Datasheet MRF166W Datasheet (M A COM)

Page 1
SEMICONDUCTOR TECHNICAL DATA
The RF MOSFET Line Power Field Effect Transistor
N–Channel Enhancement–Mode MOSFET
Designed primarily for wideband large–signal output and driver stages to
30 – 500 MHz.
Push–Pull Configuration Reduces Even Numbered Harmonics
Guaranteed Performance at 500 MHz, 28 Vdc
Output Power = 40 Watts Gain = 14 dB Efficiency = 50%
Typical Performance at 175 MHz, 28 Vdc Output Power = 40 Watts Gain = 17 dB Efficiency = 60%
Excellent Thermal Stability , Ideally Suited for Class A Operation
Facilitates Manual Gain Control, ALC and Modulation Techniques
100% Tested for Load Mismatch at All Phase Angles with 30:1 VSWR
Low C
— 4.0 pF @ VDS = 28 Volts
rss
Order this document
by MRF166W/D
MRF166W
40 W, 500 MHz
TMOS BROADBAND
RF POWER FET
MAXIMUM RATINGS
Drain–Gate Voltage V Drain–Gate Voltage (RGS = 1.0 MΩ) V Gate–Source Voltage V Drain Current — Continuous I Total Device Dissipation @ TC = 25°C
Derate above 25°C Storage Temperature Range T Operating Junction Temperature T
(TJ = 25°C unless otherwise noted)
Rating
THERMAL CHARACTERISTICS
Thermal Resistance — Junction to Case R
CASE 412–01, Style 1
1
3
5
4
Symbol Value Unit
DSS
DGR
GS
D
P
D
stg
J
θJC
–65 to +150 °C
FLANGE
2
65 Vdc 65 Vdc
± 20 Adc
8.0 ADC
175
1.0
200 °C
1.0 °C/W
Watts
°C/W
NOTE — CAUTION — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
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Page 2
ELECTRICAL CHARACTERISTICS (T
Characteristic Symbol Min Typ Max Unit
= 25°C unless otherwise noted)
C
OFF CHARACTERISTICS (1)
Drain–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 5.0 mA)
Zero Gate Voltage Drain Current
(VDS = 28 Vdc, VGS = 0 Vdc)
Gate–Source Leakage Current
(VGS = 20 Vdc, VDS = 0 Vdc)
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS= 10 Vdc, ID = 25 mA)
Forward Transconductance
(VDS= 10 Vdc, ID = 1.5 A)
DYNAMIC CHARACTERISTICS (1)
Input Capacitance
(VDS = 28 Vdc, VGS = 0 Vdc, f = 1.0 MHz)
Output Capacitance
(VDS = 28 Vdc, VGS = 0 Vdc, f = 1.0 MHz)
Reverse Transfer Capacitance
(VDS = 28 Vdc, VGS = 0 Vdc, f = 1.0 MHz)
FUNCTIONAL CHARACTERISTICS (2)
Common Source Power Gain
(VDD = 28 Vdc, P
Drain Efficiency
(VDD = 28 Vdc, P
Electrical Ruggedness
(VDD = 28 Vdc, P Load VSWR = 30:1, All phase angles at frequency of test
Series Equivalent Input Impedance
(VDD = 28 Vdc, P
Series Equivalent Output Impedance
(VDD = 28 Vdc, P
(1) Each transistor chip measured separately. (2) Both transistor chips operating in a push–pull amplifier.
= 40 W, f = 500 MHz, IDQ = 100 mA)
out
= 40 W, f = 500 MHz, IDQ = 100 mA)
out
= 40 W, f = 500 MHz, IDQ = 100 mA)
out
= 40 W, f = 500 MHz, IDQ = 100 mA)
out
= 40 W, f = 500 MHz, IDQ = 100 mA)
out
V
(BR)DSS
I
DSS
I
GSS
V
GS(th)
g
fs
C
iss
C
oss
C
rss
G
ps
η
Ψ
Z
in
Z
out
65
Vdc
mA
0.5
µA
1.0
Vdc
1.5 3.0 4.5 mS
0.9 1.1
pF
28
pF
30
pF
4.0
dB
14 16
%
50 55
No Degradation in Output Power
Ohms
2.88 –j7.96
Ohms
6.12 –j9.43
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Page 3
BIAS SUPPLY
R1
C11
R2
C12 C14
C13
+ –
VDD = 28 Vdc
RF INPUT
B1
C2
C1
C3
C9
C4
C3
R3
R4
L1
D.U.T.
