Datasheet MSM63188A-xxx, MSM63188A-xxxGS-BK Datasheet (OKI)

E2E0056-19-62

¡ Semiconductor MSM63188A

This version: Jun. 1999

¡ Semiconductor

MSM63188A

4-Bit Microcontroller with Built-in 1024-Dot Matrix LCD Drivers and Melody Circuit,
Operating at 0.9 V (Min.)

GENERAL DESCRIPTION

The MSM63188A is an enhanced version of the MSM63188 in which supply currents have been
improved.
The MSM63188A is a CMOS 4-bit microcontroller with built-in 1024-dot matrix LCD drivers and
operates at 0.9 V (min.). The MSM63188A is suitable for applications such as games, toys,
watches, etc. which are provided with an LCD display.
The MSM63188A is an M6318x series mask ROM-version product of OLMS-63K family, which
employs Oki's original CPU core nX-4/250.
The MSM63P180 is the one-time-programmable ROM version of MSM63188/A, having one-time
PROM (OTP) as internal program memory.
The MSM63P180 is used to evaluate the software development.

FEATURES

• Rich instruction set
439 instructions

Transfer, rotate, increment/decrement, arithmetic operations, comparison, logic operations,
mask operations, bit operations, ROM table reference, external memory transfer, stack
operations, flag operations, branch, conditional branch, call/return, control.

• Rich selection of addressing modes
Indirect addressing of four data memory types, with current bank register, extra bank
register, HL register and XY register.
Data memory bank internal direct addressing mode.

• Processing speed
Two clocks per machine cycle, with most instructions executed in one machine cycle.
Minimum instruction execution time : 61 ms (@ 32.768 kHz system clock)

1 ms (@ 2 MHz system clock)

• Clock generation circuit
Low-speed clock : 32.768 kHz crystal oscillator
High-speed clock : 2 MHz (Max.) RC or ceramic oscillator select

• Program memory space
16K words
Basic instruction length is 16 bits/1 word

• Data memory space
3584 nibbles

• External data memory space
64 Kbytes (expandable by using an I/O port)

1/32

¡ Semiconductor MSM63188A

• Stack level
Call stack level : 16 levels
Register stack level : 16 levels

• I/O ports
Input ports: Selectable as input with pull-up resistance/input with pull-down resistance/

high-impedance input

Output ports: Selectable as P-channel open drain output/N-channel open drain output/

CMOS output/high-impedance output

Input-output ports: Selectable as input with pull-up resistance/input with pull-down

resistance/high-impedance input
Selectable as P-channel open drain output/N-channel open drain

output/CMOS output/high-impedance output
Can be interfaced with external peripherals that use a different power supply than this device
uses.
Number of ports:

Input port : 2 ports ¥ 4 bits
Output port : 6 ports ¥ 4 bits
Input-output port : 6 ports ¥ 4 bits

• Melody output function
Melody sound frequency : 529 to 2979 Hz
Tone length : 63 types
Tempo : 15 types
Note data : Resides in the program memory
Buzzer drive signal output : 4 kHz

• LCD driver

Number of segments : 1024 Max. (64 SEG ¥ 16 COM)
1/1 to 1/16 duty
1/4 or 1/5 bias (regulator built-in)
Selectable as all-on mode/all-off mode/power down mode/normal display mode
Adjustable contrast

• Multiplier/divider circuits
Multiplier : (8 bits) ¥ (8 bits) Æ Product (16 bits)

Divider : (16 bits) ÷ (8 bits) Æ Quotient (16 bits), Remainder (8 bits)

• Reset function
Reset through RESET pin
Power-on reset
Reset by low-speed oscillation halt

• Battery check
Low-voltage supply check

Criterion voltage : Can be selected as 1.05 ±0.10 V, 1.30 ±0.15 V,

2.20 ±0.20 V or 2.80 ±0.30 V

• Power supply backup
Backup circuit (voltage multiplier) enables operation at 0.9 V minimum

2/32

¡ Semiconductor MSM63188A

• Timers and counter
8-bit timer ¥ 4

Selectable as auto-reload mode/capture mode/clock frequency measurement mode

Watchdog timer ¥ 1

Overflows in 2 sec.

100 Hz timer ¥ 1

Measurable in steps of 1/100 sec.

15-bit time base counter ¥ 1

1, 2, 4, 8, 16, 32, 64, and 128 Hz signals can be read

• Serial port
Mode : UART mode, synchronous mode
UART communication speed : 1200 bps, 2400 bps, 4800 bps, 9600 bps
Clock frequency in synchronous mode : 32.768 kHz (internal clock mode), external

clock frequency

Data length : 5 to 8 bits

• Interrupt sources
External interrupt : 4
Internal interrupt : 13 (watchdog timer interrupt is a nonmask-

able interrupt)

• Operating voltage
When backup used : 0.9 to 2.7 V

(Low-speed clock operating)

1.2 to 2.7 V
(Operating frequency: 300 to 500 kHz)

1.5 to 2.7 V
(Operating frequency: 200 kHz to 1 MHz)

When backup not used : 1.8 to 5.5 V

(Operating frequency: 300 to 500 kHz)

2.2 to 5.5 V
(Operating frequency: 300 kHz to 1 MHz)

2.7 to 5.5 V
(Operating frequency: 200 kHz to 2 MHz)

• Package:
176-pin plastic LQFP (LQFP176-P-2424-0.50-BK) : (Product name: MSM63188A-xxxGS-BK)
Chip : (Product name: MSM63188A-xxx)

xxx indicates a code number.

Differences Between the MSM63188 and the MSM63188A

The MSM63188A has the following improved characteristics.

• Supply currents (I

• The V

voltage during a halt of high-speed clock oscillation

DDL

DD1

, I

DD2

, I

) in DC characteristics

DD3

3/32

¡ Semiconductor MSM63188A

BLOCK DIAGRAM

An asterisk (*) indicates the port secondary function. indicates that the power is supplied
to the circuits corresponding to the signal names inside from V
interface).

nX-4/250

H

RESET

TST1
TST2

TIMING
CON­TROL

SP

RSP

STACK
CAL : 16-level
REG : 16-level

RST

TST

CBR

EBR

ALU

INSTRUCTION
DECODER

4

INT

L

YX

C G

RAM

3584N

INT188

MULDIV

TBC

RA

A

Z

MIE

IR

PC

BUS
CON­TROL

DATA BUS

ROM
16KW

EXTMEM

INT

4

TIMER

8bit ¥ 4

INT

2

SIO

INT

1

MELODY

INT
1

INPUT
PORT

(power supply for

DDI

D0-7*

A0-15*

RD*

WR*

TM0CAP/TM1CAP*
TM0OVF/TM1OVF*
T02CK*
T13CK*

RXC*
TXC*
RXD*
TXD*

MD
MDB

P0.0-P0.3

P1.0-P1.3

XT0

XT1
OSC0
OSC1

TBCCLK*

HSCLK*

OSC

V

CB1

CB2
V
V
V
V
V

V

DDH

V

DD1

DD2

DD3

DD4

DD5

DDL

DD

C1
C2

BACK
UP

BIAS

BLD

INT

1

INT

1

100HzTC

WDT

LCLK*

FRAME*

OUTPUT

PORT

I/O
PORT

INT

3

LCD

&

DSPR

P2.0-P2.3

P3.0-P3.3

P4.0-P4.3

P5.0-P5.3

P6.0-P6.3

P7.0-P7.3

P8.0-P8.3

P9.0-P9.3

PA.0-PA.3

PB.0-PB.3

PC.0-PC.3

PD.0-PD.3

COM1-16

SEG0-63

V

DDI

V

SS

4/32

¡ Semiconductor MSM63188A

PIN CONFIGURATION (TOP VIEW)

SEG61

SEG62

SEG63

(NC)

