Min. Typ. Max. Unit

"H" Input Voltage V

"H" Input Voltage V

"L" Input Voltage V

"H" Output Voltage V

"L" Output Voltage

"L" Output Voltage

Input Current I

Input Current — — 1/–30

"H" Output Current I

"H" Output Current

Input Capacitance C

Output Capacitance C

Power Supply Current

(In Stopped State)

Power Supply Current I

*1,*2

*3,*4

*1,*5

*1

*5

*3

*2,*4

*1

*1

V

V

IH/IIL

I

IH/IIL

OH

I

OH

I

DDS

DD

IH

IH

IL

OH

OL

OL

— 2.4 — V

— 3.6 — V

— –0.3 — +0.8 V

IO = –15 mA 4.2 — — V

IO = 1.6 mA — — 0.4 V

IO = 15 mA — — 0.4 V

VI = VDD/0 V — — 15/–15 mA

VI = VDD/0 V mA

VO = 2.4 V –0.1 — — mA

VO = 0.4 V — — –1.2 mA

I

O

f = 1 MHz, Ta = 25°C

V

= 2 V, no load, Ta = 25°C

DD

—5—

—7—

— 0.2 5 mA

No load — 1 100 mA

Crystal oscillation

f = 4 MHz, no load

—612mA

DD

DD

MSM6408¡ Semiconductor

V

V

pF

*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8
*2 Applied to P2
*3 Applied to OSC

0

*4 Applied to RESET
*5 Applied to OSC

1

11/19

AC Characteristics

Parameter Symbol Condition Min. Typ. Max. Unit

Clock (OSC

Cycle Time t

Input Data Setup Time t

Input Data Hold Time t

SR/TM Clock Pulse Width t

CT Clock Pulse Width

P2 Input Data Clock Pulse Width t

SR Data Setup Time t

SR Data Hold Time t

Data Delay Time t

Data Delay Time at Mode

Switching

Data Delay Time at OPT

Instruction

Data Delay Time at OPT

Instruction

CT/TM Data Delay Time Using

TBC Clock

SR/TM Data Delay Time Using

PORT Clock

CT Data Delay Time Using

PORT Clock

CT Data Delay Time Using

External Clock

SR/TM Data Delay Time Using

External Clock

SR Clock Invalid Time

INT Invalid Time

) Pulse Width t

0

f

W

CY

DS

DH

WS/tWT

t

WC

WP

SS

SH

DR

t

DCR

t

DI1

t

DI2

t

CT/tTT

t

SR/tTR

t

CR

t

CP

t

SP/tTP

t

SINH

t

IINH

MSM6408¡ Semiconductor

= 5 V ±10%, Ta = –40 to +85°C)

(V

DD

— 125 — — ns

CY

m

ns

ns

ns

ns

ns

ns

—1——

— 120 — — ns

— 120 — — ns

— 120 — — ns

2/8 t

—

+ 120

CY

——ns

— 120 — — ns

— 120 — — ns

— 120 — — ns

CL = 15 pF — — t

CL = 15 pF — —

CL = 15 pF — —

CL = 15 pF — —

CL = 15 pF — —

+ 300 ns

CY

7/8 t

CY

+ 300

6/8 t

CY

+ 300

7/8 t

CY

+ 300

2/8 t

CY

+ 360

CL = 15 pF — — tCY + 480 ns

10/8 t

CL = 15 pF — —

CL = 15 pF — —

+ 480

2/8 t

+ 360

CY

CL = 15 pF — — 360 ns

— 2/8 t

— 1/8 t

CY

CY

——ns

——ns

s

12/19

Timing Diagrams

Output Conditions

OSC

MSM6408¡ Semiconductor

1MC

0

t

CY

P0, P1, P3
P4, P5, P6 PA =
P7, P8

P0.1

PA = 9 or A

P0.2
P1.1

P4 OPT INST.

P5 OPT INST.

P0.1

TBC clock

P1.1

P0.1 clock*

P0.2

P1.2 clock* SRTM

P1.1

0, 1, 3
4

, 5, 6

7 or 8

CT
TM

t

DR

t

DCR

t

DI1

t

DI2

t

CT

t

TT

t

SR

t

TR

P1.0

P0.1

P0.1

P1.0

clock*CT

EXT clock

P1.2 EXT clock

P0.1 CT

P0.2 SR
P1.1 TM

t

SP

t

TP

* Output data to port is clock for SR, TM or CT.

t

CR

t

CP

13/19

Input Conditions

OSC

MSM6408¡ Semiconductor

1MC

0

P0, P1, P2
P3, P4, P5
P6, P7, P8

P0.1 SR clock
P1.2 TM clock
P2

P1.0 CT clock

P0.1 SR clock

P0.3 SI

tfWtf

W

INPUT

DATA

tDSt

DH

t

DW1

t

DW2

INPUT

DATA

tSSt

SH

t

SINH

t

IINH

1MC

OSC

0

t

IINH

t

SINH

: P0.1 (SR clock) INH period during LMSR INST.

(Note: P0.1 is used for clock of SR.)

: P2.0 (interrupt) INH period during RPB and RPBD INST.

14/19

Operating Characteristics

MSM6408¡ Semiconductor

Typ. Current (IOH) vs Voltage (VOH) for High
State Output

–1.0
–0.9
–0.8
–0.7

V

= 6 V

DD

–0.6

(mA)

–0.5

OH

I

–0.4
–0.3
–0.2

5 V

4 V

3 V

–0.1

0

012345678910

VOH (V) VOL (V)

Typ. Maximum Oscillator Frequnecy (f

Ta = 25°C

OSC

vs Supply Voltage (VDD)

10

(MHz)

OSC

f

9
8
7
6
5
4
3
2
1
0

012345678910

Ta = 25°C, CL = 15 pF

VDD (V)

Typ. Current (IOL) vs Voltage (VOL) for Low
State Output

20
18

6 V

V

DD

16
14
12

(mA)

10

OL

I

8
6

4 V

3 V

4
2
0

012345678910

)

Typ. Maximum Oscillator Frequnecy (f

= 5 V

Ta = 25°C

OSC

)

vs Temperature (Ta)

V

DD

CL = 15 pF

= 5 V

100

10

9
8
7
6

(MHz)

5

OSC

4

f

3
2
1
0

–40 –20 0 20 40 60 80 120

Ta (°C)

15/19

Operating Characteristics (continued)

Typ. Supply Current (IDD) vs Supply Voltage (VDD)

MSM6408¡ Semiconductor

10 m

100 m

(A)

DD

I

10 m

100 n

Ta = 25°C, no load

f

OSC

2 MHz
1 MHz

1 m

500 kHz
100 kHz

0 Hz

1 m

012345678910

V

(V)

DD

= 4 MHz

16/19

PACKAGE DIMENSIONS

DIP42-P-600-2.54

MSM6408¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

6.20 TYP.

17/19

QFP44-P-910-0.80-K

Mirror finish

MSM6408¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.35 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

18/19

QFP44-P-910-0.80-2K

Mirror finish

MSM6408¡ Semiconductor

(Unit : mm)

Package material
Lead frame material
Pin treatment
Solder plate thickness

Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

0.41 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

19/19