L2
Inputs Line 70 mils x 2460 mils
C4
490 mils
C5
C6
C10
C5
680 mils
C7
C8
Output Lines 70 mils x 2380 mils
B2
RF OUTPUT
C6
C1, C2, C7, C8 220 pF, 100 mil Chip Capacitor, ATC C3, C6 0 – 10 pF, Johanson C4 27 pF, 100 mil Chip Capacitor, ATC C5 22 pF, 100 mil Chip Capacitor, ATC C9, C10, C1 1, C12 0.01 µF Blue Capacitor C13 470 pF, 100 mil Chip Capacitor, ATC C14 50 mF, 50 V Electrolytic Capacitor L1, L2 8 Turns #20 A WG, 0.100 mils ID B1, B2 6 long, ID = 550 mils, 50 W Semi–Rigid Coax R1 1.0 kW 1/2 Watt R2 10 kW 1/2 Watt R3, R4 45 W 1/2 Watt Board Material – Teflon Dielectric Thickness = 0.30″,
Fiberglass
εr = 2.55 Copper Clad, 2.0 oz. Copper
Figure 1. MRF166W 500 MHz T est Circuit Schematic
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60 55 50
45 40
35 30 25 20
, OUTPUT POWER (WATTS)
15
out
P
10
5 0
f = 500 MHz
VDD = 28 Vdc IDQ = 100 mA
0 1 1.5 2 3
0.5 2.5 Pin, INPUT POWER (WA TTS)
24
f = 500 MHz
0 0.4 1.2 2
Pin, INPUT POWER (WA TTS)
, OUTPUT POWER (WATTS)
out
P
20
16
12
8
4
0
VDD = 13.5 Vdc IDQ = 100 mA
2.4 2.80.8 1.6
Figure 2. Output Power versus Input Power, 28 Vdc
56 52
12
IDQ = 100 mA f = 500 MHz
14
16 18 20 22 24 26 28
VDD, SUPPLY VOLTAGE (VOLTS)
Pin = 2 W
Pin = 1 W
Pin = 0.5 W
, OUTPUT POWER (WATTS)
out
P
48 44 40 36 32 28 24 20 16 12
8
Figure 4. Output Power versus Supply Voltage
Figure 3. Output Power versus Input Power, 13.5
Vdc
45 40
VDD = 28 Vdc IDQ = 100 mA
35 30 25 20
TYPICAL DEVICE SHOWN
15
V
= 3.0 V
, OUTPUT POWER (WATTS)
out
P
10
GS(th)
5 0
–5 –4 –2 0
VDS, GATE–SOURCE VOLTAGE (VOLTS)
f = 500 MHz
1–3 –1
Figure 5. Output Power versus Gate Voltage
2
3
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100
90 80 70 60 50 40 30
C, CAPACITANCE (pF)
20 10
0
0 4 12 20
C
oss
C
iss
C
rss
VDS, DRAIN–SOURCE VOLTAGE (VOLTS)
Figure 6. Capacitance versus V oltage
VGS = 0 V f = 1.0 MHz
24816
28
Page 5
175
400
Z
in
ZOL*
500
f = 175 MHz
400
f = 500 MHz
Zo = 50
VDD = 28 Vdc, IDQ = 100 mA, P
f
MHz
175 3.7 – j 22.4 15.2 – j 16.6 400 3.6 – j 10.99 10.3 – j 7.99 500 2.88 – j 7.96 6.12 – j 9.43
Z
in
Ohms
out
= 40 W
ZOL*
Ohms
T able 1. Input and Output Impedances
Figure 7. Series Equivalent Input/Output Impedance
ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, voltage and frequency.
NOTE: Input and output impedance values given are measured from gate to gate and drain to drain respectively.