P0.0

P0.1

P0.2

P0.3

P1.0

P1.1

P1.2

P1.3

P2.0

P2.1

P2.2

P2.3

P3.0

P3.1

P3.2

P3.3

P4.0

P4.1

P4.2

P4.3

(NC)

SEG43
SEG42
SEG41
SEG40
SEG39
SEG38
SEG37
SEG36
SEG35
SEG34
SEG33
SEG32
SEG31
SEG30
SEG29
SEG28
SEG27
SEG26
SEG25
SEG24
SEG23
SEG22
SEG21
SEG20
SEG19
SEG18
SEG17
SEG16
SEG15
SEG14
SEG13
SEG12
SEG11
SEG10

SEG9
SEG8
SEG7
SEG6
SEG5
SEG4
SEG3
SEG2
SEG1
SEG0

11
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44

SEG45

SEG46

SEG47

SEG48

SEG49

SEG50

SEG51

SEG52

SEG53

168

167

SEG54

166

165

(NC)

SEG44

174

173

172

171

170

176

175

474849505152535455565758596061

45

46

169

SEG55

SEG56

SEG57

164

163

162

SEG58

SEG59

SEG60

158

157

156

155

154

153

152

151

150

149

148

147

146

145

144

143

142

141

161

160

159

63646566676869707172737475767778798081828384858687

62

140

139

138

137

136

135

134

(NC)

133

132
131
130
129
128
127
126
125
124
123
122
121
120
119
118
117
116
115
114
113
112
111
110
109
108
107
106
105
104
103
102
101
100

99
98
97
96
95
94
93
92
91
90
89

88

P5.0
P5.1
P5.2
P5.3
P6.0
P6.1
P6.2
P6.3
P7.0
P7.1
P7.2
P7.3
P8.0
P8.1
P8.2
P8.3
P9.0
P9.1
P9.2
P9.3
PA.0
PA.1
PA.2
PA.3
PB.0
PB.1
PB.2
PB.3
PC.0
PC.1
PC.2
PC.3
PD.0
PD.1
PD.2
PD.3
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)
(NC)

(NC)

COM16

COM15

COM14

COM13

COM12

COM11

COM10

COM9

COM8

COM7

COM6

COM5

COM4

COM3

COM2

SS

DD1VDD2VDD3VDD4VDD5

V

V

COM1

C1

C2

DDH

V

CB1

CB2

DD

DDL

V

V

OSC1

OSC0

XT1

XT0

RESET

TST2

176-Pin Plastic LQFP

Note: Pins marked as (NC) are no-connection pins which are left open.

(NC)

TST1

MD

(NC)

(NC)

MDB

V

DDI

(NC)

5/32

¡ Semiconductor MSM63188A

PAD CONFIGURATION

Pad Layout

PD.3
PD.2
PD.1
PD.0
PC.3
PC.2
PC.1
PC.0
PB.3
PB.2
PB.1
PB.0
PA.3
PA.2
PA.1
PA.0

P9.3
P9.2
P9.1
P9.0
P8.3
P8.2
P8.1
P8.0
P7.3
P7.2
P7.1
P7.0
P6.3
P6.2
P6.1
P6.0

P5.3
P5.2
P5.1
P5.0

124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155

156
157
158
159

DDI

122 MDB

121 MD

123 V

118 XT0

117 XT1

119 TST2

120 TST1

DDL

116 RESET

112 V

113 V

115 OSC0

114 OSC1

DD

110 CB1

111 CB2

DDH

108 C2

109 V

DD5

DD4

106 V

105 V

107 C1

DD3

DD2

104 V

103 V

DD1

SS

102 V

101 V

100 COM1

98 COM3

97 COM4

99 COM2

96 COM5

93 COM8

95 COM6

92 COM9

94 COM7

89 COM12

91 COM10

87 COM14

88 COM13

90 COM11

85 COM16

86 COM15

84 SEG0
83 SEG1
82 SEG2
81 SEG3
80 SEG4
79 SEG5
78 SEG6
77 SEG7
76 SEG8
75 SEG9
74 SEG10
73 SEG11
72 SEG12
71 SEG13
70 SEG14
69 SEG15
68 SEG16
67 SEG17
66 SEG18
65 SEG19
64 SEG20
63 SEG21
62 SEG22
61 SEG23
60 SEG24
59 SEG25
58 SEG26
57 SEG27
56 SEG28
55 SEG29
54 SEG30
53 SEG31
52 SEG32
51 SEG33
50 SEG34
49 SEG35
48 SEG36
47 SEG37
46 SEG38
45 SEG39
44 SEG40
43 SEG41

42 SEG42
41 SEG43

Y

P4.3 1

P4.2 2

P4.1 3

P4.0 4

P3.3 5

P3.2 6

P3.1 7

P3.0 8

P2.3 9

P2.2 10

P2.1 11

P2.0 12

P1.3 13

P1.2 14

P1.1 15

P1.0 16

P0.3 17

P0.2 18

P0.1 19

P0.0 20

SEG63 21

SEG62 22

SEG61 23

SEG60 24

SEG59 25

SEG58 26

SEG57 27

SEG56 28

SEG55 29

SEG54 30

SEG53 31

SEG52 32

SEG51 33

SEG50 34

SEG49 35

SEG48 36

SEG47 37

SEG46 38

SEG45 39

SEG44 40

X

Chip Size : 6.60 mm ¥ 6.60 mm
Chip Thickness : 350 mm (typ.)
Coordinate Origin : Chip center
Pad Hole Size : 100 mm ¥ 100 mm
Pad Size : 110 mm ¥ 110 mm
Minimum Pad Pitch : 140 mm

Note: The chip substrate voltage is VSS.

6/32

¡ Semiconductor MSM63188A

Pad Coordinates

Pad No.

Name

X (µm) Y (µm)

1 P4.3 –2837 –3105

Pad

2 –2697
3 –2557
4 –2417
5 –2277
6 –2137
7 –1997
8 –1857

9 –1717
10 –1577
11 –1437
12 –1297
13 –1157
14 –1017
15 –877
16 –737
17 –597
18 –457
19 –317
20 –177
21 54
22 194

P4.2 –3105 SEG41 3155
P4.1 –3105 SEG40 3155
P4.0 –3105 SEG39 3155
P3.3 –3105 SEG38 3155
P3.2 –3105 SEG37 3155
P3.1 –3105 SEG36 3155
P3.0 –3105 SEG35 3155
P2.3 –3105 SEG34 3155
P2.2 –3105 SEG33 3155
P2.1 –3105 SEG32 3155
P2.0 –3105 SEG31 3155
P1.3 –3105 SEG30 3155
P1.2 –3105 SEG29 3155
P1.1 –3105 SEG28 3155
P1.0 –3105 SEG27 3155
P0.3 –3105 SEG26 3155
P0.2 –3105 SEG25 3155
P0.1 –3105 SEG24 3155

P0.0 –3105 SEG23 3155
SEG63
SEG62

23 SEG61 334
24 SEG60 474
25 SEG59 614
26 SEG58 754
27 SEG57 894
28 SEG56 1034
29 SEG55 1174
30 SEG54 1314
31 SEG53 1454
32 SEG52 1594
33 SEG51 1734
34 SEG50 1874
35 SEG49 2014
36 SEG48 2154
37 SEG47 2294
38 SEG46 2434
39 SEG45 2574
40 SEG44 2714
41 SEG43 3155

Pad No.

42

Name

SEG42 3155 –2870

X (µm) Y (µm)

43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61

Pad

–3105 SEG22 3155
–3105 SEG21 3155
–3105 SEG20 3155
–3105 SEG19 3155
–3105 SEG18 3155
–3105 SEG17 3155
–3105 SEG16 3155
–3105 SEG15 3155
–3105 SEG14 3155
–3105 SEG13 3155
–3105 SEG12 3155
–3105 SEG11 3155
–3105 SEG10 3155
–3105 SEG9 3155
–3105 SEG8 3155
–3105 SEG7 3155
–3105 SEG6 3155
–3105 SEG5 3155
–3105 SEG4 3155
–3105 SEG3 3155
–3010 SEG2 3155

62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
81
82

–2730
–2590
–2450
–2310
–2170
–2030
–1890
–1750
–1610
–1470
–1330
–1190
–1050

–910
–770
–630
–490
–350
–210

–70

70
210
350
490
630
770
910

1050
1190
1330
1470
1610
1750
1890
2030
2170
2310
2450
2590
2730

Pad No.

