Datasheet MRF166C Datasheet (Motorola)

1
MRF166CMOTOROLA RF DEVICE DATA
The RF MOSFET Line
    
N–Channel Enhancement Mode MOSFETs
Designed primarily for wideband large–signal output and driver from 30–500
MHz.
rss
— 4.5 pF @ VDS = 28 V
MRF166C — Typical Performance at 400 MHz, 28 Vdc Output Power = 20 W Gain = 17 dB Efficiency = 55%
Replacement for Industry Standards such as MRF136, DV2820, BLF244,
SD1902, and ST1001
100% Tested for Load Mismatch at all Phase Angles with 30:1 VSWR
Facilitates Manual Gain Control, ALC and Modulation Techniques
Excellent Thermal Stability, Ideally Suited for Class A Operation
Circuit board photomaster available upon request by
contacting RF Tactical Marketing in Phoenix, AZ.
MAXIMUM RATINGS
Rating Symbol Value Unit
Drain–Gate Voltage V
DSS
65 Vdc
Drain–Gate Voltage
(RGS = 1.0 M)
V
DGR
65 Vdc
Gate–Source Voltage V
GS
±40 Adc
Drain Current — Continuous I
D
4.0 Adc
Total Device Dissipation @ TC = 25°C
Derate Above 25°C
P
D
70
0.4
Watts
W/°C
Storage Temperature Range T
stg
–65 to 150 °C
Operating Junction Temperature T
J
200 °C
THERMAL CHARACTERISTICS
Characteristic Symbol Max Unit
Thermal Resistance, Junction to Case R
θJC
2.5 °C/W
NOTE — CAUTION — MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and packaging MOS devices should be observed.
Order this document
by MRF166C/D