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MRF166W–500MHZ M J B
NOTES: 1) 3 X 5 inch Glass Teflon 32 Mil Board, Copper Both Sides
NOTES: 2) Small Holes are 40 Mils ID and Plated Through NOTES: 3) Large Holes are 140 Mils ID and Plated Through
Figure 8. MRF166W Circuit Board Photomaster
(Scale 1:1)
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Figure 9. MRF166W T est Fixture
Page 7
f
MHz
30 40 50 60 70 80
90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 270 280 290 300 310 320 330 340 350 360 370 380 390 400 410 420 430 440
T able 1. Common Source S–Parameters (VDS = 24 V, ID = 230 mA)
S
11
|S11| φ |S21| φ |S12| φ |S22| φ
0.554
0.775
0.758
0.711
0.751
0.742
0.724
0.730
0.735
0.732
0.734
0.740
0.747
0.748
0.741
0.746
0.753
0.756
0.755
0.759
0.767
0.769
0.766
0.767
0.773
0.777
0.777
0.782
0.788
0.794
0.796
0.795
0.799
0.804
0.805
0.807
0.812
0.818
0.821
0.821
0.822
0.826
–85 –113 –124 –132 –139 –143 –146 –149 –151 –153 –155 –156 –157 –159 –160 –160 –161 –162 –162 –163 –163 –164 –164 –165 –165 –165 –166 –166 –166 –167 –167 –168 –168 –168 –168 –169 –169 –170 –170 –170 –171 –171
20.30
20.00
17.50
14.60
12.70
11.30
10.00
8.97
8.29
7.53
7.01
6.57
6.01
5.66
5.22
4.94
4.67
4.51
4.15
3.91
3.75
3.56
3.41
3.26
3.07
3.03
2.89
2.80
2.66
2.54
2.47
2.38
2.27
2.17
2.15
2.06
2.00
1.91
1.86
1.83
1.74
1.67
S
21
128 113 107 100 100
95 92 90 87 84 83 81 78 76 76 74 73 70 69 68 65 64 63 63 61 61 58 57 57 55 54 54 52 51 50 48 48 47 46 44 44 43
0.044
0.040
0.041
0.050
0.042
0.043
0.042
0.042
0.043
0.042
0.042
0.043
0.042
0.041
0.040
0.041
0.041
0.040
0.039
0.039
0.039
0.038
0.037
0.035
0.035
0.035
0.034
0.034
0.034
0.033
0.032
0.031
0.030
0.030
0.030
0.029
0.028
0.027
0.029
0.028
0.026
0.025
S
12
28 26 20 20 11
9 8 6 3 2 1
0 –2 –4 –4 –4 –6 –7 –8 –8
–10 –12 –12 –10 –10 –11 –13 –11 –12 –12 –13 –13 –11 –11 –11 –12 –12 –10 –11 –11
–9 –7
0.628
0.632
0.652
0.570
0.666
0.666
0.657
0.663
0.683
0.666
0.688
0.701
0.688
0.715
0.690
0.719
0.725
0.729
0.727
0.724
0.751
0.733
0.726
0.725
0.725
0.753
0.732
0.744
0.764
0.760
0.787
0.753
0.772
0.782
0.796
0.782
0.796
0.784
0.830
0.823
0.791
0.788
S
22
–121 –123 –135 –135 –145 –149 –151 –154 –156 –158 –159 –160 –162 –162 –161 –164 –165 –166 –165 –166 –169 –167 –167 –167 –167 –167 –169 –169 –169 –167 –169 –170 –168 –169 –169 –170 –170 –168 –170 –171 –170 –170
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f
f
f
MHz
MHz
450 460 470 480 490 500 600 700 800 900
1000
MHz
30 40 50 60 70 80
90 100 110 120 130 140 150 160 170 180 190 200 210 220 230 240 250 260 270 280 290 300
T able 1. Common Source S–Parameters (VDS = 24 V, ID = 230 mA) (continued)
S
22
–170 –174 –173 –172 –171 –172 –176 –177
178 179 174
0.830
0.831
0.832
0.835
0.835
0.823
0.874
0.910
0.932
0.966
0.975
S
12
–7
–10
–7 –3
1 3
–171
89 61 68 49
0.820
0.843
0.827
0.836
0.835
0.849
0.873
0.867
0.904
0.897
0.953
1.68
1.64
1.54
1.50
1.43
1.43
1.12
0.86
0.74
0.63
0.54
S
21
42 41 41 39 38 37 29 23 18 12
5
0.025
0.026
0.025
0.024
0.024
0.025
0.003
0.013
0.035
0.029
0.042
S
11
–171 –172 –172 –173 –173 –174 –176 –179
179 176 172
T able 2. Common Source S–Parameters (VDS = 28 V, ID = 250 mA)
S
11
|S11| φ |S21| φ |S12| φ |S22| φ
0.601
0.783
0.764
0.727
0.759
0.751
0.732
0.737
0.741
0.738
0.740
0.747
0.754
0.757
0.749
0.753
0.759
0.761
0.759
0.762
0.771
0.775