83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98

99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
122
123

Pad

Name

X (µm) Y (µm)

SEG1 3155 2870

SEG0 3155
COM16
COM15
COM14
COM13
COM12
COM11
COM10

COM9 3105
COM8 3105
COM7 3105
COM6 3105
COM5 3105
COM4 3105
COM3 3105
COM2 3105
COM1 3105

V

SS

V

DD1

V

DD2

V

DD3

V

DD4

V

DD5

C1
C2

V

DDH

CB1
CB2
V

DD

V

DDL

OSC1

OSC0
RESET

XT1

XT0
TST2
TST1

MD

MDB

V

DDI

2705
2565
2425
2285
2145
2005
1865
1725
1585
1445
1305
1165
1025

885
745
605
420
270
120

–30
–179
–329
–479
–629
–779
–929

–1079
–1229
–1379
–1529
–1679
–1829
–1979
–2129
–2324
–2464
–2604
–2744
–2884

3010
3105
3105
3105
3105
3105
3105
3105

3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105
3105

7/32

¡ Semiconductor MSM63188A

Pad Coordinates (continued)

Pad No.

124 PD.3 –3155 2428
125
126
127
128
129
130
131
132
133
134
135

Pad

Name

PD.2 2288
PD.1 2148
PD.0
PC.3
PC.2
PC.1
PC.0
PB.3
PB.2
PB.1
PB.0

X (µm) Y (µm)

–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155
–3155 –3155 –3155

2008
1868
1728
1588
1448
1308
1168
1028

888

Pad No.

136
137
138
139
140
141
142
143
144
145
146
147

Pad

Name

PA.3
PA.2
PA.1
PA.0

P9.3
P9.2
P9.1
P9.0
P8.3
P8.2
P8.1
P8.0

X (µm) Y (µm)

–3155 748

608
468
328
188

48

–92
–232
–372
–512
–652
–792

Pad No.

149
150
151
152
153
154
155
156
157
158
159

Pad

Name

P7.3
P7.2
P7.1
P7.0
P6.3
P6.2
P6.1
P6.0
P5.3
P5.2
P5.1
P5.0

X (µm) Y (µm)

–3155 –932148

–1072
–1212
–1352
–1492
–1632
–1772
–1912
–2172
–2312
–2452
–2592

8/32

¡ Semiconductor MSM63188A

PIN DESCRIPTIONS

The basic functions of each pin of the MSM63188A are described in Table 1.
A symbol with a slash (/) denotes a pin that has a secondary function.
Refer to Table 2 for secondary functions.
For type, "—" denotes a power supply pin, "I" an input pin, "O" an output pin, and "I/O" an input­output pin.

Table 1 Pin Descriptions (Basic Functions)

Function Symbol Pin Type

73 —
62 —
63
64
65 —
66
67

V
V
V
V
V

V

V

DD

SS

DD1

DD2

DD3

DD4

DD5

C1 68 —

Power

Supply

C2 69 —

V

V

V

DDI

DDL

DDH

87 —

74 —

70 —

CB1 71 —
CB2 72 —

XT0 79 I

XT1 78 O

Oscillation

OSC0 76 I

OSC1 75 O

TST1 81 I

Test

TST2 80 I

Reset RESET 77 I

Description

Positive power supply
Negative power supply
Power supply pins for LCD bias (internally generated).
Capacitors (0.1 mF) should be connected between these pins and
V

.

SS

Capacitor connection pins for LCD bias generation.
A capacitor (0.1 mF) should be connected between C1 and C2.
Positive power supply pin for external interface
(power supply for input, output, and input-output ports)
Positive power supply pin for internal logic (internally generated).
A capacitor (0.1 mF) should be connected between this pin and V

SS

.
Voltage multiplier pin for power supply backup (internally generated).
A capacitor (1.0 mF) should be connected between this pin and VSS.
Pins to connect a capacitor for voltage multiplier.
A capacitor (1.0 mF) should be connected between CB1 and CB2.
Low-speed clock oscillation pins.
A 32.768 kHz crystal should be connected between XT0 and XT1,

(5 to 25 pF) should be connected between XT0 and VSS.

and C

G

High-speed clock oscillation pins.
A ceramic resonator and capacitors (C
oscillation resistor (R

) should be connected to these pins.

OS

, CL1) or external

L0

Input pins for testing.
A pull-down resistor is internally connected to these pins.
The user cannot use these pins.
Reset input pin.
Setting this pin to "H" level puts this device into a reset state.
Then, setting this pin to "L" level starts executing an instruction
from address 0000H.
A pull-down resistor is internally connected to this pin.

Melody

MD 84 O

MDB 85 O

Melody output pin (non-inverted output)
Melody output pin (inverted output)

9/32

¡ Semiconductor MSM63188A

Table 1 Pin Descriptions (Basic Functions) (continued)

Function Symbol

P0.0/INT5
P0.1/INT5
P0.2/INT5
P0.3/INT5
P1.0/INT5
P1.1/INT5
P1.2/INT5
P1.3/INT5

P2.0
P2.1
P2.2
P2.3
P3.0
P3.1
P3.2

Port

P3.3
P4.0/A0
P4.1/A1
P4.2/A2
P4.3/A3
P5.0/A4
P5.1/A5
P5.2/A6
P5.3/A7
P6.0/A8
P6.1/A9

P6.2/A10
P6.3/A11
P7.0/A12
P7.1/A13
P7.2/A14
P7.3/A15

Pin

154
153
152
151
150
149
148
147
146
145
144
143
142
141
140
139
138
137
136
135
132
131
130
129
128
127
126
125
124
123
122
121

Type Description

4-bit input ports.
Pull-up resistor input, pull-down resistor input, or

I

high-impedance input is selectable for each bit.

I

4-bit output ports.
P-channel open drain output, N-channel open drain output,

O

CMOS output, or high-impedance output is selectable for each
bit.

O

O

O

O

O

10/32

¡ Semiconductor MSM63188A

Table 1 Pin Descriptions (Basic Functions) (continued)

Function Symbol

P8.0/RD

P8.1/WR

P8.2

P8.3/INT4

P9.0/D0
P9.1/D1
P9.2/D2
P9.3/D3

PA.0/D4
PA.1/D5
PA.2/D6
PA.3/D7

PB.0/INT0/

Port

TM0CAP/

TM0OVF

PB.1/INT0/

TM1CAP/

TM1OVF
PB.2/INT0/T02CK
PB.3/INT0/T13CK

PC.0/INT1/RXD

PC.1/INT1/TXC
PC.2/INT1/RXC
PC.3/INT1/TXD

PD.0/FRAME

PD.1/LCLK

PD.2/TBCCLK

PD.3/HSCLK

Pin

120
119
118
117
116
115
114
113
112
111
110
109

108

107

106
105
104
103
102
101
100

99
98
97

Type Description

4-bit input-output ports.
In input mode, pull-up resistor input, pull-down resistor input,

I/O

or high-impedance input is selectable for each bit.
In output mode, P-channel open drain output, N-channel open
drain output, CMOS output, or high-impedance output is
selectable for each bit.