SEMICONDUCTOR TECHNICAL DATA

20 W, 500 MHz
MOSFET
BROADBAND
RF POWER FETs
CASE 319–07, STYLE 3
Motorola, Inc. 1995
D
G
S
REV 7
MRF166C 2
MOTOROLA RF DEVICE DATA
ELECTRICAL CHARACTERISTICS (T
C
= 25°C unless otherwise noted)
Characteristic
Symbol Min Typ Max Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 V, ID = 5.0 mA)
V
(BR)DSS
65 V
Zero Gate Voltage Drain Current
(VDS = 28 V, VGS = 0 V)
I
DSS
1.0 mA
Gate–Source Leakage Current
(VGS = 40 V, VDS = 0 V)
I
GSS
1.0 µA
ON CHARACTERISTICS
Gate Threshold Voltage
(VDS = 10 V, ID = 25 mA)
V
GS(th)
1.0 3.0 6.0 V
Forward Transconductance
(VDS = 10 V, ID = 1.5 A)
g
fs
600 800 mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
(VDS = 28 V, VGS = 0 V, f = 1.0 MHz)
C
iss
30 pF
Output Capacitance
(VDS = 28 V, VGS = 0 V, f = 1.0 MHz)
C
oss
35 pF
Reverse Transfer Capacitance
(VDS = 28 V, VGS = 0 V, f = 1.0 MHz)
C
rss
4.5 pF
FUNCTIONAL CHARACTERISTICS
Noise Figure
(VDD = 28 V, f = 30 MHz, IDQ = 50 mA)
NF 2.5 dB
Common Source Power Gain
(VDD = 28 V, P
out
= 20 W, f = 400 MHz, IDQ = 100 mA)
G
ps
14 17 dB
Drain Efficiency
(VDD = 28 V, P
out
= 20 W, f = 400 MHz, IDQ = 100 mA)
η 50 55 %
Electrical Ruggedness
(VDD = 28 V, P
out
= 20 W, f = 400 MHz, IDQ = 100 mA,
Load VSWR 30:1 at All Phase Angles)
ψ No Degradation in Output Power
3
MRF166CMOTOROLA RF DEVICE DATA
Figure 1. MRF166C 400 MHz Test Circuit
C1, C7 — 270 pF Chip Capacitor C2, C6 — Johanson Trimmer Capacitor, 2–20 pF C3 — 21 pF Mini Unelco C4, C8, C9 — 0.01 µF C5 — 18 pF Mini Unelco C10, C11 — 680 pF Feed Through C12, C13 — 50 µF, 50 V D1 — 1N5925A Motorola Zener
Board Material — Teflon fiberglass 2 oz. Copper clad both sides, εr = 2.55
0.060 Dielectric Thickness
L1 — #18 AWG, 2 Turns, 0.25 ID 0.15 Wide L2 — #18 AWG Hairpin 0.7 long, bend into hairpin RFC1 — Ferroxcube VK200–19/4B RFC2 — 18 Turns #18 AWG Enameled, 0.3 ID R1 — 220 1/2 Watt R2 — 1.8 k 1/4 Watt R3 — 10 k, 10 Turns Bourns R4 — 10 k 1/4 Watt Z1 — Microstrip Line 0.150 wide, 0.420 long Z2 — Microstrip Line 0.150 wide, 0.350 long Z3 — Microstrip Line 0.150 wide, 0.350 long Z4 — Microstrip Line 0.150 wide, 0.450 long Z5 — Microstrip Line 0.150 wide, 1.1 long Z6 — Microstrip Line 0.150 wide, 0.650 long Z7 — Microstrip Line 0.150 wide, 0.200 long
R3
C4 C13
D1
R2
RFC2
C8
C10
RFC1
C11
C12
+ –
+
Vdc
+ –
R4
C9
R1
RF INPUT
C1
Z1 Z2 L1 Z3 L2
Z4
C3
C2
D.U.T.
Z5 Z6 Z7
C7
C6C5
RF OUTPUT
VDD = 28 V
100
1
2
5
10
20
50
2520151050
C
oss
C
iss
C
rss
VGS = 0 V f = 1 MHz
VDS, DRAIN–SOURCE VOLTAGE (VOLTS)
Figure 2. Capacitance versus Drain–Source Voltage
C, CAPACITANCE (pF)
100100
VDS, DRAIN–SOURCE VOLTAGE (VOLTS)
Figure 3. DC Safe Operating Area
10
1
0.1
I
D
, DRAIN CURRENT (AMPS)
TYPICAL CHARACTERISTICS
TC = 25°C
MRF166C 4
MOTOROLA RF DEVICE DATA
VDS, DRAIN–SOURCE (VOLTS)
35 30
25
20
15
10
5 0
0.8
Pin, INPUT POWER (WATTS)
Figure 4. Output Power versus Input Power
0.70.60.50.40.30.20.10
P
o
, OUTPUT POWER (WATTS)
500 MHz
f = 400 MHz
VDS = 28 V IDQ = 100 mA
16
14 12 10
8 6 4 2 0
0.8
Pin, INPUT POWER (WATTS)
0.70.60.50.40.30.20.10
f = 400 MHz
VDS = 13.5 V IDQ = 100 mA
Figure 5. Output Power versus Input Power
32
28 24
20 16 12
8 4
0
28
Figure 6. Output Power versus Voltage
2624222018161412
Pin = 0.8 W
0.4 W
0.2 W
f = 400 MHz IDQ = 100 mA
P
o
, OUTPUT POWER (WATTS)
P
o
, OUTPUT POWER (WATTS)
Figure 7. Series Equivalent Input and Output Impedance
f = 500 MHz
400
400
ZOL*
Z
in
VDD = 28 V, IDQ = 100 mA
Zo = 50
200
100
200
100
f = 500 MHz
ZOL* = Conjugate of the optimum load impedance into which the device output operates at a given output power, voltage and frequency.
f
MHz
Z
in
OHMS
ZOL*
OHMS
100 200 400 500
11.0 – j21.0
4.20 – j12.6
1.90 – j5.80
1.50 – j4.10
8.50 – j10.0
6.00 – j9.00
4.50 – j6.70
4.20 – j5.40
(P
out
= 20 W)
TYPICAL CHARACTERISTICS
5
MRF166CMOTOROLA RF DEVICE DATA
PACKAGE DIMENSIONS
CASE 319–07
ISSUE M
0.965
0.355
0.230
0.115
0.102
0.075
0.160
0.004
0.090
0.225
0.125
0.985
0.375
0.260
0.125
0.114
0.085
0.170
0.006
0.110
0.241
0.135
24.52
9.02
5.85
2.93
2.59
1.91
4.07
0.11
2.29
5.72
3.18
25.01
9.52
6.60
3.17
2.90
2.15
4.31
0.15
2.79
6.12
3.42
MM
MIN MINMAX MAX
INCHES MILLIMETER
DIM
A B C D E F H J K L N Q
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
0.725 BSC 18.42 BSC
SEATING PLANE
IDENTIFICATION
NOTCH
1 2 3
456
F
J
B
H
E
K
L
0.15 (0.006) T A N
M
-A-
-N-
-T-
Q 2 PL
D 2 PL
MM
0.38 (0.015) T A N
M
MM
0.38 (0.015) T A N
M
C
PIN 1. SOURCE (COMMON)
2. GATE (INPUT)
3. SOURCE (COMMON)
4. SOURCE (COMMON)
5. DRAIN (OUTPUT)
6. SOURCE (COMMON)
STYLE 3:
MRF166C 6
MOTOROLA RF DEVICE DATA
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MRF166C/D
*MRF166C/D*
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