0.774
0.775
0.780
0.782
0.781
0.785
–86 –112 –122 –131 –138 –142 –146 –149 –150 –153 –154 –156 –157 –159 –159 –160 –161 –161 –162 –163 –164 –164 –165 –165 –165 –165 –166 –166
22.20
21.20
18.50
15.50
13.50
12.10
10.70
9.55
8.81
8.01
7.47
7.01
6.43
6.07
5.59
5.28
4.99
4.81
4.44
4.18
4.03
3.83
3.69
3.52
3.29
3.24
3.10
3.01
S
21
128 114 108 101 100
95 93 90 88 85 83 82 79 77 76 75 73 70 70 69 66 65 64 63 61 61 59 58
0.040
0.037
0.038
0.045
0.039
0.040
0.040
0.040
0.040
0.040
0.040
0.040
0.040
0.039
0.038
0.039
0.039
0.038
0.037
0.037
0.037
0.036
0.035
0.034
0.034
0.034
0.032
0.033
S
12
29 27 21 21 12
9 8 6 4 3 2
1 –2 –3 –3 –4 –5 –7 –6 –7 –9
–10 –10 –10 –10 –11 –12 –11
0.796
0.616
0.637
0.574
0.648
0.649
0.641
0.648
0.670
0.654
0.675
0.684
0.669
0.693
0.670
0.701
0.712
0.719
0.713
0.709
0.733
0.715
0.713
0.715
0.712
0.741
0.722
0.733
S
22
–119 –122 –133 –135 –143 –148 –150 –153 –155 –156 –157 –158 –161 –161 –161 –163 –164 –165 –163 –164 –167 –165 –166 –168 –168 –168 –168 –168
φ|S22|φ|S12|φ|S21|φ|S11|
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f
f
MHz
MHz
310 320 330 340 350 360 370 380 390 400 410 420 430 440 450 460 470 480 490 500 600 700 800 900
1000
T able 2. Common Source S–Parameters (VDS = 28 V, ID = 250 mA) (continued)
S
12
–12 –12 –13 –14 –12 –12 –12 –13 –13 –11 –12 –13 –12 –11 –10 –13 –11 –10 –10 –10 138
77 58 69 49
0.792
0.798
0.801
0.800
0.803
0.807
0.808
0.809
0.813
0.820
0.823
0.823
0.824
0.828
0.832
0.833
0.835
0.840
0.844
0.845
0.879
0.912
0.935
0.966
0.974
2.87
2.75
2.68
2.58
2.44
2.33
2.30
2.19
2.14
2.06
2.02
1.98
1.89
1.83
1.81
1.75
1.65
1.60
1.55
1.56
1.21
0.92
0.79
0.67
0.57
S
21
57 56 53 53 52 50 50 48 49 47 45 44 44 43 41 41 41 40 38 37 29 23 18 11
5
0.032
0.032
0.031
0.030
0.029
0.029
0.029
0.028
0.027
0.026
0.027
0.026
0.025
0.024
0.024
0.025
0.023
0.022
0.022
0.022
0.002
0.017
0.039
0.030
0.043
S
11
–167 –167 –168 –168 –169 –169 –169 –169 –170 –170 –170 –171 –171 –172 –172 –172 –172 –172 –173 –173 –176 –179
179 176 172
0.750
0.739
0.760
0.727
0.755
0.772
0.787
0.768
0.775
0.765
0.805
0.794
0.778
0.785
0.812
0.838
0.817
0.818
0.819
0.833
0.870
0.862
0.887
0.892
0.945
S
22
φ|S22|φ|S12|φ|S21|φ|S11|
–167 –166 –170 –172 –170 –171 –169 –170 –169 –167 –170 –173 –174 –173 –172 –175 –173 –172 –172 –173 –176 –176
179 179 175
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Page 10
P ACKAGE DIMENSIONS
–A–
U
G
12
K
345
–B–
Q
2 PL
0.51 (0.020) B
M
M
A
T
M
D 4 PL
T
M
A
SEATING PLANE
M
0.51 (0.020) B
J
N
E
H
M
C
–T–
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
DIM MIN MAX MIN MAX
A 0.965 0.985 24.52 25.01 B 0.245 0.265 6.23 6.73 C 0.165 0.185 4.20 4.69 D 0.050 0.070 1.27 1.77 E 0.070 0.080 1.78 2.03 G 0.254 BSC 6.45 BSC H 0.095 0.105 2.42 2.66 J 0.003 0.006 0.08 0.15 K 0.625 0.675 15.88 17.14 N 0.495 0.520 12.58 13.20 Q 0.120 0.140 3.05 3.55 U 0.725 BSC 18.42 BSC
STYLE 1:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. GATE
5. SOURCE
MILLIMETERSINCHES
CASE 412–01
ISSUE O
Specifications subject to change without notice.
n
North America: Tel. (800) 366-2266, Fax (800) 618-8883
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298 n
Europe: Tel. +44 (1344) 869 595, Fax+44 (1344) 300 020
Visit www.macom.com for additional data sheets and product information.
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