I/O

I/O

I/O

I/O

I/O

11/32

¡ Semiconductor MSM63188A

Table 1 Pin Descriptions (Basic Functions) (continued)

Function Symbol

COM1
COM2
COM3
COM4
COM5
COM6
COM7
COM8

COM9
COM10
COM11
COM12
COM13
COM14
COM15
COM16

SEG0
SEG1
SEG2
SEG3

LCD

SEG4
SEG5
SEG6
SEG7
SEG8

SEG9
SEG10
SEG11
SEG12
SEG13
SEG14
SEG15
SEG16
SEG17
SEG18
SEG19
SEG20
SEG21
SEG22
SEG23
SEG24

Pin Type

61
60
59
58
57
56
55
54
53
52
51
50
49
48
47
46
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20

O

O

Description

LCD common signal output pins

LCD segment signal output pins

12/32

¡ Semiconductor MSM63188A

Table 1 Pin Descriptions (Basic Functions) (continued)

Function Symbol

SEG25
SEG26
SEG27
SEG28
SEG29
SEG30
SEG31
SEG32
SEG33
SEG34
SEG35
SEG36
SEG37
SEG38
SEG39
SEG40
SEG41
SEG42
SEG43

LCD

SEG44
SEG45
SEG46
SEG47
SEG48
SEG49
SEG50
SEG51
SEG52
SEG53
SEG54
SEG55
SEG56
SEG57
SEG58
SEG59
SEG60
SEG61
SEG62
SEG63

Pin Type

19
18
17
16
15
14
13
12
11
10

9
8
7
6
5
4
3
2
1

O

175
174
173
172
171
170
169
168
167
166
165
164
163
162
161
160
159
158
157
156

Description

LCD segment signal output pins

13/32

¡ Semiconductor MSM63188A

Table 2 shows the secondary functions of each pin of the MSM63188A.

Table 2 Pin Descriptions (Secondary Functions)

Function Symbol

PB.0/INT0
PB.1/INT0
PB.2/INT0
PB.3/INT0
PC.0/INT1
PC.1/INT1
PC.2/INT1

External

Interrupt

PC.3/INT1

P8.3/INT4

P0.0/INT5
P0.1/INT5
P0.2/INT5
P0.3/INT5
P1.0/INT5
P1.1/INT5
P1.2/INT5
P1.3/INT5

Pin

108
107
106
105
104
103
102
101

117

154
153
152
151
150
149
148
147

Type Description

External 0 interrupt input pins.
The change of input signal level causes an interrupt to occur.

I

The Port B Interrupt Enable register (PBIE) enables or disables
an interrupt for each bit.
External 1 interrupt input pins.
The change of input signal level causes an interrupt to occur.

I

The Port C Interrupt Enable register (PCIE) enables or disables
an interrupt for each bit.
External 4 interrupt input pins.

I

The change of input signal level causes an interrupt to occur.
External 5 interrupt input pins.
The change of input signal level causes an interrupt to occur.
The Port 0 Interrupt Enable register (P0IE) and Port 1 Interrupt
Enable register (P1IE) enable or disable an interrupt for each bit.

I

14/32

¡ Semiconductor MSM63188A

Table 2 Pin Descriptions (Secondary Functions) (continued)

Function Symbol

Capture

Timer

LCD

External
Expansion
Oscillation

Output

Serial

Port

PB.0/TM0CAP
PB.1/TM1CAP
PB.0/TM0OVF
PB.1/TM1OVF

PB.2/T02CK
PB.3/T13CK

PD.0/FRAME

PD.1/LCLK

PD.2/TBCCLK

PD.3/HSCLK

PC.0/RXD

PC.1/TXC

PC.2/RXC

PC.3/TXD

Pin

108
107
108
107
106
105

100

99
98

97

104

103

102

101

Type Description

Timer 0 capture input pin.

I

Timer 1 capture input pin.

I

Timer 0 overflow flag output pin.

O

Timer 1 overflow flag output pin.

O

External clock input pin for timer 0 and timer 2.

I

External clock input pin for timer 1 and timer 3.

I

Frame output pin for LCD driver expansion

O

Clock output pin for LCD driver expansion

O

Low-speed oscillation clock output pin

O

High-speed oscillation clock output pin

O

Serial port receive data input pin

I

Sync serial port clock input-output pin.
Transmit clock output when this device is used as a master processor.

I/O

Transmit clock input when this device is used as a slave processor.
Sync serial port clock input-output pin.

I/O

Receive clock output when this device is used as a master processor.
Receive clock input when this device is used as a slave processor.
Serial port transmit data output pin.

O

15/32

¡ Semiconductor MSM63188A

Table 2 Pin Descriptions (Secondary Functions) (continued)

Function Symbol

P4.0/A0
P4.1/A1
P4.2/A2
P4.3/A3
P5.0/A4
P5.1/A5
P5.2/A6
P5.3/A7
P6.0/A8

P6.1/A9
P6.2/A10
P6.3/A11

External

P7.0/A12

Memory

P7.1/A13
P7.2/A14
P7.3/A15

P9.0/D0

P9.1/D1

P9.2/D2

P9.3/D3

PA.0/D4
PA.1/D5
PA.2/D6
PA.3/D7
P8.0/RD

P8.1/WR

Pin

138
137
136
135
132
131
130
129
128
127
126
125
124
123
122
121
116
115
114
113
112
111
110
109
120
119

Type

Address output bus for external memory

O

Data bus for external memory

I/O

O Read signal output pin for external memory (negative logic)
O Write signal output pin for external memory (negative logic)

Description

16/32

¡ Semiconductor MSM63188A

ABSOLUTE MAXIMUM RATINGS

= 0 V)

(V

SS

Parameter Symbol Condition Rating Unit

Power Supply Voltage 6

DD1

V

DD2

V

DD3

V

DD4

V

DD5

V

V

DDH

DDL

OUT1

OUT2

OUT3

OUT4

OUT5

OUT6

OUT7

OUT8

T

STG

DD

DDI

IN1

IN2

DDI

DD1

DD2

DD3

DD4

DD5

DDI

DDH

–0.3 to +1.6Power Supply Voltage 1 Ta = 25°CV
–0.3 to +2.9Power Supply Voltage 2 Ta = 25°C
–0.3 to +4.2Power Supply Voltage 3 Ta = 25°C
–0.3 to +5.5Power Supply Voltage 4 Ta = 25°C
–0.3 to +6.8Power Supply Voltage 5 Ta = 25°C

V
V
V
V

V
–0.3 to +6.0Ta = 25°C V
–0.3 to +6.0Power Supply Voltage 7 Ta = 25°CV
–0.3 to +6.0Power Supply Voltage 8 Ta = 25°C
–0.3 to +6.0Power Supply Voltage 9 Ta = 25°CV

–0.3 to V

Input, Ta = 25°CV
Output, Ta = 25°CV
Output, Ta = 25°CV
Output, Ta = 25°CV
Output, Ta = 25°CV
Output, Ta = 25°CV

–0.3 to V
–0.3 to V
–0.3 to V
–0.3 to V
–0.3 to V
–0.3 to V

–0.3 to V

Output, Ta = 25°CV

Output, Ta = 25°CV

–0.3 to V

–0.3 to V

DD

DDI

DD1

DD2

DD3

DD4

DD5

DD

DDI

DDH

+ 0.3Input Voltage 1 VDD Input, Ta = 25°CV

+ 0.3Input Voltage 2 V

+ 0.3Output Voltage 1 V
+ 0.3Output Voltage 2 V
+ 0.3Output Voltage 3 V
+ 0.3Output Voltage 4 V
+ 0.3Output Voltage 5 V

+ 0.3Output Voltage 6 VDD Output, Ta = 25°CV

+ 0.3Output Voltage 7 V

+ 0.3Output Voltage 8 V

–55 to +150Storage Temperature —

V
V
V
V
V
V
V
V
V
V
V
V
V

°C

17/32

¡ Semiconductor MSM63188A

RECOMMENDED OPERATING CONDITIONS

• When backup is used

(V

= 0 V)

SS

Parameter Symbol Condition Range Unit

Operating Temperature T

Operating Voltage

Crystal Oscillation Frequency f

Ceramic Oscillation Frequency

External RC Oscillator Resistance

• When backup is not used

op

V

DD

V

DDI

XT

—
— 0.9 to 2.7 V
—
—

VDD = 1.2 to 2.7 V

f

CM

VDD = 1.2 to 2.7 V

R

OS

–20 to +70 °C

0.9 to 5.5 V
30 to 35 kHz

300k to 500k

Hz

200k to 1MVDD = 1.5 to 2.7 V

100 to 300

kW

50 to 300VDD = 1.5 to 2.7 V

Parameter Symbol Condition Range Unit

Operating Temperature T

Operating Voltage

Crystal Oscillation Frequency f

Ceramic Oscillation Frequency

External RC Oscillator Resistance

(V

= 0 V)

SS

op

V

DD

V

DDI

XT

—
— 1.8 to 5.5 V
—
—

–20 to +70 °C

1.8 to 5.5 V
30 to 35 kHz

300k to 500kVDD = 1.8 to 5.5 V

f

CM

300k to 1M HzVDD = 2.2 to 5.5 V
200k to 2MVDD = 2.7 to 5.5 V

100 to 300VDD = 1.8 to 5.5 V

R

OS

50 to 300 kWVDD = 2.2 to 5.5 V
30 to 300VDD = 2.7 to 5.5 V

18/32

¡ Semiconductor MSM63188A

ELECTRICAL CHARACTERISTICS

DC Characteristics

Parameter Symbol Condition

Voltage

DD2

Voltage Temperature Deviation DV

DD2

V

Voltage V

DD1

V

Voltage V

DD3

V

Voltage V

DD4

V

Voltage V

DD5

Voltage

V

DDH

(Backup used)

Voltage V

V

DDL

Crystal Oscillation Hold Voltage

External Crystal Oscillator Capacitance
Internal Crystal Oscillator Capacitance

External Ceramic Oscillator
Capacitance

POR Voltage V

Non-POR Voltage V

(V

V

V

V

T

C

DD

DD2

DD2

DD1

DD3

DD4

DD5

DDH

DDL

STA

HOLD

STOP

C

G

C

D

L0, 1

OS

POR1

POR2

= V

= 0.9 to 5.5 V, VSS = 0 V, Ta = –20 to +70°C unless otherwise specified)

DDI

Max.Typ.Min.

1/5 bias, 1/4 bias

(Ta = 25°C)

—

1/5 bias, 1/4 bias V

1/5 bias

1/4 bias (connect

V

DD3

and V

DD2

)

1/5 bias
1/4 bias
1/5 bias
1/4 bias

Typ.– 0.2
Typ.– 0.3

Typ.– 0.2

Typ.– 0.4
Typ.– 0.3
Typ.– 0.5
Typ.– 0.4

1/2 ¥ V
3/2 ¥ V

V

DD2

2 ¥ V
3/2 ¥ V
5/2 ¥ V

2 ¥ V

DD2

DD2

DD2

DD2

DD2

DD2

1.91.81.7V

—–4—V
Typ.+ 0.2
Typ.+ 0.3

Typ.+ 0.2

Typ.+ 0.4
Typ.+ 0.3
Typ.+ 0.5
Typ.+ 0.4

High-speed clock oscillation

stopped

V

DD

= 1.5 V

3.0—2.8 V

High-speed clock oscillation

(Ceramic oscillation, 1 MHz)

= 1.5 V

V

DD

High-speed clock

oscillation stopped

High-speed clock oscillation

(V

= 1.2 to 5.5 V)

DD

Oscillation start time:

within 5 seconds

Backup V

2.7—2.0

1.81.30.8

5.5—1.2

——1.0Crystal Oscillation Start Voltage V

——0.9

——1.7Backup not used V

—ms
—pF
—pF

5.0—0.1Crystal Oscillation Stop Detect Time
25—5
302520

CSA2.00MG (Murata

MFG.-make) used

V

= 3.0 V

DD

—pF

V

= 1.5 V V

DD

= 3.0 V V

DD

V

= 1.5 V V

DD

= 3.0 V V

DD

—30—

16128Internal RC Oscillator Capacitance C

0.4—0.0

0.7—0.0V

1.5—1.2

3.0—2.0V

Unit

V

mV/°C

V

V

V

V

V

V

V

pF

Mea-

suring

Circuit

1

Notes: 1. "T

reset occurs.

2. "POR" denotes Power On Reset.

3. "V
up to VDD.

4. "V
again rises up to VDD.

" indicates that if the crystal oscillator stops over the value of T

STOP

" indicates that POR occurs when VDD falls from VDD to V

POR1

" indicates that POR does not occur when VDD falls from VDD to V

POR2

, the system

STOP

and again rises

POR1

POR2

and

19/32

¡ Semiconductor MSM63188A

DC Characteristics (continued)

• When backup is used

(VDD = V

= 1.5 V, VSS = 0 V, 1/5 bias, Ta = –20 to +70°C unless otherwise specified)

DDI

Parameter Symbol Condition

CPU is in HALT state.

Supply Current 1

(High-speed clock oscillation

I

DD1

stopped)

CPU is in HALT state.

Supply Current 2

LCD is in Power Down mode.

I

DD2

(High-speed clock oscillation

stopped)

Supply Current 3 I

DD3

CPU is in operation at low-speed oscillation.

(High-speed clock oscillation stopped)

CPU is in operation at high-speed oscillation

DD4

(RC oscillation, f = approx. 720 kHz, R

CPU is in operation at high-speed oscillation

DD5

(Ceramic oscillation, 1 MHz)

• When backup is not used

Ta = –20 to +50°C

Ta = –20 to +70°C

Ta = –20 to +50°C

Ta = –20 to +70°C

= 51 kW)

OS

—

—

—

—

—

Mea-

Max.Typ.Min.

Unit

suring

Circuit

7.05.6
mA

8.55.6

5.54.5
mA

7.04.5

1

2218

mA

900700—Supply Current 4 I

1000800—Supply Current 5 I

mA

mA

(VDD = V

= 3.0 V, VSS = 0 V, 1/5 bias, Ta = –20 to +70°C unless otherwise specified)

DDI

Parameter Symbol Condition

CPU is in HALT state.

Supply Current 1

(High-speed clock oscillation

I

DD1

stopped)

CPU is in HALT state.

LCD is in Power Down mode.

Supply Current 2

I

DD2

(High-speed clock oscillation

stopped)

Supply Current 3 I

DD3

CPU is in operation at low-speed oscillation.

(High-speed clock oscillation stopped)

CPU is in operation at

Supply Current 4 I

DD4

high-speed oscillation

(RC oscillation)

CPU is in operation at high-speed oscillation

DD5

(Ceramic oscillation, 2 MHz)

Ta = –20 to +50°C

Ta = –20 to +70°C

Ta = –20 to +50°C

Ta = –20 to +70°C

f = approx. 800 kHz,

= 51 kW

R

OS

f = approx. 500 kHz,

= 100 kW

R

OS

—

—

—

—

—

—

—

Mea-

Max.Typ.Min.

Unit

suring

Circuit

3.02.7
mA

3.52.7

2.42.1
mA

3.02.1

10.58.5

mA

1

800550

mA

450390

15001000—Supply Current 5 I

mA

20/32

¡ Semiconductor MSM63188A

DC Characteristics (continued)

(VDD = V

DDI

V

DD4

= V
= 4.4 V, V

Parameter Symbol Condition

Output Current 1
(P2.0 to P2.3)
(P3.0 to P3.3)
(P4.0 to P4.3)

··· ···

(PC.0 to PC.3)

I

OH1

I

OL1

V

= V

OH1

V

OL1

– 0.5 V –1.0 mA

DDI

= 0.5 V 5.0 mA

(PD.0 to PD.3)
Output Current 2

(MD, MDB)

Output Current 3
(SEG0 to SEG63)
(COM1 to COM16)

Output Current 4
(OSC1)

I

OH2

I

OL2

I

OH3

I

OHM3

I

OHM3S

I

OMH3

I

OMH3S

I

OML3

OML3S

OLM3

OLM3S

OL3

I

OH4R

I

OL4R

I

OH4C

I

OL4C

V

= VDD – 0.7 V –2.0 mA

OH2

V

= 0.7 V 6.0 mA

OL2

V

= V

OH3

V

OHM3

V

OHM3S

V

OMH3

V

OMH3S

V

OML3

V

OML3S

V

OLM3

V

OLM3S

= VSS + 0.2 V (VSS level)

V

OL3

V

OH4R

= V

= V

= V

= V

= V

= V

= V

= V

= V

– 0.2 V (V

DD5

+ 0.2 V (V

DD4

DD4

+ 0.2 V (V

DD3

DD3

+ 0.2 V (V

DD2

DD2

+ 0.2 V (V

DD1

DD1

– 0.5 V

DDH

– 0.2 V (V

– 0.2 V (V

– 0.2 V (V

– 0.2 V (V

(RC oscillation)
V

= 0.5 V

OL4R

(RC oscillation)
V

= V

OH4C

DDH

– 0.5 V
(ceramic oscillation)
V

= 0.5 V

OL4C

(ceramic oscillation)

Output Leakage
(P2.0 to P2.3)

I

OOH

VOH = V

DDI

(P3.0 to P3.3)
(P4.0 to P4.3)

I

OOL

VOL = V

SS

(PD.0 to PD.3)

= 3.0 V, VSS = 0 V, V

DDH

= 5.5 V, Ta = –20 to +70°C unless otherwise specified)

DD5

= 1.5 V

V

DDI

= 3.0 V

V

DDI

= 5.0 V

V

DDI

V

= 1.5 V

DDI

= 3.0 V

V

DDI

= 5.0 V

V

DDI

V

= 1.5 V

DD

= 3.0 V

V

DD

= V

V

DD

DDH

V

= 1.5 V

DD

= 3.0 V

V

DD

= V

V

DD

DDH

level)

DD5

level)

DD4

level)

DD4

level)

DD3

level)

DD3

level)

DD2

level)

DD2

level)

DD1

level)

DD1

= V

V

DD

DDH

= V

V

DD

DDH

DDH

= V

V

DD

DDH

DDH

= V

V

DD

DDH

DDH

= V

V

DD

DDH

= 1.1 V, V

DD1

Min.

–2.0
–5.0
–8.0

0.2

1.0

1.5
–2.5
–6.0

= 5.0 V

–9.0

0.4

2.0

= 5.0 V

3.0

—

4

—

4

—

4

—

4

—

4

= 3.0 V

–2.5

= 5.0 V –1.0 mA–2.0–3.5
= 3.0 V
= 5.0 V 3.5 mA2.01.0
= 3.0 V
= 5.0 V –100 mA–280–450
= 3.0 V
= 5.0 V 450 mA200100

—

–0.3

Typ.

–1.2
–3.0
–4.0

1.2

3.0

4.0
–1.3
–4.0
–5.5

1.3

4.0

5.5

—
—
—
—
—
—
—
—
—
—

–1.5

—

—

= 2.2 V, V

DD2

Max.

–0.2 mA

–1.5 mA

–0.4 mA

–3.0 mA

–0.75 mA

Unit

2.0 mA

8.0 mA

2.5 mA

9.0 mA
–4 mA
— mA
–4

mA

—

mA
mA

–4

mA

—

mAI

–4

mAI

—

mAI

–4

mAI

—

2.5 mA1.50.75VDD = V

–60 mA–180–300VDD = V

300 mA12060VDD = V

0.3 mA

— mA

= 3.3 V,

DD3

Mea-

suring

Circuit

2

21/32

¡ Semiconductor MSM63188A

DC Characteristics (continued)

(VDD = V

V

DDI

DD4

= V

= 4.4 V, V

Parameter Symbol Condition

Input Current 1

V

= V

IH1

(P0.0 to P0.3)
(P1.0 to P1.3)

I

IH1

(when pulled down)

DDI

(P8.0 to P8.3)
(P9.0 to P9.3)

···

(PD.0 to PD.3)

Input Current 2
(OSC0)

I

IL1

I

IH1Z

I

IL1Z

I

IL2

I

IH2R

I

IL2R

I

IH2C

I

IL2C

V

= V

IL1

SS

(when pulled up)

V

= V

IH1

V

= V

IL1

V

= V

IL2

(in a high impedance state) 1.0 mA—0.0

DDI

(in a high impedance state) 0.0 mA—–1.0

SS

SS

(when pulled up)
V

= V

IH2R

V

= VSS (RC oscillation) 0.0 mA—–1.0

IL2R

V

= V

IH2C

(RC oscillation) 1.0 mA—0.0

DDH

DDH

(ceramic oscillation)
V

= V

IL2C

SS

(ceramic oscillation)
Input Current 3
(RESET)

I

I

IH3

IL3

V

= V

IH3

DD

V

= V

IL3

SS

Input Current 4
(TST1, TST2)

I

I

IH4

IL4

V

= V

IH4

DD

V

= V

IL4

SS

= 3.0 V, VSS = 0 V, V

DDH

= 5.5 V, Ta = –20 to +70°C unless otherwise specified)

DD5

= 1.5 V

V

DDI

= 3.0 V

V

DDI

= 5.0 V

V

DDI

V

= 1.5 V

DDI

= 3.0 V

V

DDI

= 5.0 V

V

DDI

V

= V

DD

DDH

= V

V

DD

DDH

V

= V

DD

DDH

= V

V

DD

DDH

V

= V

DD

DDH

= V

V

DD

DDH

= 1.5 V

V

DD

= 3.0 V 600 mA350150

V

DD

V

= V

DD

DDH

= 3.0 V 1.5 mA1.00.5

V

DD

= V

V

DD

DDH

= 1.1 V, V

DD1

Min.

2
30
70

–30
–180
–600

= 3.0 V
= 5.0 V

= 3.0 V
= 5.0 V
= 3.0 V
= 5.0 V

–200
–600

0.1

0.75
–1.0
–3.0

10

= 5.0 V 2.0 mA1.00.5

= 5.0 V 4.0 mA2.51.25

Typ.

10

90
250
–10
–90

–250

–110
–350

0.5

1.5
–0.5
–1.5

50

= 2.2 V, V

DD2

Max.

180 mA
600 mA

–30 mA
–70 mA

–30 mA

–150 mA

–0.1 mA

–0.75 mA

300 mA15050VDD = 1.5 V

DD3

Unit

30 mA

–2 mA

1.0 mA

3.0 mA

80 mA

0.0 mA—–1.0

0.0 mA—–1.0

= 3.3 V,

Mea­suring
Circuit

3

22/32

¡ Semiconductor MSM63188A

DC Characteristics (continued)

Parameter Symbol Condition

Input Voltage 1
(P0.0 to P0.3)
(P1.0 to P1.3)
(P8.0 to P8.3)
(P9.0 to P9.3)

··· ······

(PD.0 to PD.3)
Input Voltage 2

(OSC0)

Input Voltage 3
(RESET, TST1, TST2)

Hysteresis Width 1
(P0.0 to P0.3)
(P1.0 to P1.3)
(P8.0 to P8.3)

(VDD = V

V

IH1

V

IL1

V

IH2

V

IL2

V

IH3

V

IL3

DV

T1

DDI

V

DD4

= V
= 4.4 V, V

= 3.0 V, VSS = 0 V, V

DDH

= 5.5 V, Ta = –20 to +70°C unless otherwise specified)

DD5

= 1.5 V 1.2 — 1.5 V

V

DDI

V

= 3.0 V 2.4 — 3.0 V

DDI

= 5.0 V 4.0 — 5.0 V

V

DDI

V

= 1.5 V 0.0 — 0.3 V

DDI

V

= 3.0 V 0.0 — 0.6 V

DDI

= 5.0 V 0.0 — 1.0 V

V

DDI

VDD = V
VDD = V
VDD = V
VDD = V

V

= 3.0 V 2.4 — 3.0 V

DDH

= 5.0 V 4.0 — 5.0 V

DDH

= 3.0 V 0.0 — 0.6 V

DDH

= 5.0 V 0.0 — 1.0 V

DDH

= 1.5 V 1.35 — 1.5 V

DD

= 1.1 V, V

DD1

DD2

VDD = 3.0 V 2.4 — 3.0 V
= V

V

DD

= 5.0 V 4.0 — 5.0 V

DDH

VDD = 1.5 V 0.0 — 0.15 V
VDD = 3.0 V 0.0 — 0.6 V
= V

V

DD

V

V

= 5.0 V 0.0 — 1.0 V

DDH

= 1.5 V 0.05 0.1 0.3 V

DDI

= 3.0 V 0.2 0.5 1.0 V

DDI

= 2.2 V, V

Max.Typ.Min.

Unit

DD3

= 3.3 V,

Mea-

suring

Circuit

4

(PD.0 to PD.3)
Hysteresis Width 2

(RESET, TST1, TST2)

Input Pin Capacitance
(P0.0 to P0.3)
(P1.0 to P1.3)
(P8.0 to P8.3)
(P9.0 to P9.3)

(PC.0 to PC.3)
(PD.0 to PD.3)

DV

C

= 5.0 V 0.25 1.0 1.5 V

V

DDI

VDD = 1.5 V 0.05 0.1 0.3 V

= 3.0 V 0.2 0.5 1.0 V

T2

IN

V

DD

= V

V

DD

= 5.0 V 0.25 1.0 1.5 V

DDH

———5pF

1

23/32

¡ Semiconductor MSM63188A

p

Measuring circuit 1

CB1

C

b12

CB2
C1

C

12

C2

q

OSC0

*1

w

OSC1

Ca, Cb, Cc, Cd, Ce, Cl, C
C

, C

b12

h

C

G

C

L0

C

L1

Ceramic Resonator

V

V

SS

DDVDDIVDD1

A

12

: 0.1 mF

C

a

: 1 mF
: 15 pF
: 30 pF
: 30 pF
: CSA2.00MG (2 MHz)
CSB1000J (1 MHz)
(Murata MFG.-make)

C

G

XT0

XT1

V

C

b

V

DD2

V

C

V

DD3

c

V

C

d

V

DD4

V

C

V

DD5

e

V

V

DDH

DDL

C

V

C

h

l

V

V

32.768 kHz
Crystal

*1 RC Oscillator

q

R

OS

w

Ceramic Oscillator

q

C

L0

Ceramic Resonator

Measuring circuit 2

V

IH

*2

V

IL

C

L1

INPUT OUTPUT

w

V

SS

VDDV

DDIVDD1VDD2VDD3VDD4VDD5VDDH

V

DDL

*2 Input logic circuit to determine the specified measuring conditions.
*3 Measured at the s

ecified output pins.

*3

A

24/32

¡ Semiconductor MSM63188A

Measuring circuit 3

*4

A

Measuring circuit 4

V

IH

*4

INPUT OUTPUT

VSSVDDV

DDIVDD1VDD2VDD3VDD4VDD5VDDH

INPUT OUTPUT

V

DDL

Waveform
Monitoring

V

IL

V

V

SS

DDVDDIVDD1VDD2VDD3VDD4VDD5VDDH

V

DDL

*4 Measured at the specified input pins.

25/32

¡ Semiconductor MSM63188A

AC Characteristics (Serial Interface, Serial Port)

(VDD = 0.9 to 5.5 V, V

= 1.8 to 5.5 V, VSS = 0 V, V

DDH

specified)

(1) Synchronous Communication

Parameter Symbol Condition Unit

t

f

r

TXC/RXC Input "L" Level
Pulse Width

TXC/RXC Input "H" Level
Pulse Width

TXC/RXC Output Cycle Time

t

CWL

t

CWH

CYC

t

CYC1(O)

CYC2(O)

DDR

DS

DH

= 5.0 V, Ta = –20 to +70°C unless otherwise

DDI

Max.Typ.Min.

— ms— 1.0
— ms— 1.0

— ms——

— ms——

— ms——

CPU in operation state at 32 kHz ms30.5 —

—TXC/RXC Input Fall Time
—TXC/RXC Input Rise Time t

0.8

0.8

2.0TXC/RXC Input Cycle Time t
—

CPU in operation at 2 MHz

= V

V

DD

= 2.7 V to 5.5 V

DDH

Output load capacitance 10 pF ms— 0.4

— ms——
— ms——

—t

—TXD Output Delay Time t

0.5RXD Input Setup Time t

0.8RXD Input Hold Time t

ms0.5 —

Synchronous communication timing
("H" level = 4.0 V, "L" level = 1.0 V)

t

CYC

TXC (PC.1)/
RXC (PC.2)

t

DDR

TXD (PC.3)

t

DS

RXD (PC.0)

5 V (V

DDI

)

0 V (VSS)

t

r

t

CWH

t

DDR

t

f

t

CWL

5 V (V

DDI

)

0 V (VSS)

t

DH

t

DS

5 V (V

DDI

)

0 V (VSS)

26/32

¡ Semiconductor MSM63188A

(2) UART Communication

Parameter Symbol Condition Unit

Transmit Baud Rate

T

BRT

BRT

UART communication timing
("H" level = 4.0 V, "L" level = 1.0 V)

TXD (PC.3)

RXD (PC.0)

T

= 1/f

BRT

TCR = 1/f

= 1/f

BRT

T

BRT

R

BRT

BRT

OSC

BRT

Max.Typ.Min.

T

BRT–TCR

R

¥0.97Receive Baud Rate R

BRT

f

: Baud rates (1200, 2400, 4800, 9600 bps)

BRT

BRT

BRT

T

R

BRT

5 V (V

BRT+TCR

¥1.03R

)

DDI

0 V (VSS)

5 V (V

DDI

)

0 V (VSS)

sT

sR

27/32

¡ Semiconductor MSM63188A

AC Characteristics (External Memory Interface)

(VDD = 0.9 to 5.5 V, V

= 1.8 to 5.5 V, VSS = 0 V, V

DDH

specified)

(1) Reading from External Memory

(a) When CPU operates at 32.768 kHz

Parameter

Read Cycle Time
RD Output Delay Time
Output Valid Time

External Memory Output Delay Time

(b) When CPU operates at 2 MHz (V

Parameter

Read Cycle Time
RD Output Delay Time
Output Valid Time

External Memory Output Delay Time

Symbol Condition Min. Typ. Max. Unit

t

RC

t

OE

t

OHA

t

DO

= 2.7 to 5.5 V)

DDH

Symbol Condition Min. Typ. Max. Unit

t

RC

t

OE

t

OHA

t

DO

= 5.0 V, Ta = –20 to +70°C unless otherwise

DDI

—
—
—
—

—
—
—
—

—
—
—
—

1.0 ms
—
—
—

61.0 ms
—
—
—

—
—
—
—

—

5.0

5.0

5.0

—
100
100
150

ms
ms
ms

ns
ns
ns

AC characteristics timing
("H" level = 4.0 V, "L" level = 1.0 V)

System clock

P7 - P4

(A15 - A0)

P8.0

(RD)

PA, P9

(D7 - D0)

Port setup value

Port setup value

MOVXB obj, xadr16

MOVXB obj, [RA]

Address output Port setup value

t

OE

S2S1S2S1S2S1

t

RC

5 V (V
0 V (V

5 V (V
0 V (V

t

OHA

5 V (V

Port setup valueInput data

t

DO

0 V (V

DDI
SS

DDI
SS

DDI
SS

)

)

)

)

)

)

28/32

¡ Semiconductor MSM63188A

(2) Writing to External Memory

(a) When CPU operates at 32.768 kHz

Parameter

Write Cycle Time
Address Setup Time
Write Time
Write Recovery Time
Data Setup Time
Data Hold Time

Symbol Condition Min. Typ. Max. Unit

t

t

WC

t

t

WR

t
t

AS

W

DS

DH

—
—
—
—
—
—

—
—
—
—
—
—

61.0 ms

30.5

15.3

15.3

45.8

15.3

—

—

—

—

—

—

ms
ms
ms
ms
ms

(b) When CPU operates at 2 MHz (V

Parameter

Write Cycle Time
Address Setup Time
Write Time
Write Recovery Time
Data Setup Time
Data Hold Time

= 2.7 to 5.5 V)

DDH

Symbol Condition Min. Typ. Max. Unit

t

WC

t

AS

t

W

t

WR

t

DS

t

DH

AC characteristics timing
("H" level = 4.0 V, "L" level = 1.0 V)

MOVXB [RA], obj or MOVXB xadr16, obj

System clock

—
—
—
—
—
—

1.0 ms

0.4

0.2

0.2

0.7

0.2

—
—
—
—
—
—

—

—

—

—

—

—

ms
ms
ms
ms
ms

S2S1S2S1S2S1

t

WC

(A15 - A0)

PA, P9

(D7 - D0)

P8.1

(WR)

Address output Port setup valuePort setup valueP7 - P4

5 V (V
0 V (V

5 V (V

Output data Port setup valuePort setup value

t

DS

t

DH

0 V (V

5 V (V
0 V (V

t

tWt

AS

WR

DDI
SS

DDI
SS

DDI
SS

)

)

)

)

)

)

29/32

¡ Semiconductor MSM63188A

APPLICATION CIRCUITS

•RC oscillation is selected as high-speed

LCD

oscillation.

•Ports are powered from external memory
power source.

•C

is an IC power supply bypass capacitor.

v

•Values of C
C

, and CG, are for reference only.

h

, Cb, Cc, Cd, Ce, Cl, C

a

b12

, C12,

Crystal

32.768 kHz

COM1-16

XT0

C

G

5 to

25 pF

C

1.5 V

v

C

C

l

C

e

C

d

C

c

C

b

C

a

C

h

0.1 mF

b12

1.0 mF

1.0 mF

0.1 mF

0.1 mF

0.1 mF

0.1 mF

0.1 mF

0.1 mF

XT1
V

DDH

V

DD

CB1
CB2

V

DDL

V

DD5

V

DD4

V

DD3

V

DD2

V

DD1

MSM63188A

C1

C

12

Push SW

0.1 mF
C2

SEG0-63

OSC0

OSC1

P3.3
P3.2
P3.1
P3.0
P2.3
P2.2
P2.1
P2.0

P1.3
P1.2
P1.1
P1.0
P0.3
P0.2
P0.1
P0.0

R

OS

SW Matrix
(8 ¥ 8)

RESET

Buzzer

Open

TST1
TST2

V

DDI

MD

Note: V

Be sure to connect the V
device or to the positive power supply pin of the external memory.

V

MDB

P4-7

A15-0

DD

External

V

SS

P9, PA

P8.0
P8.1

is the power supply pin for the input, output, and input-output ports.

DDI

pin either to the positive power supply pin (VDD) of this

DDI

Memory

D7-0

(64K ¥ 8 bits)

RD
WR

V

SS

Application Circuit Example with Power Supply Backup

5.0 V

30/32

¡ Semiconductor MSM63188A

APPLICATION CIRCUITS (continued)

•Ceramic oscillation is selected as high-speed

LCD

oscillation.

•Ports, external memory, and IC share their
power supply.

•C

is an IC power supply bypass capacitor.

v

•Values of C
C

, and CL1 are for reference only.

L0

, Cb, Cc, Cd, Ce, Cl, C12, CG,

a

C

V

DD

G

5 to 25 pF

5.0 V

C

v

C

l

C

e

C

d

C

c

C

b

C

a

Buzzer

Crystal

32.768 kHz

Open

0.1 mF

0.1 mF

0.1 mF

0.1 mF

0.1 mF

0.1 mF

0.1 mF

C

12

Push SW

Open

0.1 mF

XT0

XT1
V

DDH

V

DD

CB1
CB2
V

DDL

V

DD5

V

DD4

V

DD3

V

DD2

V

DD1

C1

C2

RESET
TST1
TST2
MD

COM1-16

SEG0-63

MSM63188A

OSC0

OSC1

P3.3
P3.2
P3.1
P3.0
P2.3
P2.2
P2.1
P2.0

P1.3
P1.2
P1.1
P1.0
P0.3
P0.2
P0.1
P0.0

V

DDI

CL0 30 pF

C

L1

30 pF

Ceramic
Resonator
(Example: 1 MHz)

SW Matrix
(8 ¥ 8)

V

DD

Note: V

Be sure to connect the V
device or to the positive power supply pin of the external memory.

V

DD

MDB

P4-7

A15-0

External

V

SS

P9, PA

P8.0
P8.1

is the power supply pin for the input, output, and input-output ports.

DDI

pin either to the positive power supply pin (VDD) of this

DDI

D7-0

Memory

(64K ¥ 8 bits)

RD
WR

V

SS

Application Circuit Example with No Power Supply Backup

31/32

¡ Semiconductor MSM63188A

PACKAGE DIMENSIONS

(Unit : mm)

LQFP176-P-2424-0.50-BK

Mirror finish

Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)

Epoxy resin
42 alloy
Solder plating
5 mm or more

1.87 TYP.

Notes for Mounting the Surface Mount Type Package

The SOP, QFP, TSOP, TQFP, LQFP, SOJ, QFJ (PLCC), SHP, and BGA are surface mount type
packages, which are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact Oki’s responsible sales person
on the product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).

32/32

E2Y0002-29-62

NOTICE

1. The information contained herein can change without notice owing to product and/or
technical improvements. Before using the product, please make sure that the information
being referred to is up-to-date.

2. The outline of action and examples for application circuits described herein have been
chosen as an explanation for the standard action and performance of the product. When
planning to use the product, please ensure that the external conditions are reflected in the
actual circuit, assembly, and program designs.

3. When designing your product, please use our product below the specified maximum
ratings and within the specified operating ranges including, but not limited to, operating
voltage, power dissipation, and operating temperature.

4. Oki assumes no responsibility or liability whatsoever for any failure or unusual or

unexpected operation resulting from misuse, neglect, improper installation, repair, alteration
or accident, improper handling, or unusual physical or electrical stress including, but not
limited to, exposure to parameters beyond the specified maximum ratings or operation
outside the specified operating range.

5. Neither indemnity against nor license of a third party’s industrial and intellectual property
right, etc. is granted by us in connection with the use of the product and/or the information
and drawings contained herein. No responsibility is assumed by us for any infringement
of a third party’s right which may result from the use thereof.

6. The products listed in this document are intended for use in general electronics equipment
for commercial applications (e.g., office automation, communication equipment,
measurement equipment, consumer electronics, etc.). These products are not authorized
for use in any system or application that requires special or enhanced quality and reliability
characteristics nor in any system or application where the failure of such system or
application may result in the loss or damage of property, or death or injury to humans.
Such applications include, but are not limited to, traffic and automotive equipment, safety
devices, aerospace equipment, nuclear power control, medical equipment, and life-support
systems.

7. Certain products in this document may need government approval before they can be
exported to particular countries. The purchaser assumes the responsibility of determining
the legality of export of these products and will take appropriate and necessary steps at their
own expense for these.

8. No part of the contents contained herein may be reprinted or reproduced without our prior
permission.

9. MS-DOS is a registered trademark of Microsoft Corporation.

Copyright 1999 Oki Electric Industry Co., Ltd.

Printed in Japan